CN218125266U

CN218125266U - Multi-section radiating fin structure

Info

Publication number: CN218125266U
Application number: CN202222270577.7U
Authority: CN
Inventors: 常青保
Original assignee: Chengdu Gongtong Radiator Co ltd
Current assignee: Chengdu Gongtong Radiator Co ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2022-12-23
Anticipated expiration: 2032-08-29

Abstract

The utility model discloses a multistage formula fin structure, including the fin base member, keep connecting through a plurality of fastening screws and heat dissipation carrier, be provided with a plurality of fin groups on the fin base member, the lamellar body direction of every fin group keeps unanimous. The radiating fin structure is provided with a plurality of radiating fin groups, so that the radiating quality and the radiating efficiency can be effectively improved, and the production cost is ensured.

Description

Multi-section radiating fin structure

Technical Field

The utility model relates to an electrical apparatus heat dissipation technical field specifically says a multistage formula fin structure.

Background

In recent years, with the development of scientific technology, the main control component in intelligent industrial equipment such as a 5G communication base station, photovoltaic, wind power and the like is an IGBT module, the IGBT is an abbreviation of an Insulated Gate Bipolar Transistor (IGBT), the IGBT is a device formed by compounding a MOSFET and a Bipolar Transistor, the input of the IGBT is the MOSFET, and the output of the IGBT is a PNP Transistor, which combines the advantages of the two devices, not only has the advantages of small driving power and high switching speed of the MOSFET device, but also has the advantages of reduced saturation voltage and large capacity of the Bipolar device, the frequency characteristic of the IGBT is between the MOSFET and the power Transistor, and the IGBT can normally operate in the frequency range of dozens of kHz.

The voltage specification of the IGBT module is closely related to the input power supply (i.e., the test power supply voltage) of the device used. When the collector current of the IGBT module is increased in use, the generated rated loss is increased, so that the heat generation of the IGBT component is intensified during operation, therefore, the research on how to better control the temperature of the semiconductor component within a specified range is made, the efficiency of the semiconductor component is stable and reliable, the heat dissipation design of the semiconductor component is reasonable and important, and the purpose of heat dissipation of the electronic component is to control (or called as thermal control) the operating temperature of electronic equipment so as to ensure the stability and reliability of the operation of the electronic equipment. Otherwise, the performance of the equipment can not be improved or the equipment can not work normally.

The radiating fins of the existing radiator are generally integral radiating fins, and the heating is aggravated along with the increase of the current of a product, the integral radiating fins cannot realize quick heat dissipation, the heat dissipation performance is influenced, the process of splicing the substrates is adopted, the processing procedures can be increased, and the cost is high.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above-mentioned insufficiency, the utility model provides a multistage formula fin structure herein, this fin structure is multistage formula fin group, can effectually reinforce the heat dissipation, and the radiating efficiency is high, simple structure, and production efficiency is high, and the combined cost is low, satisfies components and parts heat dissipation demand simultaneously.

The utility model discloses a realize like this, construct a multistage formula fin structure, including the fin base member, keep connecting through a plurality of fastening screws and heat dissipation carrier, be provided with a plurality of fin groups on the fin base member, the lamellar body direction of every fin group keeps unanimous.

Furthermore, the cooling fin group comprises a cooling fin group A, a cooling fin group B and a cooling fin group C, and a groove body is arranged among the cooling fin group A, the cooling fin group B and the cooling fin group C.

Further, the gap between the cooling fins in the cooling fin group a is a distance a, the gap between the cooling fins in the cooling fin group B is a distance B, and the gap between the cooling fins in the cooling fin group C is a distance C.

Furthermore, the distance A is larger than the distance B, the distance B is larger than the distance C, and the heat exchange efficiency of the radiating fins and air is improved conveniently by setting the distance, so that the heat radiation performance is improved.

Further, the widths of the fin group a, the fin group B and the fin group C are kept consistent, the length of the fin group B is smaller than that of the fin group B, and the length of the fin group B is smaller than that of the fin group C.

Further, fin group A is the air inlet end, fin group C is the air outlet end.

Furthermore, the heat dissipation carrier is an IGBT module, and each heat dissipation fin group corresponds to one heat dissipation carrier.

The utility model discloses following beneficial effect has:

1. the structure of multi-section heat sink set is used to enhance heat dissipation.

2. Simple structure, high heat dissipation efficiency and low comprehensive cost.

Drawings

Fig. 1 is a schematic view of the connection structure of the present invention;

FIG. 2 is an inverted schematic view of FIG. 1;

fig. 3 is a schematic structural view of the heat sink substrate of the present invention;

in the figure: 1. a heat sink substrate; 1.1, a radiating fin group A;1.11, spacing A;1.2, a radiating fin group A;1.21, spacing B;1.3, a cooling fin group C;1.31, spacing C; 2. a heat dissipation carrier; 3. and (5) fastening the screw.

Detailed Description

The present invention will be described in detail with reference to fig. 1 to 3, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model discloses an improve and provide a multistage formula fin structure here, can implement according to following mode: a multi-section radiating fin structure comprises a radiating fin base body 1 and a radiating carrier 2 which are connected through a plurality of fastening screws 3, wherein a plurality of radiating fin groups are arranged on the radiating fin base body 1, and the directions of fin bodies of the radiating fin groups are kept consistent.

In this embodiment, the fin group includes a fin group a1.1, a fin group B1.2, and a fin group C1.3, and a groove is formed between the fin group a1.1, the fin group B1.2, and the fin group C1.3.

In this embodiment, the gap between the fins in fin group a1.2 is interval a1.11, the gap between the fins in fin group B1.2 is interval B1.21, and the gap between the fins in fin group C1.3 is interval C1.31.

In the present embodiment, the distance a1.11 is greater than the distance B1.21, and the distance B1.21 is greater than the distance C1.31.

In this embodiment, the widths of fin group a1.1, fin group B1.2, and fin group C1.3 are kept the same, the length of fin group 1.1 is smaller than the length of fin group B1.2, and the length of fin group B1.2 is smaller than the length of fin group C1.3.

In this embodiment, fin group a1.1 is the air inlet end, and fin group C1.3 is the air outlet end.

In this embodiment, the heat dissipation carrier 2 is an IGBT module, and each heat dissipation fin group corresponds to one heat dissipation carrier 2.

The working principle of the radiating fin structure is as follows: when the heat dissipation carrier 2 works, heat generation is intensified, a large amount of power consumption heat is generated and is transferred to the heat dissipation sheet base 1 through heat transfer, the temperature of the heat dissipation sheet base 1 is increased after heat absorption, meanwhile, the heat is transferred to the heat dissipation sheets, the heat on the heat dissipation sheets and the air among the intervals of the heat dissipation sheets are subjected to heat exchange, the air passes through the range of each heat dissipation sheet group, the temperature of the heat dissipation carrier 2 is reduced after heat dissipation, the air temperature is increased and dissipated out of equipment, or the air is cooled through other modes; the cooling of the heat dissipation carrier 2 is achieved, and the working stability and reliability of the heat dissipation carrier are guaranteed.

When the radiating fin structure is manufactured, after the radiating fin group A1.1, the radiating fin group B1.2 and the radiating fin group C1.3 are separately manufactured, friction welding is carried out at a groove body, the cost is high, the efficiency is low, and a plurality of working procedures are required to be added to finish the manufacturing.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-section type heat sink structure is characterized in that: the radiating fin structure comprises a radiating fin base body (1) and a radiating carrier (2) which are kept connected through a plurality of fastening screws (3), wherein a plurality of radiating fin groups are arranged on the radiating fin base body (1), and the directions of fin bodies of all the radiating fin groups are kept consistent.

2. The multi-sectional heat sink structure of claim 1, wherein: the radiating fin group comprises a radiating fin group A (1.1), a radiating fin group B (1.2) and a radiating fin group C (1.3), and a groove body is arranged among the radiating fin group A (1.1), the radiating fin group B (1.2) and the radiating fin group C (1.3).

3. The multi-sectional heat sink structure according to claim 2, wherein: the gaps between the radiating fins in the radiating fin group A (1.2) are the distance A (1.11), the gaps between the radiating fins in the radiating fin group B (1.2) are the distance B (1.21), and the gaps between the radiating fins in the radiating fin group C (1.3) are the distance C (1.31).

4. The multi-sectional heat sink structure of claim 3, wherein: the distance A (1.11) is greater than the distance B (1.21), and the distance B (1.21) is greater than the distance C (1.31).

5. The multi-sectional heat sink structure of claim 2, wherein: the widths of the fin group A (1.1), the fin group B (1.2) and the fin group C (1.3) are kept consistent, the length of the fin group (1.1) is smaller than that of the fin group B (1.2), and the length of the fin group B (1.2) is smaller than that of the fin group C (1.3).

6. The multi-sectional heat sink structure of claim 5, wherein: and the radiating fin group A (1.1) is an air inlet end, and the radiating fin group C (1.3) is an air outlet end.

7. The multi-sectional heat sink structure of claim 1, wherein: the heat dissipation carrier (2) is an IGBT module, and each heat dissipation plate group corresponds to one heat dissipation carrier (2).