CN113611677A - IGBT module heat radiation structure - Google Patents
IGBT module heat radiation structure Download PDFInfo
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- CN113611677A CN113611677A CN202110812308.6A CN202110812308A CN113611677A CN 113611677 A CN113611677 A CN 113611677A CN 202110812308 A CN202110812308 A CN 202110812308A CN 113611677 A CN113611677 A CN 113611677A
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- 230000005855 radiation Effects 0.000 title claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000000926 separation method Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 230000006978 adaptation Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 6
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 meanwhile Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of IGBT (insulated gate bipolar transistor) heat dissipation, in particular to an IGBT module heat dissipation structure, which comprises an IGBT module, wherein a first heat conduction substrate is fixedly connected to the lower surface of the IGBT module, a first mounting groove is formed in the lower surface of one end, away from the IGBT module, of the first heat conduction substrate, a water cooling plate is fixedly connected to the inside of the first mounting groove, and a second heat conduction substrate is fixedly connected to the upper surface of the IGBT module. According to the invention, the first heat conducting substrate is arranged below the IGBT module, so that heat generated by the operation of the IGBT module can be transferred through the first heat conducting substrate, the contact area between the first heat conducting substrate and the water cooling plate can be increased by the first mounting groove, the groove and the first heat conducting strip, the heat dissipation efficiency is improved, and meanwhile, the deformation of the IGBT module caused by heat generation can be reduced by the cooperation of the groove and the heat conducting strip, so that the firmness between the IGBT module and the water cooling plate is increased, and the damage of the IGBT module is avoided.
Description
Technical Field
The invention relates to the technical field of IGBT heat dissipation, in particular to an IGBT module heat dissipation structure.
Background
An IGBT (insulated gate bipolar transistor) and an insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices consisting of bipolar triodes and insulated gate field effect transistors, have the advantages of high input impedance of MOSFETs and low conduction voltage drop of GTRs (GTRs), and are widely applied to the fields of industrial frequency conversion, smart grids, photovoltaics, electric vehicles and the like due to the characteristics of high switching speed, low loss, low on-state voltage reduction, high input impedance, pulse current impact resistance and the like of IGBT modules.
With the development of electronic technology, electronic devices are developing more and more in the directions of high frequency, high speed and modularization, the heat generated by the electronic devices is always increased due to the wide application of high-power 6-inch components and high-power IGBT modules, and data shows that 55% of operation errors of electronic equipment are caused by overheating, so that the cooling of the electronic devices becomes more and more an important link in the development and development of electronic products. The existing water-cooling insulated gate bipolar transistor IGBT module is generally single in heat dissipation structure in the using process, so that the heat dissipation effect is poor.
Therefore, it is desirable to design a heat dissipation structure of an IGBT module to solve the above problems.
Disclosure of Invention
The invention aims to provide a heat dissipation structure of an IGBT module, which aims to solve the problem that the heat dissipation structure of the IGBT module provided in the background technology is single and the heat dissipation effect is poor in the use process.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a IGBT module heat radiation structure, includes the IGBT module, the first heat conduction base plate of the lower fixed surface of IGBT module, the one end lower surface that the IGBT module was kept away from to first heat conduction base plate has seted up first mounting groove, the inside fixedly connected with water-cooling board of first mounting groove, the last fixed surface of IGBT module is connected with second heat conduction base plate, the one end upper surface fixedly connected with a plurality of second heat conduction strips of keeping away from the IGBT module of second heat conduction base plate, the last fixed surface of second heat conduction base plate is connected with the third heat conduction base plate with second heat conduction strip looks adaptation, a plurality of radiating fin of upper surface middle part fixedly connected with of third heat conduction base plate, the upper surface of third heat conduction base plate just is located a plurality of radiating fin's outside fixedly connected with seal box.
Preferably, the size of the first heat conduction substrate is larger than that of the IGBT module, a plurality of grooves are formed in the inner top wall of the first mounting groove, and the grooves are distributed at equal intervals.
Preferably, the one end upper surface fixed connection that the water-cooling board is close to first heat conduction base plate has the first heat conduction strip with slot looks adaptation, first heat conduction strip passes through tin cream fixed connection in the inside of slot, and the upper end of IGBT module is located the inside of first mounting groove and passes through tin cream soldering fixed connection with first heat conduction base plate.
Preferably, the size of second heat conduction base plate is the same with the size of IGBT module, the size of third heat conduction base plate is greater than the size of first heat conduction base plate, and the third heat conduction base plate is close to the one end lower surface of second heat conduction base plate and offers the second mounting groove with second heat conduction base plate looks adaptation, and is a plurality of the second heat conduction strip is the array distribution, and the cross-section of second heat conduction strip is trapezoidal setting, the dovetail groove with second heat conduction strip looks adaptation is offered to the interior roof of second mounting groove, second heat conduction strip and second heat conduction base plate all through tin cream tin soldering fixed connection in the inside of dovetail groove and second mounting groove.
Preferably, the right and left bilateral symmetry of the positive inside of water-cooling board has seted up second water inlet and second delivery port, cavity in the middle of having seted up is seted up to the inside of water-cooling board, the inside of water-cooling board and the bilateral symmetry that is located cavity in the middle of having seted up left cavity and right cavity, the public runner of mutual intercommunication is all seted up to the front end of middle cavity, the front end of left cavity and the front end of right cavity, the inner wall of public runner and the equal fixedly connected with parting bead in the position that corresponds in the middle of the middle cavity, the position that corresponds in the middle of the left cavity and the position that corresponds in the middle of the right cavity.
Preferably, the second water inlet and the second water outlet are respectively communicated with the left cavity and the right cavity, the second water inlet and the second water outlet are respectively located on the left side of the left cavity internal separation strip and the right side of the right cavity internal separation strip, six diversion strips which are symmetrically distributed about the separation strip are fixedly connected with the inside of the middle cavity, the inside of the left cavity and the inside of the right cavity, one end of the diversion strip, which is far away from the public flow channel, and one end of the diversion strip, which is far away from the public flow channel, are respectively in non-contact with the inner wall of the corresponding middle cavity, the inner wall of the left cavity and the inner wall of the right cavity, and the inside of the second water inlet and the second water outlet is respectively fixedly connected with a second water inlet pipe and a second water outlet pipe.
Preferably, it is a plurality of radiating fin is equidistant distribution, and radiating fin's upper surface and the interior roof fixed connection of seal box, the outside radiating fin leaves the space with the inner wall of seal box, first water inlet and first delivery port have been seted up respectively to the back lower extreme middle part and the positive lower extreme middle part of seal box, the inside fixedly connected with of first delivery port goes out the second outlet pipe.
Preferably, one end of the first water outlet pipe, which is far away from the seal box, is fixedly connected with a micro water cooler through a first connecting pipe, and a water outlet end of the micro water cooler is fixedly connected with the second water inlet pipe through a second connecting pipe.
Compared with the prior art, the invention has the beneficial effects that:
set up first heat conduction base plate through the below at the IGBT module, the heat that can make IGBT module work produce carries out the heat transfer through first heat conduction base plate, first mounting groove and slot on the first heat conduction base plate pass through the tin cream and are fixed with the soldering of water-cooling board simultaneously, first mounting groove, the area of contact of first heat conduction base plate and water-cooling board can be increased to slot and first heat conduction strip, the radiating efficiency is improved, the slot cooperates with the heat conduction strip simultaneously and can reduce the deformation that the IGBT module takes place because of when producing the heat, thereby increase the fastness between IGBT module and the water-cooling board, avoid the IGBT module because of damaging.
Through the middle cavity that sets up in the inside of water-cooling board, left cavity, right cavity and public runner, and at middle cavity, left cavity, the inside of right cavity sets up parting strip and water conservancy diversion strip, make the hydroenergy that water got into from the second water inlet enough get into left cavity and get into public runner under the direction of parting strip and water conservancy diversion strip like this, and enter into middle cavity and left cavity through public runner, discharge through the second delivery port at last, make the hydroenergy of water-cooling inboard enough even flow, and evenly dispel the heat to first heat conduction base plate, thereby improve the radiating efficiency to the IGBT module.
Through setting up second heat conduction base plate at IGBT module top, and set up the second heat conduction strip that the cross-section is trapezoidal on second heat conduction base plate, second heat conduction base plate and second heat conduction strip can increase the heat radiating area of IGBT module, the heat that third heat conduction base plate was transmitted second heat conduction base plate and second heat conduction strip dispels the heat through radiating fin simultaneously, and send water into the seal box through first water inlet, and discharge through first outlet pipe, this in-process radiating fin can carry out the water conservancy diversion, the water that rivers flowed simultaneously can take away radiating fin and the heat in the seal box, thereby the radiating efficiency to the IGBT module has been improved.
Through setting up miniature water-cooling machine, make the first outlet pipe exhaust have in thermal water gets into miniature water-cooling machine through first connecting pipe, miniature water-cooling machine can carry out cooling to having thermal water, the water outlet end of rethread miniature water-cooling machine is the water cold plate that intakes through second connecting pipe and second inlet pipe after with the cooling, make refrigerated water pass through left cavity in proper order, middle cavity, public runner and left cavity dispel the heat to the IGBT module, discharge through the second delivery port at last, make this circulation process can improve the radiating efficiency to the IGBT module.
Drawings
FIG. 1 is a schematic view of the entire structure of the present invention;
FIG. 2 is a front view in section;
FIG. 3 is a perspective view of a first thermally conductive substrate according to the present invention;
FIG. 4 is a perspective view of the water cooling plate of the present invention;
FIG. 5 is a perspective view of a second thermally conductive substrate according to the present invention;
FIG. 6 is a perspective view of a heat sink fin according to the present invention;
FIG. 7 is an enlarged view taken at A in FIG. 2 according to the present invention;
FIG. 8 is a schematic diagram of the distribution of the internal flow channels of the water-cooling plate of the present invention.
In the figure: 1. an IGBT module; 2. a first thermally conductive substrate; 3. a first mounting groove; 4. a trench; 5. a water-cooling plate; 6. a first heat conducting strip; 7. a second water inlet pipe; 8. a second water outlet pipe; 9. a second thermally conductive substrate; 10. a second heat conducting strip; 11. a third thermally conductive substrate; 12. a heat dissipating fin; 13. a sealing box; 14. a first water outlet pipe; 15. a first connecting pipe; 16. a micro water cooler; 17. a second connecting pipe; 18. a second water inlet; 19. a second water outlet; 20. a middle cavity; 21. a left cavity; 22. a right cavity; 23. a dividing strip; 24. a flow guide strip; 25. a common flow path.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 8, an IGBT module heat dissipation structure includes an IGBT module 1, a first heat conducting substrate 2 is fixedly connected to a lower surface of the IGBT module 1, a first mounting groove 3 is formed in a lower surface of an end of the first heat conducting substrate 2, which is far away from the IGBT module 1, of the first mounting groove 3, a water cooling plate 5 is fixedly connected to an inside of the first mounting groove 3, a second heat conducting substrate 9 is fixedly connected to an upper surface of the IGBT module 1, a plurality of second heat conducting strips 10 are fixedly connected to an end of the second heat conducting substrate 9, a third heat conducting substrate 11, which is matched with the second heat conducting strips 10, is fixedly connected to an upper surface of the second heat conducting substrate 9, a plurality of heat dissipation fins 12 are fixedly connected to an upper surface of the third heat conducting substrate 11, and a sealing box 13 is fixedly connected to an outside of the plurality of heat dissipation fins 12 is located on an upper surface of the third heat conducting substrate 11.
Further, as shown in fig. 3, the size of the first heat conducting substrate 2 is larger than that of the IGBT module 1, the inner top wall of the first mounting groove 3 is provided with a plurality of grooves 4, the grooves 4 are distributed at equal intervals, and the grooves 4 can reduce the deformation of the IGBT module 1 caused by heat generation.
Further, as shown in fig. 2, fig. 3 and fig. 4, a first heat conducting strip 6 matched with the groove 4 is fixedly connected to the surface of the water cooling plate 5 close to one end of the first heat conducting substrate 2, the first heat conducting strip 6 is fixedly connected inside the groove 4 through solder paste, the upper end of the IGBT module 1 is located inside the first mounting groove 3 and is fixedly connected with the first heat conducting substrate 2 through solder paste soldering, the first mounting groove 3, the groove 4 and the first heat conducting strip 6 can increase the contact area between the first heat conducting substrate 2 and the water cooling plate 5, and the heat dissipation efficiency is improved.
Further, as shown in fig. 2 and 5, the size of the second heat conducting substrate 9 is the same as that of the IGBT module 1, the size of the third heat conducting substrate 11 is larger than that of the first heat conducting substrate 2, a second mounting groove matched with the second heat conducting substrate 9 is formed in the lower surface of one end, close to the second heat conducting substrate 9, of the third heat conducting substrate 11, the plurality of second heat conducting strips 10 are distributed in an array manner, the cross section of each second heat conducting strip 10 is in a trapezoid shape, a trapezoid groove matched with the second heat conducting strip 10 is formed in the inner top wall of the second mounting groove, the second heat conducting strips 10 and the second heat conducting substrate 9 are fixedly connected inside the trapezoid groove and the second mounting groove through tin paste soldering, the second heat conducting substrate 9 and the trapezoid second heat conducting strips 10 can increase the contact area with the third heat conducting substrate 11, and the heat transfer efficiency and the heat dissipation efficiency of the IGBT module 1 are improved.
Further, as shown in fig. 8, a second water inlet 18 and a second water outlet 19 are symmetrically formed at the left side and the right side of the inside of the front surface of the water cooling plate 5, a middle cavity 20 is formed inside the water cooling plate 5, a left cavity 21 and a right cavity 22 are symmetrically formed at the two sides of the inside of the water cooling plate 5 and located at the middle cavity 20, mutually communicated common flow channels 25 are formed at the front end of the middle cavity 20, the front end of the left cavity 21 and the front end of the right cavity 22, separating strips 23 are fixedly connected to the inner wall of the common flow channel 25 and the positions corresponding to the middle of the middle cavity 20, the middle of the left cavity 21 and the middle of the right cavity 22, the middle cavity 20, the left cavity 21, the right cavity 22 and the common flow channel 25 can accommodate discharged water, meanwhile, water can take away heat inside the middle cavity 20, the left cavity 21, the right cavity 22 and the common flow channel 25, and heat dissipation efficiency is improved.
Further, as shown in fig. 4 and 8, the second water inlet 18 and the second water outlet 19 are respectively communicated with the left cavity 21 and the right cavity 22, the second water inlet 18 and the second water outlet 19 are respectively located on the left side of the internal partition 23 of the left cavity 21 and the right side of the internal partition 23 of the right cavity 22, six flow guide strips 24 symmetrically distributed with respect to the partition 23 are fixedly connected inside the middle cavity 20, inside the left cavity 21 and inside the right cavity 22, one end of the flow guide strip 24 away from the common flow channel 25 and one end of the partition 23 away from the common flow channel 25 are respectively not in contact with the inner wall of the corresponding middle cavity 20, the inner wall of the left cavity 21 is not in contact with the inner wall of the right cavity 22, the second water inlet 18 and the second water outlet 19 are respectively and fixedly connected with the second water inlet tube 7 and the second water outlet tube 8, water enters the left cavity 21 from the second water inlet 18 and enters the common flow channel 25 under the guidance of the partition 23 and the flow guide strip 24, and enters the middle cavity 20 and the left cavity 21 through the common flow channel 25, and is finally discharged through the second water outlet 19, so that the water inside the water cooling plate 5 can uniformly flow circularly, the first heat conducting substrate 2 is uniformly cooled, and the heat dissipation efficiency of the IGBT module 1 is improved.
Further, as shown in fig. 1, fig. 2 and fig. 6, a plurality of radiating fins 12 are distributed at equal intervals, the upper surfaces of the radiating fins 12 are fixedly connected with the inner top wall of the seal box 13, a space is reserved between the outermost radiating fins 12 and the inner wall of the seal box 13, a first water inlet and a first water outlet are respectively formed in the middle of the lower end of the back side and the middle of the lower end of the front side of the seal box 13, a first water outlet pipe 14 is fixedly connected to the inside of the first water outlet, the radiating fins 12 can increase the radiating area of the third heat-conducting substrate 11, meanwhile, water enters the seal box 13 through the first water inlet and is discharged through the first water outlet pipe 14, the radiating fins 12 can guide water, meanwhile, the flowing water can take away the heat in the radiating fins 12 and the seal box 13, and therefore the radiating efficiency of the IGBT module 1 is improved.
Further, as shown in fig. 1, one end of the first water outlet pipe 14, which is far away from the seal box 13, is fixedly connected with a micro water cooler 16 through a first connecting pipe 15, a water outlet end of the micro water cooler 16 is fixedly connected with the second water inlet pipe 7 through a second connecting pipe 17, water with heat, which is discharged from the first water outlet pipe 14, enters the micro water cooler 16 through the first connecting pipe 15, the micro water cooler 16 can cool the water with heat, and the cooled water is discharged into the water cooling plate 5 through the second connecting pipe 17 and the second water inlet pipe 7 through the water outlet end of the micro water cooler 16.
The working principle is as follows: when the heat exchanger is used, the first water inlet can be communicated with an external water pipe, cooling water is discharged into the sealed box 13 through the first water inlet, the cooling water flows to the first water outlet under the guidance of the plurality of radiating fins 12 after entering the sealed box 13, in the process, the flowing water can take away heat in the sealed box 13 and on the radiating fins 12, so that the heat transferred by the second heat-conducting substrate 9 and the third heat-conducting substrate 11 is taken away, the water with heat is discharged into the micro water cooler 16 through the first water outlet pipe 14 and the first connecting pipe 15, the micro water cooler 16 can cool the water with heat, the micro water cooler 16 discharges the cooled water into the left cavity 21 in the water cooling plate 5 through the water outlet end of the micro water cooler, the second connecting pipe 17 and the second water inlet pipe 7, and the cooled water can circularly flow out in the left cavity 21 under the guidance and separation effects of the flow guide strips 24 and the separation strips 23, and enters the middle cavity 20 through the common flow channel 25, and simultaneously, under the flow guide and separation action of the flow guide strips 24 and the separation strips 23, water can circularly flow out in the middle cavity 20, and flows into the right cavity 22 through the common flow channel 25, and is circularly discharged through the second water outlet 19 and the second water outlet pipe 8, so that the water-cooling plate 5 can take away heat transferred by the first heat-conducting substrate 2, and the heat dissipation efficiency is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a IGBT module heat radiation structure, includes IGBT module (1), its characterized in that: the lower surface of the IGBT module (1) is fixedly connected with a first heat-conducting substrate (2), the lower surface of one end of the first heat-conducting substrate (2) far away from the IGBT module (1) is provided with a first mounting groove (3), a water cooling plate (5) is fixedly connected inside the first mounting groove (3), a second heat-conducting substrate (9) is fixedly connected on the upper surface of the IGBT module (1), a plurality of second heat conducting strips (10) are fixedly connected to the upper surface of one end of the second heat conducting substrate (9) far away from the IGBT module (1), the upper surface of the second heat conduction substrate (9) is fixedly connected with a third heat conduction substrate (11) matched with the second heat conduction strip (10), the middle part of the upper surface of the third heat-conducting substrate (11) is fixedly connected with a plurality of radiating fins (12), and a sealing box (13) is fixedly connected to the upper surface of the third heat-conducting substrate (11) and positioned outside the plurality of radiating fins (12).
2. The IGBT module heat dissipation structure according to claim 1, wherein: the size of first heat conduction base plate (2) is greater than the size of IGBT module (1), a plurality of slot (4) have been seted up to the interior roof of first mounting groove (3), and is a plurality of slot (4) are equidistant distribution.
3. The IGBT module heat dissipation structure according to claim 1, wherein: fixed surface is connected with first heat conduction strip (6) with slot (4) looks adaptation on one end that water-cooling board (5) are close to first heat conduction base plate (2), first heat conduction strip (6) are in the inside of slot (4) through tin cream fixed connection, and the upper end of IGBT module (1) is located the inside of first mounting groove (3) and passes through tin cream tin soldering fixed connection with first heat conduction base plate (2).
4. The IGBT module heat dissipation structure according to claim 1, wherein: the size of second heat conduction base plate (9) is the same with the size of IGBT module (1), the size of third heat conduction base plate (11) is greater than the size of first heat conduction base plate (2), and third heat conduction base plate (11) are close to the one end lower surface of second heat conduction base plate (9) and offer the second mounting groove with second heat conduction base plate (9) looks adaptation, and is a plurality of second heat conduction strip (10) are array distribution, and the cross-section of second heat conduction strip (10) is trapezoidal setting, the dovetail groove with second heat conduction strip (10) looks adaptation is seted up to the interior roof of second mounting groove, second heat conduction strip (10) and second heat conduction base plate (9) are all through tin soldering fixed connection in the inside of dovetail groove and second mounting groove.
5. The IGBT module heat dissipation structure according to claim 1, wherein: second water inlet (18) and second delivery port (19) have been seted up to the left and right sides symmetry of the positive inside of water-cooling board (5), middle cavity (20) have been seted up to the inside of water-cooling board (5), the inside of water-cooling board (5) and the bilateral symmetry that is located middle cavity (20) have seted up left cavity (21) and right cavity (22), mutual intercommunication's public runner (25) have all been seted up to the front end of middle cavity (20), the front end of left cavity (21) and the front end of right cavity (22), the inner wall of public runner (25) just with the equal fixedly connected with in position that middle cavity (20) middle part corresponds, the position that left cavity (21) middle part corresponds and the position that right cavity (22) middle part corresponds separate strip (23).
6. The IGBT module heat dissipation structure according to claim 5, wherein: the second water inlet (18) and the second water outlet (19) are respectively communicated with the left cavity (21) and the right cavity (22), the second water inlet (18) and the second water outlet (19) are respectively located on the left side of the internal separation strip (23) of the left cavity (21) and the right side of the internal separation strip (23) of the right cavity (22), six diversion strips (24) which are symmetrically distributed relative to the separation strip (23) are fixedly connected to the inside of the middle cavity (20), the inside of the left cavity (21) and the inside of the right cavity (22), one end of each diversion strip (24) far away from the public flow channel (25) and one end of each separation strip (23) far away from the public flow channel (25) are respectively not in contact with the inner wall of the corresponding middle cavity (20), the inner wall of the left cavity (21) is not in contact with the inner wall of the right cavity (22), and the inside of the second water inlet (18) and the second water outlet (19) are respectively fixedly connected with a second water inlet pipe (7) and a second water outlet pipe (22) 8).
7. The IGBT module heat dissipation structure according to claim 1, wherein: it is a plurality of radiating fin (12) are equidistant distribution, and radiating fin's (12) upper surface and seal box (13) interior roof fixed connection, the outside radiating fin (12) leave the space with the inner wall of seal box (13), first water inlet and first delivery port have been seted up respectively in the middle part of the back lower extreme of seal box (13) and front lower extreme middle part, the inside fixedly connected with of first delivery port goes out first outlet pipe (14).
8. The IGBT module heat dissipation structure according to claim 7, wherein: one end, far away from the seal box (13), of the first water outlet pipe (14) is fixedly connected with a micro water cooler (16) through a first connecting pipe (15), and the water outlet end of the micro water cooler (16) is fixedly connected with the second water inlet pipe (7) through a second connecting pipe (17).
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| CN202110812308.6A CN113611677A (en) | 2021-07-16 | 2021-07-16 | IGBT module heat radiation structure |
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| CN202110812308.6A CN113611677A (en) | 2021-07-16 | 2021-07-16 | IGBT module heat radiation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242672A (en) * | 2021-12-10 | 2022-03-25 | 北京微焓科技有限公司 | Uniform-temperature heat dissipation device and IGBT module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242672A (en) * | 2021-12-10 | 2022-03-25 | 北京微焓科技有限公司 | Uniform-temperature heat dissipation device and IGBT module |
| CN114242672B (en) * | 2021-12-10 | 2022-09-06 | 北京微焓科技有限公司 | Uniform-temperature heat dissipation device and IGBT module |
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Application publication date: 20211105 |