CN105390460A - IGBT (Insulated Gate Bipolar Transistor) hybrid radiator - Google Patents
IGBT (Insulated Gate Bipolar Transistor) hybrid radiator Download PDFInfo
- Publication number
- CN105390460A CN105390460A CN201510911904.4A CN201510911904A CN105390460A CN 105390460 A CN105390460 A CN 105390460A CN 201510911904 A CN201510911904 A CN 201510911904A CN 105390460 A CN105390460 A CN 105390460A
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- China
- Prior art keywords
- square groove
- medium
- igbt
- gathering sill
- communicated
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The present invention discloses an IGBT (Insulated Gate Bipolar Transistor) hybrid radiator. The IGBT hybrid radiator comprises a rectangular cooling plate, wherein a medium outlet and a medium inlet are alternately formed on the cooling plate, an outflow guide groove is formed at a position relative to the medium outlet, and an inflow guide groove is formed at a position relative to the medium inlet; and multiple square grooves in the vertical direction are formed communicating with the outflow guide groove and the inflow guide groove, and cooling fins are arranged in the square grooves; medium inlet and outlet interfaces are arranged on an inner cavity cooling plate, the guide grooves for inflow and outflow of a cooling medium are formed at relative positions, and the square grooves communicating with the fluid inlet and outlet guide grooves are formed in the vertical direction; and meanwhile, the cooling fins are placed in a few of the square grooves, so that the flow velocity of the medium in a corresponding flow passage is reduced, the local heat exchange area is increased, and heat exchange can be implemented more uniformly and completely, and meanwhile, the pressure resistance of a water cooling plate is enhanced by increasing from the original conventional withstand pressure of 0.3 MPa to 0.8 MPa. The use reliability is greatly improved, and the heat dissipation effect is good.
Description
Technical field
The present invention relates to heat sink technology field, especially a kind of IGBT hybrid heat sink.
Background technology
IGBT(insulated gate bipolar transistor) by BJT(double pole triode) and MOS(insulating gate type field effect tube) the compound full-control type voltage driven type power semiconductor that forms, have the advantage of the high input impedance of MOSFET and low conduction voltage drop two aspect of GTR concurrently, not only driving power is little, and saturation pressure reduces, being applicable to very much being applied to direct voltage is that 600V and above AC system are as fields such as alternating current machine, frequency converter, Switching Power Supply, lighting circuit, Traction Drives.Under environmental problem increasingly serious now and energy resource consumption pressure, low-carbon economy is just becoming the development common recognition of countries in the world, and the fields such as the energy-saving and emission-reduction of IGBT involved by low-carbon economy, new forms of energy, high ferro, intelligent grid play indispensable important function, be the crucial core " core " of low-carbon economy.
Radiator of the prior art, poor to the radiating effect of transistor, dependability is poor.
Summary of the invention
The applicant is for the shortcoming in above-mentioned existing production technology, and provide a kind of IGBT hybrid heat sink rational in infrastructure, thus substantially increase the heat radiation to transistor, its reliability is high, good heat dissipation effect, meets the cooling requirement needed for IGBT completely.
The technical solution adopted in the present invention is as follows:
A kind of IGBT hybrid heat sink, comprise into the coldplate of rectangular structure, on described coldplate, interval has media outlet and medium entrance, has outflow gathering sill with media outlet relative position, has inflow gathering sill with medium entrance relative position; With flow out gathering sill and flow into the square groove having again many vertical directions that gathering sill communicates, in described square groove, installation is placed with cooling fins.
Further improvement as technique scheme:
On described coldplate, interval has eight square grooves, described coldplate also offers the first connectivity slot, the second connectivity slot and third connecting groove; Coldplate from left to right first square groove top is communicated with by the first connectivity slot with between the 4th square groove top, and the bottom of first square groove is for flowing out gathering sill, and the top of second and third square groove is communicated with, and the bottom of second square groove is for flowing into gathering sill; Be communicated with by the second connectivity slot between the bottom of the bottom of the 3rd square groove and the 6th square groove, the bottom of fourth, fifth square groove is communicated with, and the top of the 5th square groove is communicated with by third connecting groove with the top of the 8th square groove, is communicated with bottom the 7th, eight square groove.
Beneficial effect of the present invention is as follows:
Compact conformation of the present invention, rationally, easy to operate, by being provided with medium inlet and outlet connectors on inner chamber coldplate, relative position has again the gathering sill flowing into and flow out coolant, the square groove having again many vertical directions communicated with fluid inlet and outlet gathering sill.Simultaneously place cooling fins in the middle of several square grooves wherein, reduce the flow velocity of medium in corresponding runner, add Local Heat Transfer area, make heat exchange evenly thoroughly.Also enhance the voltage endurance capability of cooled plate simultaneously, increase to 0.8MPa by original conventional withstand voltage 0.3MPa.Substantially increase dependability, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is vertical view of the present invention.
Wherein: 1, media outlet; 2, medium entrance; 3, gathering sill is flowed into; 4, gathering sill is flowed out; 5, square groove; 6, the first connectivity slot; 7, the second connectivity slot; 8, coldplate; 9, third connecting groove; 10, cooling fins.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
As depicted in figs. 1 and 2, the IGBT hybrid heat sink of the present embodiment, comprises into the coldplate 8 of rectangular structure, and on coldplate 8, interval has media outlet 1 and medium entrance 2, have with media outlet 1 relative position and flow out gathering sill 4, have with medium entrance 2 relative position and flow into gathering sill 3; With flow out gathering sill 4 and flow into the square groove 5 having again many vertical directions that gathering sill 3 communicates, in square groove 5, installation is placed with cooling fins 10.
On coldplate 8, interval has eight square grooves 5, coldplate 8 also offers the first connectivity slot 6, second connectivity slot 7 and third connecting groove 9; Coldplate 8 from left to right first square groove 5 top is communicated with by the first connectivity slot 6 with between the 4th square groove 5 top, the bottom of first square groove 5 is for flowing out gathering sill 4, the top of second and third square groove 5 is communicated with, and the bottom of second square groove 5 is for flowing into gathering sill 3; Be communicated with by the second connectivity slot 7 between the bottom of the bottom of the 3rd square groove 5 and the 6th square groove 5, the bottom of fourth, fifth square groove 5 is communicated with, the top of the 5th square groove 5 is communicated with by third connecting groove 9 with the top of the 8th square groove 5, is communicated with bottom the 7th, eight square groove 5.
The design of cooling fins 10 of the present invention, reduces the flow velocity of medium in corresponding runner, adds Local Heat Transfer area, makes heat exchange evenly thoroughly.Also enhance the voltage endurance capability of coldplate 8 simultaneously, increase to 0.8MPa by original conventional withstand voltage 0.3MPa.
In actual mechanical process, be positioned over by igbt transistor on production board face, then inner chamber passes into coolant, coolant flows in square groove 5 by inlet channel equably, flow to square groove 5 by gathering sill, then flow through fin by square groove 5, its heat radiation just completes jointly primarily of square groove 5 and cooling fins 10.This type of cooling is by changing the quantity of square groove 5, size, position and different fin specifications, and both perfect adaptations reach the cooling requirement needed for IGBT.
In addition, this product adopts vacuum brazing technique to make, need not only ensure the fastness of soldering between two plates but also ensure the fastness of fin and plate soldering during soldering, different from conventional braze technique, need make through the precision of rational design in early stage and each parts, suitable soldering processes design, three's perfect adaptation finally ensures the qualification of product.
The present invention places the structure of fin in square groove 5, reduces the flow velocity of product, adds the heat exchange area of medium, and heat exchange is evenly thoroughly.
More than describing is explanation of the invention, and be not the restriction to invention, limited range of the present invention, see claim, within protection scope of the present invention, can do any type of amendment.
Claims (2)
1. an IGBT hybrid heat sink, it is characterized in that: the coldplate (8) comprising into rectangular structure, the upper interval of described coldplate (8) has media outlet (1) and medium entrance (2), have with media outlet (1) relative position and flow out gathering sill (4), have with medium entrance (2) relative position and flow into gathering sill (3); With flow out gathering sill (3) and flow into the square groove (5) having again many vertical directions that gathering sill (4) communicates, the interior installation of described square groove (5) is placed with cooling fins (10).
2. IGBT hybrid heat sink as claimed in claim 1, it is characterized in that: the upper interval of described coldplate (8) has eight square grooves (5), described coldplate (8) also offers the first connectivity slot (6), the second connectivity slot (7) and third connecting groove (9); Coldplate (8) from left to right first square groove (5) top is communicated with by the first connectivity slot (6) with between the 4th square groove (5) top, the bottom of first square groove (5) is for flowing out gathering sill (3), the top of second and third square groove (5) is communicated with, and the bottom of second square groove (5) is for flowing into gathering sill (4); Be communicated with by the second connectivity slot (7) between the bottom of the bottom of the 3rd square groove (5) and the 6th square groove (5), the bottom of fourth, fifth square groove (5) is communicated with, the top of the 5th square groove (5) is communicated with by third connecting groove (9) with the top of the 8th square groove (5), and the 7th, eight square groove (5) bottom is communicated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510911904.4A CN105390460B (en) | 2015-12-11 | 2015-12-11 | IGBT hybrid heat sinks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510911904.4A CN105390460B (en) | 2015-12-11 | 2015-12-11 | IGBT hybrid heat sinks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105390460A true CN105390460A (en) | 2016-03-09 |
| CN105390460B CN105390460B (en) | 2018-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510911904.4A Active CN105390460B (en) | 2015-12-11 | 2015-12-11 | IGBT hybrid heat sinks |
Country Status (1)
| Country | Link |
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| CN (1) | CN105390460B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960147A (en) * | 2016-06-13 | 2016-09-21 | 东南大学 | Spiral fractal based integrated micro flat plate heat pipe |
| CN107248507A (en) * | 2017-07-06 | 2017-10-13 | 华南理工大学 | A kind of IGBT module liquid cooling plate connected based on spout and its manufacture method |
| WO2017181840A1 (en) * | 2016-04-22 | 2017-10-26 | 珠海格力电器股份有限公司 | Igbt module assembly |
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| JPH02110959A (en) * | 1988-10-19 | 1990-04-24 | Hitachi Cable Ltd | Planar cooling body |
| JP2005019794A (en) * | 2003-06-27 | 2005-01-20 | Mitsubishi Electric Corp | Cooling device |
| CN101895189A (en) * | 2009-05-22 | 2010-11-24 | Ls产电株式会社 | Water-cooled cooler and inverter with this water-cooled cooler |
| CN102762075A (en) * | 2011-04-25 | 2012-10-31 | 北汽福田汽车股份有限公司 | Balanced heat dissipation liquid cooling device |
| CN202888157U (en) * | 2012-05-21 | 2013-04-17 | 株洲南车奇宏散热技术有限公司 | Liquid cooling plate-type radiator used for electric power semiconductor element |
| CN103415191A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Temperature equalizing device of heat pipe/micro channel cold plate composite structure |
| CN203482570U (en) * | 2013-09-18 | 2014-03-12 | 无锡马山永红换热器有限公司 | Water-cooling substrate |
| CN203661498U (en) * | 2013-12-24 | 2014-06-18 | 周细文 | Water cooling plate for heat radiation of large-power electric heating element |
| CN204392764U (en) * | 2015-03-12 | 2015-06-10 | 株洲南车奇宏散热技术有限公司 | A kind of cooled plate |
| CN204558620U (en) * | 2015-04-29 | 2015-08-12 | 启明信息技术股份有限公司 | A kind of batteries of electric automobile module liquid cooling apparatus |
| CN205211732U (en) * | 2015-12-11 | 2016-05-04 | 无锡方盛换热器股份有限公司 | Mixed radiator of IGBT |
-
2015
- 2015-12-11 CN CN201510911904.4A patent/CN105390460B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110959A (en) * | 1988-10-19 | 1990-04-24 | Hitachi Cable Ltd | Planar cooling body |
| JP2005019794A (en) * | 2003-06-27 | 2005-01-20 | Mitsubishi Electric Corp | Cooling device |
| CN101895189A (en) * | 2009-05-22 | 2010-11-24 | Ls产电株式会社 | Water-cooled cooler and inverter with this water-cooled cooler |
| CN102762075A (en) * | 2011-04-25 | 2012-10-31 | 北汽福田汽车股份有限公司 | Balanced heat dissipation liquid cooling device |
| CN202888157U (en) * | 2012-05-21 | 2013-04-17 | 株洲南车奇宏散热技术有限公司 | Liquid cooling plate-type radiator used for electric power semiconductor element |
| CN103415191A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Temperature equalizing device of heat pipe/micro channel cold plate composite structure |
| CN203482570U (en) * | 2013-09-18 | 2014-03-12 | 无锡马山永红换热器有限公司 | Water-cooling substrate |
| CN203661498U (en) * | 2013-12-24 | 2014-06-18 | 周细文 | Water cooling plate for heat radiation of large-power electric heating element |
| CN204392764U (en) * | 2015-03-12 | 2015-06-10 | 株洲南车奇宏散热技术有限公司 | A kind of cooled plate |
| CN204558620U (en) * | 2015-04-29 | 2015-08-12 | 启明信息技术股份有限公司 | A kind of batteries of electric automobile module liquid cooling apparatus |
| CN205211732U (en) * | 2015-12-11 | 2016-05-04 | 无锡方盛换热器股份有限公司 | Mixed radiator of IGBT |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017181840A1 (en) * | 2016-04-22 | 2017-10-26 | 珠海格力电器股份有限公司 | Igbt module assembly |
| US10811333B2 (en) | 2016-04-22 | 2020-10-20 | Gree Electric Appliances, Inc. Of Zhuhai | IGBT module assembly |
| CN105960147A (en) * | 2016-06-13 | 2016-09-21 | 东南大学 | Spiral fractal based integrated micro flat plate heat pipe |
| CN107248507A (en) * | 2017-07-06 | 2017-10-13 | 华南理工大学 | A kind of IGBT module liquid cooling plate connected based on spout and its manufacture method |
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| Publication number | Publication date |
|---|---|
| CN105390460B (en) | 2018-01-09 |
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