CN114242672B - Uniform-temperature heat dissipation device and IGBT module - Google Patents
Uniform-temperature heat dissipation device and IGBT module Download PDFInfo
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- CN114242672B CN114242672B CN202111502901.7A CN202111502901A CN114242672B CN 114242672 B CN114242672 B CN 114242672B CN 202111502901 A CN202111502901 A CN 202111502901A CN 114242672 B CN114242672 B CN 114242672B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
The application relates to the technical field of heat dissipation, in particular to a uniform-temperature heat dissipation device and an IGBT module. The temperature-equalizing heat dissipation device comprises a heat conduction substrate and a temperature-equalizing heat dissipation module, wherein the temperature-equalizing heat dissipation module comprises a vertical plate component and a heat dissipation component; the vertical plate component is vertically arranged on the heat-conducting substrate, a circulating channel is formed between the interior of the vertical plate component and the interior of the heat-conducting substrate, and a cooling working medium flows through the circulating channel; the heat conducting substrate is used for contacting a heat source so that the cooling working medium is absorbed and evaporated in the heat conducting substrate and flows into the vertical plate component through the circulating channel; the heat dissipation member is arranged on the outer wall of the vertical plate member, so that the cooling working medium is dissipated and condensed in the vertical plate member and flows back to the heat conduction substrate through the circulation channel. The IGBT module comprises the temperature-equalizing heat dissipation device. This samming heat abstractor and this IGBT module can be rapidly with on the heat dissipation component on the heat source produced conducts the riser component, through the heat dissipation component with the heat arrange the heat to the heat sink, realized the high-efficient cooling heat dissipation to the heat source.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a uniform-temperature heat dissipation device and an IGBT module.
Background
An IGBT (Insulated Gate Bipolar Transistor) is a composite fully-controlled voltage-driven power semiconductor device composed of a Bipolar Transistor and an Insulated Gate field effect Transistor.
At present, a plurality of IGBT modules are generally integrated on a uniform temperature heat dissipation plate, and then the uniform temperature heat dissipation plate is directly cooled through a structure that a heat pipe is assisted by a radiator so as to dissipate heat of the plurality of IGBT modules.
However, this heat dissipation scheme has low heat dissipation efficiency and cannot meet the requirement that the temperature of the heat source contact surface of the heat sink is kept below 83 ℃ at the ambient temperature of 40 ℃.
Disclosure of Invention
The application aims to provide a uniform temperature heat dissipation device and an IGBT module so as to solve the technical problems that in the prior art, the heat dissipation efficiency of a heat radiator is low and the heat dissipation requirement of the IGBT cannot be met to a certain extent.
The application provides a uniform-temperature heat dissipation device which comprises a heat conduction substrate and a uniform-temperature heat dissipation module, wherein the uniform-temperature heat dissipation module comprises a vertical plate component and a heat dissipation component;
the vertical plate component is vertically arranged on the heat conducting substrate, a circulating channel is formed between the interior of the vertical plate component and the interior of the heat conducting substrate, and a cooling working medium flows through the circulating channel;
the heat conducting substrate is used for contacting a heat source so that the cooling working medium is subjected to heat absorption and evaporation in the heat conducting substrate and flows into the vertical plate component through the circulating channel;
the heat dissipation member is arranged on the outer wall of the vertical plate member, so that the cooling working medium is dissipated and condensed in the vertical plate member and flows back to the heat conduction substrate through the circulation channel.
In the above technical solution, further, the temperature-equalizing heat-dissipating module further includes a circulating plate member;
the number of the vertical plate members is multiple, the vertical plate members are arranged on the heat conduction substrate side by side at intervals, and the heat dissipation members are arranged between every two adjacent vertical plate members;
the first cavity is formed inside the heat-conducting substrate, the second cavity is formed inside the vertical plate member, the third cavity is formed inside the circulating plate member, and the first cavity, the second cavity and the third cavity are communicated in sequence to form the circulating channel.
In any of the above technical solutions, further, a barrier belt is disposed inside the second cavity, and the barrier belt divides the second cavity into a gas cavity and a reflux cavity;
one end of the first cavity is communicated with one end of the third cavity through the gas cavity, and the other end of the first cavity is communicated with the other end of the third cavity through the reflux cavity.
In any of the above technical solutions, further, a ratio of lengths of the openings of the gas cavity and the backflow cavity facing the first cavity is greater than 1;
a ratio of a length of an opening of the gas cavity to the return cavity facing the third cavity is less than 1.
In any of the above technical solutions, further, a ratio of a length of an opening of the gas cavity facing the first cavity to a length of an opening of the return cavity is 1.5 to 3;
a ratio 1/3-2/3 of a length of an opening of the gas cavity to the recirculation cavity facing the third cavity;
the barrier belt is in an arc shape protruding towards the backflow cavity.
In any of the above technical solutions, further, a plurality of flow-guiding heat-conducting strips are arranged in the second cavity at intervals side by side, and a flow-guiding channel for communicating the first cavity with the third cavity is formed between every two adjacent flow-guiding heat-conducting strips.
In any of the above technical solutions, further, an average arrangement interval of the flow guide and heat conduction strips of the backflow cavity is smaller than an average arrangement interval of the flow guide and heat conduction strips in the gas cavity.
In any of the above technical solutions, further, the flow guide heat conduction strip is provided with a discontinuous portion, and the discontinuous portion penetrates through the flow guide channels on two sides of the flow guide heat conduction strip.
In any of the above technical solutions, further, the temperature-equalizing heat dissipation device includes a plurality of temperature-equalizing heat dissipation modules;
the tooth space of at least two of the temperature-equalizing heat-radiating modules is different;
the material of the temperature-equalizing heat-radiating device is aluminum.
The application also provides an IGBT module, including above-mentioned arbitrary technical scheme of IGBT module samming heat abstractor, the IGBT module set up in on samming heat abstractor's the heat conduction base plate.
Compared with the prior art, the beneficial effect of this application is:
the application provides a samming heat abstractor includes heat conduction base plate and samming heat dissipation module, and samming heat dissipation module includes riser component and radiating component. The heat conducting substrate is used for contacting a heat source so that the cooling working medium is absorbed and evaporated in the heat conducting substrate and flows into the vertical plate component through the circulating channel; the heat dissipation component is arranged on the outer wall of the vertical plate component, so that cooling working media are subjected to heat dissipation and condensation in the vertical plate component and flow back to the heat conduction substrate through the circulation channel, the heat conduction substrate is communicated with the vertical plate component through the circulation channel, heat generated by a heat source can be rapidly conducted to the heat dissipation component on the vertical plate component, heat on the heat dissipation component is discharged to a heat sink through air cooling, convection and the like, efficient cooling and heat dissipation of the heat source are achieved, and the temperature of the heat source is controlled within a reasonable range.
The application provides an IGBT module, including foretell samming heat abstractor, therefore can realize all beneficial effects of this samming heat abstractor, specifically speaking, can make the contact surface temperature control of the IGBT module in the IGBT module and heat conduction base below 83 ℃ at least under ambient temperature 40 ℃.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a first structural schematic diagram of an IGBT module according to a second embodiment of the present application;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
fig. 3 is a second schematic structural diagram of an IGBT module according to the second embodiment of the present application;
fig. 4 is a schematic diagram of a third structure of the IGBT module according to the second embodiment of the present application;
FIG. 5 is an enlarged view of a portion of FIG. 4 at B;
fig. 6 is a fourth schematic structural diagram of an IGBT module according to the second embodiment of the present application;
fig. 7 is a cross-sectional view of fig. 6 at section C-C.
Reference numerals are as follows:
1-an IGBT module; 10-an IGBT module; 11-a temperature-equalizing heat-dissipating device; 110-a thermally conductive substrate; 1100-a first cavity; 1101-aluminum powder sintered layer; 111-temperature-equalizing heat-dissipating module; 1110-a riser member; 11100-a flow-guiding heat-conducting strip; 11101-gas chamber; 11102-reflux cavity; 11103-barrier tape; 11104-discontinuity; 1111-a heat dissipating member; 1112-a circulating plate member; 11120-third Chamber.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
With reference to fig. 1 to 7, an embodiment of the present application provides a uniform temperature heat dissipation device 11 for cooling and dissipating heat of a heat generating device, in particular, cooling and dissipating heat of an IGBT module 10, so that the IGBT module 10 is stabilized in a suitable temperature range, and operation stability is ensured.
The uniform temperature heat dissipation device 11 provided in this embodiment includes a heat conduction substrate 110 and a uniform temperature heat dissipation module 111, where the uniform temperature heat dissipation module 111 includes a vertical plate member 1110 and a heat dissipation member 1111.
The heat dissipating member 1111 may be an air-cooled heat sink, and particularly, may be a finned air-cooled heat sink.
The vertical plate member 1110 is vertically disposed on the heat conducting substrate 110, a circulation channel is formed between the interior of the vertical plate member 1110 and the interior of the heat conducting substrate 110, and a cooling working medium flows through the circulation channel, that is, the cooling working medium can flow to the interior of the vertical plate member 1110 and the interior of the heat conducting substrate 110 along the circulation channel, so that heat is transported between the vertical plate member 1110 and the heat conducting substrate 110 through the cooling working medium.
The heat conducting substrate 110 is used for contacting a heat source, the temperature of the heat source is high, so that the heat of the heat conducting substrate 110 is transferred to the cooling working medium inside the heat conducting substrate 110 through the heat conducting substrate 110, when the temperature reaches the boiling point of the cooling working medium, the cooling working medium is changed into high-temperature saturated steam in a phase mode, namely, the cooling working medium is enabled to be evaporated in the heat conducting substrate 110 in a heat absorption mode to become a gaseous high-temperature cooling working medium, and the high-temperature gaseous cooling working medium flows into the vertical plate member 1110 through the circulating channel.
The heat radiation member 1111 is disposed on the outer wall of the vertical plate member 1110, the high-temperature gaseous cooling working medium heats the vertical plate member 1110, and the heat radiation member 1111 cools the vertical plate member 1110 after heating, so that the high-temperature gaseous cooling working medium is cooled and condensed in the vertical plate member 1110 to become a low-temperature liquid cooling working medium, the low-temperature liquid cooling working medium flows back to the heat conduction substrate 110 through the circulation channel, thereby continuously absorbing the heat of the heat source, and the absorbed heat is discharged outwards through the heat radiation member 1111.
Optionally, the cooling working medium is a refrigerant, such as acetone, R134a, R123, 1233ZD or R1234ZE, and further optionally, the filling rate of the cooling working medium in the circulation channel is 55 ± 3%.
In an alternative of this embodiment, the temperature-equalizing heat-dissipating module 111 further includes a circulation plate member 1112.
The number of the vertical plate members 1110 is plural, the plurality of vertical plate members 1110 are arranged on the heat conducting substrate 110 side by side at intervals, and the heat dissipation members 1111 are arranged between the adjacent vertical plate members 1110, so that the number of the heat dissipation members 1111 and the contact area between the heat dissipation members 1111 and the vertical plate members 1110 can be effectively increased, that is, the total heat dissipation area is effectively increased, the condensation efficiency of the cooling working medium is increased, and further, the overall heat dissipation efficiency of the uniform temperature heat dissipation device 11 is increased.
The first cavity 1100 is formed inside the heat conductive substrate 110, the second cavity is formed inside the riser member 1110, the third cavity 11120 is formed inside the circulating plate member 1112, and the first cavity 1100, the second cavity, and the third cavity 11120 are sequentially communicated to form a circulating channel. That is to say, the cooling working medium is in the first cavity 1100 for heat absorption evaporation, the gas cooling working medium after the evaporation flows to the second cavity for heat dissipation condensation, the cooling working medium after the condensation assembles in the third cavity 11120, and then flows back to the plurality of first cavities 1100 by the one-to-one correspondence of the plurality of second cavities to carry out the heat absorption evaporation of a new round, and the circulation is continuous in proper order, thereby realizes the quick diffusion and the transfer of heat.
Since the heat sources corresponding to the first cavities 1100 have different temperatures and the heat dissipation members 1111 corresponding to the second cavities have different heat dissipation efficiencies, the pressure, temperature, and condensation ratio of the cooling medium flowing out of the second cavities are different. All the second cavities are communicated through the third cavity 11120, so that the cooling working media flowing out of all the second cavities can be mixed in the third cavity 11120, the mixed cooling working media are redistributed back to the second cavities, the uniformity of the cooling working media in the second cavities in the parameters of multiple dimensions such as pressure, temperature and condensation ratio can be improved, and the space uniformity of the cooling effect of a heat source is improved.
In this embodiment, the second chamber is internally disposed in the barrier 11103, and the barrier 11103 divides the second chamber into a gas chamber 11101 and a reflow chamber 11102.
One end of the first cavity 1100 is communicated with one end of the third cavity 11120 through the gas cavity 11101, the other end of the first cavity 1100 is communicated with the other end of the third cavity 11120 through the backflow cavity 11102, so that gas-liquid flow division can be realized through the barrier belt 11103, gaseous cooling working medium flows to the gas cavity 11101 from the first cavity 1100, flows to the backflow cavity 11102 through the third cavity 11120 after being cooled in the gas cavity 11101, heat is continuously condensed in the backflow cavity 11102 to release, and finally liquid cooling working medium flows back to the first cavity 1100 through the backflow cavity 11102. The gas cavity 11101 has a high temperature and a high pressure, and the reflux cavity 11102 has a low temperature and a low pressure, so that the cooling medium moves from the gas cavity 11101 to the reflux cavity 11102 through the third cavity 11120 under the pressure.
In a using state, the gas cavity 11101 is arranged above the reflux cavity 11102, so that the cooling working medium in the first cavity 1100 is evaporated and then moves upwards to enter the gas cavity 11101, and in addition, the cooling working medium in the third cavity 11120 can be condensed and then moves downwards to enter the reflux cavity 11102, and gas-liquid flow splitting is assisted by gravity.
Optionally, an aluminum powder sintered layer 1101 is disposed in the first cavity 1100, and capillary force is provided for the cooling medium by the aluminum powder sintered layer 1101, so that the cooling medium is uniformly distributed along the height direction of the first cavity 1100, rather than being gathered at the bottom of the first cavity 1100.
In this embodiment, the length of the opening of the gas chamber 11101 facing the first chamber 1100 is defined as a first length, and the length of the opening of the backflow chamber 11102 facing the first chamber 1100 is defined as a second length, so as to ensure that the cooling medium evaporated in the first chamber 1100 can smoothly flow to the gas chamber 11101, the ratio of the first length to the second length is greater than 1, that is, the first length is greater than the second length.
Specifically, the ratio of the first length to the second length is 1.5-3, wherein by being limited to be not less than 1.5, it is ensured that the opening of the gas cavity 11101 facing the first cavity 1100 is large enough for the gas cooling medium to smoothly flow into the gas cavity 11101, and by being limited to be not more than 3, it is ensured that the opening of the backflow cavity 11102 facing the first cavity 1100 is not too small for the cooling medium to smoothly flow back to the first cavity 1100. For example, the ratio of the first length to the second length is 1.5, 2, 2.5, or 3.
In this embodiment, the length of the opening of the gas chamber 11101 facing the third chamber 11120 is defined as a third length, and the length of the opening of the gas chamber 11102 facing the third chamber 11120 is defined as a fourth length, so as to ensure that the condensed cooling medium can smoothly flow back from the third chamber 11120 to the second chamber, the ratio of the third length to the fourth length is less than 1, that is, the third length is less than the fourth length.
Specifically, the ratio of the third length to the fourth length is 1/3-2/3, wherein by defining no less than 1/3, the opening of gas chamber 11101 facing third chamber 11120 is ensured to be sufficiently large for the smooth flow of gaseous cooling medium out of gas chamber 11101, and by defining no more than 2/3, the opening of recirculation chamber 11102 facing third chamber 11120 is ensured to be sufficiently large for the smooth flow of cooling medium into recirculation chamber 11102. For example, the ratio of the third length to the fourth length is 1/3, 1/2, or 2/3.
In this embodiment, to further reduce the flow resistance to the gas cooling medium, the barrier tape 11103 has an arc shape convex toward the reflow chamber 11102.
In the alternative of this embodiment, a plurality of flow-guiding heat-conducting strips 11100 arranged side by side at intervals are arranged in the second cavity, a flow-guiding channel for communicating the first cavity 1100 with the third cavity 11120 is formed between every two adjacent flow-guiding heat-conducting strips 11100, so that the cooling medium flows between the first cavity 1100 and the third cavity 11120 through the second cavity along the flow-guiding channel, and the cooling medium contacts with the flow-guiding heat-conducting strips 11100 in the flowing process, thereby transferring the heat of the cooling medium to the flow-guiding heat-conducting strips 11100, and the heat dissipation member 1111 cools the flow-guiding heat-conducting strips 11100 by dissipating heat from the flow-guiding heat-conducting strips 11100, thereby achieving efficient cooling and condensation of the cooling medium in the flow-guiding channel.
That is to say, through setting up water conservancy diversion heat conduction area 11100, increased the heat transfer area between riser component 1110 and the cooling working medium to the cooling condensation efficiency to the cooling working medium has been improved.
In this embodiment, the average interval of the flow-guiding and heat-conducting strips 11100 of the backflow cavity 11102 is smaller than the average interval of the flow-guiding and heat-conducting strips 11100 in the gas cavity 11101, so that the heat exchange efficiency in the backflow cavity 11102 is higher than that in the gas cavity 11101, the cooling medium flowing into the backflow cavity 11102 is efficiently cooled, and the cooling medium flowing back into the first cavity 1100 is prevented from being completely condensed.
In this embodiment, the diversion heat conduction band 11100 is provided with the discontinuous portion 11104, and the discontinuous portion 11104 penetrates through the diversion channels on the two sides of the diversion heat conduction band 11100, so that the cooling working medium forms turbulent flow in the second cavity to the first extent, the staying time of the cooling working medium in the second cavity is prolonged, the heat dissipation and condensation effects of the cooling working medium are further improved, and the heat dissipation efficiency of the uniform temperature heat dissipation device 11 is also improved.
In an alternative of this embodiment, the temperature-equalizing heat-dissipating device 11 includes a plurality of temperature-equalizing heat-dissipating modules 111, and when the number of heat sources is multiple or the area of the heat source is large, the heat-equalizing heat-dissipating device can satisfy a large heat-dissipating requirement of the plurality of temperature-equalizing heat-dissipating modules 111.
Specifically, in the case where the heat source includes a plurality of sub heat sources, the plurality of sub heat sources can be radiated by the plurality of uniform temperature radiation modules 111 in a one-to-one correspondence. The heat dissipation scheme that the forming relieved tooth radiator that usually adopts is assisted with the heat pipe among the prior art has bulky, strict customization and characteristics with high costs, compares in current heat dissipation scheme, should satisfy the heat dissipation scheme of its large tracts of land heat dissipation demand through a plurality of samming heat dissipation module 111, can carry out the modularization equipment to samming heat dissipation module 111 according to the quantity of the sub heat source of heat source and the distribution characteristics, and the commonality is strong, extensive applicability.
In this embodiment, the pitches of at least two uniform temperature heat dissipation modules 111 in the plurality of uniform temperature heat dissipation modules 111 are different, so that the pitch between the heat dissipation members 1111 of the uniform temperature heat dissipation module 111 is selected according to the power or the heat generation efficiency of the heat source corresponding to the uniform temperature heat dissipation module 111. Specifically, when the power of the heat source is higher or the heat generation efficiency is higher, the inter-tooth distance of the heat discharging member 1111 of the temperature-uniforming heat discharging module 111 is smaller.
Specifically, in the case where the heat source includes sub heat sources of a plurality of powers, the tooth pitch of the soaking heat dissipation module 111 corresponding thereto may be determined for the power of each sub heat source. When the plurality of sub heat sources are arranged in multiple rows, the power of all the sub heat sources in any row is the same, and the power of the sub heat sources in different rows is different, correspondingly, the plurality of uniform-temperature heat dissipation modules 111 are arranged in multiple rows, all the uniform-temperature heat dissipation modules 111 in each row are arranged in one-to-one correspondence with all the sub heat sources in each row, so that the tooth spaces of all the uniform-temperature heat dissipation modules 111 in any row are equal, and the tooth spaces of the uniform-temperature heat dissipation modules 111 in different rows are different.
In the alternative of this embodiment, since the temperature-equalizing heat-dissipating device 11 is located outdoors for a long time, the conventional heat pipe radiator or copper temperature-equalizing plate radiator has the risk of the electrochemical reaction of copper and aluminum, the temperature-equalizing heat-dissipating device 11 is made of aluminum, and the temperature-equalizing heat-dissipating device 11 is made of all-aluminum, thereby fundamentally eliminating the risk of the electrochemical reaction of copper and aluminum.
Example two
The second embodiment provides an IGBT module, and the second embodiment includes the uniform-temperature heat dissipation device in the first embodiment, and the technical features of the uniform-temperature heat dissipation device disclosed in the first embodiment are also applicable to the first embodiment, and the technical features of the uniform-temperature heat dissipation device disclosed in the first embodiment are not described again.
Referring to fig. 1 to 7, the IGBT module 1 provided in this embodiment includes an IGBT module 10 and a uniform temperature heat sink 11, the IGBT module 10 is disposed on the heat conducting substrate 110 of the uniform temperature heat sink 11, so that heat generated by the IGBT module 10 during operation is conducted to the heat conducting substrate 110, and then, under the circulation action of a cooling working medium, heat absorbed by the heat conducting substrate 110 from the IGBT module 10 is transported to the vertical plate member 1110 and is transferred to the heat dissipating member 1111 through the vertical plate member 1110, and finally, the heat is discharged through the heat dissipating member 1111.
It is understood that, in the case where the IGBT module 1 includes a plurality of IGBT modules 10, each IGBT module 10 is a sub-heat source. Optionally, the IGBT module 1 includes a first IGBT module and a second IGBT module, and the plurality of uniform temperature heat dissipation modules 111 includes a first uniform temperature heat dissipation module 111 and a second uniform temperature heat dissipation module 111, and the first IGBT module is cooled and dissipated through the first uniform temperature heat dissipation module 111, and the second IGBT module is cooled and dissipated through the second uniform temperature heat dissipation module 111.
The power of the first IGBT module is greater than that of the second IGBT module, and the pitch between the heat dissipation members 1111 of the first isothermal heat dissipation module 111 is smaller than that of the heat dissipation members 1111 of the second isothermal heat dissipation module 111.
For example, the power of the first IGBT module is about twice that of the second IGBT module, and the pitch of the heat dissipation members 1111 of the first isothermal heat dissipation module 111 is 1.5-2.5 times, for example, 1.5 times, 1.8 times, 2 times, or 2.5 times that of the heat dissipation members 1111 of the second isothermal heat dissipation module 111.
The IGBT module in this embodiment has the advantages of the uniform-temperature heat dissipation device in the first embodiment, and the advantages of the uniform-temperature heat dissipation device disclosed in the first embodiment are not described again here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (9)
1. A temperature-equalizing heat-dissipating device is characterized by comprising a heat-conducting substrate and a temperature-equalizing heat-dissipating module, wherein the temperature-equalizing heat-dissipating module comprises a vertical plate member and a heat-dissipating member;
the vertical plate component is vertically arranged on the heat conducting substrate, a circulating channel is formed between the interior of the vertical plate component and the interior of the heat conducting substrate, and a cooling working medium flows through the circulating channel;
the heat conducting substrate is used for contacting a heat source so that the cooling working medium is subjected to heat absorption and evaporation in the heat conducting substrate and flows into the vertical plate component through the circulating channel;
the heat dissipation member is arranged on the outer wall of the vertical plate member, so that the cooling working medium is subjected to heat dissipation and condensation in the vertical plate member and flows back to the heat conduction substrate through the circulation channel;
the temperature-equalizing heat-dissipating module also comprises a circulating plate component;
the number of the vertical plate members is multiple, the vertical plate members are arranged on the heat conduction substrate side by side at intervals, and the heat dissipation members are arranged between every two adjacent vertical plate members;
the first cavity is formed inside the heat-conducting substrate, the second cavity is formed inside the vertical plate member, the third cavity is formed inside the circulating plate member, and the first cavity, the second cavity and the third cavity are communicated in sequence to form the circulating channel.
2. The temperature-equalizing heat sink device as claimed in claim 1, wherein a barrier strip is disposed inside the second cavity, the barrier strip dividing the second cavity into a gas cavity and a return cavity;
one end of the first cavity is communicated with one end of the third cavity through the gas cavity, and the other end of the first cavity is communicated with the other end of the third cavity through the reflux cavity.
3. The temperature-equalizing heat sink device according to claim 2, wherein a ratio of a length of an opening of the gas cavity to the return cavity facing the first cavity is greater than 1;
a ratio of a length of an opening of the gas cavity to the return cavity facing the third cavity is less than 1.
4. The temperature-equalizing heat sink device according to claim 3, wherein a ratio of a length of the opening of the gas cavity to the return cavity facing the first cavity is 1.5-3;
a ratio 1/3-2/3 of a length of an opening of the gas cavity to the recirculation cavity facing the third cavity;
the barrier belt is in an arc shape protruding towards the backflow cavity.
5. The temperature-equalizing heat sink device as claimed in claim 2, wherein a plurality of flow-guiding and heat-conducting strips are disposed in the second cavity, and a flow-guiding channel is formed between every two adjacent flow-guiding and heat-conducting strips for communicating the first cavity with the third cavity.
6. The temperature-equalizing heat sink device as claimed in claim 5, wherein the average arrangement interval of the flow-guiding and heat-conducting strips in the reflow chamber is smaller than the average arrangement interval of the flow-guiding and heat-conducting strips in the gas chamber.
7. The uniform-temperature heat sink according to claim 5, wherein the flow-guiding and heat-conducting strip is provided with a discontinuity portion, and the discontinuity portion penetrates through flow-guiding channels on two sides of the flow-guiding and heat-conducting strip.
8. The temperature-equalizing heat sink device according to claim 1, comprising a plurality of temperature-equalizing heat sink modules;
the tooth space of at least two of the temperature-equalizing heat-radiating modules is different;
the material of the uniform temperature heat dissipation device is aluminum.
9. An IGBT module, characterized by comprising an IGBT module and the temperature equalizing and heat dissipating device of any one of claims 1 to 8;
the IGBT module is arranged on the heat conducting substrate of the uniform temperature heat dissipation device.
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| CN202111502901.7A CN114242672B (en) | 2021-12-10 | 2021-12-10 | Uniform-temperature heat dissipation device and IGBT module |
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| CN202111502901.7A CN114242672B (en) | 2021-12-10 | 2021-12-10 | Uniform-temperature heat dissipation device and IGBT module |
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| CN114242672B true CN114242672B (en) | 2022-09-06 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205211737U (en) * | 2015-12-21 | 2016-05-04 | 思源清能电气电子有限公司 | Water -filled radiator for IGBT module |
| CN210807995U (en) * | 2019-02-25 | 2020-06-19 | 顺科新能源技术股份有限公司 | Temperature-equalizing heat dissipation structure suitable for IGBT module |
| CN113611677A (en) * | 2021-07-16 | 2021-11-05 | 深圳市芯愚公半导体有限公司 | IGBT module heat radiation structure |
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| CN110430733B (en) * | 2019-08-08 | 2020-11-20 | 盐城市钊扬工业设计有限公司 | High-efficient heat abstractor of electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205211737U (en) * | 2015-12-21 | 2016-05-04 | 思源清能电气电子有限公司 | Water -filled radiator for IGBT module |
| CN210807995U (en) * | 2019-02-25 | 2020-06-19 | 顺科新能源技术股份有限公司 | Temperature-equalizing heat dissipation structure suitable for IGBT module |
| CN113611677A (en) * | 2021-07-16 | 2021-11-05 | 深圳市芯愚公半导体有限公司 | IGBT module heat radiation structure |
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