CN212303315U

CN212303315U - High-voltage alternating current induction box

Info

Publication number: CN212303315U
Application number: CN202021222987.9U
Authority: CN
Inventors: 吴建华; 吴建新
Original assignee: Sulaifu Metal Technology Suzhou Co ltd
Current assignee: Sulaifu Metal Technology Suzhou Co ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2021-01-05
Anticipated expiration: 2030-06-24

Abstract

The utility model relates to the technical field of electrical equipment, and a high pressure alternating current inductance box is disclosed, comprises a box bod, the bottom fixedly connected with heat dissipation box of box body, the heat-conducting component of inductance is placed to the inside fixedly connected with of heat dissipation box, the fin that heat-conducting component's bottom fixedly connected with equidistance was arranged, the logical groove of dispelling the heat has all been seted up to the inside of fin, the heat radiation fins of the equal a plurality of symmetric distribution of the equal fixedly connected with in the left and right sides of fin, the inside fixedly connected with semiconductor refrigeration piece of heat dissipation box, the roof of semiconductor refrigeration piece and the bottom fixed connection of fin have high-efficient heat dissipation and satisfy the user demand, avoid the advantage of potential safety hazard. The utility model discloses a, the heat of having solved the inductance part relies on the inside cooling fan who sets up of dc-to-ac converter to hardly carry out effective heat dissipation, and the radiating effect is not fine, can not reach the heat dissipation demand, has the problem of potential safety hazard easily.

Description

High-voltage alternating current induction box

Technical Field

The utility model relates to the technical field of electrical equipment, specifically be a high voltage alternating current inductance box.

Background

The inductor is an element capable of converting electric energy into magnetic energy to be stored, the high-voltage alternating current induction box is an important component of an inverter structure, and the high-voltage alternating current induction box is mainly used for placing an inductor in a power system and helping the inductor to dissipate heat so as to ensure that the inductor can work normally.

At present, when inverter voltage is higher, and power is great, the inductance produces a large amount of heats easily, though the inside cooling fan that is provided with of inverter, single cooling fan often hardly dispels the heat effectively, especially the heat of inductance part, and the radiating effect is not very good, does not reach the heat dissipation demand under the long-time work operation operating mode, has the potential safety hazard easily, for this reason, provides a high voltage alternating current inductance box and solves above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a high-pressure alternating current inductance box has high-efficient heat dissipation and satisfies the user demand, avoids the advantage of potential safety hazard, and the heat that has solved the inductance part relies on the inside cooling fan that sets up of dc-to-ac converter to hardly dispel the heat effectively, and the radiating effect is not fine, does not reach the heat dissipation demand, has the problem of potential safety hazard easily.

(II) technical scheme

Satisfy the user demand for realizing above-mentioned high-efficient heat dissipation, avoid the purpose of potential safety hazard, the utility model provides a following technical scheme:

a high-voltage alternating current induction box comprises a box body, the bottom of the box body is fixedly connected with a heat dissipation box, the interior of the heat dissipation box is fixedly connected with a heat conduction component for placing an inductor, the bottom of the heat conduction component is fixedly connected with radiating fins which are arranged at equal intervals, the radiating fins are provided with radiating through grooves in the inner part, the left side and the right side of the radiating fins are fixedly connected with a plurality of radiating fins which are symmetrically distributed, the interior of the heat dissipation box is fixedly connected with a semiconductor refrigeration piece, the top plate of the semiconductor refrigeration piece is fixedly connected with the bottom of the heat dissipation piece, the inside of the heat dissipation box is fixedly connected with a water cooling plate, the top of the water cooling plate is fixedly connected with the bottom of the semiconductor refrigeration piece, the inside fixed mounting of heat dissipation box has the fan that is located water-cooling board bottom, heat-conducting component's inside fixedly connected with condenser tube, the both ends of condenser tube run through the heat dissipation box and extend to the front and the back of heat dissipation box.

Preferably, the heat conduction subassembly is including the heat-conducting plate, the outside fixedly connected with annular distribution's of heat-conducting plate heat conduction strip, the heat conduction strip is kept away from the one end of heat-conducting plate and the inner wall fixed connection of heat dissipation box, and is adjacent form the heat dissipation passageway with heat-conducting plate and heat dissipation box between the heat conduction strip.

Preferably, condenser tube is located the inside of heat-conducting plate, condenser tube is the heliciform in the inside arrangement of heat-conducting plate, the positive one end fixedly connected with water receiving pipe of condenser tube, the one end fixedly connected with outlet pipe at the condenser tube back.

Preferably, graphene layers are coated on the outer sides of the box body and the heat dissipation box, and heat-conducting silicon paste is coated between the semiconductor refrigeration piece and the water cooling plate.

Preferably, the top of the front and the back of the box body is fixedly connected with a cap peak, and the left side and the right side of the top of the cap peak are both provided with threaded holes.

Preferably, the right side fixedly connected with card strip of box body, the draw-in groove has been seted up in the left side of box body, card strip and draw-in groove phase-match.

(III) advantageous effects

Compared with the prior art, the utility model provides a high voltage alternating current inductance box possesses following beneficial effect:

1. when the inductor works to generate heat, the heat is transferred to the heat conducting component, the heat is radiated and cooled by cooling liquid in the cooling water pipe, and then transferred to the radiating fins, because the radiating fins are internally provided with radiating through grooves which enable the radiating fins to form an annular thin-wall structure, the radiating fins can have better radiating effect, the radiating is more balanced, the heat is transferred to the radiating fins by the radiating fins, the plurality of radiating fins improve the heat conduction efficiency and improve the contact area with air, a more reasonable gap is formed, the airflow distribution is reasonable, the efficient radiating is realized, the radiating effect is further ensured, the heat is transferred to the semiconductor refrigerating fins by the radiating fins, the heat at the bottom of the semiconductor refrigerating fins is absorbed by the water cooling plate, the top and the bottom of the semiconductor refrigerating fins can respectively absorb the heat and emit the heat, and the refrigerating purpose can be realized, the drive fan rotates and takes away the heat, can also make the water-cooling board cool down rapidly, keep the difference in temperature on semiconductor refrigeration piece two sides all the time, continuously absorb heat and release heat, continuously refrigerate, realize the efficient heat dissipation, in order to satisfy the user demand, avoid the too big potential safety hazard that leads to of heat, the cooling fan that has solved the inside setting of inductor part's heat dependence dc-to-ac converter is difficult to effectively dispel the heat, the radiating effect is not very good, can not reach the heat dissipation demand, there is the problem of potential safety hazard easily.

2. This high pressure alternating current inductance box, through placing the inductance on the heat-conducting plate, the heat-conducting plate absorbs the heat that produces on the inductance and transmits to the heat conduction strip and dispels the heat, and the heat dissipation channel can form reasonable space and make the air flow, is convenient for dispel the heat.

3. This high pressure alternating current inductance box carries out the water conservancy diversion through water receiving pipe and outlet pipe connection coolant liquid, and the condenser tube who arranges through the heliciform can make coolant liquid flow time and distance increase in condenser tube, better dispels the heat to the heat-conducting plate.

4. This high pressure alternating current inductance box all scribbles through box body and the outside of heat dissipation box and is equipped with graphite alkene layer and make whole heat dissipation better, scribbles between semiconductor refrigeration piece and the water-cooling plate and establishes and have good heat transfer performance, promotes the heat transfer effect, and then improves the radiating efficiency.

5. This high voltage alternating current inductance box through the setting of brim of a hat and screw hole, can use bolt or screw to be connected the box body with corresponding components and parts fixedly, convenient to use, the installation of being convenient for.

6. This high voltage alternating current inductance box, through card strip and draw-in groove phase-match, the inside that the accessible card strip inserted the draw-in groove between two box bodys is connected, can adjust the quantity of box body as required, assembles each other, has fine suitability.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the present invention at A in FIG. 1;

fig. 3 is a schematic top view of the present invention.

In the figure: 1. a box body; 2. a heat dissipation box; 3. a heat conducting component; 31. a heat conducting plate; 32. a heat conducting strip; 33. a heat dissipation channel; 4. a heat sink; 5. a heat dissipation through groove; 6. heat dissipation fins; 7. a semiconductor refrigeration sheet; 8. a water-cooling plate; 9. a fan; 10. a cooling water pipe; 11. a water receiving pipe; 12. a water outlet pipe; 13. a brim; 14. a threaded hole; 15. clamping the strip; 16. a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a high voltage alternating current induction box comprises a box body 1, a heat dissipation box 2 is fixedly connected to the bottom of the box body 1, a heat conduction assembly 3 for placing an inductor is fixedly connected to the inside of the heat dissipation box 2, the inductor is placed inside the box body 1 and above the heat conduction assembly 3, heat dissipation fins 4 are fixedly connected to the bottom of the heat conduction assembly 3 and are arranged at equal intervals, heat is transferred from the heat conduction assembly 3 to the heat dissipation fins 4, heat dissipation through grooves 5 are formed in the heat dissipation fins 4, the heat dissipation through grooves 5 enable the heat dissipation fins 4 to form an annular thin-walled structure, the heat dissipation effect is better, the heat dissipation is more balanced, a plurality of symmetrically distributed heat dissipation fins 6 are fixedly connected to the left side and the right side of the heat dissipation fins 4, the heat dissipation fins 6 improve the heat conduction efficiency, improve the contact area with air, form reasonable gaps, further ensuring the heat dissipation effect, the semiconductor refrigeration sheet 7 is fixedly connected inside the heat dissipation box 2, the top plate of the semiconductor refrigeration sheet 7 is fixedly connected with the bottom of the heat dissipation sheet 4, heat is transferred from the heat dissipation sheet 4 to the semiconductor refrigeration sheet 7 to heat the semiconductor refrigeration sheet 7, the water cooling plate 8 is fixedly connected inside the heat dissipation box 2, the top of the water cooling plate 8 is fixedly connected with the bottom of the semiconductor refrigeration sheet 7, the heat at the bottom of the semiconductor refrigeration sheet 7 is absorbed by the water cooling plate 8, the top and the bottom of the semiconductor refrigeration sheet 7 can respectively absorb heat and emit heat, the refrigeration purpose can be realized, the fan 9 positioned at the bottom of the water cooling plate 8 is fixedly arranged inside the heat dissipation box 2, the fan 9 is driven to rotate to take away heat, the water cooling plate 8 can be rapidly cooled, the temperature difference between the two sides of the semiconductor refrigeration sheet 7 can be always kept, heat, the inside fixedly connected with condenser tube 10 of heat conduction subassembly 3, condenser tube 10's both ends run through heat dissipation box 2 and extend to the front and the back of heat dissipation box 2, are dispelled the heat and are cooled down by the coolant liquid in condenser tube 10.

Further, the heat conducting component 3 includes a heat conducting plate 31, the outer side of the heat conducting plate 31 is fixedly connected with heat conducting strips 32 distributed annularly, one end of the heat conducting strip 32 far away from the heat conducting plate 31 is fixedly connected with the inner wall of the heat dissipating box 2, a heat dissipating channel 33 is formed between adjacent heat conducting strips 32, the heat conducting plate 31 absorbs the heat generated on the inductor and transmits the heat to the heat conducting strip 32 for heat dissipation by placing the inductor on the heat conducting plate 31, the heat dissipating channel 33 can form a reasonable gap to make the air flow for heat dissipation,

further, condenser tube 10 is located the inside of heat-conducting plate 31, condenser tube 10 is the heliciform in heat-conducting plate 31 inside and arranges, the positive one end fixedly connected with water receiving pipe 11 of condenser tube 10, the one end fixedly connected with outlet pipe 12 at the condenser tube 10 back, be connected the coolant liquid through water receiving pipe 11 and outlet pipe 12 and carry out the water conservancy diversion, condenser tube 10 through the heliciform is arranged can make the coolant liquid increase with distance in condenser tube 10 flow time, better dispels the heat to heat-conducting plate 31.

Further, the outside of box body 1 and heat dissipation box 2 all scribbles and is equipped with graphite alkene layer, scribbles between semiconductor refrigeration piece 7 and the water-cooling plate 8 and is equipped with heat conduction silicon paste, all scribble through the outside of box body 1 and heat dissipation box 2 and be equipped with graphite alkene layer and make whole heat dissipation better, scribble between semiconductor refrigeration piece 7 and the water-cooling plate 8 and establish and have good heat transfer performance, promote the heat transfer effect, and then improve the radiating efficiency.

Further, the box body 1 openly with the equal fixedly connected with brim of a hat 13 in top at the back, threaded hole 14 has all been seted up to the left and right sides at two brim of a hat 13 tops, through the setting of brim of a hat 13 with threaded hole 14, can use bolt or screw to be connected box body 1 with corresponding components and parts fixedly, convenient to use, the installation of being convenient for.

Further, the card strip 15 is fixedly connected with on the right side of box body 1, and draw-in groove 16 has been seted up on the left side of box body 1, and card strip 15 and draw-in groove 16 phase-match through card strip 15 and draw-in groove 16 phase-match, and accessible card strip 15 inserts the inside of draw-in groove 16 between two box bodies 1 and is connected, can adjust the quantity of box body 1 as required, assembles each other, has fine suitability.

The type of the fan 9 may be RL-SB12-20PK-R1, other electrical components used in this embodiment may be used, and the specific circuit connection manner and the using method thereof are commonly disclosed technologies, and thus, will not be described herein.

The working principle is as follows: when the utility model is used, an inductor is arranged inside the box body 1 and above the heat conducting component 3, when the inductor generates heat during working, the heat is transferred to the heat conducting component 3, the heat is radiated and cooled through the cooling liquid in the cooling water pipe 10, the heat is transferred to the radiating fins 4 from the heat conducting component 3, because the radiating through grooves 5 are arranged inside the radiating fins 4, the radiating fins 4 form an annular thin-wall structure, the radiating fins 4 can have better radiating effect, the radiating is more balanced, the heat is transferred to the radiating fins 6 through the radiating fins 4, the heat conduction efficiency is improved by the plurality of radiating fins 6, the contact area with the air is improved, reasonable gaps are formed, the air flow distribution is reasonable, the efficient radiating is realized, the radiating effect is further ensured, the heat is transferred to the semiconductor refrigerating sheets 7 from the radiating fins 4, and the temperature of the semiconductor refrigerating sheets 7 is raised, absorb the heat of semiconductor refrigeration piece 7 bottom by water-cooling board 8, make the top and the bottom of semiconductor refrigeration piece 7 absorb the heat respectively and emit the heat, can realize refrigerated purpose, drive fan 9 rotates and takes away the heat, can also make water-cooling board 8 cool down rapidly, keep the difference in temperature on semiconductor refrigeration piece 7 two sides all the time, continuously absorb heat and release heat, continuously refrigerate, realize the efficient heat dissipation, in order to satisfy the user demand, avoid the too big potential safety hazard that leads to of heat, the cooling fan that the heat of having solved inductance part relies on the inside setting of dc-to-ac converter is difficult to effectively dispel the heat, the radiating effect is not very good, reach the radiating demand, there is the problem of potential safety hazard easily.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high voltage alternating current inductance box, includes box body (1), its characterized in that: the bottom of the box body (1) is fixedly connected with a heat dissipation box (2), the inner part of the heat dissipation box (2) is fixedly connected with a heat conduction assembly (3) for placing an inductor, the bottom of the heat conduction assembly (3) is fixedly connected with radiating fins (4) which are arranged equidistantly, a heat dissipation through groove (5) is formed in the radiating fins (4), the left side and the right side of each radiating fin (4) are fixedly connected with a plurality of radiating fins (6) which are symmetrically distributed, the inner part of the heat dissipation box (2) is fixedly connected with semiconductor refrigerating fins (7), the top plate of each semiconductor refrigerating fin (7) is fixedly connected with the bottom of each radiating fin (4), the inner part of the heat dissipation box (2) is fixedly connected with a water cooling plate (8), the top part of each water cooling plate (8) is fixedly connected with the bottom of each semiconductor refrigerating fin (7), and a fan (9) positioned at the bottom of each water cooling plate (8) is, the inside fixedly connected with cooling water pipe (10) of heat-conducting component (3), the both ends of cooling water pipe (10) run through heat dissipation box (2) and extend to the front and the back of heat dissipation box (2).

2. A high voltage alternating current induction box according to claim 1, characterized in that: heat-conducting component (3) are including heat-conducting plate (31), the outside fixedly connected with annular distribution's of heat-conducting plate (31) heat conduction strip (32), the one end of heat-conducting plate (31) and the inner wall fixed connection of heat dissipation box (2) are kept away from in heat conduction strip (32), and are adjacent form heat dissipation channel (33) with heat-conducting plate (31) and heat dissipation box (2) between heat conduction strip (32).

3. A high voltage alternating current induction box according to claim 2, characterized in that: condenser tube (10) are located the inside of heat-conducting plate (31), condenser tube (10) are the heliciform and arrange in heat-conducting plate (31) inside, the positive one end fixedly connected with water receiving pipe (11) of condenser tube (10), one end fixedly connected with outlet pipe (12) at the condenser tube (10) back.

4. A high voltage alternating current induction box according to claim 1, characterized in that: graphene layers are coated on the outer sides of the box body (1) and the heat dissipation box (2), and heat-conducting silicon paste is coated between the semiconductor refrigeration piece (7) and the water cooling plate (8).

5. A high voltage alternating current induction box according to claim 1, characterized in that: the novel hat is characterized in that the front surface and the back surface of the box body (1) are fixedly connected with hat brim (13), and threaded holes (14) are formed in the left side and the right side of the top of the hat brim (13).

6. A high voltage alternating current induction box according to claim 1, characterized in that: the right side fixedly connected with card strip (15) of box body (1), draw-in groove (16) have been seted up in the left side of box body (1), card strip (15) and draw-in groove (16) phase-match.