CN113314484A

CN113314484A - Radiator, packaging structure and electronic equipment

Info

Publication number: CN113314484A
Application number: CN202110445378.2A
Authority: CN
Inventors: 李霁阳; 武昊; 张伟龙; 陈君; 李泉明; 惠晓卫; 李慧
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-04-23
Filing date: 2021-04-23
Publication date: 2021-08-27
Also published as: CN117542803A; WO2022222759A1

Abstract

The application provides a radiator, packaging structure and electronic equipment, the radiator includes: a substrate (11); the lug boss (12) is arranged on the base plate (11) in a protruding mode, the lug boss (12) comprises a plurality of lug bosses which are arranged at intervals, and a plurality of radiating fins (13) are arranged on the lug boss (12) at intervals. This application improves through the structure to the radiator for this radiator has good heat dispersion, can satisfy IGBT module etc. and can produce the heat dissipation demand of the electron heating element of high heat flux density.

Description

Radiator, packaging structure and electronic equipment

Technical Field

The present application relates to the field of electronic device heat dissipation technologies, and more particularly, to a heat sink, a package structure, and an electronic apparatus.

Background

With the development of new energy industry, Insulated Gate Bipolar Transistor (IGBT) modules are gradually widely used as high-power switching devices. For example, in the field of electric vehicles, direct current in a battery can be converted into alternating current through an IGBT module, the converted alternating current is led to a driving motor, and the driving motor converts electric energy into mechanical energy for driving a vehicle to run. The IGBT module is a core device for energy conversion and transmission, adopts the IGBT module to carry out power conversion, can improve the power utilization efficiency and quality, has the characteristics of high efficiency, energy conservation and environmental protection, and is a key support technology for solving the problem of energy shortage and reducing carbon emission.

The IGBT module itself generates heat during use, requiring heat dissipation assistance through a heat sink. One side of a traditional radiator is a plane and is used for being attached to and connected with an IGBT module, and radiating fins (also called fins) are fully distributed on the other side of the traditional radiator and are used for exchanging heat with heat transfer media such as water. Along with the development of the IGBT module towards miniaturization and integration, the heat flux density of the IGBT module becomes larger and larger, and the traditional radiator structure can not meet the heat dissipation requirement of the IGBT module, so that the working performance of the IGBT module is influenced.

Disclosure of Invention

The application provides a radiator, packaging structure and electronic equipment, and this radiator has good heat dispersion, can satisfy IGBT module etc. and can produce the heat dissipation demand of the electron heating element of high heat flux density.

In a first aspect, a heat sink is provided, comprising: a substrate; the base plate is provided with a plurality of bosses, the bosses are convexly arranged on the base plate and comprise a plurality of bosses which are arranged at intervals, and each boss is provided with a plurality of radiating fins at intervals.

The base plate that this application embodiment provided protrusion is provided with a plurality of bosss on the surface, and the boss forms the step on the base plate, and this a plurality of bosss separate each other, and the centre forms the clearance, and the interval is provided with a plurality of radiating fin on every boss, and radiating fin passes through the boss promptly and sets up on the base plate.

When the heat-conducting medium flows through the substrate, the heat-conducting medium enters the gap formed between the adjacent bosses and impacts the side walls of the bosses, the disturbance of the heat-conducting medium is increased, the flow of the heat-conducting medium is more disordered, and the fluid exchange between the heat-conducting media of different fluid layers is better and more severe, so that the heat dissipation effect of the fin root is enhanced, particularly, the enhancement effect on the fin roots of a plurality of heat dissipation fins arranged on the bosses per se is better, and the heat transfer quantity of the fin roots usually occupies more than 50% of the total heat transfer quantity, therefore, compared with the traditional heat sink, the heat sink provided by the embodiment of the application has an obvious heat dissipation advantage and higher heat dissipation efficiency, and can meet the heat dissipation requirements of electronic heating elements such as IGBT (insulated gate bipolar transistor) modules and the like which can generate high heat flow density. The radiator that this application embodiment provided is simple structure compact, need not to occupy too big space, is favorable to electronic product's small-size lightweight development to use cost is low.

In one possible design, the boss is in an elongated structure, and the plurality of heat dissipation fins are arranged in a row along the extending direction of the long edge of the elongated structure.

That is to say, in the embodiment of the present application, the bosses are in the elongated strip-shaped structure, each boss is only provided with one row of heat dissipation fins at intervals, each heat sink generally includes multiple rows of heat dissipation fins, at this time, the bosses and the multiple rows of heat dissipation fins can be in one-to-one correspondence, enough bosses are provided, the plurality of bosses in the elongated structure can be arranged on the substrate in a certain manner, and the flowing disturbance of the heat transfer medium is further increased. The boss is of a long strip structure, and only one row of radiating fins are arranged on the boss, so that the boss is convenient to machine and form in process, the production efficiency can be improved, and the production cost can be saved.

Further, through the arrangement, the fin root of each row of radiating fins can be close to the side wall of the boss, and the disturbance of the heat-conducting medium at the side wall of the boss is strongest, so that the disturbance (turbulent flow) effect of the side wall of the boss can be efficiently applied to each radiating fin arranged on the side wall of the boss, and the radiating performance of the radiator provided by the embodiment of the application is better.

In one possible design, two adjacent bosses are parallel to each other. Through the arrangement, the arrangement rule of the bosses is controllable, the production difficulty can be reduced, the production efficiency is improved, and the manufacturing cost is saved.

In one possible design, the boss is configured to: the included angle between the extending direction of the long edge of the long strip-shaped structure and the flowing direction of the heat conducting medium is 15-75 degrees. For example, 45 to 60 degrees.

The contained angle between the extending direction on long structure's the long limit of boss and the flow direction of heat-conducting medium is 15 ~ 75 degrees, can guarantee that heat-conducting medium flows into inside the radiator (flow into on the base plate promptly), can fully reliable erode the boss for the vortex effect of boss is more obvious, and then makes the radiator heat dispersion that this application embodiment provided better.

In one possible design, the cross-sectional shape of the heat dissipation fin is triangular or polygonal.

Optionally, the cross-sectional shape of the heat dissipation fin may also be circular or elliptical.

Optionally, the cross-sectional shapes of the plurality of heat dissipation fins may be the same or different, which is not limited in this application.

For example, the cross-sectional shape of the heat dissipation fin may be any one or a mixture of a circle, an ellipse, a triangle, or a polygon.

In the description of the present application, a polygon refers to a planar figure formed by sequentially connecting four or more sides end to end, for example, the polygon may be a quadrangle, a pentagon, or the like, and the quadrangle may be a square, a rectangle, a rhombus, a trapezoid, or the like.

In a possible design, the heat dissipation fins are of a quadrangular columnar structure with a cross section, and two side faces of the columnar structure correspond to two side faces of the long edge of the boss in the extending direction one by one and are parallel and level to each other.

Through the arrangement, on the one hand, the fin root of the radiating fin is close to the side wall of the boss, so that the radiating reinforcing effect on the fin root is better, and the radiating performance of the radiator provided by the embodiment of the application is better. On the other hand, the processing is convenient, the production efficiency is improved, and the production cost is reduced. For example, when the heat sink provided by the embodiment of the present application is produced by a cutting process, the number of times of cutting can be reduced.

Alternatively, the cross-sectional shape of the heat dissipation fin may be rectangular, square, trapezoid, or diamond, which is not limited in this application.

In one possible design, a vertex angle of the heat dissipation fin is arranged opposite to the flowing direction of the heat conducting medium. Through the arrangement, the separation resistance between the heat-conducting medium and the radiating fins can be reduced, and the stability of a flow field and the full heat exchange are ensured.

In a possible design, the height of the boss protruding out of the substrate is 0.1-0.5 mm.

The boss should not set up too high or low excessively, if the boss sets up excessively low, then the vortex effect is not obvious (the heat dissipation intensification effect is not obvious promptly), if the boss sets up too high, then increase too much resistance to heat-conducting medium's flow. The height of the boss provided by the embodiment of the application is between 0.1 and 0.5 mm, preferably between 0.2 and 0.45 mm, for example, 0.2, 0.25, 0.3, 0.35 and 0.4 mm, and the two aspects can be considered at the same time, so that the heat conducting medium can flow sufficiently and smoothly while the heat radiator is ensured to have excellent heat dissipation performance.

In one possible design, the heat sink is integrally formed from sheet metal by a cross-cut, forging, or die-casting process. Through the arrangement, the whole radiator has better mechanical strength, the machining is convenient, and the production efficiency is improved. In addition, because the base plate, the boss and the radiating fins are integrally formed by the same metal plate, thermal contact resistance does not exist at joints between the base plate and the boss and between the boss and the radiating fins, and therefore the radiating performance of the radiator provided by the embodiment of the application is better.

Alternatively, the metal plate may be a copper alloy, an aluminum alloy plate, or a copper aluminum composite alloy plate.

Alternatively, the heat sink may also be formed by assembling, for example, the heat sink is formed by bonding or welding the substrate, the boss and the heat dissipation fin, which are independent of each other, and this is not limited in this application.

In one possible design, the heat dissipation fins are arranged in an array, and two adjacent rows of heat dissipation fins are staggered. Through above setting, can increase vortex intensity to increase heat transfer area, make the radiator heat dispersion that this application embodiment provided better from this.

In a possible design, the heat sink further includes a top cover, the top cover covers the substrate, and two opposite sides of the top cover are respectively provided with a heat-conducting medium inlet and a heat-conducting medium outlet.

In a second aspect, the present application further provides a package structure, including: an electronic component and a heat sink as provided in any one of the possible implementations of the first aspect; the heat sink is connected with the electronic component. The connection is a thermal connection, and heat dissipated by the electronic component can be transferred to the heat sink. The connection may be direct or indirect. For example, the electronic component and the heat sink may be in direct contact, and end surfaces of the electronic component and the heat sink may directly abut against each other, or may be connected through an intermediate medium.

In one possible design, the electronic components are IGBT modules.

At this moment, can dispel the heat to the IGBT module through the radiator, because the radiator that this application embodiment provided possesses more heat dispersion than traditional radiator for the heat that the IGBT module gived off can be fast by the effluvium, guarantees that the IGBT module is in best operating condition, guarantees motor controller motion's stability and reliability.

Meanwhile, the maximum current output capacity of the IGBT module is improved through good heat dissipation measures, the overall performance of the electric vehicle is further improved, and the product competitiveness is improved. The radiator that this application embodiment provided simple structure is compact, need not to occupy too big space, is favorable to realizing electric automobile's small-size lightweight development.

Optionally, the electronic component may also be any other electronic component that can dissipate heat when powered on and needs heat dissipation. For example, the electronic component may be a chip, a battery, a circuit board, a power electronic device, or other heat generating device.

In one possible design, the electronic component may also be a silicon carbide (SiC) module.

Alternatively, the electronic component may be an integrated gate-commutated thyristor (IGCT) module, which may also convert dc power to ac power.

Alternatively, the electronic component may also be any other processing chip that needs heat dissipation, for example, any other computing chip, power chip, graphics processing chip, Artificial Intelligence (AI) chip, and the like.

Optionally, the application scenario of the radiator is not limited to an electric vehicle, and for example, the application scenario may also be in the fields of variable frequency air conditioners, rail transit, smart grids, aerospace, new energy equipment, servers (clusters), communication rooms, and the like.

In one possible design, the electronic component includes a plurality of electronic components, and the heat sink is connected to each of the electronic components. Through the arrangement, the radiator can simultaneously realize the heat dissipation of a plurality of electronic elements, so that the manufacturing cost can be saved, the size of a product is reduced, and the miniaturization design of the product is facilitated.

For example, a plurality of electronic components may be arranged in parallel and attached to the bottom surface of the heat sink, so as to achieve high heat dissipation efficiency for the plurality of electronic components.

In one possible design, the heat sinks include two heat sinks, and the two heat sinks are connected to two opposite sides of the electronic component. Through the arrangement, the heat dissipation effect on the electronic element can be improved, and the electronic element can be quickly cooled. The opposing sides may be, for example, a top side and a bottom side.

In one possible design, the heat sinks include two heat sinks, the electronic component includes a plurality of electronic components, and the electronic components are arranged between the two heat sinks in parallel. Through the arrangement, the rapid cooling of the electronic elements can be realized. For example, a plurality of electronic components may be arranged in parallel between two heat sinks and attached to the bottom surfaces of the heat sinks, so as to achieve a better heat dissipation effect.

In one possible embodiment, a thermally conductive connecting layer is provided between the heat sink and the electronic component. Thereby enabling to enhance the heat transfer efficiency between the heat sink and the electronic component.

In one possible embodiment, the thermally conductive connecting layer is a solder layer, a thermally conductive paste layer or a thermally conductive adhesive layer.

Alternatively, the thermally conductive connecting layer may be a solder layer, and in this case, the heat sink may be connected to the electronic component by soldering, and the solder between the two forms the thermally conductive connecting layer. The welding may be by brazing, diffusion welding, fusion welding, or the like.

Alternatively, the thermally conductive connecting layer may be a layer of thermally conductive paste, also referred to as a thermal interface material, having good thermal conductivity properties. For example, the thermal grease may be thermal silicone grease. The heat-conducting silicone grease is a novel organic grease specially prepared for heat transfer of electronic components, is produced by adopting a special formula, and is prepared by compounding metal oxide with good heat conductivity and insulativity and organic siloxane. Has good thermal conductivity, electrical insulation, impact resistance and chemical stability.

Optionally, the heat conductive connection layer may also be a heat conductive adhesive layer, and the heat conductive adhesive may be, for example, a heat conductive silicone adhesive.

In one possible design, the heat-conducting connection layer includes a first metal layer, a heat-conducting insulation layer, and a second metal layer sequentially disposed between the heat sink and the electronic component.

The second metal layer can supply power to the electronic element and can realize the functions of temperature equalization and heat conduction. The heat conduction insulating layer is made of heat conduction and insulating materials, the heat conduction and electric isolation effects can be achieved, and the first metal layer is used for conducting heat on the heat conduction insulating layer to the radiator.

Optionally, the first metal layer and the second metal layer may be made of copper alloy, aluminum alloy, or stainless steel.

Alternatively, the thermally conductive and insulating layer may be formed of a ceramic material having sufficient thermal conductivity.

Optionally, the first metal layer and the second metal layer are respectively closely attached to two opposite sides of the thermal insulation layer. For example, the first metal layer and the second metal layer may be disposed on two opposite sides of the thermal insulation layer by thermal adhesive bonding, electroplating, Atomic Layer Deposition (ALD), or the like.

For example, the first metal layer and the second metal layer may be copper films.

Optionally, the heat sink and the electronic component may be fixed relative to each other by screwing, clamping, or adhering, which is not limited in this application.

In a third aspect, an electronic device is provided, where the electronic device includes a housing, a device to be heat-dissipated, and the heat sink provided in any one of the possible implementations of the first aspect, where the device to be heat-dissipated and the heat sink are located in the housing, and the substrate of the heat sink is connected to the device to be heat-dissipated.

In one possible design, the device to be cooled is any one of a power electronic device element, a chip, a battery, or a battery circuit board.

For example, the electronic device may be an electronic device having a heat generating device such as a chip, a battery, a circuit board, or a power electronic device, such as an inverter, a vehicle-mounted power supply unit, an energy supply unit or a calculation unit of a data center, an energy supply unit or a processing unit of a communication station, or the like.

In a possible design, the electronic device may be an intelligent vehicle, such as an electric vehicle, and the device to be cooled may be any electronic component in the vehicle that needs to be cooled, such as the aforementioned IGBT module, IGCT module, or SiC module.

In a possible design, the electronic device may also be a Motor Control Unit (MCU) in an automobile, and the device to be cooled may be any electronic component in the motor controller that needs to be cooled, such as the aforementioned IGBT module, IGCT module, or SiC module.

In one possible design, the electronic device can also be any electrical device which needs to dissipate heat in the fields of variable frequency air conditioners, rail transit, smart grids, aerospace, new energy equipment and the like, servers (clusters), high-performance computers, communication rooms and the like.

Drawings

Fig. 1 is a schematic structural diagram of an example of a heat sink according to an embodiment of the present application.

Fig. 2 is a top view of the heat sink shown in fig. 1.

Fig. 3 is a partially enlarged view of a portion a in fig. 1.

Fig. 4 is a partially enlarged view of a portion B in fig. 2.

Fig. 5 is a schematic structural diagram of another example of a heat sink according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of another example of a heat sink according to an embodiment of the present application.

Fig. 7 is a perspective view of the heat sink shown in fig. 6.

Fig. 8 is a schematic structural diagram of an example of a package structure according to an embodiment of the present application.

Fig. 9 is a schematic diagram of a perspective view of the package structure shown in fig. 8 after shelling.

Fig. 10 is a schematic diagram of the package structure shown in fig. 8 from another perspective after shelling.

Fig. 11 is a partially enlarged view of a portion C in fig. 10.

Fig. 12 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application.

Fig. 13 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application.

Fig. 14 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application.

Fig. 15 is a graph comparing experimental results of the heat sink provided in the embodiment of the present application and the heat sink in the prior art.

Fig. 16 is a schematic structural diagram of a heat dissipation system according to an embodiment of the present application.

Fig. 17 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.

Reference numerals: 10. a heat sink; 11. a substrate; 12. a boss; 13. a heat dissipating fin; 14. a top cover; 15. a heat transfer medium inlet; 16. a heat transfer medium outlet; 20. an electronic component; 30. a thermally conductive connection layer; 31. a first metal layer; 32. a thermally conductive insulating layer; 33. a second metal layer; 40. a package housing; 41. a first terminal; 42. a second terminal; 43. a third terminal; 44. a fourth terminal; 50. a condenser; 60. a circulation line; 70. a power pump; 80. a housing; 90. and (5) a device to be cooled.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first," "second," etc. may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, it is to be understood that the terms "upper", "lower", "side", "front", "rear", "inner", "outer", and the like indicate orientations or positional relationships based on installation, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.

It should be noted that the same reference numerals are used to denote the same components or parts in the embodiments of the present application, and for the same parts in the embodiments of the present application, only one of the parts or parts may be given the reference numeral, and it should be understood that the reference numerals are also applicable to the other same parts or parts.

The high-power semiconductor device has a wide application in the power electronic industry, for example, in the field of electric vehicles, direct current in a storage battery can be converted into alternating current with fixed frequency and fixed voltage or frequency and voltage regulation through an IGBT module, the converted alternating current is led to a driving motor, and the driving motor is used as a power conversion element of a vehicle to convert electric energy into mechanical energy so as to drive the vehicle to run.

The IGBT module is an important component of an inverter and is a core device for energy conversion and transmission, the IGBT module is used for power conversion, the power utilization efficiency and quality can be improved, the IGBT module has the characteristics of high efficiency, energy conservation and environmental protection, and the IGBT module is a key support technology for solving the problem of energy shortage and reducing carbon emission.

The IGBT module is a modular semiconductor product formed by bridge-packaging a series of chips such as an IGBT chip and a freewheeling diode (FWD) chip by a specific circuit. The packaged IGBT module can be directly applied to devices such as a frequency converter and an Uninterruptible Power Supply (UPS).

The IGBT module has the characteristics of energy conservation, convenience in installation and maintenance, stable heat dissipation and the like. Most of the current market products are such modular products, generally, the IGBT is also referred to as IGBT module; with the promotion of concepts such as energy conservation and environmental protection, the application of the IGBT module is more and more popular. The IGBT module is commonly referred to as a "CPU" of a power electronic device, and is used as a new strategic industry in the country, and has a wide application range in the fields of electric vehicles, rail transit, smart grids, aerospace, new energy equipment, and the like.

The high-power semiconductor devices such as the IGBT module can generate heat in use, and with the increasing heat flow density of the high-power semiconductor devices, if good heat dissipation measures cannot be taken, the use environment of the devices is limited greatly, and the performance of products is also limited. At present, electronic equipment develops towards miniaturization and integration, the space left for a heat dissipation assembly is not large, and the heat dissipation capability of a high-power semiconductor device under high power density needs to be improved urgently.

For an electric vehicle, the heat dissipation design of the IGBT module is a key design element of a Motor Control Unit (MCU). Along with the gradual increase of the heat flux density of the IGBT module, the current IGBT module is cooled in a liquid cooling (water cooling) mode. One side of the traditional radiator is a plane and is used for being attached to and connected with the IGBT module, and the other side of the traditional radiator is fully distributed with radiating fins and is used for exchanging heat with heat transfer media such as water. The heat dissipation capability of the heat sink depends on the design form of the heat sink fins to a great extent, and the fins of the current heat sink mainly focus on stamping type fins and integrally forging type fins.

Along with the heat flux density of the IGBT module becomes bigger and bigger, the traditional radiator structure can not meet the heat dissipation requirement of the IGBT module, so that the heat dissipation effect of the IGBT module is poor, the IGBT module can not be cooled quickly, and the working performance of the IGBT module is influenced. The current radiator is difficult to support the continuous upward evolution of present IGBT module consumption, and the design of a radiator with higher heat dispersion performance becomes a technical problem that needs to be solved urgently.

In order to solve the above problem, the embodiment of the present application firstly provides a heat sink, which has an excellent heat dissipation performance by improving a structure of the heat sink, and can meet a heat dissipation requirement of an electronic heating element such as an IGBT module that generates a high heat flux density. The radiator provided by the embodiment of the application can also be called as a cooler or a liquid cooling plate and the like in some cases.

Fig. 1 is a schematic structural diagram of a heat sink 10 according to an embodiment of the present application. Fig. 2 is a plan view of the heat sink 10 shown in fig. 1. Fig. 3 is a partially enlarged view of a portion a in fig. 1. Fig. 4 is a partially enlarged view of a portion B in fig. 2. As shown in fig. 1 to 4, the heat sink provided by the embodiment of the present application includes a base plate 11, a boss 12, and a plurality of heat dissipation fins 13.

Wherein, boss 12 protrusion set up in on base plate 11, boss 12 includes a plurality of that set up at interval each other, and every boss 12 is gone up the interval and is provided with a plurality of radiating fin 13.

The plurality of bosses 12 are convexly arranged on the surface of the base plate 11, the bosses 12 form steps on the base plate 11, the plurality of bosses 12 are spaced apart from each other, gaps are formed in the gaps, and a plurality of heat dissipation fins 13 are arranged on each boss 12 at intervals, that is, the heat dissipation fins 13 are arranged on the base plate 11 through the bosses 12.

When the heat-conducting medium flows over the substrate 11, the heat-conducting medium enters the gap formed between the adjacent bosses 12 and impacts the side walls of the bosses 12, and the disturbance of the heat-conducting medium is increased, so that the flow of the heat-conducting medium is more disordered, and the fluid exchange between the heat-conducting media with different heights is better and more severe, so that the heat dissipation effect of the fin root is enhanced, particularly, the enhancement effect on the fin root of the plurality of heat-radiating fins 13 arranged on the bosses 12 per se is better, and the heat transfer quantity of the fin root generally occupies more than 50% of the total heat transfer quantity, so compared with the traditional heat sink, the heat sink provided by the embodiment of the application has an obvious heat dissipation advantage, has higher heat dissipation efficiency, and can meet the heat dissipation requirement of an electronic heating element with high heat flow density, such as an IGBT module. The radiator that this application embodiment provided is simple structure compact, need not to occupy too big space, is favorable to electronic product's small-size lightweight development to use cost is low.

Optionally, the heat conducting medium used in the heat sink 10 provided in the embodiment of the present application may be water, an ethylene glycol aqueous solution, or an electronic fluorinated liquid, which is not limited in the present application.

As shown in fig. 2 to 4, the boss 12 is an elongated structure, the width of the boss 12 and the width of the heat dissipation fins 13 are adapted to each other, for example, equal to or slightly larger than the width of the heat dissipation fins 13, and the plurality of heat dissipation fins 13 are arranged in a row along the extending direction S1 of the long side of the elongated structure.

That is to say, in the embodiment of the present application, the bosses 12 are elongated structures, each boss 12 is provided with only one row of heat dissipation fins 13 at intervals, each heat sink generally includes multiple rows of heat dissipation fins 13, at this time, the bosses 12 may correspond to the multiple rows of heat dissipation fins 13 one to one, the bosses 12 are provided enough, the multiple bosses 12 of the elongated structures may be arranged on the substrate 11 in a certain manner, and the flowing disturbance of the heat transfer medium is further increased. The boss 12 is in a long strip structure, and only one row of radiating fins 13 is arranged on the boss, so that the boss is convenient to machine and form in process, the production efficiency can be improved, and the production cost can be saved.

Further, through the above arrangement, the fin root of each row of the heat dissipation fins 13 can be close to the side wall of the boss 12, and the disturbance of the heat conduction medium at the side wall of the boss 12 is strongest, so that the disturbance (turbulent flow) effect of the side wall of the boss 12 can be efficiently applied to the heat dissipation fins 13 arranged on the side wall of the boss, and the heat dissipation performance of the heat sink provided by the embodiment of the application is better.

As shown in fig. 2 to 4, in the embodiment of the present application, the sidewalls of the bosses 12 protrude from the upper surface of the substrate 11 and are perpendicular to the upper surface of the substrate 11. The top surface of the boss 12 and the upper surface of the substrate 11 are kept parallel to each other. The top surface of the boss 12 is vertically provided with a heat radiation fin 13 in a columnar structure.

In the embodiment of the present application, the plurality of bosses 12 are all in a strip-shaped structure and have the same width, and two adjacent bosses 12 are parallel to each other. Here, two adjacent bosses 12 are parallel to each other, and may be that the center lines of the two bosses 12 in the length direction are parallel to each other. And because the width of two adjacent bosses 12 is the same, the side walls of two adjacent bosses 12 are also parallel to each other, and the gap between two bosses 12 is kept unchanged. Through the arrangement, the arrangement rule of the bosses 12 is controllable, the production difficulty can be reduced, the production efficiency is improved, and the manufacturing cost is saved.

In the embodiment of the present application, the height of the projection 12 protruding from the substrate 11 is 0.1-0.5 mm. The boss 12 should not be set too high or too low, if the boss 12 is set too low, the turbulent flow effect is not obvious (i.e. the heat dissipation enhancing effect is not obvious), and if the boss 12 is set too high, too much resistance is added to the flow of the heat-conducting medium. The height of the boss 12 provided in the embodiment of the present application is between 0.1 and 0.5 mm, preferably between 0.2 and 0.45 mm, for example, 0.2, 0.25, 0.3, 0.35, and 0.4 mm, which can be considered at the same time, so that the heat sink has excellent heat dissipation performance and the heat conducting medium flows sufficiently and smoothly.

As shown in fig. 3 and 4, in the present embodiment, the boss 12 is configured to: the extending direction S1 of the long side of the long strip structure of the boss 12 and the flowing direction S2 of the heat-conducting medium form an included angle of 15-75 degrees.

Here, the extending direction S1 of the long side of the elongated structure is a direction extending from the inlet side to the outlet side of the heat transfer medium, i.e., a direction forward in the flow direction S2 of the heat transfer medium. Contained angle between the extending direction S1 of the long limit structure of boss 12 and the flow direction S2 of heat-conducting medium & be 15 ~ 75 degrees, can guarantee that heat-conducting medium flows into the inside (flow into on the base plate 11 promptly) of radiator 10 after, can wash away boss 12 by fully reliable for boss 12' S vortex effect is more obvious, and then makes the radiator heat dispersion that this application embodiment provided better.

Optionally, an included angle between the extending direction S1 of the long side of the elongated structure of the boss 12 and the flowing direction S2 of the heat-conducting medium is 45 to 60 degrees, so that the heat-conducting medium can flow smoothly enough under the condition of ensuring the turbulent flow effect.

As shown in fig. 3 and 4, in the present embodiment, the extending direction S1 of the long side of the long-sized structure is inclined in the direction from right to left, but in other embodiments, the extending direction S1 of the long side of the long-sized structure may also be inclined in the direction from left to right, i.e., the direction of S3 in fig. 3 and 4, in which case similar technical effects as described above can be achieved.

In the description of the present application, the angle between the extending direction S1 of the long side of the elongated structure of the bosses 12 and the flowing direction S2 of the heat transfer medium is 15 to 75 degrees, and at least two cases of tilting from right to left (i.e., the direction of S1) and tilting from left to right (i.e., the direction of S3) in fig. 3 and 4 should be included.

As shown in fig. 2 to 4, the heat dissipating fin 13 is a columnar structure having a quadrangular cross-sectional shape, and two side surfaces of the columnar structure correspond to two side surfaces of the boss 12 in the extending direction S1 of the long side one by one and are flush with each other.

Through the arrangement, on one hand, the fin root of the radiating fin 13 is close to the side wall of the boss 12, so that the radiating reinforcing effect on the fin root is better, and further the radiating performance of the radiator provided by the embodiment of the application is better. On the other hand, the processing is convenient, the production efficiency is improved, and the production cost is reduced. For example, when the heat sink 10 provided in the embodiment of the present application is produced by a cutting process, the number of times of cutting can be reduced.

The cross-sectional shape of the heat dissipating fin 13 is a quadrangle, and may be, for example, a rectangle, a square, a trapezoid, or a rhombus, which is not limited in the present application.

The heat sink 10 provided by the embodiment of the present application may be manufactured as an integral structure through an integral molding process, so as to have higher mechanical strength. Alternatively, the heat sink 10 provided in the embodiment of the present application may be integrally formed by a cross cutting process from a metal plate.

For example, it can be produced by multiple cross cuts with a cutter head, a milling cutter, a saw blade mill, a multiple saw blade mill, or the like.

For another example, the metal sheet may be integrally formed by forging or die casting.

Through the arrangement, the whole radiator has better mechanical strength, the machining is convenient, and the production efficiency is improved. In addition, because the substrate 11, the boss 12 and the heat dissipation fins 13 are integrally formed by the same metal plate, thermal contact resistance does not exist at joints between the substrate 11 and the boss 12 and at joints between the boss 12 and the heat dissipation fins 13, and therefore the heat dissipation performance of the heat sink provided by the embodiment of the application is better.

Alternatively, in another embodiment, the heat sink 10 may be formed by assembling, for example, the heat sink 10 is formed by bonding or welding the substrate 11, the boss 12 and the heat dissipation fin 13 which are independent of each other, which is not limited in the present application.

As shown in fig. 1 to 4, in the present embodiment, the cross-sectional shape of the heat dissipating fin 13 is a diamond shape. In other embodiments, the cross-sectional shape of the heat dissipation fins 13 may be any one or a mixture of circular, oval, triangular and polygonal shapes.

Alternatively, the cross-sectional shapes of the plurality of heat dissipation fins 13 may be the same or different, and this is not limited in this application.

Fig. 5 is a schematic structural diagram of another example of the heat sink 10 according to the embodiment of the present application. In the embodiment shown in fig. 5, the cross-sectional shape of the heat radiating fins 13 may be circular, and the projection of the heat radiating fins 13 is located inside the boss 12.

Further, unlike the embodiment shown in fig. 1 to 4, in the embodiment shown in fig. 5, the extending direction S1 of the long side (i.e. the boss 12) of the elongated structure is inclined along the direction from left to right, and the included angle with the flowing direction S2 of the heat-conducting medium is & 15 to 75 degrees, for example, 45 to 60 degrees, which can also achieve the similar technical effect of enhancing the turbulence.

As shown in fig. 1 to 4, in the embodiment of the present application, the heat dissipation fins 13 are arranged in an array, and two adjacent rows of heat dissipation fins 13 are staggered. At this moment, the heat dissipation fins 13 in the back row just face the gap between two adjacent heat dissipation fins 13 in the front row, and through the above setting, the turbulent flow strength can be increased, and the heat exchange area is increased, so that the heat dissipation performance of the heat sink provided by the embodiment of the application is better.

As shown in fig. 3 and 4, in the embodiment of the present application, the cross section of the heat dissipation fin 13 is a diamond shape, and one vertex of the heat dissipation fin 13 is opposite to the flow direction S2 of the heat transfer medium. Through the arrangement, the separation resistance between the heat-conducting medium and the radiating fins 13 can be reduced, and the stability of a flow field and the full heat exchange are ensured.

Fig. 6 is a schematic structural diagram of another example of the heat sink 10 according to the embodiment of the present application. Fig. 7 is a perspective view of the heat sink 10 shown in fig. 6. As shown in fig. 6 and 7, in this embodiment, the heat sink further includes a top cover 14, the top cover 14 covers the base plate 11 to form a closed heat exchange chamber, and the boss 12 and the heat dissipation fins 13 are located in the heat exchange chamber. The opposite two sides of the top cover 14 are respectively provided with a heat conducting medium inlet 15 and a heat conducting medium outlet 16, and the heat conducting medium enters the heat exchange chamber from the heat conducting medium inlet 15 and flows out through the heat conducting medium outlet 16. The aforementioned flow direction S2 of the heat transfer medium is formed between the heat transfer medium inlet 15 and the heat transfer medium outlet 16.

On the other hand, the embodiment of the application also provides a packaging structure. Fig. 8 is a schematic structural diagram of a package structure according to an embodiment of the present application. Fig. 9 is a schematic diagram of a perspective view of the package structure shown in fig. 8 after shelling. Fig. 10 is a schematic diagram of the package structure shown in fig. 8 from another perspective after shelling.

As shown in fig. 8-10, the package structure includes an electronic component 20 and the heat spreader 10 provided in any of the embodiments described above. The electronic component 20 can generate heat when being powered on, and the heat sink 10 is connected with the electronic component 20 and used for dissipating heat of the electronic component 20.

Here, the heat sink 10 is connected to the electronic component 20, which means that the electronic component 20 and the heat sink 10 are thermally connected to each other, and heat emitted from the electronic component 20 can be conducted to the heat sink. The connection may be direct or indirect. For example, the electronic component 20 and the heat sink 10 may be in direct contact, and end surfaces of the two may directly abut against each other, or may be connected through an intermediate medium.

In the embodiment of the present application, the electronic component 20 is the aforementioned IGBT module (in the description of the present embodiment hereinafter, the electronic component 20 is described as the IGBT module 20). At this moment, can dispel the heat to IGBT module 20 through radiator 10, because the radiator 10 that this application embodiment provided possesses more heat dispersion than traditional radiator for the heat that IGBT module 20 gived off can be fast by the effluvium, guarantees that IGBT module 20 is in the best operating condition, guarantees motor controller motion's stability and reliability.

Meanwhile, the maximum current output capacity of the IGBT module 20 is improved through good heat dissipation measures, the overall performance of the electric vehicle is further improved, and the product competitiveness is improved. The radiator 10 provided by the embodiment of the application has a simple and compact structure, does not need to occupy too large space, and is favorable for realizing the small and light development of the electric automobile.

Alternatively, in other embodiments, the electronic element 20 may be any other electronic heating element, which is not limited in this application.

Alternatively, the electronic component 20 may be any other electronic component that can dissipate heat when powered on and needs heat dissipation. For example, the electronic component 20 may be a chip, a battery, a circuit board, a power electronic device, or other heat generating device.

For example, the electronic component 20 may also be a silicon carbide (SiC) module.

For example, the electronic component 20 may also be an integrated gate-commutated thyristor (IGCT) module, which may also convert dc power to ac power.

For another example, the electronic component 20 may also be any other processing chip that needs heat dissipation, such as any other computing chip, power chip, graphics processing chip, Artificial Intelligence (AI) chip, and the like.

The application scenario of the radiator 10 is not limited to electric vehicles, and may also be in the fields of variable frequency air conditioners, rail transit, smart grids, aerospace, new energy equipment, servers (clusters), communication rooms, and the like.

As shown in fig. 8, the package structure provided in the embodiment of the present application further includes a package housing 40, the package housing 40 packages the heat sink 10 and the IGBT module 20 into an integral structure, and the package housing 40 may be formed by curing epoxy-based package glue, silicone-based package glue, polyurethane package glue, ultraviolet light curing package glue, and the like.

As shown in fig. 8-10, the package structure further includes a plurality of metal terminals connected to the IGBT module 20, and the plurality of metal terminals penetrate through the package housing 40 to electrically connect the IGBT module 20 to an external device.

For example, the plurality of metal terminals include a first terminal 41, a second terminal 42, and a third terminal 43. The first terminal 41 and the second terminal 42 are respectively connected to the positive and negative electrodes of a battery in the electric vehicle, and the third terminal 43 is connected to a drive motor of the electric vehicle. The dc power of the battery is converted into ac power to be supplied to the driving motor through the IGBT module 20.

The plurality of metal terminals further includes a fourth terminal 44, and the fourth terminal 44 is connected with the vehicle controller to electrically connect the vehicle controller with the IGBT module 20.

Fig. 11 is a partially enlarged view of a portion C in fig. 10. As shown in fig. 10 and 11, a heat conductive connection layer 30 is disposed between the heat sink 10 and the IGBT module 20 to realize thermal connection between the heat sink 10 and the IGBT module 20, and heat generated by the IGBT module 20 during operation is transferred to the heat sink 10 through the heat conductive connection layer 30.

The thermally conductive connection layer 30 has a sufficient thermal conductivity to enable efficient heat transfer, and the thermally conductive connection layer 30 also has an electrical isolation function since the heat sink 10 needs to be electrically insulated from the IGBT module 20.

As shown in fig. 11, the thermal conductive connection layer 30 includes a first metal layer 31, a thermal conductive insulation layer 32, and a second metal layer 33 sequentially disposed between the heat sink 10 and the electronic component 20.

The second metal layer 33 can supply power to the IGBT module 20, and can realize uniform temperature and heat conduction. The heat conductive and insulating layer 32 is made of a heat conductive and insulating material, and can perform heat conduction and electrical isolation, and the first metal layer 31 is used for conducting heat on the heat conductive and insulating layer 32 to the heat sink 10.

Alternatively, the material of the first metal layer 31 and the second metal layer 33 may be copper alloy, aluminum alloy, or stainless steel.

Alternatively, the thermally conductive and insulating layer 32 may be formed of a ceramic material having sufficient thermal conductivity.

Optionally, the first metal layer 31 and the second metal layer 33 are respectively closely attached to two opposite sides of the thermal insulation layer 32. For example, the first metal layer 31 and the second metal layer 33 may be disposed on two opposite sides of the thermal insulation layer 32 by thermal adhesive bonding, electroplating, Atomic Layer Deposition (ALD), or the like.

For example, the first and second metal layers 31 and 33 may be copper films.

Optionally, the heat sink 10 and the IGBT module 20 may be fixed relative to each other by screwing, clamping, or adhering, which is not limited in this application.

Fig. 12 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application. As shown in fig. 12, in the present embodiment, the heat sinks 10 include two, and two heat sinks 10 are connected to opposite sides of the IGBT module 20, i.e., the top and bottom surfaces in fig. 12. With the above arrangement, the heat dissipation effect of the IGBT module 20 can be improved.

Fig. 13 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application. As shown in fig. 13, in the present embodiment, the IGBT module 20 includes a plurality (e.g., 3 in the figure), and the heat sink 10 is connected to each IGBT module 20. With the above arrangement, one heat sink 10 can simultaneously dissipate heat of a plurality of IGBT modules 20. For example, a plurality of IGBT modules 20 may be arranged in parallel and attached to the bottom surface of the heat sink 10, so as to achieve better heat dissipation effect.

As shown in fig. 13, the heat sink 10 is thermally connected to the IGBT module 20 through the thermally conductive connection layer 30. In the present embodiment, the thermal connection layer 30 may be a solder layer, a thermal paste layer, or a thermal adhesive layer.

Alternatively, the thermally conductive connecting layer 30 may be a solder layer, and in this case, the heat sink 10 may be connected to the IGBT module 20 by soldering, and the solder between the two forms the thermally conductive connecting layer 30. The welding may be by brazing, diffusion welding, fusion welding, or the like.

Alternatively, the thermally conductive connecting layer 30 may be a layer of thermally conductive paste, also referred to as a thermal interface material, having good thermal conductivity properties. For example, the thermal grease may be thermal silicone grease. The heat-conducting silicone grease is a novel organic grease specially prepared for heat transfer of electronic components, is produced by adopting a special formula, and is prepared by compounding metal oxide with good heat conductivity and insulativity and organic siloxane. Has good thermal conductivity, electrical insulation, impact resistance and chemical stability.

Alternatively, the thermally conductive connecting layer 30 may also be a thermally conductive adhesive layer, which may be, for example, a thermally conductive silicone adhesive.

Fig. 14 is a schematic structural diagram of another example of a package structure according to an embodiment of the present application. As shown in fig. 14, in the present embodiment, the number of heat sinks 10 is two, the number of IGBT modules 20 is plural (e.g., 3 in the figure), and the plural electronic components 20 are arranged in parallel between the two heat sinks 10.

Fig. 15 is a graph comparing experimental results of the heat sink 10 according to the embodiment of the present application and the heat sink according to the prior art. As shown in fig. 15, in a 455V reactor test environment, the heat sink 10 provided in the embodiment of the present application (corresponding to the present solution in fig. 1) and two conventional heat sinks in the prior art (corresponding to prior art 1 and prior art 2 in the figure) are used to perform a heat dissipation test on IGBT modules of the same model. In the test process, a heat-conducting medium with the flow rate of 10 liters/minute and the temperature of 25 ℃ flows through each radiator to radiate the IGBT module.

An experimental result shows that in the working process of the IGBT module, the heat dissipation performance of the heat sink 10 provided in the embodiment of the present application is always better than that of two conventional heat sinks in the prior art, the temperature of the IGBT module corresponding to the heat sink 10 is significantly lower than that of the IGBT module cooled by the conventional heat sink, the gain of temperature reduction (i.e., heat dissipation enhancement gain) reaches 14 ℃, the heat dissipation efficiency is improved by 15%, and the heat sink 10 in the embodiment of the present application is an effective heat dissipation structure of a future higher-power module.

On the other hand, the embodiment of the application also provides a heat dissipation system. Fig. 16 is a schematic structural diagram of a heat dissipation system according to an embodiment of the present application.

As shown in fig. 16, the heat dissipation system includes a radiator 10, a condenser 50, a circulation line 60, and a power pump 70. The outlet end of the radiator 10 is connected to the condenser 50 and the power pump 70 in sequence through the circulation pipeline 60, and the outlet end of the power pump 70 is connected to the inlet end of the radiator 10, so that the whole cooling system forms a closed loop.

The heat sink 10 is thermally connected to the electronic component 20 for dissipating heat from the electronic component 20. After absorbing the heat emitted from the electronic component 20, the heat-conducting medium in the heat sink 10 flows into the condenser 50 through the circulation line 60, in the condenser 50, the heat carried by the heat-conducting medium is emitted into the environment, and the heat-conducting medium with the reduced temperature flows into the heat sink 10 again under the action of the power pump 70, thereby completing the whole refrigeration cycle.

Optionally, the heat dissipation system further includes a heat dissipation fan (not shown in the drawings), which is disposed opposite to the condenser 50 and used for cooling the heat transfer medium in the condenser 50.

Optionally, the heat dissipation system can be arranged in the electric automobile to dissipate heat of an IGBT module in the automobile, the condenser 50 can be arranged at the head of the automobile and just opposite to the windward opening, a heat dissipation fan is not needed to be arranged at the moment, and the heat conducting medium in the condenser 50 can be cooled by utilizing air flow generated by the starting of the automobile.

On the other hand, an embodiment of the present application further provides an electronic device, and fig. 17 is a schematic structural diagram of the electronic device provided in the embodiment of the present application. As shown in fig. 17, the electronic apparatus includes a housing 80, a device to be heat-dissipated 90, and the heat sink 10 provided in any of the foregoing embodiments, the device to be heat-dissipated 90 and the heat sink 10 are located in the housing 80, and the substrate of the heat sink 10 is connected to the device to be heat-dissipated 90.

Optionally, the device to be dissipated 90 is any one of a power electronic device element, a chip, a battery, or a battery circuit board.

Alternatively, the electronic device may be an intelligent vehicle, such as an electric vehicle, and the device to be cooled may be any electronic component in the vehicle, such as the aforementioned IGBT module, IGCT module, or SiC module, which needs to be cooled.

Optionally, the electronic device may also be a motor controller in an automobile, and the device to be cooled may be any electronic component in the motor controller that needs to be cooled, such as the aforementioned IGBT module, IGCT module, or SiC module.

Optionally, the electronic device may also be any electrical device that needs to dissipate heat in the fields of variable frequency air conditioners, rail transit, smart grids, aerospace, new energy equipment, and the like, servers (clusters), high performance computers, communication rooms, and the like.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat sink, comprising:

a substrate (11);

the lug boss (12) is arranged on the base plate (11) in a protruding mode, the lug boss (12) comprises a plurality of lug bosses which are arranged at intervals, and a plurality of radiating fins (13) are arranged on the lug boss (12) at intervals.

2. A heat sink according to claim 1, wherein the bosses (12) are in an elongated structure, and the plurality of heat dissipation fins (13) are arranged in a line along an extending direction (S1) of long sides of the elongated structure.

3. A heat sink according to claim 2, wherein two adjacent bosses (12) are parallel to each other.

4. A heat sink according to claim 2 or 3, wherein the boss (12) is configured to: and the included angle between the extending direction (S1) of the long edge of the long strip structure and the flowing direction (S2) of the heat-conducting medium is 15-75 degrees.

5. A heat sink according to any one of claims 2-4, characterised in that the cross-sectional shape of the fins (13) is triangular or polygonal.

6. The heat sink according to claim 5, wherein the heat dissipating fins (13) are columnar structures having a quadrangular cross-sectional shape, and two side surfaces of the columnar structures correspond to two side surfaces in the extending direction (S1) of the long sides of the bosses (12) one by one and are flush with each other.

7. The heat sink according to claim 5, wherein a top corner of the heat dissipating fin (13) is disposed opposite to the flow direction (S2) of the heat transfer medium.

8. The heat sink according to any one of claims 1-7, wherein the height of the protrusion (12) from the base plate (11) is 0.1-0.5 mm.

9. A heat sink according to any one of claims 1 to 8, wherein the fins (13) are arranged in an array, and adjacent rows of fins (13) are staggered.

10. A heat sink according to any one of claims 1-9, further comprising a top cover (14), wherein the top cover (14) covers the substrate (11), and wherein the top cover (14) is provided with a heat conducting medium inlet (15) and a heat conducting medium outlet (16) at two opposite sides thereof, respectively.

11. A package structure, comprising: an electronic component (20) and a heat sink according to any of claims 1-10; the substrate (11) of the heat sink is connected to the electronic component (20).

12. The encapsulation structure according to claim 11, wherein the electronic component (20) comprises a plurality, and the heat sink is connected to each of the electronic components (20).

13. The package structure according to claim 11, wherein the heat spreader comprises two heat spreaders, the two heat spreaders being connected to opposite sides of the electronic component (20).

14. The package structure according to claim 11, wherein the heat sinks include two, the electronic component (20) includes a plurality of electronic components, and the plurality of electronic components (20) are juxtaposed between the two heat sinks.

15. Encapsulation structure according to any of claims 11-14, characterized in that a thermally conductive connection layer (30) is provided between the heat sink and the electronic component (20).

16. The package structure according to claim 15, wherein the thermally conductive connection layer (30) is a solder layer, a thermally conductive paste layer, or a thermally conductive glue layer.

17. The package structure according to claim 15, wherein the thermally conductive connection layer (30) comprises a first metal layer (31), a thermally conductive insulating layer (32) and a second metal layer (33) sequentially disposed between the heat spreader and the electronic component (20).

18. An electronic device, characterized in that it comprises a housing, a device to be cooled, and a heat sink according to any of claims 1-10, the device to be cooled and the heat sink being located within the housing, the substrate (11) of the heat sink being connected to the device to be cooled.

19. The electronic device of claim 18, wherein the device to be cooled is any one of a power electronic device, a chip, a battery, or a circuit board.