CN205430851U - IGBT heat dissipation module and have its IGBT module - Google Patents
IGBT heat dissipation module and have its IGBT module Download PDFInfo
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- CN205430851U CN205430851U CN201520977636.1U CN201520977636U CN205430851U CN 205430851 U CN205430851 U CN 205430851U CN 201520977636 U CN201520977636 U CN 201520977636U CN 205430851 U CN205430851 U CN 205430851U
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Abstract
The utility model discloses a IGBT heat dissipation module and have its IGBT module, IGBT heat dissipation module includes: radiator bottom plate, radiator bottom plate includes: a bottom plate body and N heat dissipation post, bottom plate body include this somatic part and set up first top layer and the second top layer on two relative surfaces of this somatic part respectively, and a N heat dissipation intercolumniation separates to be established on first top layer, and the one end of every heat dissipation post the fixed and other end be the free end with first top layer, first top layer all is suitable for with the post that dispels the heat and contacts with the coolant liquid, radiator bottom plate is copper one -tenth, copper -clad plate, copper -clad plate include base plate, first copper layer and second copper layer, and first copper layer sets up two surfaces of the relative setting on the base plate respectively with second copper layer on, the base plate is the silicon nitride base plate, and establish on the second top layer on first copper layer. Radiator bottom plate radiating effect made of copper is good, can promote the heat -sinking capability of IGBT heat dissipation module, can satisfy the heat dissipation requirement of IGBT heat dissipation module. And silicon nitride base plate structural strength is good.
Description
Technical field
This utility model relates to heat sink technology field, particularly relates to a kind of IGBT heat radiation module and has the IGBT module of this IGBT heat radiation module.
Background technology
Compact using liquid as the heat spreader structures of cooling medium and be configured to than relatively thin tabular or strip metal fin or needle-like structure, fluid passage is arranged in the inside of radiator, make to produce between fluid and cooled plate heat convection, thus fluid can disperse the heat power consumption of cooled plate surface high power electronic components and parts.
In correlation technique, the material of base plate of radiator is most important, and whether be directly connected to can the cooling requirements of IGBT heat radiation module.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, the utility model proposes a kind of IGBT heat radiation module, the good heat dissipation effect of this IGBT heat radiation module.
This utility model proposes a kind of IGBT module further.
According to IGBT of the present utility model heat radiation module, including: base plate of radiator, described base plate of radiator includes: base plate body and N number of thermal column, described base plate body includes body and the first top layer on relative two surface being separately positioned on described body and the second top layer, described N number of thermal column is spaced apart to be located on described first top layer, and one end of each described thermal column fixes with described first top layer and the other end is free end, described first top layer is adapted to contact with coolant with described thermal column, and described base plate of radiator is that copper becomes；Described first top layer and the second top layer are metal level, and described thermal column is metal column；Copper-clad plate, described copper-clad plate includes substrate, the first layers of copper and the second layers of copper, described first layers of copper and described second layers of copper are respectively provided with on be oppositely arranged two surfaces on the substrate, and described substrate is silicon nitride board, and described first layers of copper is located on described second top layer.
According to IGBT of the present utility model heat radiation module, use base plate of radiator good heat conductivity made of copper, the heat-sinking capability of IGBT heat radiation module can be improved, the cooling requirements of IGBT heat radiation module can be met.It addition, copper-clad plate can play support electric elements effect, and copper-clad plate and electric elements can also produce be mutually linked, the effect of mutually insulated, thereby may be ensured that the job security of electric elements and base plate of radiator.And, use silicon nitride board as substrate, it is ensured that substrate does not crushes, it is ensured that the functional reliability of copper-clad plate.
According to IGBT module of the present utility model, including igbt chip and described IGBT heat radiation module, described igbt chip is arranged in described second layers of copper.Use base plate of radiator good heat conductivity made of copper, the heat-sinking capability of IGBT heat radiation module can be improved, the cooling requirements of IGBT heat radiation module can be met.It addition, copper-clad plate can play support electric elements effect, and copper-clad plate and electric elements can also produce be mutually linked, the effect of mutually insulated, thereby may be ensured that the job security of electric elements and base plate of radiator.And, use silicon nitride board as substrate, it is ensured that substrate does not crushes, it is ensured that the functional reliability of copper-clad plate.And, silicon nitride board can make up the difference of the thermal coefficient of expansion with base plate of radiator made of copper, so that copper-clad plate and base plate of radiator package reliability are preferable.
Accompanying drawing explanation
Fig. 1 is the side view of the base plate of radiator in the IGBT heat radiation module according to this utility model embodiment；
Fig. 2 is the enlarged drawing of region A in Fig. 1；
Fig. 3 is the upward view of the IGBT heat radiation module according to first embodiment of this utility model；
Fig. 4 is the enlarged drawing of region B in Fig. 3；
The sectional view of the base plate of radiator that Fig. 5 is located in cooling bath；
Fig. 6 is the enlarged drawing of region C in Fig. 5；
Fig. 7 is the side view according to this utility model embodiment IGBT heat radiation module；
Fig. 8 is the enlarged drawing of region D in Fig. 7；
Fig. 9 is the schematic diagram of the IGBT heat radiation module according to first embodiment of this utility model；
Figure 10 is the axonometric chart of the IGBT heat radiation module according to first embodiment of this utility model；
Figure 11 is the upward view of the IGBT heat radiation module according to second embodiment of this utility model；
Figure 12 is the top view of the IGBT heat radiation module according to second embodiment of this utility model；
Figure 13 is the side view of the IGBT heat radiation module according to this utility model embodiment；
Figure 14 is the enlarged drawing of region E in Figure 13.
Reference:
IGBT dispels the heat module 1000；
Base plate of radiator 100；
Base plate body 10；First top layer 11；Second top layer 12；Body 13；
Thermal column 20；Free end 21；Fixing end 22；Cooling bath 30；
Copper-clad plate 200；Substrate 210；First layers of copper 220；Second layers of copper 230；
Igbt chip 2000.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to be used for explaining this utility model, and it is not intended that to restriction of the present utility model.
Below with reference to the accompanying drawings the IGBT(InsulatedGateBipolarTransistor-insulated gate bipolar transistor according to this utility model embodiment is described in detail) heat radiation module 1000.
IGBT heat radiation module 1000 according to this utility model embodiment may include that base plate of radiator 100 and copper-clad plate 200.Base plate of radiator 100 may include that base plate body 10 and N number of thermal column 20.As shown in figures 1 and 3, base plate body 10 can include body 13 be separately positioned on body 13 relative two surface on the first top layer 11 and the second top layer 12, i.e. first top layer 11 and the second top layer 12 are oppositely arranged on body 13, copper-clad plate 200 is installed on second top layer 12, copper-clad plate 200 is provided with electric elements.It should be noted that, base plate of radiator 100 has multiple choices, such as, although the quantity of the thermal column 20 on the base plate of radiator 100 shown in Figure 11 is significantly more than the quantity of the thermal column 20 on the base plate of radiator 100 shown in Fig. 3, but two kinds of base plate of radiator 100 all can be chosen.Described first top layer and the second top layer are metal level, and described thermal column is metal column.
By copper-clad plate 200 is arranged between base plate of radiator 100 and electric elements, copper-clad plate 200 can play the effect supporting electric elements, and copper-clad plate 200 and electric elements can also produce be mutually linked, the effect of mutually insulated, thereby may be ensured that electric elements and the job security of base plate of radiator 100.
N number of thermal column 20 is spaced apart to be located on the first top layer 11, and one end of each thermal column 20 is fixed with the first top layer 11, and the other end of each thermal column 20 is free end 21, and the first top layer 11 is adapted to contact with coolant with thermal column 20.
As in figure 2 it is shown, one end of thermal column 20 is the fixing end 22 of thermal column 20, the fixing end 22 of thermal column 20 can be fixedly connected on the first top layer 11.Thus, coolant can contact with the first top layer 11, can also contact with the surface exposed of each thermal column 20, the heat that the electric elements being arranged on the second top layer 12 send can pass to the first top layer 11 and N number of thermal column 20 by copper-clad plate the 200, second top layer 12 and body 13, thus the heat of electric elements can be passed to coolant by the first top layer 11 and N number of thermal column 20 further, and then the effect of the heat distributing electric elements can be played, it is ensured that electric elements job stability.
According to an embodiment of the present utility model, on the first top layer 11, the area with coolant contact portion is S1, and the area of part that the first top layer 11 contacts with each thermal column 20 is S2,180≤S1/S2≤800.It is understandable that, meet the base plate of radiator 100 of above-mentioned relation formula so that the first top layer 11 is reasonable in design with the area S1 of coolant contact portion, it is also possible that the first top layer 11 is reasonable in design with the area S2 of N number of thermal column 20 contact portion, so that the first top layer 11 and N number of thermal column 20 are stable with coolant heat exchange and reliable respectively, can be while ensureing sufficiently large area of dissipation, well reduce coolant flow resistance, improve radiating efficiency.Preferably, 200≤S1/S2≤500.
Wherein, the quantity of thermal column 20 meets relational expression: 300≤N ＜ 650.The thermal column 20 meeting above-mentioned relation formula can be in the case of ensureing that thermal column 20 and coolant heat exchange effect are reliably, it is also possible that base plate of radiator 100 effectively reduces the quantity of thermal column 20, such that it is able to reduce the processing technique requirement of base plate of radiator 100, the demoulding difficulty of base plate of radiator 100 can also be reduced, improve the yield rate of base plate of radiator 100, reduce the production difficulty of base plate of radiator 100, reduce the production cost of base plate of radiator 100.Preferably, 300≤N ＜ 420.
Shown in Fig. 7 and Fig. 8, copper-clad plate 200 can include substrate the 210, first layers of copper 220 and the second layers of copper 230, first layers of copper 220 and the second layers of copper 230 can be respectively provided with on be oppositely arranged two surfaces over the substrate 210, as shown in Figure 8, first layers of copper 220 is arranged on the lower surface of substrate 210, second layers of copper 230 is arranged on the upper surface of substrate 210, and the first layers of copper 220 is arranged on the first top layer 11, and electric elements are arranged in the second layers of copper 230.
Wherein, base plate of radiator 100 becomes for copper.It is understandable that, copper has good heat conductivility, and base plate of radiator 100 can be effectively improved the heat-sinking capability of IGBT heat radiation module 1000, can meet the cooling requirements of IGBT heat radiation module 1000, and base plate of radiator 100 structure made of copper is reliable, service life is long.
Owing to silicon nitride is a kind of superhard material, itself there is lubricity and wearability, and silicon nitride is atomic crystal, can be with antioxidation when high temperature.And it can also resist thermal shock, is heated to more than 1000 DEG C in atmosphere, quick refrigeration the most drastically heats, also will not fragmentation.Substrate 210 can be silicon nitride board, thereby may be ensured that the functional reliability of copper-clad plate 200.Still optionally further, copper-clad plate can be silicon nitride DBC copper-clad plate or silicon nitride AMB copper-clad plate, and wherein DBC (DIRECTBondingCopper) the most directly covers copper method, AMB (Activemetalbrazing) i.e. active metal brazing method.
According to a preferred embodiment of the present utility model, the thickness h 2 of the thickness h 1 of the first layers of copper 220 and the second layers of copper 230 can be equal, and the first layers of copper 220 is located on the second top layer 12.By rationally arranging the first layers of copper 220 and thickness of the second layers of copper 230, the copper-clad plate 200 support effect to electric elements can be improved further, it is also possible to improve the structural strength of copper-clad plate 200, extend the service life of copper-clad plate 200.And copper-clad plate 200 processing technology is simple, low cost of manufacture.
IGBT heat radiation module 1000 according to this utility model embodiment, uses base plate of radiator 100 good heat conductivity made of copper, can improve the heat-sinking capability of IGBT heat radiation module 1000, can meet the cooling requirements of IGBT heat radiation module 1000.It addition, copper-clad plate 200 can play support electric elements effect, and copper-clad plate 200 and electric elements can also produce be mutually linked, the effect of mutually insulated, thereby may be ensured that electric elements and the job security of base plate of radiator 100.And, use silicon nitride board as substrate 210, it is ensured that substrate 210 does not crushes, it is ensured that the functional reliability of copper-clad plate 200.And, silicon nitride board can make up the difference of the thermal coefficient of expansion with base plate of radiator 100 made of copper, so that copper-clad plate 200 and base plate of radiator 100 package reliability are preferable.
The optional arrangement of copper-clad plate 200 is described below in detail.
Alternatively, the thickness h 1 of the first layers of copper 220 and the thickness h 2 of the second layers of copper 230 are 0.2 millimeter-0.6 millimeter.Thickness uses the first layers of copper 220 in above-mentioned numerical range and the second layers of copper 230 can promote the structural strength of copper-clad plate 200 further, extends the service life of copper-clad plate 200.
Alternatively, as shown in Figure 8, the thickness h 3 of substrate 210 can be 0.25 millimeter-1 millimeter.By rationally arranging the thickness h 3 of substrate 210, copper-clad plate 200 can be promoted and support the effect of electric elements, but also can ensure that the structural strength of copper-clad plate 200, extend the service life of copper-clad plate 200.
Alternatively, as shown in Fig. 9, Figure 10 and Figure 12, copper-clad plate 200 can be multiple, and multiple copper-clad plates 200 are along the spaced apart setting of length direction of base plate of radiator.Preferably, distance L3 between adjacent two copper-clad plates 200 is 3 millimeters-10 millimeters.By rationally arranging distance L3 between adjacent two copper-clad plates 200, so that multiple copper-clad plate 200 supports electric elements jointly, so that electric elements uniform force.
The optional arrangement of base plate of radiator 100 is described below in detail.
According to an embodiment of the present utility model, the area of dissipation of IGBT heat radiation module 1000 is S, and the area sum of the outer surface of the perisporium of N number of thermal column 20 is S3, and the area sum of the end face of the free end 21 of N number of thermal column 20 is S4, S=S1+S3+S4, and 40000mm2≤S≤50000mm2.Thus, by rationally arranging the area of dissipation S of IGBT heat radiation module 1000, so that the volume of IGBT heat radiation module 1000 arranges rationally, and can ensure that the first top layer 11 and N number of thermal column 20 respectively with the heat exchange effect of coolant, so that base plate of radiator 100 heat-sinking capability is good and area design reasonable, the radiating effect of radiator is effectively ensured.The area of dissipation of each described thermal column is (S3+S4)/N, 80≤(S3+S4)/N≤120.
In examples more of the present utility model, as in figure 2 it is shown, from one end of thermal column 20 to free end 21, the area of the cross section of thermal column 20 can reduce to free end 21 from one end of thermal column 20.By size and the size of free end 21 of the fixing end 22 of each thermal column of appropriate design 20, so that each thermal column 20 all with the first top layer 11 stable connection, but also so that thermal column 20 structure is reliable, and beneficially thermal column 20 and the heat exchange of coolant.
Alternatively, as shown in Figure 6, the height of thermal column 20 is h, wherein, and 7.5mm≤h ＜ 8.2mm.Preferably, h=8mm.By rationally arranging the height h of thermal column 20, can be so that thermal column 20 be arranged in cooling bath 30, it is ensured that the radiating effect of thermal column 20.
Wherein, the concrete structure of thermal column 20 is not limited.According to an embodiment of the present utility model, thermal column 20 is it is so structured that pyramidal structure, and the cross section of thermal column 20 can be circular, and the radius of one end of thermal column 20 is α with the ratio of the radius of free end 21,1.2≤α≤1.8.As in figure 2 it is shown, the radius of the free end 21 of thermal column 20 is r1, the radius of the fixing end 22 of thermal column 20 is r2, α=r2/r1.Thermal column 20 structure meeting above-mentioned relation formula is reliable, and relatively big with the area of coolant contact portion, can fully ensure that the radiating effect of radiator so that heat exchange between thermal column 20 and coolant.Preferably, α=1.69.
In examples more of the present utility model, as shown in Figure 5 and Figure 6, coolant is suitable to be contained in cooling bath 30, and cooling bath 30 is suitable to be connected with the first top layer 11, and the free end 21 of thermal column 20 is L1 apart from the minimum range of the diapire of cooling bath 30,0.2 millimeter≤L1≤2 millimeter.It is understood that the length of thermal column 20 is cooled the depth limit of groove 30, such that it is able to rationally arrange the degree of depth of cooling bath 30 so that the length of thermal column 20 is reasonable.The cooling bath 30 and the thermal column 20 that meet above-mentioned relation formula can reduce the cooling bath 30 interference to thermal column 20, and can ensure that the normal work of thermal column 20.
In an optional embodiment of the present utility model, as shown in Figure 4, the distance of adjacent two thermal columns 20 can be L2,0.4 millimeter≤L2≤1.1 millimeter.Meet distance L2 of adjacent two thermal columns 20 of above-mentioned relation formula so that N number of thermal column 20 arranges rationally on the first top layer 11, and interfering with each other between adjacent two thermal columns 20 can be reduced the most to a certain extent, thereby may be ensured that the normal heat exchange of each thermal column 20 and coolant, and then can ensure that the normal work of base plate of radiator 100.
Alternatively, two thermal columns 20 of arbitrary neighborhood may be constructed one group, and the L2 of the L2 of one of which and a group in remaining group can be unequal.Therefrom, it may be appreciated that, distance L2 of adjacent two thermal columns 20 can be adjusted according to practical condition, thus can reduce the production difficulty of base plate of radiator 100 the most to a certain extent.Such as, distance L2 between two adjacent heat radiation posts 20 that the corner on neighbouring first top layer 11 is arranged can regulate as the case may be.
The concrete arrangement form of the N number of thermal column 20 of a kind of base plate of radiator 100 is given below, but is not limited to this, wherein, quantity N=368 of N number of thermal column 20, the L2=0.62 millimeter of first group, the L2=1.038 millimeter of second group, L2 of remaining group meets following condition: 0.62 millimeter≤L2≤1.04 millimeter.It is understood that the distance L2 minimum between adjacent two thermal columns 20 can be 0.62 millimeter, and maximum can be 1.04 millimeters.Thus, the connection and reasonable arrangement of thermal column 20, the demoulding is easy, and yield rate is high.
Alternatively, the withdrawing pattern angle beta of each thermal column 20 can be 2 degree of-4 degree.Wherein, the withdrawing pattern angle beta of a thermal column 20 and the withdrawing pattern angle beta of another thermal column 20 can be different, it is also possible to identical.Withdrawing pattern angle beta meets the thermal column 20 of above-mentioned angular range can reduce the demoulding difficulty of base plate of radiator 100 the most to a certain extent, improves the production yield rate of base plate of radiator 100.
Preferably, withdrawing pattern angle beta is the radiating effect that the radiating effect of the thermal column 20 of 2 degree to be better than the thermal column 20 that withdrawing pattern angle beta is 4 degree slightly, but there is no and be obviously improved, withdrawing pattern can be more conducive to owing to increasing withdrawing pattern angle beta, and ensure that inlet outlet pressure differential is minimum, the withdrawing pattern angle beta of thermal column 20 can be determined according to technology difficulty and actual demand when using.
Preferably, the 11, second top layer 12, body the 13, first top layer can be one-body molded by air pressure THROUGH METHOD die casting with thermal column 20.Thus, integrated base plate of radiator 100 structural strength is high, and service life is long, and manufacturing process is simple.
One group setting value according to the IGBT heat radiation module 1000 of this utility model embodiment is given below, but this utility model is not limited to this.40000 square millimeters≤S≤50000 square millimeter, N=368, S1/S2=229.284, the height h=8mm of thermal column 20, α=1.69, L1=0.4mm.
With reference to shown in Fig. 7, wherein Fig. 1 and Fig. 3 is 40000 square millimeters≤S≤50000 square millimeter, N=368, the base plate of radiator 100 of S1/S2=229.284, by result of the test it can be seen that the base plate of radiator 100 of this utility model embodiment maximum temperature that A phase, B phase are corresponding with C in IGBT heat radiation module 1000 all can meet actual IGBT dispels the heat the cooling requirements of module 1000.
Wherein, the arrangement being arranged on the N number of thermal column 20 on the first top layer 11 has multiple, provides below the arrangement of a kind of N number of thermal column 20.N number of thermal column 20 can be divided into many groups, the many groups of length direction along base plate of radiator 100 (i.e. direction before and after shown in Fig. 3) intervals are arranged, many groups include the first subgroup d1 and the second subgroup d2 being arranged alternately along the length direction of base plate of radiator 100, all include width (i.e. left and right directions shown in Fig. 3) the spaced multiple thermal columns 20 along base plate of radiator 100 in the first subgroup d1 and the second subgroup d2.It is understood that the first subgroup d1 being arranged alternately and the second subgroup d2 are so that N number of thermal column 20 is reasonably distributed on the first top layer 11, it is ensured that thermal column 20 and the heat-exchange capacity of coolant.Wherein, the quantity of the thermal column 20 in the first subgroup d1 and the second subgroup d2 can adjust according to practical situation.
According to IGBT module of the present utility model, including above-mentioned IGBT heat radiation module 1000 and igbt chip 2000, igbt chip 2000 is arranged in the second layers of copper 230.Use base plate of radiator 100 good heat conductivity made of copper, the heat-sinking capability of IGBT heat radiation module 1000 can be improved, the cooling requirements of IGBT heat radiation module 1000 can be met.It addition, copper-clad plate 200 can play support electric elements effect, and copper-clad plate 200 and electric elements can also produce be mutually linked, the effect of mutually insulated, thereby may be ensured that electric elements and the job security of base plate of radiator 100.And, use silicon nitride board as substrate 210, it is ensured that substrate 210 does not crushes, it is ensured that the functional reliability of copper-clad plate 200.And, silicon nitride board can make up the difference of the thermal coefficient of expansion with base plate of radiator 100 made of copper, so that copper-clad plate 200 and base plate of radiator 100 package reliability are preferable.
The following detailed description of the test to the IGBT module according to utility model embodiment.
First the experimental condition of IGBT module is discussed in detail, the preferred dimension of copper-clad plate 200 is 61 × 67 × 0.92mm, base plate of radiator 100 is made of copper, voltage is 480V, electric current 0-150A, it is stepped up output current phase to 150A from 0, the maximum temperature of test IGBT module, and measure, with thermal resistance tester, the steady state heat resistance that igbt chip 2000 joins the copper-clad plate 200 of silicon nitride board.Wherein it is desired to explanation, the model that igbt chip 2000 uses is IGC193T120T8RMA, and igbt chip 2000 is 1200v/200A, and the production company of igbt chip 2000 is company of Infineon.
Finally introduce the result of the test of IGBT module, the temperature thermal resistance being recorded copper-clad plate 200 by thermal resistance tester is 0.08582k/w, IGBT module maximum temperature is 81 DEG C, such that it is able to learn: IGBT module can meet cooling requirements, and the good heat dissipation effect of IGBT module.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axially ", " radially ", orientation or the position relationship of the instruction such as " circumferential " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two, three etc., unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be mechanically connected, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in this utility model can be understood as the case may be.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine this embodiment or example description are contained at least one embodiment of the present utility model or example.In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be to combine in one or more embodiments in office or example in an appropriate manner.Additionally, in the case of the most conflicting, the feature of the different embodiments described in this specification or example and different embodiment or example can be combined and combine by those skilled in the art.
Although above it has been shown and described that embodiment of the present utility model, it is understandable that, above-described embodiment is exemplary, it is not intended that to restriction of the present utility model, above-described embodiment can be changed in the range of this utility model, revises, replace and modification by those of ordinary skill in the art.
Claims (21)
1. an IGBT heat radiation module, it is characterised in that including:
Base plate of radiator, described base plate of radiator includes: base plate body and N number of thermal column, described base plate body includes body and the first top layer on relative two surface being separately positioned on described body and the second top layer, described N number of thermal column is spaced apart to be located on described first top layer, and one end of each described thermal column fixes with described first top layer and the other end is free end, described first top layer is adapted to contact with coolant with described thermal column, and described base plate of radiator is that copper becomes；Described first top layer and the second top layer are metal level, and described thermal column is metal column；
Copper-clad plate, described copper-clad plate includes substrate, the first layers of copper and the second layers of copper, described first layers of copper and described second layers of copper are respectively provided with on be oppositely arranged two surfaces on the substrate, and described substrate is silicon nitride board, and described first layers of copper is located on described second top layer.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that described first layers of copper is equal with the thickness of described second layers of copper.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that the thickness of described first layers of copper and described second layers of copper is 0.2 millimeter-0.6 millimeter.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that the thickness of described substrate is 0.25 millimeter-1 millimeter.
IGBT the most according to claim 1 dispels the heat module, it is characterised in that described copper-clad plate is multiple, and multiple described copper-clad plates are along the spaced apart setting of length direction of described base plate of radiator, and the distance between adjacent two described copper-clad plates is 3 millimeters-10 millimeters.
IGBT the most according to claim 1 dispels the heat module, it is characterized in that, on described first top layer, the area with described coolant contact portion is S1, the area of the part that contacts with each described thermal column on described first top layer is S2,180≤S1/S2≤800, wherein 300≤N ＜ 650.
IGBT the most according to claim 6 dispels the heat module, it is characterised in that 200≤S1/S2≤500；Wherein 300≤N ＜ 420.
IGBT the most according to claim 6 dispels the heat module, it is characterized in that, the area of dissipation of described IGBT heat radiation module is S, the area sum of the outer surface of the perisporium of N number of described thermal column is S3, the area sum of the end face of the free end of N number of described thermal column is S4, S=S1+S3+S4, and 40000 square millimeters≤S≤50000 square millimeter.
IGBT the most according to claim 6 dispels the heat module, it is characterised in that the height of described thermal column is h, wherein, and 7.5 millimeters≤h ＜ 8.2 millimeters.
IGBT the most according to claim 9 dispels the heat module, it is characterised in that the area of dissipation of each described thermal column is (S3+S4)/N, 80≤(S3+S4)/N≤120.
11. IGBT according to claim 6 heat radiation modules, it is characterised in that from described one end of described thermal column to described free end, the area of the cross section of described thermal column reduces to described free end from described one end of described thermal column.
12. IGBT according to claim 11 heat radiation modules, it is characterised in that the cross section of described thermal column is circular, and the radius of described one end of described thermal column is α with the ratio of the radius of described free end, 1.2≤α≤1.8.
13. IGBT according to claim 6 heat radiation modules, it is characterized in that, described coolant is suitable to be contained in cooling bath, described cooling bath is suitable to be connected with described first top layer, and the free end of described thermal column is L1 at the distance minimum of the diapire of described cooling bath, 0.2 millimeter≤L1≤2 millimeter.
14. IGBT according to claim 6 heat radiation modules, it is characterised in that the distance of adjacent two described thermal columns is L2,0.4 millimeter≤L2≤1.1 millimeter.
15. IGBT according to claim 14 heat radiation modules, it is characterised in that two described thermal columns of arbitrary neighborhood constitute one group, and the L2 of one of which is unequal with the L2 of a group in remaining group.
16. IGBT according to claim 15 dispel the heat modules, it is characterised in that N=368, wherein the L2=0.62 millimeter of first group, the L2=1.04 millimeter of second group, L2 of remaining group meets following condition: 0.62 millimeter≤L2≤1.04 millimeter.
17. IGBT according to claim 6 heat radiation modules, it is characterised in that the withdrawing pattern angle beta of each described thermal column is 2 degree of-4 degree.
18. IGBT according to claim 6 heat radiation modules, it is characterised in that described body, described first top layer, described second top layer and described thermal column are one-body molded by air pressure THROUGH METHOD die casting.
19. IGBT according to claim 8 heat radiation modules, it is characterised in that 40000 square millimeters≤S≤50000 square millimeter, N=368, S1/S2=229.284.
20. according to the IGBT heat radiation module according to any one of claim 1-19, it is characterized in that, described N number of thermal column is divided into many groups, the many groups of length direction intervals along described IGBT heat radiation module are arranged, described many groups include all including the spaced multiple thermal columns of width along described IGBT heat radiation module in the first subgroup being arranged alternately along the length direction of described IGBT heat radiation module and the second subgroup, described first subgroup and described second subgroup.
21. 1 kinds of IGBT modules, it is characterised in that including igbt chip and according to the IGBT heat radiation module according to any one of claim 1-20, described igbt chip is arranged in described second layers of copper.
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| CN113314484A (en) * | 2021-04-23 | 2021-08-27 | 华为技术有限公司 | Radiator, packaging structure and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113314484A (en) * | 2021-04-23 | 2021-08-27 | 华为技术有限公司 | Radiator, packaging structure and electronic equipment |
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