CN216311762U - Water-cooling radiating substrate for power module - Google Patents
Water-cooling radiating substrate for power module Download PDFInfo
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- CN216311762U CN216311762U CN202121660531.5U CN202121660531U CN216311762U CN 216311762 U CN216311762 U CN 216311762U CN 202121660531 U CN202121660531 U CN 202121660531U CN 216311762 U CN216311762 U CN 216311762U
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Abstract
The utility model discloses a water-cooling heat dissipation substrate for a power module, which comprises a heat dissipation substrate body, wherein the upper surface of the heat dissipation substrate body is a substrate welding surface for arranging the electrical layout of the power module, the lower surface of the heat dissipation substrate body is a substrate heat dissipation surface, a plurality of mounting holes are arranged on the heat dissipation substrate body in a penetrating manner, the heat dissipation substrate body is bent towards one side of the substrate welding surface along the length direction and forms an arc-shaped bending structure, the height difference between the arc top and the two side edges of the arc-shaped bending structure is 0.1-1 mm, a plurality of welding bosses for keeping the thickness of welding materials uniform during welding are uniformly arranged on the substrate welding surface, and a plurality of oval heat dissipation columns are vertically arranged on the substrate heat dissipation surface; the oval heat dissipation columns are arranged on the heat dissipation surface of the substrate in a plurality of longitudinal rows along the length direction of the heat dissipation substrate body, two adjacent sets of oval heat dissipation columns are arranged in a staggered mode, the welding boss is of a rectangular, circular or trapezoidal structure, and the upper surface of the welding boss is parallel to the welding surface of the substrate.
Description
Technical Field
The utility model relates to the technical field of power module heat dissipation, in particular to a water-cooling heat dissipation substrate for a power module.
Background
With the rapid development of electronic technology, the power module package is continuously developed towards high integration level, the heat power consumption per unit volume is increased along with the improvement of the integration level, if the generated heat cannot be timely and effectively released to the outside of a radiator, the heat is accumulated in the module, and the temperature of the module is increased. The stability of the module is reduced when it is operated in a high temperature environment for a long time. Efficient heat dissipation of power modules is therefore a crucial concern in the field of module applications.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a water-cooled heat dissipation substrate for a power module, which has high reliability and good heat dissipation effect, in order to overcome the above-mentioned defects in the prior art.
The utility model aims to provide a water-cooling heat dissipation substrate for a power module, which comprises a heat dissipation substrate body, wherein the upper surface of the heat dissipation substrate body is a substrate welding surface for arranging the electrical layout of the power module, the lower surface of the heat dissipation substrate body is a substrate heat dissipation surface, a plurality of mounting holes are arranged on the heat dissipation substrate body in a penetrating manner, the heat dissipation substrate body is bent towards one side of the substrate welding surface along the length direction to form an arc-shaped bending structure, the height difference between the arc top and the two side edges of the arc-shaped bending structure is 0.1-1 mm, a plurality of welding bosses for keeping the uniform thickness of welding flux during welding are uniformly arranged on the substrate welding surface, and a plurality of oval heat dissipation columns are vertically arranged on the substrate heat dissipation surface.
Furthermore, the oval heat dissipation columns are arranged on the heat dissipation surface of the substrate in a plurality of longitudinal rows along the length direction of the heat dissipation substrate body, two adjacent groups of the oval heat dissipation columns are arranged in a staggered mode, the gap between every two adjacent oval heat dissipation columns is smaller than the length of the short axis of each oval heat dissipation column, and the minimum gap between every two adjacent oval heat dissipation columns is 0.5-2.5 mm.
Furthermore, the welding boss is in a rectangular, circular or trapezoidal structure, and the upper surface of the welding boss is parallel to the welding surface of the substrate; the height of the welding boss is 0.01-0.15 mm.
Further, the ratio of the ellipse major axis to the ellipse minor axis of the ellipse heat dissipation pillar is between 1.2: 1-5: 1, the height of the oval heat dissipation column is 1-10 mm.
Furthermore, the heat dissipation substrate body is made of pure copper, copper alloy, pure aluminum or aluminum alloy materials, and the welding boss and the oval heat dissipation column are made of the same materials as the heat dissipation substrate body and are formed and arranged on the heat dissipation substrate body in an integral casting or integral forging mode.
The utility model has the beneficial technical effects that: the radiating substrate body can effectively improve the welding reliability of the substrate through the arc-shaped bending structure and the welding lug boss, the oval radiating columns can improve the radiating performance of the power module, the oval radiating columns are closely arranged and keep a certain gap to ensure the radiating effect of the oval radiating columns, the radiating capacity is increased, and the radiating capacity of the power module can be effectively improved, so that the working capacity of a device is improved.
Drawings
FIG. 1 is a schematic view of a bonding surface of a substrate according to the present invention;
FIG. 2 is a schematic view of a heat-dissipating surface of a substrate according to the present invention;
FIG. 3 is a schematic side view of the heat-dissipating substrate body according to the present invention;
fig. 4 is a partially enlarged schematic view of fig. 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further described with reference to the accompanying drawings and examples.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inside", "outside", "lateral", "vertical", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1-4, the water-cooled heat dissipation substrate for a power module according to the present invention includes a heat dissipation substrate body, wherein the upper surface of the heat dissipation substrate body is a substrate soldering surface 1 for disposing electrical layout of the power module, the lower surface of the heat dissipation substrate body is a substrate heat dissipation surface 3, a plurality of mounting holes 5 are formed in the heat dissipation substrate body, the heat dissipation substrate body is bent towards one side of the substrate soldering surface along the length direction to form an arc-shaped bending structure, the curvature of the arc-shaped bending structure is determined as required, and can be adjusted according to different processing requirements, and the height difference between the arc top and the two side edges of the arc-shaped bending structure is preferably controlled to be 0.1-1 mm so as to avoid an excessively large bending curvature. The welding structure is characterized in that a plurality of welding bosses 2 for keeping the thickness of welding flux uniform during welding are uniformly arranged on the welding surface 1 of the substrate, and a plurality of oval radiating columns 4 are vertically arranged on the radiating surface 3 of the substrate. The heat dissipation substrate body is made of pure copper, copper alloy, pure aluminum or aluminum alloy materials, the welding boss 2 and the oval heat dissipation column 4 are made of the same materials as the heat dissipation substrate body and are arranged on the heat dissipation substrate body in a forming mode of integral casting or integral forging.
Referring to fig. 1-4, the welding boss 2 is in a rectangular, circular or trapezoidal structure, and the upper surface of the welding boss 2 is parallel to the substrate welding surface 1; the height of the welding boss 2 is 0.01-0.15 mm.
Referring to fig. 2-4, the oval heat-dissipating studs 4 are arranged on the heat-dissipating surface 3 of the substrate in a plurality of longitudinal rows along the length direction of the heat-dissipating substrate body, two adjacent sets of oval heat-dissipating studs 4 are arranged in a staggered manner, the gap between two adjacent oval heat-dissipating studs 4 is smaller than the length of the minor axis of the oval heat-dissipating stud, and the minimum gap between two adjacent oval heat-dissipating studs 4 is 0.5-2.5 mm. The ratio of the ellipse long axis to the ellipse short axis of the ellipse heat dissipation column 4 is 1.2: 1-5: 1, the height of the oval heat dissipation column 4 is 1-10 mm.
The radiating substrate body can effectively improve the welding reliability of the substrate through the arc-shaped bending structure and the welding lug boss, the oval radiating columns can improve the radiating performance of the power module, the oval radiating columns are closely arranged and keep a certain gap to ensure the radiating effect, the purpose of increasing the radiating capacity is achieved, the radiating capacity of the module can be greatly improved, and the service life and the reliability of the module are improved.
The specific embodiments described herein are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (5)
1. The utility model provides a power module is with water-cooling heat dissipation base plate, includes the heat dissipation base plate body, the upper surface of heat dissipation base plate body is the base plate face of weld of arranging the electric overall arrangement of power module, and the lower surface of heat dissipation base plate body is the base plate cooling surface, its characterized in that: wear to be equipped with a plurality of mounting holes on the heat dissipation base plate body, the heat dissipation base plate body is along length direction towards base plate bonding surface lateral bending and form arc bending structure, and the difference in height on the arc top and both sides limit of this arc bending structure is 0.1~1mm, evenly be provided with a plurality of welding bosss that keep solder thickness even when being used for the welding on the base plate bonding surface, be provided with a plurality of oval heat dissipation posts on the base plate cooling surface perpendicularly.
2. The water-cooled heat dissipation substrate for a power module according to claim 1, wherein: the oval heat dissipation columns are arranged on the heat dissipation surface of the substrate in a plurality of longitudinal rows along the length direction of the heat dissipation substrate body, two adjacent groups of the oval heat dissipation columns are arranged in a staggered mode, and the gap between every two adjacent oval heat dissipation columns is smaller than the length of the short axis of each oval heat dissipation column.
3. The water-cooled heat dissipation substrate for a power module according to claim 1 or 2, wherein: the welding boss is in a rectangular, circular or trapezoidal structure, and the upper surface of the welding boss is parallel to the welding surface of the substrate; the height of the welding boss is 0.01-0.15 mm.
4. The water-cooled heat dissipation substrate for a power module according to claim 2, wherein: the ratio of the ellipse long axis to the ellipse short axis of the ellipse heat dissipation column is 1.2: 1-5: 1, the height of the oval heat dissipation column is 1-10 mm; the minimum gap between two adjacent oval heat dissipation columns is 0.5-2.5 mm.
5. The water-cooled heat dissipation substrate for a power module according to claim 1, 2 or 4, wherein: the heat dissipation substrate body is made of pure copper, copper alloy, pure aluminum or aluminum alloy materials, the welding lug bosses and the oval heat dissipation columns are made of the same materials as the heat dissipation substrate body and are formed and arranged on the heat dissipation substrate body in an integral casting or integral forging mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121660531.5U CN216311762U (en) | 2021-07-21 | 2021-07-21 | Water-cooling radiating substrate for power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121660531.5U CN216311762U (en) | 2021-07-21 | 2021-07-21 | Water-cooling radiating substrate for power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216311762U true CN216311762U (en) | 2022-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121660531.5U Active CN216311762U (en) | 2021-07-21 | 2021-07-21 | Water-cooling radiating substrate for power module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116441696A (en) * | 2023-06-19 | 2023-07-18 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
-
2021
- 2021-07-21 CN CN202121660531.5U patent/CN216311762U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116441696A (en) * | 2023-06-19 | 2023-07-18 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
| CN116441696B (en) * | 2023-06-19 | 2023-09-15 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
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