CN210718787U

CN210718787U - Ultra-thin heat-conducting plate

Info

Publication number: CN210718787U
Application number: CN201921474725.9U
Authority: CN
Inventors: 任思宇; 王岩
Original assignee: Tangshan Dachuang Conduction Technology Co ltd
Current assignee: Tangshan Dachuang Conduction Technology Co ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2020-06-09
Anticipated expiration: 2029-09-06

Abstract

The utility model discloses an ultra-thin heat-conducting plate, which comprises a housin, be provided with the cavity in the casing, there is liquid working medium in the cavity, and the cavity inner wall is the capillary inner wall, the cavity internal fixation sets up a plurality of copper posts, copper post evenly distributed, be the liquid circulation layer on the capillary inner wall, be the gas-liquid circulation layer in the cavity, the casing is installed on heat source upper portion. The utility model discloses an ultra-thin heat-conducting plate has characteristics such as the radiating effect is good, simple structure.

Description

Ultra-thin heat-conducting plate

Technical Field

The utility model relates to a heat abstractor technical field, more specifically relates to an ultra-thin heat-conducting plate.

Background

Many products have proposed higher requirement to the heat dissipation of product along with the improvement of technology at present, and current heat-conducting plate is heat conduction effect unsatisfactory usually, just is provided with heat conduction copper post usually like current heat-conducting plate inside, and simple structure heat conduction effect is unsatisfactory.

Disclosure of Invention

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, an object of the present invention is to provide an ultra-thin heat conducting plate, which has the advantages of good heat dissipation effect, simple structure, etc.

The utility model provides an above-mentioned technical problem's technical scheme as follows: the ultrathin heat conducting plate comprises a shell, wherein a cavity is arranged in the shell, a liquid working medium is arranged in the cavity, the inner wall of the cavity is a capillary inner wall, a plurality of copper columns are fixedly arranged in the cavity and are uniformly distributed, a liquid circulation layer is arranged on the capillary inner wall, a gas-liquid circulation layer is arranged in the cavity, and the shell is arranged on the upper portion of a heat source.

Further, the shell is attached to a heat source.

Furthermore, the inner capillary wall in the cavity is integrated with the cavity.

Further, the inner wall of the capillary is distributed in an elliptical shape.

Further, the outline of the copper column is an ellipse.

The beneficial effects of the utility model are that: the utility model provides an ultra-thin heat-conducting plate, when guaranteeing inner support structure for oval distribution through the capillary inner wall, furthest does benefit to the backward flow of liquid working medium, improves the radiating efficiency, and the profile of copper post reduces the resistance that the copper post produced to vapor flow in the gas-liquid circulation layer for oval structure simultaneously, convenient quick heat conduction, convenient operation, the practicality is strong.

Drawings

Fig. 1 is a schematic structural view of an ultra-thin heat conducting plate of the present invention;

fig. 2 is a schematic view of a partial structure of an ultra-thin heat conducting plate according to the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

1. a housing; 10. a cavity; 11. an inner capillary wall; 12. a liquid circulation layer; 13. a copper pillar; 14. a gas-liquid circulation layer; 100. a heat source.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1-2, the ultra-thin heat conducting plate of this embodiment includes a casing 1, a cavity 10 is disposed in the casing 1, a liquid working medium is disposed in the cavity 10, an inner wall of the cavity 10 is a capillary inner wall 11, a plurality of copper pillars 13 are fixedly disposed in the cavity 10, the copper pillars 13 are uniformly distributed, a liquid circulation layer 12 is disposed on the capillary inner wall 11, a gas-liquid circulation layer 14 is disposed in the cavity 10, and the casing 1 is mounted on an upper portion of a heat source 100.

In the ultra-thin heat conducting plate of the present embodiment, the housing 1 is attached to the heat source 100.

In the ultra-thin heat conducting plate of the present embodiment, the inner capillary wall 11 in the cavity is integrated with the cavity 10.

The capillary inner walls 11 of the ultra-thin heat conducting plate of the embodiment are distributed in an oval shape.

The outline of the copper 13 column in the ultra-thin heat conducting plate of the embodiment is an ellipse.

During working, the working medium close to the heat source forms backflow on the inner wall of the bottom capillary, the vaporized working medium is heated and meets cold liquefaction backflow on the inner wall of the upper capillary, so that the heat conduction efficiency is greatly improved, and meanwhile, the outline of the copper column is elliptical, so that backflow resistance can be reduced, and heat conduction is accelerated.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that various changes, modifications, substitutions and alterations can be made therein by those skilled in the art without departing from the scope of the present invention.

Claims

1. The ultrathin heat conducting plate is characterized by comprising a shell, wherein a cavity is arranged in the shell, a liquid working medium is arranged in the cavity, the inner wall of the cavity is a capillary inner wall, a plurality of copper columns are fixedly arranged in the cavity and are uniformly distributed, a liquid circulation layer is arranged on the capillary inner wall, a gas-liquid circulation layer is arranged in the cavity, and the shell is arranged on the upper portion of a heat source.

2. The ultra-thin, thermally conductive plate of claim 1, wherein the shell is configured to engage a heat source.

3. The ultra-thin, thermally conductive plate of claim 1, wherein the capillary walls within the cavity are integral with the cavity.

4. The ultra-thin, thermally conductive plate of claim 1, wherein the capillary walls are elliptically shaped.

5. The ultra-thin, thermally conductive plate of claim 1, wherein the copper posts have an oval profile.