CN205232659U - IGBT heat dissipation module and have its IGBT module - Google Patents
IGBT heat dissipation module and have its IGBT module Download PDFInfo
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- CN205232659U CN205232659U CN201520977686.XU CN201520977686U CN205232659U CN 205232659 U CN205232659 U CN 205232659U CN 201520977686 U CN201520977686 U CN 201520977686U CN 205232659 U CN205232659 U CN 205232659U
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Abstract
The utility model discloses a IGBT heat dissipation module and have its IGBT module, this IGBT heat dissipation module includes: radiator bottom plate, radiator bottom plate includes: a bottom plate body and N heat dissipation post, bottom plate body include this somatic part and set up first top layer and the second top layer on two relative surfaces of this somatic part respectively, and this somatic part is made for aluminium carborundum, and a N heat dissipation intercolumniation separates to be established on first top layer, and the one end of every heat dissipation post is the free end with the fixed just other end in first top layer, and the first top layer and the post that dispels the heat all are suitable for and contact with the coolant liquid, copper -clad plate, copper -clad plate include base plate, first copper layer and second copper layer, and first copper layer sets up two surfaces of the relative setting on the base plate respectively with second copper layer on, the base plate is the silicon nitride base plate, and establish on the second top layer on first copper layer, installs electrical components on the second copper layer. The heat conductivity of this somatic part that adoption aluminium carborundum was made is good, can be so that IGBT heat dissipation module radiating effect is good.
Description
Technical field
The utility model relates to heat sink technology field, particularly relates to a kind of IGBT heat radiation module and has the IGBT module of this IGBT heat radiation module.
Background technology
Compact and be configured to thinner tabular or strip metal fin or needle-like structure as the heat spreader structures of coolant using liquid, the internal placement fluid passage of radiator, make to produce heat convection between fluid and cooled plate, the heat power consumption of cooled plate surface high power electronic components and parts thus fluid can leave.
Whether, in correlation technique, the material of base plate of radiator is most important, be directly connected to and can dispel the heat the cooling requirements of module by IGBT.
Utility model content
The utility model is intended to solve one of technical problem in correlation technique at least to a certain extent.For this reason, the utility model proposes a kind of IGBT heat radiation module, this IGBT heat emission module structure intensity is good, and base plate of radiator thermal diffusivity is good.
The utility model proposes a kind of IGBT module further.
According to IGBT heat radiation module of the present utility model, comprise: base plate of radiator, described base plate of radiator comprises: base plate body and N number of thermal column, described base plate body comprises body and the first top layer on two the relative surfaces being separately positioned on described body and the second top layer, described body is that aluminium silicon carbide is made, described N number of thermal column is spaced apart to be located on described first top layer, and one end of each described thermal column and described first top layer fix and the other end is free end, described first top layer and described thermal column are all suitable for contacting with cooling fluid; Described first top layer and the second top layer are metal level, and described thermal column is metal column; Copper-clad plate, described copper-clad plate comprises substrate, the first layers of copper and the second layers of copper, described first layers of copper and described second layers of copper are separately positioned on be oppositely arranged two surfaces on described substrate, and described substrate is silicon nitride board, and described first layers of copper is located on described second top layer.
According to IGBT heat radiation module of the present utility model, the thermal conductivity of the body adopting aluminium silicon carbide to make is good, and structural strength is good, can ensure the functional reliability of base plate of radiator, can make IGBT heat radiation module good heat dissipation effect.In addition, copper-clad plate can play the effect supporting electric elements, and copper-clad plate and electric elements can also produce the effect of mutual linking, mutually insulated, thus can ensure the job security of electric elements and base plate of radiator.And, adopt silicon nitride board as substrate, can ensure that substrate is not broken in the case of a high temperature, the functional reliability of copper-clad plate can be ensured.
According to IGBT module of the present utility model, comprise above-mentioned IGBT heat radiation module and igbt chip, described igbt chip is arranged in described second layers of copper.Wherein, the thermal conductivity of the body adopting aluminium silicon carbide to make is good, and structural strength is good, can ensure the functional reliability of base plate of radiator, can make IGBT heat radiation module good heat dissipation effect.In addition, copper-clad plate can play the effect supporting electric elements, and copper-clad plate and electric elements can also produce the effect of mutual linking, mutually insulated, thus can ensure the job security of electric elements and base plate of radiator.And, adopt silicon nitride board as substrate, can ensure that substrate is not broken in the case of a high temperature, the functional reliability of copper-clad plate can be ensured.
Accompanying drawing explanation
Fig. 1 is the end view according to the base plate of radiator in the IGBT heat radiation module of the utility model embodiment;
Fig. 2 is the enlarged drawing of region A in Fig. 1;
Fig. 3 is the upward view of the IGBT heat radiation module according to the utility model first embodiment;
Fig. 4 is the enlarged drawing of region B in Fig. 3;
Fig. 5 is the cutaway view of the base plate of radiator be placed in cooling bath;
Fig. 6 is the enlarged drawing of region C in Fig. 5;
Fig. 7 is the end view according to the utility model example I GBT heat radiation module;
Fig. 8 is the enlarged drawing of region D in Fig. 7;
Fig. 9 is the schematic diagram of the IGBT heat radiation module according to the utility model first embodiment;
Figure 10 is the stereogram of the IGBT heat radiation module according to the utility model first embodiment;
Figure 11 is the upward view of the IGBT heat radiation module according to the utility model second embodiment;
Figure 12 is the vertical view of the IGBT heat radiation module according to the utility model second embodiment;
Figure 13 is the end view of the IGBT heat radiation module according to the utility model embodiment;
Figure 14 is the enlarged drawing of region E in Figure 13.
Reference numeral:
IGBT dispels the heat module 1000;
Base plate of radiator 100;
Base plate body 10; First top layer 11; Second top layer 12; Body 13;
Thermal column 20; Free end 21; Stiff end 22; Cooling bath 30;
Copper-clad plate 200; Substrate 210; First layers of copper 220; Second layers of copper 230;
Igbt chip 2000.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Below with reference to the accompanying drawings the IGBT(InsulatedGateBipolarTransistor-insulated gate bipolar transistor according to the utility model embodiment is described in detail) dispel the heat module 1000.
IGBT heat radiation module 1000 according to the utility model embodiment can comprise: base plate of radiator 100 and copper-clad plate 200.Base plate of radiator 100 can comprise: base plate body 10 and N number of thermal column 20.As shown in figures 1 and 3, base plate body 10 can comprise body 13 and the first top layer 11 and the second top layer 12 on two the relative surfaces being separately positioned on body 13, namely the first top layer 11 and the second top layer 12 are oppositely arranged on body 13, second top layer 12 is provided with copper-clad plate 200, copper-clad plate 200 is provided with electric elements.It should be noted that, base plate of radiator 100 has multiple choices, such as, although the quantity of thermal column 20 on the base plate of radiator 100 shown in Figure 11 is obviously more than the quantity of the thermal column 20 on the base plate of radiator 100 shown in Fig. 3, two kinds of base plate of radiator 100 all can be chosen.Described first top layer and the second top layer are metal level, and described thermal column is metal column.
By copper-clad plate 200 is arranged between base plate of radiator 100 and electric elements, copper-clad plate 200 can play the effect supporting electric elements, and copper-clad plate 200 and electric elements can also produce the effect of mutual linking, mutually insulated, thus can ensure the job security of electric elements and base plate of radiator 100.
Wherein, alternatively, the second top layer 12 can be aluminium lamination.N number of thermal column 20 is spaced apart to be located on the first top layer 11, and one end of each thermal column 20 and the first top layer 11 are fixed, and the other end of each thermal column 20 is free end 21, and the first top layer 11 and thermal column 20 are all suitable for contacting with cooling fluid.
As shown in Figure 2, one end of thermal column 20 is the stiff end 22 of thermal column 20, and the stiff end 22 of thermal column 20 can be fixedly connected on the first top layer 11.Thus, cooling fluid can contact with the first top layer 11, can also with the surface contact exposed of each thermal column 20, be arranged on the heat that the electric elements on the second top layer 12 send and can pass to the first top layer 11 and N number of thermal column 20 by copper-clad plate 200, second top layer 12 and body 13, thus the heat of electric elements can be passed to cooling fluid by the first top layer 11 and N number of thermal column 20 further, and then the effect of the heat distributing electric elements can be played, ensure electric elements job stability.
According to an embodiment of the present utility model, the first top layer 11 is S1 with the area of cooling fluid contact portion, the area of part that the first top layer 11 contacts with each thermal column 20 is S2,180≤S1/S2≤800.Be understandable that, the base plate of radiator 100 meeting above-mentioned relation formula can make the first top layer 11 reasonable in design with the area S1 of cooling fluid contact portion, the first top layer 11 can also be made reasonable in design with the area S2 of N number of thermal column 20 contact portion, thus the first top layer 11 and N number of thermal column 20 can be made stable with cooling fluid heat exchange respectively and reliable, can while the enough large area of dissipation of guarantee, good reduction cooling fluid flow resistance, improves radiating efficiency.Preferably, 200≤S1/S2≤500.
Wherein, the quantity of thermal column 20 meets relational expression: 300≤N < 650.The thermal column 20 meeting above-mentioned relation formula can at guarantee thermal column 20 with in the reliable situation of cooling fluid heat exchange effect, base plate of radiator 100 can also be made effectively to reduce the quantity of thermal column 20, thus the processing technology requirement of base plate of radiator 100 can be reduced, the demoulding difficulty of base plate of radiator 100 can also be reduced, improve the rate of finished products of base plate of radiator 100, reduce the production difficulty of base plate of radiator 100, reduce the production cost of base plate of radiator 100.Preferably, 300≤N < 420.
Shown in composition graphs 7 and Fig. 8, copper-clad plate 200 can comprise substrate 210, first layers of copper 220 and the second layers of copper 230, first layers of copper 220 and the second layers of copper 230 can be separately positioned on be oppositely arranged two surfaces on substrate 210, as shown in Figure 8, first layers of copper 220 is arranged on the lower surface of substrate 210, second layers of copper 230 is arranged on the upper surface of substrate 210, and the first layers of copper 220 is arranged on the first top layer 11, and electric elements are arranged in the second layers of copper 230.
Wherein, due to aluminium silicon carbide there is high-termal conductivity, the thermal coefficient of expansion that matches with chip, density is little, lightweight, and the advantage of high rigidity and high-flexural strength, body 13 can be made for aluminium silicon carbide, body 13 has high thermal conductivity, thus can ensure the functional reliability of base plate of radiator 100.
Because silicon nitride is a kind of superhard material, itself there is lubrification and resistance to wear, and silicon nitride is atomic crystal, can also be anti-oxidant when high temperature.And it can also resist thermal shock, be heated to more than 1000 DEG C in atmosphere, quick refrigeration sharply heats again, also can not be cracked.Substrate 210 can be silicon nitride board, thus can ensure the functional reliability of copper-clad plate 200.Further alternatively, copper-clad plate can be silicon nitride DBC copper-clad plate or silicon nitride AMB copper-clad plate, and wherein DBC (DIRECTBondingCopper) namely directly covers copper method, AMB (Activemetalbrazing) i.e. active metal brazing method.
According to a preferred embodiment of the present utility model, the thickness h 1 of the first layers of copper 220 can be equal with the thickness h 2 of the second layers of copper 230, and the first layers of copper 220 is located on the second top layer 12.By rationally arranging the thickness of the first layers of copper 220 and the second layers of copper 230, the support effect of copper-clad plate 200 pairs of electric elements can be improved further, the structural strength of copper-clad plate 200 can also be improved, extend the useful life of copper-clad plate 200.And copper-clad plate 200 manufacture craft is simple, low cost of manufacture.
According to the IGBT heat radiation module 1000 of the utility model embodiment, the thermal conductivity of the body 13 adopting aluminium silicon carbide to make is good, and structural strength is good, the functional reliability of base plate of radiator 100 can be ensured, IGBT heat radiation module 1000 good heat dissipation effect can be made.In addition, copper-clad plate 200 can play the effect supporting electric elements, and copper-clad plate 200 and electric elements can also produce the effect of mutual linking, mutually insulated, thus can ensure the job security of electric elements and base plate of radiator 100.And, adopt silicon nitride board as substrate 210, can ensure that substrate 210 is not broken in the case of a high temperature, the functional reliability of copper-clad plate 200 can be ensured.
The optional arrangement of copper-clad plate 200 is described below in detail.
Alternatively, the thickness h 1 of the first layers of copper 220 and the thickness h 2 of the second layers of copper 230 are 0.2 millimeter-0.6 millimeter.Thickness adopts the first layers of copper 220 in above-mentioned number range and the second layers of copper 230 can promote the structural strength of copper-clad plate 200 further, extends the useful life of copper-clad plate 200.
Alternatively, as shown in Figure 8, the thickness h 3 of substrate 210 can be 0.25 millimeter-1 millimeter.By rationally arranging the thickness h 3 of substrate 210, the effect that copper-clad plate 200 supports electric elements can be promoted, but also the structural strength of copper-clad plate 200 can be ensured, extend the useful life of copper-clad plate 200.
Alternatively, as shown in Fig. 9, Figure 10 and Figure 12, copper-clad plate 200 can be multiple, and multiple copper-clad plate 200 is along the spaced apart setting of length direction of base plate of radiator 100.Preferably, the distance L3 between adjacent two copper-clad plates 200 is 3 millimeters-10 millimeters.By rationally arranging the distance L3 between adjacent two copper-clad plates 200, multiple copper-clad plate 200 can be made to support multiple electric elements.
The optional arrangement of base plate of radiator 100 is described below in detail.
According to an embodiment of the present utility model, the area of dissipation of IGBT heat radiation module 1000 is S, and the area sum of the outer surface of the perisporium of N number of thermal column 20 is S3, and the area sum of the end face of the free end 21 of N number of thermal column 20 is S4, S=S1+S3+S4, and 40000mm
2≤ S≤50000mm
2.Thus, by rationally arranging the area of dissipation S of IGBT heat radiation module 1000, the volume of IGBT heat radiation module 1000 can be made to arrange rationally, and can ensure the first top layer 11 and N number of thermal column 20 respectively with the heat exchange effect of cooling fluid, thus base plate of radiator 100 heat-sinking capability can be made good and area design is reasonable, effectively ensure that the radiating effect of radiator.
In examples more of the present utility model, as shown in Figure 2, from one end of thermal column 20 to free end 21, the area of the cross section of thermal column 20 can reduce from one end of thermal column 20 to free end 21.By the size of stiff end 22 and the size of free end 21 of each thermal column 20 of appropriate design, can make each thermal column 20 all with the first top layer 11 stable connection, but also thermal column 20 structure can be made reliable, and be conducive to the heat exchange of thermal column 20 and cooling fluid.
Alternatively, as shown in Figure 6, the height of thermal column 20 is h, wherein, and 7.5mm≤h < 8.2mm.Preferably, h=8mm.By rationally arranging the height h of thermal column 20, so that thermal column 20 is arranged in cooling bath 30, the radiating effect of thermal column 20 can be ensured.
Wherein, the concrete structure of thermal column 20 is not limited.According to an embodiment of the present utility model, thermal column 20 can be configured to pyramidal structure, and the cross section of thermal column 20 can be circular, and the radius of one end of thermal column 20 is α with the ratio of the radius of free end 21,1.2≤α≤1.8.As shown in Figure 2, the radius of the free end 21 of thermal column 20 is r1, and the radius of the stiff end 22 of thermal column 20 is r2, α=r2/r1.Thermal column 20 structure meeting above-mentioned relation formula is reliable, and comparatively large with the area of cooling fluid contact portion, so that heat exchange between thermal column 20 and cooling fluid, can fully ensure the radiating effect of radiator.Preferably, α=1.69.
In examples more of the present utility model, as shown in Figure 5 and Figure 6, cooling fluid is suitable for being contained in cooling bath 30, and cooling bath 30 is suitable for being connected with the first top layer 11, and the free end 21 of thermal column 20 is L1 apart from the minimum range of the diapire of cooling bath 30,0.2 millimeter≤L1≤2 millimeter.Be understandable that, the length of thermal column 20 is subject to the degree of depth restriction of cooling bath 30, thus rationally can arrange the degree of depth of cooling bath 30, makes the length of thermal column 20 reasonable.Meet the interference that the cooling bath 30 of above-mentioned relation formula and thermal column 20 can reduce cooling bath 30 pairs of thermal columns 20, and the normal work of thermal column 20 can be ensured.
In an optional execution mode of the present utility model, as shown in Figure 4, the distance of adjacent two thermal columns 20 can be L2,0.4 millimeter≤L2≤1.1 millimeter.The distance L2 meeting adjacent two thermal columns 20 of above-mentioned relation formula can make N number of thermal column 20 arrange rationally on the first top layer 11, and interfering with each other between adjacent two thermal columns 20 can be reduced at least to a certain extent, thus can ensure that each thermal column 20 exchanges with the normal heat of cooling fluid, and then the normal work of base plate of radiator 100 can be ensured.
Alternatively, arbitrary neighborhood two thermal columns 20 can form one group, and the L2 of a group wherein in the L2 of a group and all the other groups can be unequal.Thus, be understandable that, the distance L2 of adjacent two thermal columns 20 can regulate according to practical condition, thus can reduce the production difficulty of base plate of radiator 100 at least to a certain extent.Such as, the distance L2 between two adjacent heat radiation posts 20 that the corner being close to the first top layer 11 is arranged can regulate as the case may be.
Provide a kind of concrete arrangement form of N number of thermal column 20 of base plate of radiator 100 below, but be not limited thereto, wherein, the quantity N=368 of N number of thermal column 20, the L2=0.62 millimeter of first group, the L2=1.038 millimeter of second group, the L2 of all the other groups meets following condition: 0.62 millimeter≤L2≤1.04 millimeter.Be understandable that, the distance L2 between adjacent two thermal columns 20 is minimum can be 0.62 millimeter, and maximumly can be 1.04 millimeters.Thus, the connection and reasonable arrangement of thermal column 20, the demoulding is easy, and rate of finished products is high.
Alternatively, the draft angle β of each thermal column 20 can be 2 degree of-4 degree.Wherein, the draft angle β of a thermal column 20 can be different from the draft angle β of another thermal column 20, also can be identical.The thermal column 20 that draft angle β meets above-mentioned angular range can reduce the demoulding difficulty of base plate of radiator 100 at least to a certain extent, improves the rate that manufactures a finished product of base plate of radiator 100.
Preferably, draft angle β is the radiating effect that the radiating effect of the thermal column 20 of 2 degree will be better than that draft angle β is the thermal column 20 of 4 degree slightly, but there is no obvious lifting, withdrawing pattern can be more conducive to owing to increasing draft angle β, and can ensure that inlet outlet pressure differential is minimum, can determine according to technology difficulty and actual demand when the draft angle β of thermal column 20 uses.
Preferably, top layer 12, body 13, first top layer 11, second can be one-body molded by the die casting of air pressure THROUGH METHOD with thermal column 20.Thus, integrated base plate of radiator 100 structural strength is high, long service life, and manufacturing process is simple.
According to a preferred embodiment of the present utility model, the aluminium silicon carbide that body 13 can be 60%-70% for volume fraction is made.Wherein, volume fraction refers to the volume of carborundum and the ratio of Al+ carborundum volume.Be understandable that, body 13 structure adopting aforementioned proportion to make is reliable, and heat-exchange capacity is good, and while protecting radiating efficiency, low cost of manufacture.Alternatively, thermal column 20 can be aluminium post or aluminium alloy column, and the first top layer 11 and the second top layer 12 can be aluminium lamination or aluminium alloy layer.Thus, can so that heat exchange between electric elements and the second top layer 12, can so that cooling fluid respectively with the heat exchange of the first top layer 11 and thermal column 20, and manufacturing cost reduces.Preferably, the aluminium silicon carbide that body 13 can be 65% for volume fraction is made.
Provide the setting value of the one group of heat radiation of the IGBT according to the utility model embodiment module 1000 below, but the utility model is not limited to this.40000 square millimeters≤S≤50000 square millimeter, N=368, S1/S2=229.284, the height h=8mm of thermal column 20, α=1.69, L1=0.4mm.
Wherein, the arrangement being arranged on the N number of thermal column 20 on the first top layer 11 has multiple, provides a kind of arrangement of N number of thermal column 20 below.N number of thermal column 20 can be divided into many groups, the many groups of length direction along base plate of radiator 100 (fore-and-aft direction namely shown in Fig. 3) intervals are arranged, many groups comprise in the first subgroup d1 and the second subgroup d2, the first subgroup d1 and the second subgroup d2 that the length direction along base plate of radiator 100 is arranged alternately the spaced multiple thermal column 20 of Width (left and right directions namely shown in Fig. 3) included along base plate of radiator 100.Be understandable that, the first subgroup d1 be arranged alternately and the second subgroup d2 can make N number of thermal column 20 distribute on the first top layer 11 rationally, can ensure the heat-exchange capacity of thermal column 20 and cooling fluid.Wherein, the quantity of the thermal column 20 in the first subgroup d1 and the second subgroup d2 can adjust according to actual conditions.
According to IGBT module of the present utility model, comprise above-mentioned IGBT heat radiation module 1000 and igbt chip 2000, igbt chip 2000 is arranged in the second layers of copper 230.The thermal conductivity of the body 13 adopting aluminium silicon carbide to make is good, and structural strength is good, can ensure the functional reliability of base plate of radiator 100, can make IGBT heat radiation module 1000 good heat dissipation effect.In addition, copper-clad plate 200 can play the effect supporting igbt chip 2000, and copper-clad plate 200 and igbt chip 2000 can also produce the effect of mutual linking, mutually insulated, thus can ensure the job security of electric elements and base plate of radiator 100.And, adopt silicon nitride board as substrate 210, can ensure that substrate 210 is not broken in the case of a high temperature, the functional reliability of copper-clad plate 200 can be ensured.
The following detailed description of the test to the IGBT module according to utility model embodiment.
First the experimental condition of IGBT module is introduced in detail, the preferred dimension of copper-clad plate 200 is 61 × 67 × 0.92mm, the body 13 of the base plate body 10 of base plate of radiator 100 is that the composite material of aluminium silicon carbide composition is made, voltage is 480V, electric current 0-150A, progressively increase output current phase to 150A from 0, the maximum temperature of test I GBT module, and join the steady state heat resistance of the copper-clad plate 200 of silicon nitride board with thermal resistance tester measurement igbt chip 2000.Wherein, it should be noted that, the model that igbt chip 2000 adopts is IGC193T120T8RMA, and igbt chip 2000 is 1200v/200A, and the production company of igbt chip 2000 is company of Infineon.
Finally introduce the result of the test of IGBT module, the temperature thermal resistance being recorded copper-clad plate 200 by thermal resistance tester is 0.08712k/w, IGBT module maximum temperature is 82 DEG C, thus can learn: IGBT module can meet cooling requirements, and the good heat dissipation effect of IGBT module.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In description of the present utility model, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection or each other can communication; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this specification or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.
Claims (23)
1. an IGBT heat radiation module, is characterized in that, comprising:
Base plate of radiator, described base plate of radiator comprises: base plate body and N number of thermal column, described base plate body comprises body and the first top layer on two the relative surfaces being separately positioned on described body and the second top layer, described body is that aluminium silicon carbide is made, described N number of thermal column is spaced apart to be located on described first top layer, and one end of each described thermal column and described first top layer fix and the other end is free end, described first top layer and described thermal column are all suitable for contacting with cooling fluid; Described first top layer and the second top layer are metal level, and described thermal column is metal column;
Copper-clad plate, described copper-clad plate comprises substrate, the first layers of copper and the second layers of copper, described first layers of copper and described second layers of copper are separately positioned on be oppositely arranged two surfaces on described substrate, and described substrate is silicon nitride board, and described first layers of copper is located on described second top layer.
2. IGBT heat radiation module according to claim 1, it is characterized in that, described first layers of copper is equal with the thickness of described second layers of copper.
3. IGBT heat radiation module according to claim 1, it is characterized in that, the thickness of described first layers of copper and described second layers of copper is 0.2 millimeter-0.6 millimeter.
4. IGBT heat radiation module according to claim 1, it is characterized in that, the thickness of described substrate is 0.25 millimeter-1 millimeter.
5. IGBT heat radiation module according to claim 1, it is characterized in that, described copper-clad plate is multiple, and multiple described copper-clad plate is along the spaced apart setting of length direction of described base plate of radiator, and the distance between adjacent two described copper-clad plates is 3 millimeters-10 millimeters.
6. IGBT heat radiation module according to claim 1, it is characterized in that, described first top layer is S1 with the area of described cooling fluid contact portion, the area of part that described first top layer contacts with each described thermal column is S2,180≤S1/S2≤800, wherein 300≤N < 650.
7. IGBT heat radiation module according to claim 6, is characterized in that, 200≤S1/S2≤500; Wherein 300≤N < 420.
8. IGBT heat radiation module according to claim 6, it is characterized in that, the area of dissipation of described IGBT heat radiation module is S, the area sum of the outer surface of the perisporium of N number of described thermal column is S3, the area sum of the end face of the free end of N number of described thermal column is S4, S=S1+S3+S4, and 40000 square millimeters≤S≤50000 square millimeter.
9. IGBT heat radiation module according to claim 6, it is characterized in that, the height of described thermal column is h, wherein, 7.5 millimeters≤h < 8.2 millimeters.
10. IGBT heat radiation module according to claim 9, it is characterized in that, the area of dissipation of each described thermal column is (S3+S4)/N, 80≤(S3+S4)/N≤120.
11. IGBT according to claim 6 dispel the heat modules, it is characterized in that, from described one end of described thermal column to described free end, the area of the cross section of described thermal column reduces from described one end of described thermal column to described free end.
12. IGBT heat radiation modules according to claim 11, it is characterized in that, the cross section of described thermal column is circular, and the radius of described one end of described thermal column is α with the ratio of the radius of described free end, 1.2≤α≤1.8.
13. IGBT heat radiation modules according to claim 6, it is characterized in that, described cooling fluid is suitable for being contained in cooling bath, described cooling bath is suitable for being connected with described first top layer, and the free end of described thermal column is L1 apart from the minimum place of the distance of the diapire of described cooling bath, 0.2 millimeter≤L1≤2 millimeter.
14. IGBT heat radiation modules according to claim 6, it is characterized in that, the distance of adjacent two described thermal columns is L2,0.4 millimeter≤L2≤1.1 millimeter.
15. IGBT according to claim 14 dispel the heat modules, and it is characterized in that, arbitrary neighborhood two described thermal columns form one group, and the L2 of a group wherein in the L2 of a group and all the other groups is unequal.
16. IGBT heat radiation modules according to claim 15, it is characterized in that, N=368, wherein the L2=0.62 millimeter of first group, the L2=1.04 millimeter of second group, L2 of all the other groups meet following condition: 0.62 millimeter≤L2≤1.04 millimeter.
17. IGBT heat radiation modules according to claim 6, is characterized in that, the draft angle β of each described thermal column is 2 degree of-4 degree.
18. IGBT heat radiation modules according to claim 6, it is characterized in that, described body, described first top layer, described second top layer and described thermal column are one-body molded by the die casting of air pressure THROUGH METHOD.
19. IGBT according to claim 1 dispel the heat modules, it is characterized in that, the aluminium silicon carbide of described body to be volume fraction be 60%-70% is made.
20. IGBT heat radiation modules according to claim 19, it is characterized in that, described thermal column is aluminium post or aluminium alloy column, and described first top layer and the second top layer are aluminium lamination or aluminium alloy layer.
21. IGBT heat radiation modules according to claim 8, is characterized in that, 40000 square millimeters≤S≤50000 square millimeter, N=368, S1/S2=229.284.
22. IGBT according to any one of claim 1-21 dispel the heat module, it is characterized in that, described N number of thermal column is divided into many groups, the many groups of length direction intervals along described IGBT heat radiation module are arranged, described many groups comprise the first subgroup and the second subgroup that the length direction that dispels the heat module along described IGBT is arranged alternately, and include the spaced multiple thermal column of Width of the module that to dispel the heat along described IGBT in described first subgroup and described second subgroup.
23. 1 kinds of IGBT modules, is characterized in that, comprise igbt chip and the heat radiation of the IGBT according to any one of claim 1-22 module, described igbt chip is arranged in described second layers of copper.
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| CN201520977686.XU CN205232659U (en) | 2015-11-30 | 2015-11-30 | IGBT heat dissipation module and have its IGBT module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092627A1 (en) * | 2015-11-30 | 2017-06-08 | 比亚迪股份有限公司 | Igbt module heat dissipation module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017092627A1 (en) * | 2015-11-30 | 2017-06-08 | 比亚迪股份有限公司 | Igbt module heat dissipation module |
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