CN211090416U - Circuit board with heat radiation structure - Google Patents

Circuit board with heat radiation structure Download PDF

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Publication number
CN211090416U
CN211090416U CN201922115372.XU CN201922115372U CN211090416U CN 211090416 U CN211090416 U CN 211090416U CN 201922115372 U CN201922115372 U CN 201922115372U CN 211090416 U CN211090416 U CN 211090416U
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CN
China
Prior art keywords
circuit board
heat dissipation
radiating
mounting groove
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201922115372.XU
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Chinese (zh)
Inventor
栾巍
史长凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huangshi Fredier Electronic Technology Co ltd
Original Assignee
Huangshi Fredier Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Huangshi Fredier Electronic Technology Co ltd filed Critical Huangshi Fredier Electronic Technology Co ltd
Priority to CN201922115372.XU priority Critical patent/CN211090416U/en
Application granted granted Critical
Publication of CN211090416U publication Critical patent/CN211090416U/en
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Abstract

The utility model relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation structure, which comprises a circuit board, wherein both sides of the surface of the circuit board are respectively provided with a mounting groove, a bolt is movably arranged in the mounting groove, one side of the lower surface of the circuit board is provided with a water inlet pipe in a laminating way, the other side of the lower surface of the circuit board is provided with a water outlet pipe in a laminating way, a longitudinal heat dissipation part and a transverse heat dissipation part which are of an integrated structure are arranged between the water inlet pipe and the water outlet pipe in a communicating way, the longitudinal heat dissipation part and the transverse heat dissipation part are arranged at intervals, a plurality of contact bulges are fixedly arranged on the upper sides of the longitudinal heat dissipation part and the transverse heat dissipation part, the contact bulges are fixedly adhered on the lower surface of the circuit board, the circuit board has good heat dissipation effect and is worth popularizing.

Description

Circuit board with heat radiation structure
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board with heat radiation structure.
Background
The circuit board is after using a period of time, and the temperature on surface can become high, and current circuit board just utilizes radiator fan to dispel the heat and cools off moreover, can not satisfy its radiating needs at all, because there are a lot of structures on the circuit board surface again, causes the damage very easily, so when dispelling the heat to it, has to guarantee can not damage the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem of the prior art that the heat dissipation effect is not obvious, and providing a circuit board with a heat dissipation structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the circuit board with the heat dissipation structure comprises a circuit board, wherein mounting grooves are formed in two sides of the surface of the circuit board, bolts are movably mounted in the mounting grooves, a water inlet pipe is arranged on one side of the lower surface of the circuit board in a laminating mode, a water outlet pipe is arranged on the other side of the lower surface of the circuit board in a laminating mode, a longitudinal heat dissipation part and a transverse heat dissipation part which are of an integrated structure are arranged between the water inlet pipe and the water outlet pipe in a communicating mode, a plurality of contact bulges are fixedly mounted on the upper sides of the longitudinal heat dissipation part and the transverse heat dissipation part respectively, the contact bulges are fixedly bonded on the lower surface of the circuit board, connecting pins are fixedly mounted on two sides of the lower surface of the circuit board through plugs, a fixed support is vertically and fixedly, the heat radiation fan is positioned on one side of the upper surface of the circuit board.
Preferably, the radius of the contact protrusion is much smaller than the radii of the longitudinal heat dissipation part and the lateral heat dissipation part.
Preferably, the longitudinal heat dissipation portion and the lateral heat dissipation portion are connected to each other in a spiral shape perpendicular to each other.
Preferably, reinforcing layers are fixedly mounted at two ends of the mounting groove.
The utility model provides a pair of circuit board with heat radiation structure, beneficial effect lies in: inside protruding and vertical heat-dissipating part of the inside contact of this circuit board and horizontal heat-dissipating part are inside to be linked together, water can be inside through the contact arch, can cool off the heat dissipation to the circuit board surface through the contact arch, radiator fan directly can blow to the circuit board surface, increase the circulation of air speed on circuit board surface, improve the radiating effect on circuit board surface, carry out good scattered thermal treatment through two kinds of forms of water-cooling and air-cooling to the circuit board surface, the radiating effect is fine.
Drawings
Fig. 1 is a schematic diagram of a cross-sectional structure of a circuit board with a heat dissipation structure according to the present invention;
fig. 2 is a schematic longitudinal sectional structural view of a circuit board with a heat dissipation structure according to the present invention;
fig. 3 is a schematic bottom view of a circuit board with a heat dissipation structure according to the present invention.
In the figure: the heat radiating structure comprises a circuit board 1, a bolt 2, a reinforcing layer 3, a longitudinal heat radiating part 4, a transverse heat radiating part 5, a water inlet pipe 6, a water outlet pipe 7, a contact protrusion 8, a mounting groove 9, a fixing support 10, a connecting pin 11, a plug 12 and a heat radiating fan 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, a circuit board with heat radiation structure, including circuit board 1, mounting groove 9 has all been seted up to 1 surperficial both sides of circuit board, movable mounting has bolt 2 in mounting groove 9, circuit board 1 installs through bolt 2, it is convenient to install, the laminating of 1 lower surface one side of circuit board is equipped with inlet tube 6, the laminating of 1 lower surface opposite side of circuit board is equipped with outlet pipe 7, communicate between inlet tube 6 and the outlet pipe 7 and install vertical heat dissipation portion 4 and the horizontal heat dissipation portion 5 of a body structure, inlet tube 6 and 7 internal flow water of outlet pipe flow through, play better water-cooling effect, the radiating effect is good.
Mutual interval sets up between vertical heat dissipation part 4 and the horizontal heat dissipation part 5, vertical heat dissipation part 4 and the equal fixed mounting of 5 upside of horizontal heat dissipation part have a plurality of contact protrusion 8, contact protrusion 8 pastes and is fixed in 1 lower surface of circuit board, contact protrusion 8 and vertical heat dissipation part 4 and the inside of horizontal heat dissipation part 5 are linked together, water can be inside through contact protrusion 8, can cool off the heat dissipation to 1 surface of circuit board through contact protrusion 8, contact protrusion 8's radius is far less than vertical heat dissipation part 4 and the radius of horizontal heat dissipation part 5, mutually perpendicular is the heliciform between vertical heat dissipation part 4 and the horizontal heat dissipation part 5 and connects the setting.
The radius of contact arch 8 is very little, when guaranteeing to have appropriate area of contact between and the circuit board 1, can also guarantee that the water pipe body can not wholly paste at circuit board 1, only need through contact arch 8 with paste between the circuit board 1 can, prevent that the contact of watering by a large tracts of land on circuit board 1 surface from leading to the radiating effect variation.
The connecting pins 11 are fixedly mounted on two sides of the lower surface of the circuit board 1 through plugs 12, the fixing supports 10 are vertically and fixedly mounted at the end portions of the connecting pins 11, the heat dissipation fans 13 are fixedly mounted on the surfaces of the fixing supports 10, and the heat dissipation fans 13 are located on one side of the upper surface of the circuit board 1.
The heat radiation fan 13 can directly blow air to the surface of the circuit board 1, increase the air circulation speed of the surface of the circuit board 1, improve the heat radiation effect of the surface of the circuit board 1, and realize a better heat radiation effect together with the water cooling structure.
Example 2
Referring to fig. 1-3, as another preferred embodiment of the present invention, on the basis of embodiment 1, there are reinforced layers 3 at both ends of the mounting groove 9, and the reinforced layers 3 can protect between the bolt 2 and the circuit board 1, and prevent the bolt 2 from damaging the surface of the circuit board 1 when being connected with the circuit board 1, so that the bolt 2 can be locked to the maximum extent when being installed, and there is no fear of damaging the circuit board, and the installation stability is high.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (4)

1. The utility model provides a circuit board with heat radiation structure, includes circuit board (1), its characterized in that, mounting groove (9) have all been seted up to circuit board (1) surface both sides, movable mounting has bolt (2) in mounting groove (9), the laminating of circuit board (1) lower surface one side is equipped with inlet tube (6), the laminating of circuit board (1) lower surface opposite side is equipped with outlet pipe (7), communicate between inlet tube (6) and outlet pipe (7) and install vertical radiating part (4) and the horizontal radiating part (5) of an organic whole structure, set up at an interval each other between vertical radiating part (4) and the horizontal radiating part (5), vertical radiating part (4) and the equal fixed mounting in upside of horizontal radiating part (5) have a plurality of contact arch (8), contact arch (8) paste and are fixed in circuit board (1) lower surface, circuit board (1) lower surface both sides have connecting pin (11) through end cap (12) fixed mounting, the perpendicular fixed mounting of connecting pin (11) tip has fixed bolster (10), fixed bolster (10) fixed surface installs radiator fan (13), radiator fan (13) are located circuit board (1) upper surface one side.
2. A circuit board having a heat dissipation structure according to claim 1, wherein the radius of the contact projection (8) is much smaller than the radius of the longitudinal heat dissipation portion (4) and the radius of the lateral heat dissipation portion (5).
3. The circuit board with a heat dissipation structure according to claim 1, wherein the longitudinal heat dissipation portion (4) and the transverse heat dissipation portion (5) are perpendicular to each other and are spirally connected.
4. The circuit board with the heat dissipation structure as claimed in claim 1, wherein the reinforcing layer (3) is fixedly mounted at both ends of the mounting groove (9).
CN201922115372.XU 2019-11-28 2019-11-28 Circuit board with heat radiation structure Active CN211090416U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922115372.XU CN211090416U (en) 2019-11-28 2019-11-28 Circuit board with heat radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922115372.XU CN211090416U (en) 2019-11-28 2019-11-28 Circuit board with heat radiation structure

Publications (1)

Publication Number Publication Date
CN211090416U true CN211090416U (en) 2020-07-24

Family

ID=71631820

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922115372.XU Active CN211090416U (en) 2019-11-28 2019-11-28 Circuit board with heat radiation structure

Country Status (1)

Country Link
CN (1) CN211090416U (en)

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