CN213177733U - Structure for solving work heat dissipation of LED lamp - Google Patents
Structure for solving work heat dissipation of LED lamp Download PDFInfo
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- CN213177733U CN213177733U CN202021616899.7U CN202021616899U CN213177733U CN 213177733 U CN213177733 U CN 213177733U CN 202021616899 U CN202021616899 U CN 202021616899U CN 213177733 U CN213177733 U CN 213177733U
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Abstract
In the LED lamp, the heat dissipation design of emitting diode during operation is one of the key of LED lamp life-span design, the utility model discloses a weld LED emitting diode back on the single face circuit board, fill insulating heat conduction cream in the trompil, the structure of heating panel (ware) is gone up in the back pressure equipment of single face circuit board no components and parts, not only the radiator will have more design spaces, has better dielectric strength between the emitting diode, and is with low costs, effectual moreover. The utility model discloses a solve LED lamp emitting diode radiating structure of work, can extensively be used for in the LED light is used.
Description
Technical Field
A structure for solving the problem of heat dissipation of a light-emitting diode in an LED lamp during working.
Background
The LED illuminating lamp not only has high luminous efficiency and convenient modeling, but also has energy conservation and long service life, and gradually becomes the development direction of the design of the illuminating lamp. However, the LED diode of the LED lamp generates heat under normal operating conditions, and particularly when a plurality of LEDs are designed together, heat accumulation is very serious, and the heat dissipation design becomes one of the key issues for increasing the reliability and the service life of the LED lamp.
To solve this problem, known methods include: the reliability of the LED is improved, more expensive devices are used, and people can easily repair the LED by replacing the strip-shaped LED, for example, the LED with a braided structure is replaced by a user, so that the use cost is greatly increased, the heat conductivity of the braided structure is poor, and the improvement of the heat dissipation efficiency is limited.
The other method is to weld the LED diode by using the aluminum-based circuit board, and reduce the temperature rise value of the lamp by using the good heat dissipation characteristic of the circuit board, because the aluminum-based circuit board is expensive (generally more than 8 times of the unit price of a common single-sided board), the use cost is also improved. On the other hand, the compressive strength of the aluminum-based circuit board is also inferior to that of the fiber-based circuit board, which is not favorable for the LED lamp in the high-voltage environment.
Disclosure of Invention
The utility model discloses the problem that solves: the utility model aims at inventing a low-cost effective structure and method, solve the heat dissipation difficult problem in designing the LED lamp with a plurality of LED emitting diode.
The utility model discloses a realize like this: fig. 1 is the structure diagram of the utility model for solving the heat dissipation problem of LED. 【1】 Is an LED light emitting diode; 【2】 Is a power supply electrode of the LED; 【3】 The circuit board is welded with the LED; 【4】 Welding an electrode designed on a circuit board of the LED; 【5】 The LED chip comprises an opening (through hole) below all LED chip parts and insulating heat conducting paste filled in the opening. The opening is arranged below the position where the circuit board is welded with the LED, and after the LED is welded, the opening is filled with insulating heat-conducting paste; 【6】 The radiator is pressed below the circuit board and can be in contact with heat conducting paste, and the radiator directly touches the LED through the heat conducting paste filled in holes below all LED tube cores, so that heat generated by the LED can be timely and quickly conducted to the radiator (6).
The size requirements of the openings below all the LED tube core parts are as follows: and a rectangular or circular opening (through hole) is formed, wherein the width of the opening is less than or equal to that of the LED, and the length of the opening is reserved for power supply bonding pads at two ends of the LED.
A solve the difficult problem of radiating in LED lamp LED during operation, have LED at least, weld the circuit board of LED, there is the trompil of filling the insulating heat conduction cream below the LED die position, press the radiator that can contact the heat conduction cream below the circuit board, its characteristic is:
a. the lower part of the circuit board where the LED is welded is provided with rectangular or circular openings, the width of the openings is less than or equal to that of the LED, and the length of the openings is reserved for power supply bonding pads at two ends of the LED;
b, after the LED is welded, filling insulating heat-conducting paste in the opening;
c. a radiator which can be contacted with the heat conducting paste is arranged below the circuit board, and the radiator can be directly contacted with the LED through the heat conducting paste filled in the holes below all the LED tube cores, so that the heat generated by the LED can be conducted to the radiator (6).
The utility model discloses a heat dissipation problem when following method is solved LED emitting diode and is worked has following step and characteristic step of including:
the first step comprises the steps of designing and welding a single-sided circuit board of a plurality of LED light-emitting diodes;
the second characteristic step, the LED luminescent diode of the LED lamp is designed on the single-sided circuit board, there is a through hole below each LED luminescent diode;
and a third characteristic step, after the LED is welded on the single-sided circuit board, filling insulating heat-conducting paste (heat-conducting silicone grease is filled in one embodiment) in the opening, and pressing a heat-radiating plate (device) on the back surface of the single-sided circuit board without the component.
A method for solving the problem that a series light-emitting diode in an LED lamp can normally work under the condition of open circuit damage at least comprises the following steps and characteristic steps:
the first step comprises the steps of designing and welding a single-sided circuit board of a plurality of LED light-emitting diodes;
the second characteristic step, the LED luminescent diode of the LED lamp is designed on the single-sided circuit board, there is a through hole below each LED luminescent diode;
and a third characteristic step, after the LED is welded on the single-sided circuit board, filling insulating heat-conducting paste (heat-conducting silicone grease is filled in one embodiment) in the opening, and pressing a heat-radiating plate (device) on the back surface of the single-sided circuit board without the component.
The heat dissipation plate (device) can conduct and dissipate heat generated in the working process of the LED to the outside through the insulating heat conducting paste which is directly attached to the LED in the open hole.
The LED light emitting diodes of the lamp are designed on a single-sided circuit board, and a through hole meeting the following requirements is formed below each LED light emitting diode: the width is close to the packaging width of the LED, and the length is smaller than the opening of the power supply electrode of the LED. The larger the opening is, the more the work heat of the light emitting diode can be transferred to the heat dissipation plate (device) through the insulating heat conducting paste filled in the opening, but the larger the opening is, the insulating heat conducting paste can be extruded to the outside of the light emitting diode when being filled in the opening. In one embodiment, the width is 0.2-0.5 mm smaller than the LED, and the length is determined by not affecting the welding of the power supply electrode of the LED.
The back of the single-sided circuit board welded with the LED is provided with a heat dissipation plate (device) in a pressing way, and the heat dissipation plate (device) can lead the heat generated by the LED out through the heat conduction paste and the heat dissipation plate (device) through the heat conduction paste which is arranged in the open hole and directly attached to the LED.
Drawings
Fig. 1 is the structure diagram of the utility model for solving the heat dissipation problem of LED. 【1】 Is an LED light emitting diode; 【2】 Is a power supply electrode of the LED; 【3】 The circuit board is welded with an LED diode; 【4】 Welding circuit board electrodes of the LED; 【5】 The LED chip comprises an opening (through hole) below an LED chip part and insulating heat conducting paste filled in the opening; 【6】 The radiator is pressed below the circuit board and can be in contact with heat conducting paste, and the radiator is contacted with the LED through the heat conducting paste filled in holes below all LED tube cores, so that heat generated by the LED can be quickly conducted to the radiator (6) in time.
Detailed Description
An embodiment, the utility model discloses well welding LED's circuit chooses the thick single face circuit board of 1mm with low costs for use, and single face circuit board welding LED's below is opened has the width to be less than the LED diode width, and length weak point is in the rectangle trompil of LED power connection electrode. The LED diode bottom is except the electrode, usually still with the chip pedestal connection be used for radiating electrode, because the utility model discloses an it fills insulating heat conduction cream in the trompil, directly conducts the generating heat of LED diode to paste through insulating heat conduction cream and presses on the heat dissipation aluminum plate of single face circuit board reverse side, therefore LED base electrode part also is included by the trompil. One embodiment, LED emitting diode is about 3mm wide, and about 5.5mm long, and it has about 4.5mm to get rid of the electrode at both ends, the utility model discloses trompil 2.6mm 4mm rectangular hole in LED welded single face circuit board below, fill heat conduction silicone grease to do not have the component face at single face circuit board and press the aluminium heating panel that the heat conductivility is good, light in weight. When the heat dissipation effect requirement is better, aluminum plate can several layers of clamp gasket superposes, enlarges heat radiating area, reduces the temperature rise to improve LED lamp's reliability and life-span greatly.
An embodiment, the utility model discloses well welding LED's circuit chooses for use the thick single face circuit board of 0.5mm with low costs.
An embodiment, the utility model discloses in, through heat conduction cream and the contact of LED emitting diode for radiating radiator is the aluminum plate of 1mm thickness, and aluminum plate presses the back at the single face circuit board that is welded with LED emitting diode.
An embodiment, in the utility model discloses in, through heat conduction cream and the contact of LED emitting diode, be used for radiating radiator to be N piece 1mm thick aluminum plate fold into the radiator through the gasket after, press the back that has welded LED emitting diode.
The utility model provides a solve LED in the LED lamp during operation heat dissipation difficult problem's structure which characterized by: a circuit for welding the LED adopts a single-sided circuit board with the thickness of 1mm and low cost, and a rectangular opening with the width smaller than that of the LED and the length shorter than that of an electrode of the LED connected with a power supply is formed below the single-sided circuit board for welding the LED.
The utility model provides a solve LED in the LED lamp during operation heat dissipation difficult problem's structure which characterized by: LED emitting diode is wide about 3mm, and long about 5.5mm, it has about 4.5mm to get rid of the electrode at both ends, the utility model discloses at LED welded single face circuit board below trompil 2.6mm 4mm rectangular hole, fill heat conduction silicone grease.
An embodiment, in the utility model discloses in, through heat conduction cream and the contact of LED emitting diode for radiating radiator is 2 aluminum plates 1mm thick, and there is a metal gasket in the centre, by the post fold the radiator after, fix the back at the single face circuit board that has welded LED emitting diode.
The invention has the following effects: in the LED lamp, the heat dissipation design of emitting diode during operation is one of the key of LED lamp life-span design, and uses aluminium base circuit board although the radiating effect also is good, but the cost probably is the utility model discloses the ordinary circuit board cost of single face is 6 to 10 times. What is particularly important is that the structure and the method of the utility model are adopted, the radiator will have more design spaces, and the LED has better insulation strength. The utility model discloses a structure and method of heat conduction cream are filled in ordinary single face circuit board trompil, with low costs, effectual, solved the utility model discloses a problem has accomplished the utility model provides a task target. The utility model relates to a low-cost can solve the technical scheme of the common difficult problem that dispels the heat of LED lamp again, can extensively be used for in the LED light uses.
Claims (4)
1. The structure for solving the problem of working heat dissipation of the LED lamp is at least provided with the LED, a circuit board for welding the LED is welded, an opening filled with insulating heat-conducting paste is arranged below the tube core part of the LED, and a radiator which is pressed below the circuit board and can be contacted with the heat-conducting paste is characterized in that:
a. the lower part of the circuit board where the LED is welded is provided with rectangular or circular openings, the width of the openings is less than or equal to that of the LED, and the length of the openings is reserved for power supply bonding pads at two ends of the LED;
b, after the LED is welded, filling insulating heat-conducting paste in the opening;
c. the heat radiator which can contact the heat conducting paste is arranged below the circuit board, and the heat radiator can directly contact the LED through the heat conducting paste filled in the holes below all the LED tube core parts, so that the heat generated by the LED can be conducted to the heat radiator.
2. The structure for dissipating heat generated by the LED lamp in the working process of the LED lamp as claimed in claim 1, wherein: a circuit for welding the LED adopts a single-sided circuit board with the thickness of 1mm and low cost, and a rectangular opening with the width smaller than that of the LED and the length shorter than that of an electrode of the LED connected with a power supply is formed below the single-sided circuit board for welding the LED.
3. The structure for dissipating heat generated by the LED lamp in the working process of the LED lamp as claimed in claim 1, wherein: the width of the LED is about 3mm, the length of the LED is about 5.5mm, the electrode at two ends of the LED is about 4.5mm, a rectangular hole with the length of 2.6mm multiplied by 4mm is formed below a single-sided circuit board welded by the LED, and heat-conducting silicone grease is filled in the rectangular hole.
4. The structure for dissipating heat generated by the LED lamp in the working process of the LED lamp as claimed in claim 1, wherein: the radiator for heat dissipation is 2 aluminum plates with the thickness of 1mm, a metal gasket is arranged in the middle, and the aluminum plates are fixed on the back of the single-sided circuit board welded with the LED after being overlapped into the radiator by the columns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021616899.7U CN213177733U (en) | 2020-08-06 | 2020-08-06 | Structure for solving work heat dissipation of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021616899.7U CN213177733U (en) | 2020-08-06 | 2020-08-06 | Structure for solving work heat dissipation of LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213177733U true CN213177733U (en) | 2021-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021616899.7U Active CN213177733U (en) | 2020-08-06 | 2020-08-06 | Structure for solving work heat dissipation of LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213177733U (en) |
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- 2020-08-06 CN CN202021616899.7U patent/CN213177733U/en active Active
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