CN111963912A - Structure and method for solving work heat dissipation of LED lamp - Google Patents

Structure and method for solving work heat dissipation of LED lamp Download PDF

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Publication number
CN111963912A
CN111963912A CN202010783614.7A CN202010783614A CN111963912A CN 111963912 A CN111963912 A CN 111963912A CN 202010783614 A CN202010783614 A CN 202010783614A CN 111963912 A CN111963912 A CN 111963912A
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CN
China
Prior art keywords
led
circuit board
heat
sided circuit
heat dissipation
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Pending
Application number
CN202010783614.7A
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Chinese (zh)
Inventor
潘之凯
雷悦
潘艳
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Beijing Naheng Instruments And Meters Co ltd
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Beijing Naheng Instruments And Meters Co ltd
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Priority to CN202010783614.7A priority Critical patent/CN111963912A/en
Publication of CN111963912A publication Critical patent/CN111963912A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

In the LED lamp, the heat dissipation design of the working LED is one of the keys of the design of the service life of the LED lamp, and the invention fills the insulating heat-conducting paste in the open hole after the LED is welded on the single-sided circuit board, and presses the structure and the method of the heat dissipation plate (device) on the back surface of the single-sided circuit board without components, so that the heat radiator has more design space, the LEDs have better insulation strength, the cost is low, and the effect is good. The invention is a technical scheme which has low cost and can solve the common heat dissipation problem of the LED lamp, and can be widely applied to the LED illuminating lamp.

Description

Structure and method for solving work heat dissipation of LED lamp
Technical Field
A structure and a method for solving the problem of heat dissipation of a light emitting diode in an LED lamp during working.
Background
The LED illuminating lamp not only has high luminous efficiency and convenient modeling, but also has energy conservation and long service life, and gradually becomes the development direction of the design of the illuminating lamp. However, the LED diode of the LED lamp generates heat under normal operating conditions, and particularly when a plurality of LEDs are designed together, heat accumulation is very serious, and the heat dissipation design becomes one of the key issues for increasing the reliability and the service life of the LED lamp.
To solve this problem, known methods include: the reliability of the LED is improved, more expensive devices are used, and people can easily repair the LED by replacing the strip-shaped LED, for example, the LED with a braided structure is replaced by a user, so that the use cost is greatly increased, the heat conductivity of the braided structure is poor, and the improvement of the heat dissipation efficiency is limited.
The other method is to weld the LED diode by using the aluminum-based circuit board, and reduce the temperature rise value of the lamp by using the good heat dissipation characteristic of the circuit board, because the aluminum-based circuit board is expensive (generally more than 8 times of the unit price of a common single-sided board), the use cost is also improved. On the other hand, the compressive strength of the aluminum-based circuit board is also inferior to that of the fiber-based circuit board, which is not favorable for the LED lamp in the high-voltage environment.
Disclosure of Invention
The problems to be solved by the invention are as follows: the invention aims to invent a structure and a method with low cost and effectiveness, and solves the problem of heat dissipation in the design of an LED lamp by using a plurality of LED light-emitting diodes.
The invention is realized by the following steps: fig. 1 is a schematic structural diagram for solving the problem of heat dissipation of the LED according to the present invention. 【1】 Is an LED light emitting diode; 【2】 Is a power supply electrode of the LED; 【3】 The circuit board is welded with the LED; 【4】 Welding an electrode designed on a circuit board of the LED; 【5】 The LED chip comprises an opening (through hole) below all LED chip parts and insulating heat conducting paste filled in the opening. The opening is arranged below the position where the circuit board is welded with the LED, and after the LED is welded, the opening is filled with insulating heat-conducting paste; 【6】 The radiator is pressed below the circuit board and can be in contact with heat conducting paste, and the radiator is directly contacted with the LED through the heat conducting paste filled in the (5), so that the heat generated by the LED can be quickly conducted to the radiator (6) in time.
The size requirement of the open pore (5): and a rectangular or circular opening (through hole) is formed, wherein the width of the opening is less than or equal to that of the LED, and the length of the opening is reserved for power supply bonding pads at two ends of the LED.
A solve the difficult structure of heat dissipation of LED while working in LED lamp, there are LED light-emitting diode (1) at least, weld the circuit board (4) of LED light-emitting diode, there are open pores (5) filled with insulating heat conduction cream, have the heat sink (6) that can contact the heat conduction cream under the circuit board under the LED die position, its characteristic is:
a. the lower part of the circuit board where the LED is welded is provided with rectangular or circular openings, the width of the openings is less than or equal to that of the LED, and the length of the openings is reserved for power supply bonding pads at two ends of the LED;
b. after the LED is welded, insulating heat-conducting paste is filled in the opening;
c. a radiator which can be contacted with the heat conducting paste is arranged below the circuit board, and the radiator can be directly contacted with the LED through the heat conducting paste filled in the (5), so that the heat generated by the LED can be conducted to the radiator (6).
The invention solves the heat dissipation problem of the LED during working by the following method, which comprises the following steps and characteristic steps:
the first step comprises the steps of designing and welding a single-sided circuit board of a plurality of LED light-emitting diodes;
the second characteristic step, the LED luminescent diode of the LED lamp is designed on the single-sided circuit board, there is a through hole below each LED luminescent diode;
and a third characteristic step, after the LED is welded on the single-sided circuit board, filling insulating heat-conducting paste (heat-conducting silicone grease is filled in one embodiment) in the opening, and pressing a heat-radiating plate (device) on the back surface of the single-sided circuit board without the component.
A method for solving the problem that a series light-emitting diode in an LED lamp can normally work under the condition of open circuit damage at least comprises the following steps and characteristic steps:
the first step comprises the steps of designing and welding a single-sided circuit board of a plurality of LED light-emitting diodes;
the second characteristic step, the LED luminescent diode of the LED lamp is designed on the single-sided circuit board, there is a through hole below each LED luminescent diode;
and a third characteristic step, after the LED is welded on the single-sided circuit board, filling insulating heat-conducting paste (heat-conducting silicone grease is filled in one embodiment) in the opening, and pressing a heat-radiating plate (device) on the back surface of the single-sided circuit board without the component.
The heat dissipation plate (device) can conduct and dissipate heat generated in the working process of the LED to the outside through the insulating heat conducting paste which is directly attached to the LED in the open hole.
The LED light emitting diodes of the lamp are designed on a single-sided circuit board, and a through hole meeting the following requirements is formed below each LED light emitting diode: the width is close to the packaging width of the LED, and the length is smaller than the opening of the power supply electrode of the LED. The larger the opening is, the more the work heat of the light emitting diode can be transferred to the heat dissipation plate (device) through the insulating heat conducting paste filled in the opening, but the larger the opening is, the insulating heat conducting paste can be extruded to the outside of the light emitting diode when being filled in the opening. In one embodiment, the width is 0.2-0.5 mm smaller than the LED, and the length is determined by not affecting the welding of the power supply electrode of the LED.
The back of the single-sided circuit board welded with the LED is provided with a heat dissipation plate (device) in a pressing way, and the heat dissipation plate (device) can lead the heat generated by the LED out through the heat conduction paste and the heat dissipation plate (device) through the heat conduction paste which is arranged in the open hole and directly attached to the LED.
Description of the drawings: fig. 1 is a schematic structural diagram for solving the problem of heat dissipation of the LED according to the present invention. 【1】 Is an LED light emitting diode; 【2】 Is a power supply electrode of the LED; 【3】 The circuit board is welded with an LED diode; 【4】 Welding circuit board electrodes of the LED; 【5】 The LED chip comprises an opening (through hole) below an LED chip part and insulating heat conducting paste filled in the opening; 【6】 The radiator is pressed below the circuit board and can be in contact with heat conducting paste, and the radiator is contacted with the LED through the heat conducting paste filled in the (5), so that the heat generated by the LED can be quickly conducted to the radiator (6) in time.
The implementation scheme is as follows: according to one embodiment, the circuit for welding the LED is a single-sided circuit board with the thickness of 1mm and low cost, and a rectangular opening with the width smaller than that of the LED and the length shorter than that of the LED connected with a power electrode is formed below the single-sided circuit board and the LED is welded on the single-sided circuit board. The bottom of the LED diode is usually provided with an electrode which is connected with the chip base and used for heat dissipation, and the opening is filled with the insulating heat-conducting paste, so that the heat generated by the LED diode is directly conducted to the heat-dissipating aluminum plate which is attached and pressed on the back surface of the single-sided circuit board through the insulating heat-conducting paste, and the electrode part of the LED base is also included by the opening. In one embodiment, the width of an LED is about 3mm, the length of the LED is about 5.5mm, and the electrode removed from two ends of the LED is about 4.5 mm. When the heat dissipation effect requirement is better, aluminum plate can several layers of clamp gasket superposes, enlarges heat radiating area, reduces the temperature rise to improve LED lamp's reliability and life-span greatly.
In one embodiment, the circuit for welding the LED is a 0.5mm thick single-sided circuit board with low cost.
In one embodiment, the heat sink for heat dissipation is a 1mm thick aluminum plate that is pressed against the back of the single-sided circuit board to which the LED LEDs are soldered, by contacting the LED LEDs with a thermally conductive paste.
In one embodiment, the heat sink is a heat sink formed by stacking N aluminum plates with thickness of 1mm with gaskets, and is pressed on the back surface on which the LED is welded.
The utility model provides a solve LED in the LED lamp during operation heat dissipation difficult problem's structure which characterized by: a circuit for welding the LED adopts a single-sided circuit board with the thickness of 1mm and low cost, and a rectangular opening with the width smaller than that of the LED and the length shorter than that of an electrode of the LED connected with a power supply is formed below the single-sided circuit board for welding the LED.
The utility model provides a solve LED in the LED lamp during operation heat dissipation difficult problem's structure which characterized by: the width of the LED is about 3mm, the length of the LED is about 5.5mm, the electrode removed from two ends of the LED is about 4.5mm, a rectangular hole with the length of 2.6mm multiplied by 4mm is formed below a single-sided circuit board welded by the LED, and heat-conducting silicone grease is filled in the rectangular hole.
In one embodiment, the heat sink is a 2-piece aluminum plate with the thickness of 1mm, the middle of the heat sink is provided with a metal gasket, and the heat sink is fixed on the back of the single-sided circuit board welded with the LED after being stacked by the pillars.
The invention has the following effects: in the LED lamp, the heat dissipation design of the LED during working is one of the keys of the design of the service life of the LED lamp, and the cost of the aluminum-based circuit board is 6 to 10 times of the cost of the single-sided common circuit board although the heat dissipation effect is good. More importantly, by adopting the structure and the method, the radiator has more design space, and the light-emitting diodes have better insulation strength. The invention has the advantages of low cost and good effect by the structure and the method for filling the heat conducting paste into the holes of the common single-sided circuit board, solves the problem of the invention and fulfills the task aim of the invention. The invention is a technical scheme which has low cost and can solve the common heat dissipation problem of the LED lamp, and can be widely applied to the LED illuminating lamp.

Claims (5)

1. A solve the difficult structure of heat dissipation of LED while working in LED lamp, there are LED light-emitting diode (1) at least, weld the circuit board (4) of LED light-emitting diode, there are open pores (5) filled with insulating heat conduction cream, have the heat sink (6) that can contact the heat conduction cream under the circuit board under the LED die position, its characteristic is:
a. the lower part of the circuit board where the LED is welded is provided with rectangular or circular openings, the width of the openings is less than or equal to that of the LED, and the length of the openings is reserved for power supply bonding pads at two ends of the LED;
b. after the LED is welded, insulating heat-conducting paste is filled in the opening;
c. a radiator which can be contacted with the heat conducting paste is arranged below the circuit board, and the radiator can be directly contacted with the LED through the heat conducting paste filled in the (5), so that the heat generated by the LED can be conducted to the radiator (6).
2. A method for solving the problem that a series light-emitting diode in an LED lamp can normally work under the condition of open circuit damage at least comprises the following steps and characteristic steps:
the first step comprises the steps of designing and welding a single-sided circuit board of a plurality of LED light-emitting diodes;
the second characteristic step, the LED luminescent diode of the LED lamp is designed on the single-sided circuit board, there is a through hole below each LED luminescent diode;
and a third characteristic step, after the LED is welded on the single-sided circuit board, filling insulating heat-conducting paste (heat-conducting silicone grease is filled in one embodiment) in the opening, and pressing a heat-radiating plate (device) on the back surface of the single-sided circuit board without the component.
3. The structure of claim 1, wherein the structure is characterized in that: a circuit for welding the LED adopts a single-sided circuit board with the thickness of 1mm and low cost, and a rectangular opening with the width smaller than that of the LED and the length shorter than that of an electrode of the LED connected with a power supply is formed below the single-sided circuit board for welding the LED.
4. The structure of claim 1, wherein the structure is characterized in that: the width of the LED is about 3mm, the length of the LED is about 5.5mm, the electrode removed from two ends of the LED is about 4.5mm, a rectangular hole with the length of 2.6mm multiplied by 4mm is formed below a single-sided circuit board welded by the LED, and heat-conducting silicone grease is filled in the rectangular hole.
5. The structure of claim 1, wherein the structure is characterized in that: the radiator for heat dissipation is 2 aluminum plates with the thickness of 1mm, a metal gasket is arranged in the middle, and the aluminum plates are fixed on the back of the single-sided circuit board welded with the LED after being overlapped into the radiator by the columns.
CN202010783614.7A 2020-08-06 2020-08-06 Structure and method for solving work heat dissipation of LED lamp Pending CN111963912A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010783614.7A CN111963912A (en) 2020-08-06 2020-08-06 Structure and method for solving work heat dissipation of LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010783614.7A CN111963912A (en) 2020-08-06 2020-08-06 Structure and method for solving work heat dissipation of LED lamp

Publications (1)

Publication Number Publication Date
CN111963912A true CN111963912A (en) 2020-11-20

Family

ID=73364997

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010783614.7A Pending CN111963912A (en) 2020-08-06 2020-08-06 Structure and method for solving work heat dissipation of LED lamp

Country Status (1)

Country Link
CN (1) CN111963912A (en)

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Application publication date: 20201120

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