CN216563101U

CN216563101U - Discrete device integrated power module based on DBC ceramic copper-clad plate

Info

Publication number: CN216563101U
Application number: CN202122458558.2U
Authority: CN
Inventors: 姚建华; 李柏楠; 马云巧; 姚宏宇; 叶红盼; 贾凯
Original assignee: Beijing Dynamic Power Co Ltd
Current assignee: Beijing Dynamic Power Co Ltd
Priority date: 2021-10-12
Filing date: 2021-10-12
Publication date: 2022-05-17
Anticipated expiration: 2031-10-12

Abstract

The utility model discloses a discrete device integrated power module based on a DBC ceramic copper-clad plate, which is characterized in that: the PCB comprises an upper layer of PCB, a plurality of discrete power tubes which are welded with the PCB below the PCB and are arranged according to a certain regular plane, a ceramic copper-clad plate which is positioned between the power tubes and a radiating base and is used for insulation and heat radiation, and a radiating base which is positioned below the ceramic copper-clad plate, wherein the ceramic copper-clad plate is a plurality of small ceramic copper-clad plates which are arranged according to a certain regular plane and have the same number with the power tubes, and the small ceramic copper-clad plates are respectively matched with the corresponding power tubes in size; the heat dissipation base is provided with bosses which are the same as the small ceramic copper-clad plates on the upper layer in number and are matched with each other in size, and grooves for meeting the design requirements of safety specifications are formed around the bosses or in the middle and around the bosses; the utility model realizes the packaging of the high-power-density power module, and realizes high reliability, high insulation, high thermal conductivity and high expansibility.

Description

Discrete device integrated power module based on DBC ceramic copper-clad plate

Technical Field

The utility model belongs to the technical field of semiconductor discrete device integrated power modules, and particularly relates to a discrete device integrated power module based on a DBC ceramic copper-clad plate.

Background

Discrete devices generally refer to single-function devices such as silicon-based or silicon carbide-based diodes, MOSFETs, IGBTs, thyristors and the like, a heat dissipation substrate surface of the discrete device is generally in an electrified design, an integrated power module generally refers to a power electronic device which is combined according to a certain function and then encapsulated into a module, the integrated power module mainly solves the problem that a plurality of semiconductor devices are intensively arranged on an insulated heat dissipation base to facilitate insulated heat dissipation, and the integrated power module of the discrete device is mainly applied to high-power DCDC, ACDC and DCAC converters and relates to the fields of water-cooling super charging station DCDC power modules, water-cooling vehicle-mounted hydrogen fuel DCDC converters, high-power water-cooling electrolysis hydrogen production ACDC, DCDC converters, high-power converters, multi-level converters and the like, compared with the traditional IGBT integrated module and diode integrated module, the IGBT integrated module has the advantages of better device selection, flexible layout and processing, and good heat dissipation performance under the condition that the electrode and the heat dissipation base meet the insulation requirement.

The discrete device integrated power module at least comprises three parts from top to bottom: the high-power tube heat dissipation device comprises a high-power tube combined according to a certain function, a heat dissipation base for dissipating heat of the high-power tube, and a ceramic chip or a heat conduction insulating material for insulating and conducting heat between the high-power tube and the heat dissipation base.

The problems of the prior art discrete device integrated power module are: first, high reliability is poor. The high reliability difference refers to the high reliability difference of the ceramic wafer. The middle layer of the discrete device integrated power module in the prior art adopts the whole ceramic chip or other heat-conducting insulating pads, and if the ceramic chip is selected, the power tube acts on the whole ceramic chip. Due to the thickness deviation of a plurality of power tubes and the size processing deviation of the aluminum plate, which act on the whole ceramic plate, certain assembly stress is randomly added to the ceramic plate, the time is long, the ceramic plate has the risk of fracture under the action of internal stress and time stress, and the service life of the power module is influenced; if the heat conducting insulating pad is selected, the heat conducting coefficient of the heat conducting insulating pad in the prior art is far lower than that of the ceramic chip, the heat resistance is higher, and the price is higher. Second, poor high density performance: the high density is the power density of the power tube with the same volume. In order to solve the insulation problem between the power tube and the heat dissipation base in the prior art, the horizontal distance between the power tubes is increased, and a sufficient distance is reserved, so that the creepage distance is increased, the insulation problem is solved, and the whole volume of the power module is enlarged. The same power, the larger the volume, the lower the power density. Thirdly, the high thermal conductivity is poor: the total thermal resistance between the power tube and the heat dissipation base is the contact thermal resistance between the power tube and the ceramic plate, the ceramic plate thermal resistance and the heat dissipation base. Fourth, the high expansion performance is poor. When the discrete device integrated power module in the market is used for products with different voltage grades, a special chip needs to be customized, and the processes of assembling, welding, aluminum wire bonding, cleaning and the like are complex and various.

SUMMERY OF THE UTILITY MODEL

The utility model provides a discrete device integrated power module based on a DBC (dielectric ceramic) copper-clad plate, aiming at solving the problems of poor high reliability, poor high density performance, poor high heat-conducting performance and poor high expansion performance of the discrete device integrated power module in the prior art.

In order to solve the technical problem, the utility model provides the following technical scheme:

a discrete device integrated power module based on a DBC ceramic copper-clad plate comprises an upper layer of PCB, a plurality of TO247 or TO220 discrete power tubes which are arranged according TO a certain regular plane and welded with the PCB below the PCB, the ceramic copper-clad plate which is positioned between the upper layer of power tubes and a lower layer of radiating base and used for insulation and radiation, and the radiating base which is positioned below the ceramic copper-clad plate, wherein the radiating base comprises an aluminum plate or a copper plate radiating base; the method is characterized in that:

the ceramic copper-clad plate between the power tube and the heat dissipation base is a plurality of small ceramic copper-clad plates 4 which are arranged according to a certain regular plane and the number of which is the same as that of the power tube, and the small ceramic copper-clad plates 4 which are arranged according to the certain regular plane are respectively matched with the sizes of the corresponding power tubes; the heat dissipation base below the power tube is provided with bosses which are the same with the small ceramic copper-clad plates on the upper layer in quantity and are matched with each other in size, and grooves for meeting the design requirements of safety standards are further arranged around each boss or in the middle and around each boss.

The upper surface and the lower surface of the small ceramic copper-clad plate 4 are respectively provided with a copper sheet 4-1, a certain distance is arranged between the copper sheet 4-1 and the ceramic edge 4-2, and the distance is used for meeting the design requirement of safety specifications.

The discrete device integrated power module comprises a screw packaging mode and a welding packaging mode; when a screw connection mode is adopted, screw mounting holes or threaded holes are formed in the screw packaging PCB 2-1, the power tube 3, the small ceramic copper clad plate 4 and the screw packaging heat dissipation base 5-1, and the grooves of the screw packaging heat dissipation base 5-1 comprise screw packaging circular grooves 5-1-3 in the center of each boss and screw packaging opening-shaped grooves 5-1-2 around each boss; when the welding connection mode is adopted, the welding packaging PCB 2-2, the small ceramic copper clad plate 4 and the welding packaging heat dissipation base 5-2 are not provided with screw mounting holes or threaded holes, and the groove of the welding packaging heat dissipation base 5-2 is limited to the welding packaging square groove 5-2-2 around each boss.

When the welding packaging mode is adopted: each small ceramic copper clad laminate 4 is welded together through a copper sheet 4-1 on the upper surface, a copper sheet 4-1 on the lower surface, a power tube 3 on the upper surface and a welding packaging heat dissipation base boss 5-2-1 on the lower surface, and high-temperature welding materials are adopted for welding each small ceramic copper clad laminate 4 and the power tube 3, and low-temperature welding materials are adopted for welding each small ceramic copper clad laminate 4 and the welding packaging heat dissipation base boss 5-2-1; when adopting the screw encapsulation mode: the small ceramic copper-clad plates 4 are connected upwards through screws and downwards through welding; the upward threaded connection is both: the screw is sleeved with the insulating particles 6 and then sequentially passes through the power tube 3 and the small ceramic copper-clad plate 4 to be installed on the screw packaging heat dissipation base 5-1; the downward connection by welding is that: and all the small ceramic copper clad plates 4 are welded together through the copper sheet 4-1 on the lower surface and the bosses 5-1-1 of the screw packaging heat dissipation base.

When a screw packaging mode is adopted, the sum of the distance from the copper sheet 4-1 on the upper surface of the small ceramic copper-clad plate 4 TO the ceramic edge 4-2, the distance from the screw packaging circular groove 5-1-3 at the center of each screw packaging heat dissipation base boss 5-1-1 TO the ceramic edge 4-2 and the distance from the screw packaging opening-shaped groove 5-1-2 edge at the periphery TO the ceramic edge 4-2 is a creepage distance, and the three parts are matched with each other TO meet the safety specification requirement of a TO247/TO220 power module; when a welding packaging mode is adopted, the distance between the copper sheet 4-1 on the upper surface of the small ceramic copper-clad plate and the ceramic edge 4-2 and the total distance between the edge of each welding packaging heat dissipation base boss 5-2-1 and the ceramic edge 4-2 are creepage distances which are matched with each other TO meet the requirement of the safety specification of a TO247/TO220 power module; the safety code requirements are both: the distance between the copper sheet on the upper surface and the copper sheet on the lower surface of the ceramic copper-clad plate 4 needs to meet the requirement of product creepage distance design, and the sum of the distance between the copper sheet 4-1 on the upper surface of each ceramic copper-clad plate and the ceramic edge 4-2, the distance between the screw packaging circular groove 5-1-3 at the center of each screw packaging heat dissipation base boss 5-1-1 and the ceramic edge 4-2 and the distance between the edge of the screw packaging mouth-shaped groove 5-1-2 at the periphery and the ceramic edge 4-2 is the creepage distance; or the total distance between the copper sheet 4-1 on the upper surface of each ceramic copper-clad plate and the ceramic edge 4-2 and the total distance between the edge of each welded packaging heat dissipation base boss 5-2-1 and the ceramic edge 4-2 are creepage distances.

The high-density TO247/TO220 discrete device integrated power module comprises a power module consisting of a plurality of TO247 power tubes and a power module consisting of a plurality of TO220 power tubes, and is characterized in that: the arrangement gaps among the TO247/TO220 power tubes are small enough TO meet the requirement of high-density power, the arrangement gaps among the TO247 power tubes include but are not limited TO 18mm, and the arrangement gaps among the TO220 power tubes include but are not limited TO 12 mm.

The discrete device integrated power module adopts high-insulation medium high-heat-dissipation-performance materials which include but are not limited to ceramic copper clad plates, aluminum oxide ceramic copper clad plates and aluminum nitride ceramic copper clad plates.

Advantageous effects of the utility model

1. The utility model organically combines all parts and obtains new effects after combination: the size design of the small power tube determines the size design of the small ceramic copper-clad plate, and the design of the small ceramic copper-clad plate also depends on the design of the small boss, if only a small ceramic copper-clad plate is used, but no boss matched with the small ceramic copper-clad plate is used, and the lower heat dissipation base is still the whole heat dissipation aluminum plate, the power tube spacing needs to be increased due to the safety requirements, which leads to increased volume, decreased power density, if the whole copper clad ceramic plate is adopted instead of the small copper clad ceramic plate, the service life of the copper clad ceramic plate is reduced due to the deviation of the thickness of the power tube and the uneven thickness of the whole heat dissipation aluminum plate and the plane flatness error of the heat dissipation aluminum plate when the copper clad ceramic plate is installed under the action of the heat dissipation aluminum plate on the whole copper clad ceramic plate, therefore, the three support and depend on each other, and a new effect with high reliability is generated after combination; similarly, the copper sheet of every fritter pottery copper-clad plate upper surface to ceramic edge's distance to and the recess on the heat dissipation base apart from the distance on ceramic edge, the two constitutes creepage distance jointly, lack one can, the copper sheet is to ceramic edge's distance, the degree of depth of lower floor's heat dissipation base recess has been decided, the degree of depth of lower floor's heat dissipation base upper groove has also decided the distance of fritter pottery copper-clad plate copper sheet to ceramic edge, consequently, the two supports each other and has just produced high insulating new effect. Similarly, high reliability and high insulation are both used up and down, the high reliability is meaningless only if the ceramic copper-clad plate is high in reliability but cannot be insulated, the high insulation is meaningless only if the ceramic copper-clad plate is high in insulation but not high in reliability, and the high insulation is meaningless only if the ceramic copper-clad plate is combined to mutually support interdependence, so that a new effect of high reliability and high insulation can be generated; the welding packaging method adopts two times of welding and welding with high temperature and low temperature, and also has new effect after combination, if the first time adopts low temperature welding flux instead of high temperature welding flux, the first time of low temperature welding flux is melted when the second time adopts high temperature welding flux, so that the welding falls off. If the first weld is broken off, the second weld is successful but is meaningless. The expected effect of the solder package can be achieved only by combining the two.

2. The utility model realizes the high-power-density power module packaging by organically combining the materials such as a PCB, a TO247/TO220 discrete power semiconductor device, a small ceramic copper-clad plate with high density and high reliability, a heat dissipation base with a boss and a groove, high and low temperature solders with different temperatures, moisture-proof soft pouring sealant and the like, and the packaging flexibly arranges the devices according TO the circuit and topological principle, can select heat dissipation bases with different shapes according TO the heat dissipation amount and the heat dissipation form, can flexibly form a series-parallel connection structural form according TO the circuit requirement by the discrete small packaging device, improves the through-flow and pressure resistance of the integrated packaging, has less limitation on the types and specification models of combinable power devices, does not need a complex packaging production line in design and manufacture, and is flexible in design and greatly reduces the packaging cost of the high-power module. By the packaging method, the cost of the high-power electronic power module is greatly reduced, and the discrete device is extended to the application occasion of high-power electronic conversion.

Drawings

FIG. 1 is an exploded view of the high density TO247 power module screw attachment of the present invention;

FIG. 2 is an exploded view of a high density TO220 power module solder connection of the present invention;

in the figure, 1: packaging the upper cover; 2-1: the PCB is packaged by the screws; 2-2: welding and packaging the PCB; 2-1-1: the screw hole of the PCB is encapsulated by the screw; 3: a power tube; 3-1: a power tube pin; 4: a small ceramic copper-clad plate; 4-1: copper sheet; 4-2: a ceramic edge; 5-1: the screw encapsulates the heat dissipation base; 5-1-1: a boss of the heat dissipation base is encapsulated by a screw; 5-1-2: the screw encapsulates the square groove; 5-1-3: the screw encapsulates the circular groove; 5-2: welding and packaging the heat dissipation base; 5-2-1: welding and packaging the boss of the radiating base; 5-2-2: and welding and packaging the opening-shaped groove.

Detailed Description

Design principle of the utility model

1. High reliability module package design principles. The high reliability is to the high reliability of ceramic wafer, and the ceramic wafer is used for insulation and heat conduction, and the prior art adopts the ceramic wafer of big piece and the method of coating the heat conduction cream on the ceramic wafer to solve the insulation and the heat conduction problem between power tube and the aluminum plate. Due to the thickness deviation of the power tubes of the discrete elements and the size processing deviation of the aluminum plate, the assembly stress is increased, the time is long, the ceramic plate can be broken under the action of the internal stress, the insulation and heat conduction performance of the power module is poor due to the breakage of the ceramic plate, and the reliability is reduced. Firstly, the utility model adopts a method of using a small ceramic copper clad laminate to modify a large ceramic copper clad laminate into the small ceramic copper clad laminate, the size of the small ceramic copper clad laminate is designed according to the size of each discrete component power tube above the small ceramic copper clad laminate, and the boss of a heat dissipation base below the small ceramic copper clad laminate is also designed according to the size of each small ceramic copper clad laminate, so that each small ceramic copper clad laminate only bears the downward acting force of the corresponding single discrete component power tube from top to bottom and only bears the upward acting force of the corresponding single boss from bottom to top, and does not bear the shearing stress of other power tubes or aluminum plates around to the current ceramic plate due to unevenness. Secondly, the small ceramic copper-clad plate of the utility model not only reduces the downward and upward acting force of the surrounding environment on the small ceramic copper-clad plate according to the size of each discrete device power tube, but also arranges a layer of copper sheet on the front and back surfaces of each small ceramic, and the ceramic and the copper sheets greatly prolong the service life of the ceramic plate.

2. High density, high insulation and high heat conductivity. The high density is that the volume of the power module is minimum under the same power. The high density and the high insulation are in a pair of contradictions, the density is large, the creepage distance is small, and the insulation performance is poor. Therefore, the prior art adopts increasing the distance between the power tubes to leave enough distance, but this not only results in larger volume, but also reduces the power density. The utility model can realize high insulation under the condition of ensuring high power density, and adopts the following method: the gap between the power tubes was minimized in the horizontal direction, 18mm and 12mm respectively. The distance from the upper surface of the small ceramic copper-clad plate to the lower surface of the aluminum plate heat dissipation base is increased in the vertical direction, so that high insulation is realized. The method for increasing the distance in the vertical direction comprises the following steps: on the basis of not increasing the thickness of the original aluminum plate heat dissipation base, a concave groove is formed in the base along the vertical direction. If the welding method is adopted, the concave groove is arranged around each small boss; if the method of screw connection is adopted, because the screw is stretched into the aluminum plate heat dissipation base, therefore, besides the recess is opened around every boss, still need open circular recess around the screw, the degree of depth and the scope of concave groove need be according to the requirement design of ann's rule, just that the creepage distance must be enough big, just can guarantee high insulating nature. The design principle of high heat conduction performance is as follows: the thermal resistance of the power module is reduced as much as possible, and the thermal resistance is small, so that the heat conducting performance is high. In order to increase the heat conduction performance of the power module, the prior art adopts a method of connecting a ceramic plate and a heat conduction paste in series with a heat conduction element. The utility model adopts soldering tin to replace heat-conducting paste: when the welding packaging method is adopted, the upper surface and the lower surface of each small ceramic copper-clad plate are connected with the power tube and the radiating base through the soldering tin, and the thermal resistance of the soldering tin is much smaller than that of the heat conducting paste, so that the power module is a power module with high heat conducting performance. The difficulty of welding the upper surface and the lower surface of the ceramic copper-clad plate is that for the same small ceramic copper-clad plate, the upper surface of the small ceramic copper-clad plate is welded with the power tube for the first time, and the lower surface of the small ceramic copper-clad plate is welded with the radiating base for the second time. In order to ensure that the first welding position cannot fall off during the second welding, the first high-temperature welding flux is adopted, and the second low-temperature welding flux is adopted, so that the second low-temperature welding flux cannot melt the first high-temperature welding flux.

3. High flexibility and a design principle of expansibility. Because the utility model adopts the small ceramic copper-clad plate, when the utility model is used for products with different voltage grades, only power tubes with different models under the same package are needed (220 package or 247 package, each package has a plurality of models), the design is flexible to adjust, and the processing procedure is simple.

Based on the principle, the utility model designs a discrete device integrated power module based on a DBC ceramic copper-clad plate.

A discrete device integrated power module based on a DBC ceramic copper-clad plate is shown in figures 1 and 2 and comprises an upper PCB, a plurality of TO247 or TO220 discrete power tubes which are welded with the PCB below the PCB and are arranged according TO a certain regular plane, the ceramic copper-clad plate which is positioned between the upper power tube and a lower heat dissipation base and used for insulation and heat dissipation, and the heat dissipation base which is positioned below the ceramic copper-clad plate, wherein the heat dissipation base comprises an aluminum plate or copper plate heat dissipation base; the method is characterized in that:

When the welding packaging mode is adopted: each small ceramic copper clad laminate 4 is welded together through a copper sheet 4-1 on the upper surface, a copper sheet 4-1 on the lower surface, a power tube 3 on the upper surface and a welding packaging heat dissipation base boss 5-2-1 on the lower surface, and high-temperature welding materials are adopted for welding each small ceramic copper clad laminate 4 and the power tube 3, and low-temperature welding materials are adopted for welding each small ceramic copper clad laminate 4 and the welding packaging heat dissipation base boss 5-2-1; when adopting the screw encapsulation mode: the small ceramic copper-clad plates 4 are connected upwards through screws and downwards through welding; the upward threaded connection is both: the screw is sleeved with the insulating particles 6 and then sequentially passes through the power tube 3 and the small ceramic copper-clad plate 4 to be installed on the screw packaging heat dissipation base 5-1; the downward connection by welding is that: each small ceramic copper-clad plate 4 is welded with a boss 5-1-1 of the screw packaging heat dissipation base through a copper sheet 4-1 on the lower surface.

It should be emphasized that the described embodiments of the present invention are illustrative rather than limiting and, thus, the present invention includes embodiments that are not limited to those described in the detailed description.

Claims

1. A discrete device integrated power module based on a DBC ceramic copper-clad plate comprises an upper layer of PCB, a plurality of TO247 or TO220 discrete power tubes which are arranged according TO a certain regular plane and welded with the PCB below the PCB, the ceramic copper-clad plate which is positioned between the upper layer of power tubes and a lower layer of radiating base and used for insulation and radiation, and the radiating base which is positioned below the ceramic copper-clad plate, wherein the radiating base comprises an aluminum plate or a copper plate radiating base; the method is characterized in that:

the ceramic copper-clad plate positioned between the power tube and the radiating base is a plurality of small ceramic copper-clad plates (4) which are arranged according to a certain regular plane and the number of which is the same as that of the power tube, and the small ceramic copper-clad plates (4) which are arranged according to the certain regular plane are respectively matched with the sizes of the corresponding power tubes; the heat dissipation base below the power tube is provided with bosses which are the same with the small ceramic copper-clad plates on the upper layer in quantity and are matched with each other in size, and grooves for meeting the design requirements of safety standards are further arranged around each boss or in the middle and around each boss.

2. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 1, wherein: the upper surface and the lower surface of the small ceramic copper-clad plate (4) are respectively provided with a copper sheet (4-1), a certain distance is arranged between the copper sheet (4-1) and the ceramic edge (4-2), and the distance is used for meeting the design requirement of safety specifications.

3. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 1, wherein: the discrete device integrated power module comprises a screw packaging mode and a welding packaging mode; when a screw connection mode is adopted, screw mounting holes or threaded holes are formed in the screw packaging PCB (2-1), the power tube (3), the small ceramic copper clad plate (4) and the screw packaging heat dissipation base (5-1), and the grooves of the screw packaging heat dissipation base (5-1) comprise screw packaging circular grooves (5-1-3) in the center of each boss and screw packaging opening-shaped grooves (5-1-2) around each boss; when the welding connection mode is adopted, the welding packaging PCB (2-2), the small ceramic copper clad plate (4) and the welding packaging heat dissipation base (5-2) are not provided with screw mounting holes or threaded holes, and the groove of the welding packaging heat dissipation base (5-2) is limited to the welding packaging square groove (5-2-2) around each boss.

4. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 3, wherein: when the welding packaging mode is adopted: each small ceramic copper-clad plate (4) is welded together through a copper sheet (4-1) on the upper surface, a copper sheet (4-1) on the lower surface, a power tube (3) on the upper surface and a welding packaging heat dissipation base boss (5-2-1) on the lower surface, and high-temperature welding materials are adopted for welding each small ceramic copper-clad plate (4) and the power tube (3), and low-temperature welding materials are adopted for welding each small ceramic copper-clad plate (4) and the welding packaging heat dissipation base boss (5-2-1); when adopting the screw encapsulation mode: the small ceramic copper-clad plates (4) are connected upwards through screws and downwards through welding; the upward threaded connection is both: insulating particles (6) are sleeved on the screws and then sequentially pass through the power tubes (3) and the small ceramic copper-clad plates (4) to be installed on the screw packaging heat dissipation base (5-1); the downward connection by welding is as follows: each small ceramic copper-clad plate (4) is welded together through the copper sheet (4-1) on the lower surface and the boss (5-1-1) of the screw packaging heat dissipation base.

5. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 3, wherein: when a screw packaging mode is adopted, the sum of the distance from the copper sheet (4-1) on the upper surface of the small ceramic copper-clad plate (4) TO the ceramic edge (4-2) and the distance from the screw packaging circular groove (5-1-3) at the center of each screw packaging heat dissipation base boss (5-1-1) TO the ceramic edge (4-2) and the distance from the edge of the screw packaging opening-shaped groove (5-1-2) at the periphery TO the ceramic edge (4-2) is a creepage distance, and the three are matched with each other TO meet the safety specification requirement of the TO247/TO220 power module together; when a welding packaging mode is adopted, the distance between the copper sheet (4-1) on the upper surface of the small ceramic copper-clad plate and the ceramic edge (4-2) and the total distance between the edge of each welding packaging heat dissipation base boss (5-2-1) and the ceramic edge (4-2) are creepage distances which are matched with each other TO meet the safety specification requirement of a TO247/TO220 power module; the safety code requirements are both: the distance between the copper sheet on the upper surface and the copper sheet on the lower surface of the ceramic copper-clad plate (4) needs to meet the requirement of product creepage distance design, and the creepage distance is represented by the sum of the distance between the copper sheet (4-1) on the upper surface of each ceramic copper-clad plate and the ceramic edge (4-2), the distance between the screw packaging circular groove (5-1-3) at the center of each screw packaging heat dissipation base boss (5-1-1) and the ceramic edge (4-2) and the distance between the edge of the screw packaging opening-shaped groove (5-1-2) at the periphery and the ceramic edge (4-2); or the distance between the copper sheet (4-1) on the upper surface of each ceramic copper-clad plate and the ceramic edge (4-2) and the total distance between the edge of each welding packaging heat dissipation base boss (5-2-1) and the ceramic edge (4-2) are creepage distances.

6. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 1, which comprises a power module consisting of a plurality of TO247 power tubes and a power module consisting of a plurality of TO220 power tubes, and is characterized in that: the arrangement gaps among the TO247/TO220 power tubes are small enough TO meet the requirement of high-density power, the arrangement gaps among the TO247 power tubes include but are not limited TO 18mm, and the arrangement gaps among the TO220 power tubes include but are not limited TO 12 mm.

7. The discrete device integrated power module based on the DBC ceramic copper-clad plate of claim 1, wherein: the discrete device integrated power module adopts a high-insulation medium high-heat-dissipation-performance material, and the high-insulation medium high-heat-dissipation-performance material comprises but is not limited to a ceramic copper-clad plate, an aluminum oxide ceramic copper-clad plate and an aluminum nitride ceramic copper-clad plate.