CN211557522U

CN211557522U - Heater core, heater and heating system comprising same

Info

Publication number: CN211557522U
Application number: CN201890000775.0U
Authority: CN
Inventors: 李仁宰; 梁义烈; 李东华
Original assignee: LG Innotek Co Ltd
Current assignee: LG Innotek Co Ltd
Priority date: 2017-04-25
Filing date: 2018-04-23
Publication date: 2020-09-22
Anticipated expiration: 2028-04-23
Also published as: KR102292905B1; KR20180119339A; WO2018199571A1

Abstract

An embodiment discloses a heater core, a heater and a heating system including the heater, the heater core includes: a first substrate; a second substrate; and a first ceramic, a second ceramic, and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and a minimum thickness of the first substrate is greater than a minimum thickness of the second substrate in a first direction.

Description

Heater core, heater and heating system comprising same

Technical Field

Embodiments relate to a heater and a heating system including the same.

Background

An automobile includes an air conditioner for providing thermal comfort to a room, and includes, for example, a heating device for heating by a heater and a cooling device for cooling by a refrigerant cycle.

Since a conventional internal combustion engine car generates a large amount of waste heat from an engine, it is easy to obtain heat required for heating. In contrast, electric vehicles generate less heat than internal combustion vehicles, and have a problem in that batteries need to be heated.

Thus, the electric vehicle requires an additional heating device, and it is important to improve the efficiency of the heating device.

However, the heating device is heavy, and has a problem of low thermal efficiency due to low thermal conductivity.

SUMMERY OF THE UTILITY MODEL

Technical problem

Embodiments provide a heater and a heating system including the same.

In addition, a heater which is structurally stable and improves reliability is provided.

In addition, a heater which is lightweight and has improved durability is provided.

In addition, a heater is provided which improves stability by sensing temperatures acting differently.

In addition, a heater with improved thermal efficiency is provided.

Technical scheme

The embodiment of the utility model relates to a heater core includes: a first substrate; a second substrate; and a first ceramic, a second ceramic and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and a minimum thickness of the first substrate is greater than a minimum thickness of the second substrate in a first direction.

A thickness ratio between a minimum thickness of the second substrate and a minimum thickness of the first substrate in the first direction may be 1:1.1 to 1: 10.

In a third direction, the width of the first substrate is smaller than the width of the second substrate.

The second substrate covers the first ceramic, the second ceramic, and a side surface of the first substrate.

The second substrate includes a protrusion extending in a first direction.

In the first direction, a height of the protruding portion is larger than thicknesses of the first ceramic, the heating element, and the second ceramic.

The protrusion may contact a side of the first substrate.

May further include a bonding layer disposed between the second substrate and the second ceramic.

The first and second substrates may include any one of Al, Cu, Ag, Au, Mg, SUS, and stainless steel, and the first and second ceramics may include at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), and silicon (Si), and at least one of oxygen (O) and nitrogen (N).

The utility model discloses a heater that embodiment relates to includes: a power supply module; and a heating module electrically connected to the power module for generating heat, wherein the heating module includes a plurality of fins and a plurality of heater cores alternately arranged, and the heater cores include: a first substrate; a second substrate; and the first ceramic, the second ceramic and the heating element are arranged between the first substrate and the second substrate, the heating element is arranged between the first ceramic and the second ceramic, and the minimum thickness of the first substrate is larger than that of the second substrate in the first direction.

The plurality of heat sinks further include an adhesive member disposed between the first substrates and between the second substrates.

The embodiment of the utility model relates to a heating system includes: a flow path for air to flow; an air supply part for introducing air; an exhaust portion for exhausting air into a room of a vehicle; and a heater provided between the air supply portion and the air discharge portion in the flow path, for heating air, wherein the heater includes: a power supply module; and a heating module electrically connected to the power module for generating heat, the heating module including a plurality of fins and a plurality of heater cores alternately arranged, the heater cores including: a first substrate; a second substrate; and a first ceramic, a second ceramic and a heating element arranged between the first substrate and the second substrate, wherein the heating element is arranged between the first ceramic and the second ceramic, and the minimum thickness of the first substrate is larger than that of the second substrate in a first direction.

Effect of the utility model

According to the embodiment, a heater which is lightweight and has improved durability can be realized.

In addition, a heater which is structurally stable and improved in reliability can be manufactured.

In addition, a heater with improved stability through temperature sensing in different ways may be manufactured.

In addition, a heater with improved thermal efficiency can be realized.

The various and advantageous advantages and effects of the present invention are not limited to the above-described embodiments, and can be understood more easily in describing the embodiments of the present invention.

Drawings

Fig. 1 is a perspective view of a heater according to an embodiment.

Fig. 2 is a plan view of the heat generation module according to the embodiment.

Fig. 3 is an exploded perspective view of a heater core of the heat generating module according to the embodiment.

FIG. 4a is a sectional view of a heater core according to an embodiment.

Fig. 4b is a cross-sectional view of a heater core and a heat sink coupled to the heater core according to another embodiment.

FIG. 5 is a cross-sectional view along AA' in FIG. 4 a.

FIG. 6 is a view showing various shapes of the heat generating body.

FIG. 7a is a cross-sectional view of a heater core according to another embodiment.

Fig. 7b and 7c show a modification of fig. 7 a.

FIG. 8a is a cross-sectional view of a heater core according to another embodiment.

Fig. 8b is a modification of fig. 8 a.

Fig. 9a is a perspective view of a heat generation module according to another embodiment.

Fig. 9b is a modification of fig. 9 a.

Fig. 10a is a sectional view showing a connection part according to an embodiment.

Fig. 10b and 10c are plan views of fig. 10 a.

Fig. 11 is an exploded perspective view of a heater according to an embodiment.

Fig. 12a to 12c are flowcharts showing a method of manufacturing a heater core according to an embodiment.

Fig. 13 is a conceptual diagram illustrating a heating system according to an embodiment.

Detailed Description

While the invention is susceptible to various modifications and alternative embodiments, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. However, it should be understood that the present invention is not limited to the specific embodiments, and encompasses all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.

Terms including such terms as second, first, etc. may be used to describe various elements, but the elements are not limited to the terms. The terms are only used to distinguish one constituent element from another constituent element. For example, the second component may be named as the first component, and similarly, the first component may also be named as the second component without departing from the scope of the present invention. The term "and/or" includes a combination of a plurality of related items or one of a plurality of related items.

It should be understood that when a component is referred to as being "connected" or "in contact with" another component, it includes not only the case where the component is directly connected or in contact with the other component but also the case where the other component is present therebetween. Conversely, when a component is referred to as being "directly connected" or "directly contacting" another component, it is to be understood that no other component is present therebetween.

The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, expressions in the singular include expressions in the plural. In the present application, it should be understood that the terms "comprises" or "comprising," or the like, are intended to specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their contextual meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding constituent elements are given the same reference numerals regardless of the reference numerals, and a repetitive description thereof will be omitted.

Fig. 1 is a perspective view of a heater according to an embodiment, fig. 2 is a plan view of a heat generating module according to an embodiment, and fig. 3 is an exploded perspective view of a heater core of the heat generating module according to an embodiment.

Referring to fig. 1, a heater according to an embodiment includes a case, a heat generating module, and a power supply module.

The case 100 may be disposed outside the heater 1000. The case 100 may be configured to wrap the heat generating module 200 housed inside the case 100 as an exterior member of the heater 1000. One side of the case 100 may be provided with a power module 300. The case 100 may be combined with the power module 300.

The lower portion of the case 100 may include a receiving portion combined with the power module 300. For example, the case 100 and the power module 300 may be coupled to each other by insertion coupling. However, this method is not limited to this method, and various combinations can be applied.

The housing 100 may have a hollow block-shaped housing portion, but is not limited to this shape. As an example, the housing 100 may include a first surface 110 and a second surface 120. Wherein a plurality of inflow ports may be provided at the first surface 110. Thereby, the fluid may flow in toward the first surface 110. The fluid is a medium for transferring heat, and may be air, for example. However, the present invention is not limited to this type.

The first surface 110 may be provided with a plurality of inlets according to a predetermined amount of heat. The width (for example, the width in the first direction) of the plurality of inflow ports may be different, but is not limited to this shape.

A plurality of discharge ports may be provided at the second surface 120. The fluid flowing in through the first surface 110 may be heated by the heat generating module inside the case 100 and move through the discharge port of the second surface 120. The second surface may be provided with a discharge port according to a predetermined amount of heat. In addition, it may be provided so as to correspond to a plurality of inflow ports. Thus, the fluid flowing in through the inlet port can be smoothly discharged through the outlet port.

And, the fluid b flowing in from the inlet₁May be lower than the fluid b discharged through the discharge port₂. In addition, the width (e.g., the width in the first direction) of the plurality of discharge ports may beHowever, the shape is not limited to this.

The heat generating module 200 may be disposed inside the case 100. The heat generating module 200 may be electrically connected with the power module 300 disposed at one side of the case 100. The heat generation module 200 can generate heat using power received from the power module 300.

The power module 300 may be disposed at one side of the case 100. For example, the power module 300 may be disposed at a lower portion of the case 100 to support the case 100 and the heat generating module 200. The power module 300 may be combined with the case 100. The power module 300 may be electrically connected with the heat generating module 200 to supply power to the heat generating module 200. One side of the power module 300 may be connected with an external power supply device. In addition, the embodiment may relate to the heater 1000 whose MAF (mass air flow) may be 300kg/h, but may have different values according to the volume of the heater 1000.

Referring to fig. 2, the heat generating module 200 according to the embodiment may include a plurality of heater cores 220, a heat sink 210, a first gasket 230, and a second gasket 240.

The heater core 220, which is a heat generating portion, may be provided inside the housing 100. The heater core 220 may receive power from the power module and generate heat. The heater core 220 may be plural, but is not limited to these numbers.

The thickness T1 of the heater core 220 may be 1mm to 6 mm. However, without being limited to these thicknesses, the thickness of the heater core 220 (e.g., the thickness in the first direction (X-axis direction)) may be increased as the size of the heater becomes larger. The first direction (X-axis direction) is a direction in which the heater core 220 and the fins 210 are alternately arranged, and is the same as the thickness direction of the heater core. With this as a reference, the first direction (X-axis direction) will be described below.

The embodiment of the present invention relates to a heater in which the thickness T1 of the heater core 220 is reduced in the first direction (X-axis direction), and the maximum width L1 of the heater in the first direction (X-axis direction) can be reduced. With this structure, the heater according to the embodiment is more lightweight, and the same size of the heater may include more heater cores 220, thereby being capable of providing improved thermal efficiency.

The thickness T1 of the heater core 220 may be preferably 1mm or more and 5mm or less, and more preferably 1.5m or more and 3mm or less.

A plurality of heater cores 220 can be provided spaced apart by a predetermined length. Further, the heat sink 210 may be disposed between the plurality of heater cores 220.

Further, the heater core 220 and the fins 210 may be alternately arranged along the first direction.

That is, the heat generating module 200 may include the heat sinks 210 and the heater core 220 alternately arranged along the first direction. The minimum width W1 of the heat generating module 200 may be 160mm to 200 mm. The heater core 220 and the heat sink 210 may be connected to each other so that heat occurring at the heater core 220 can be moved to the heat sink 210. Accordingly, the fluid passing through the heater core 220 and the heat sink 210 receives heat, and thus the temperature can be raised.

A heat conductive member (not shown) may be provided between the heater core 220 and the heat sink 210 for heat transfer. Although the heat conductive member (not shown) may include heat conductive silicone, it is not limited to such a material.

The heat sink 210 may be disposed inside the case 100. The heat sink 210 may be provided between the heater cores 220, and may be plural. The plurality of fins 210 may be spaced apart in the first direction (X-axis direction).

Like the heater core 220, the fins 210 may be shaped to extend in the second direction (Z-axis direction). Wherein the second direction (Z-axis direction) is a direction perpendicular to the first direction (X-axis direction), which is applied as follows. Although the heat sink 210 may be a Louver fin (Louver fin), it is not limited thereto. The heat sink 210 may have a shape in which inclined plates are stacked along the second direction (Z-axis direction). Thus, the heat sink 210 may include a plurality of gaps through which the fluid can pass. The fluid may receive heat while passing through the gap. With such a heat sink 210, a heat conduction area where heat generated from the heater core 220 is transferred to the fluid is increased, so that heat conduction efficiency can be improved.

The heat sink 210 may be bonded to the heater core 220 by a Silver (Silver) adhesive layer 224 or an adhesive member such as aluminum (Al) solder Paste (Paste). However, the method is not limited to this method.

The adhesive member (not shown) is disposed between the heater core 220 and the heat sink 210, so that the heater core 220 and the heat sink 210 can be coupled to each other. The adhesive member (not shown) prevents the heater core 220 and the heat sink 210 from being separated from each other at a high temperature generated when the heater is driven, thereby improving durability and reliability of the heater.

Although the width W of the heat sink 210 (e.g., the width in the first direction (X-axis direction)) may be 8mm to 32mm, different heat sinks may be applied according to the size of the heater.

When the width W of the heat sink 210 (e.g., the width in the first direction (X-axis direction)) is less than 8mm, there is a problem of reducing MAF (mass air flow) of the heater, and when the width W of the heat sink 210 (e.g., the width in the first direction (X-axis direction)) is greater than 32mm, there is a limitation of reducing the temperature increase rate of the fluid due to poor heat transfer effect to the passing fluid.

In addition, the minimum length L1 of the heat sink 210 may be 180mm to 220mm in the second direction (Z-axis direction), which is a direction perpendicular to the first direction (X-axis direction).

A support portion (not shown) may be provided between the heat sinks 210. The support portions (not shown) may be randomly disposed between the plurality of fins 210, and for example, one or more support portions (not shown) may be disposed between adjacent heater cores 220.

The supporting portion (not shown) may support the heater core 220 and the heat sink 210 to prevent the heater core 220 and the heat sink 210 from being bent by an external force. The thickness (e.g., the thickness in the first direction) of the support portion (not shown) may be 0.4mm to 0.6 mm. When the thickness of the support portion (not shown) (for example, the thickness in the first direction (X-axis direction)) is less than 0.4mm, there is a limitation in that the amount of fluid discharged through the heater becomes small. When the thickness of the support portion (not shown), for example, the thickness in the first direction (X-axis direction) is greater than 0.6mm, the pores of the fins 210 are reduced, resulting in a reduction in the amount of heat transferred to the fluid.

A support portion (not shown) may be provided at the center of the heater cores 220 adjacent between the heater cores 220. With this structure, the force applied from the outside is uniformly dispersed, thereby minimizing damage of the heater.

The support portion (not shown) may have the same thickness as the thickness that is reduced by reducing the thickness T1 of the heater core 220 without changing the minimum width W1 (e.g., the width in the first direction (X-axis direction)) of the heat generating module 200. That is, the support portion (not shown) can be inserted into the heater while maintaining the width W of the heat sink 210. With this configuration, when the heater according to the embodiment of the present invention is applied to a heater of a conventional automobile, it is not necessary to change the design (size, etc.) of the heater, and therefore, other components used in the conventional heater production can be easily produced and reused. For example, the heat sink of the conventional heater can be similarly applied to the heater according to the embodiment. Since the conventional manufacturing process of the heater can be used, the heater according to the present embodiment can improve the compatibility without changing the conventional manufacturing process.

The first gasket 230 may be located at an upper side of the inside of the case 100. The second gasket 240 may be located at the lower side of the inside of the gasket 100. The first gasket 230 and the second gasket 240 can be coupled to the case 100 by insertion, adhesion, or the like.

The first and

second gaskets

230 and 240 may be provided with a plurality of first and second receiving portions 231 and 232 that are spaced apart along the first direction (X-axis direction). The first gasket 230 may include a plurality of first receiving portions 231 protruding therefrom. The second gasket 240 may include a plurality of second receiving portions 241 that protrude.

Referring to fig. 3, the heater core 220 according to the embodiment may include a first substrate 221, a second substrate 223, and a heating body 222.

The first substrate 221 and the second substrate 223 can house the heating element 222 therein.

The first substrate 221 is disposed at one side of the heater core 220, and the second substrate 223 may be disposed at the other side of the heater core 220.

The first substrate 221 and the second substrate 223 may include a metal having high thermal conductivity. For example, the first substrate 221 and the second substrate 223 may include Al, Cu, Ag, Au, Mg, SUS, stainless steel, and the like. But is not limited to these materials.

The first ceramic 221a and the second ceramic 223a can face each other with reference to the heating element 222. The first ceramic 221a and the second ceramic 223a may be formed by anodizing, Thermal Spraying, screen printing, patterning, and the like.

The first and

second ceramics

221a and 223a may be ceramics including at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), and silicon (Si) and at least one of oxygen (O) and nitrogen (N). For example, the first ceramic 221a and the second ceramic 223a may be concepts of a layer, a base material, a sheet, and the like including the above-described materials.

In addition, the first ceramic 221a and the second ceramic 223a may be formed thinly, and the thicknesses T3, T5 (the thickness in the first direction (X-axis direction)) thereof are 50 μm to 500 μm. With this configuration, the first ceramic 221a and the second ceramic 223a can easily dissipate heat generated from the heating element 222 provided between the first ceramic 221a and the second ceramic 223a, and thus, it is possible to prevent a phenomenon such as cracking (crack) of the first ceramic 221a and the second ceramic 223a due to insufficient heat dissipation.

In addition, the first ceramic 221a and the second ceramic 223a may be formed on the first substrate 221 by thermal spraying of a high temperature nozzle of about 10000 ℃. At this time, the temperature formed between the first and

second ceramics

221a and 223a and the first substrate 221 is about 200 ℃, and thus, the adhesion force between the first substrate 221 and the first and

second ceramics

221a and 223a is improved, so that the first and

second ceramics

221a and 223a can be prevented from being separated from the first substrate 221 when the heater is operated.

Moreover, the same can be applied to the case where the second ceramics 223a is formed on the second substrate 223 by thermal spraying as described above.

Also, by reflecting the thermal expansion coefficients of the first and

second ceramics

221a and 223a, the thermal expansion coefficients of the first and

second substrates

221 and 223 may be determined according to a preset condition. That is, the thermal expansion coefficients of the first and

second substrates

221 and 223 may have a similar value to that of the first and

second ceramics

221a and 223 a.

In addition, the thermal expansion coefficients of the first and

second substrates

221 and 223 may have the same value as the thermal expansion coefficients of the first and

second ceramics

221a and 223 a. As a result, the first ceramic 221a and the second ceramic 223a, which have good thermal conductivity but are brittle and are easily damaged by thermal shock, can be reinforced.

The difference between the thermal expansion coefficients of the first and

second substrates

221 and 223 and the thermal expansion coefficients of the first and

second ceramics

221a and 223a may be the same including 0, or the ratio of the thermal expansion coefficients may be in the range of 1:1 to 6: 1. Preferably, the coefficient ratio between the thermal expansion coefficients of the first and

second substrates

221 and 223 and the thermal expansion coefficients of the first and

second ceramics

221a and 223a may be in the range of 2:1 to 4: 1. When the coefficient ratio between the thermal expansion coefficients of the first substrate 221 and the second substrate 223 and the first ceramic 221a and the second ceramic 223a is greater than 6:1, the first ceramic 221a and the second ceramic 223a may crack.

The first substrate 221 and the second substrate 223 may be formed to surround the heating element 222, the first ceramic 221a, and the second ceramic 223a, so as to protect the heating element 222, the first ceramic 221a, and the second ceramic 223 a. Also, the first substrate 221 and the second substrate 223 use a material having high thermal conductivity, such as aluminum (Al), so that the heat generated in the heat-generating body 222 can be easily transmitted to the outside through the heat radiation sheet 210. The heating body 222 may be disposed between the first substrate 221 and the second substrate 223. For example, the heating element 222 may be provided on one surface of the first substrate 221 by printing (printing), patterning (patterning), thermal spraying, vapor deposition, or the like, for the heating element 222.

The heat generating body 222 may be provided inside the heat generating module 200. The heating element 222 may be provided on the first substrate 221 by printing, patterning, thermal spraying, vapor deposition, or the like. The heat generating body may be disposed on a surface of the first substrate 221 contacting the second substrate 223.

The heating element 222 may be a resistance wire (line). The heating element 222 may be a resistor including nickel-chromium (Ni — Cr), molybdenum (Mo), tungsten (W), ruthenium (Ru), silver (Ag), copper (Cu), or the like, but is not limited thereto. The heating element 222 may generate heat when energized.

The heating element 222 may be formed on the first ceramic 221a of the first substrate 221 by screen printing, Thermal Spraying (Thermal Spraying), or the like.

As described above, the heat generating body may be formed on the first substrate 221 by thermal spraying of a high temperature nozzle of about 10000 ℃. Also, the temperature formed between the heating element 222 and the first ceramic 221a is about 200 ℃, and thus, the adhesion between the heating element 222 and the first ceramic 221a can be improved, and the heating element 222 is prevented from being separated from the first ceramic 221a when the heater is operated.

The heating element 222 may extend in different directions of the first substrate 221, and may be rolled (bent or bent) from a part of the first substrate 221. For example, the heat generating elements 222 may have a shape that repeatedly extends along the second direction (Z-axis direction) of the first substrate 221. The heat-generating body 222 may have a shape stacked along the third direction in which the fluid passes by repeating such extension.

Due to this structure, the fluid sequentially passes through the heat generating parts generated in the heater core 220 during the passage through the heat generating module 200, so that heat can be received. That is, due to the arrangement shape of the heat-generating bodies 222, the contact area of the fluid with the heat generated from the heater core 220 can be increased.

In the conventional heater including ceramic, the area of the heating element is about 10% of the area of the substrate, which results in low heat efficiency, but the heating element 222 according to the embodiment may have a different area of the heating element 222 between the first substrate 221 and the second substrate 223 with respect to the area of the first substrate 221 and the second substrate 223. For example, the surface area of the heating element 222 can be secured to 10% or more, 50% or more, or 70% or more of the surface area of the first substrate 221, thereby improving the thermal efficiency and controlling the thermal efficiency of the heating module.

Both end portions of the heating element 222 may be electrically connected to either the first electrode terminal 225a or the second electrode terminal 225 b.

The heating element 222 may receive power from the power module through the first electrode terminal 225a and the second electrode terminal 225 b. The heat-generating body 222 may convert electric energy of the power module into heat energy. For example, the heat generating body 222 can generate heat by flowing current. The heating element 222 controls heat generation under the control of the power supplied from the power module.

Heat diffusion plates (not shown) may be provided on both side surfaces of the heater core 220. The heat diffusion plate is formed of a plurality of layers, and heat diffusion can be easily performed. However, the present invention is not limited to this configuration.

In addition, a cover portion (not shown) covering the heater core 220 may be provided. The heat diffusion plate is provided on one side of the first substrate 221 and the second substrate 223 so as to transfer heat to the housing part. For example, heat diffusion plates may be respectively coupled to the sides of the first substrate 221 and the second substrate 223.

The electrode portion 225 may be disposed at one end of the heater core 220. The electrode part 225 may include a first electrode terminal 225a and a second electrode terminal 225 b. For example, the first electrode terminal 225a and the second electrode terminal 225b may extend to the outside of the first substrate 221 and the second substrate 223.

The first electrode terminal 225a and the second electrode terminal 225b can be electrically connected to the heating element 222 in the first substrate 221. Accordingly, a portion of the first and

second electrode terminals

225a and 225b may be disposed between the first and

second substrates

221 and 223, respectively. The first electrode terminal 225a and the second electrode terminal 225b may have different electrical polarities from each other.

Another connection part 226 for electrically connecting the first electrode terminal 225a and the second electrode terminal 225b to the heating element 222 may be provided. The first electrode terminal 225a and the second electrode terminal 225b may be electrically connected to a power supply module. Thereby, the power of the power module 200 may be supplied to the heat generating module.

A cover (not shown) can surround the first substrate 221 and the second substrate 223. Also, the housing portion may include a receiving hole.

The material of the cover portion may include aluminum (Al). The cover portion may be a hollow rod (bar) or a bar shape as an exterior member of the heater core 220, but is not limited to such a shape.

The cover portion can house the first substrate 221, the second substrate 223, the heating element 222, and a heat diffusion plate (not shown) therein. In this case, the inner surface of the cover may be in contact with at least one of the first substrate 221, the second substrate 223, and a heat diffusion plate (not shown).

Heat conductive silicone may be disposed between the cover portion and the first and

second substrates

221 and 223 and a heat diffusion plate (not shown). The cover portion can be bonded to the first substrate 221, the second substrate 223, and the heat diffusion plate (not shown) by a heat conductive silicone. Furthermore, the cover portion may be structurally fastened to the first substrate 221, the second substrate 223, and the heat diffusion plate (not shown), but is not limited thereto.

Since the cover portion surrounds the first substrate 221, the second substrate 223, and the heat diffusion plate (not shown), the first substrate 221, the second substrate 223, and the heat diffusion plate (not shown) can be protected. With this structure, the cover portion can improve the reliability of the heater core 220.

Further, since the cover portion has high thermal conductivity, heat generated from the heating elements 222 of the first substrate 221 and the second substrate 223 can be conducted through the heat radiation fins 210 in contact with the heater core 220.

The housing portion may be inserted into the first gasket 230 and the second gasket 240. The housing part may support the heat generating module 200 of the embodiment by being inserted into the first gasket 230 and the second gasket 240.

However, the shape of the cover portion may be changed according to design requirements, but the shape is not limited to this shape. The cover portion (not shown) may have an additional configuration that can be changed according to design requirements. In the heater core 220, the cover portion may be omitted. Moreover, the heat diffusion plate (not shown) may be omitted in the same manner as the cover portion (not shown).

The first gasket 230 may include a plurality of first receiving portions. In addition, the second gasket 240 may include a plurality of second receiving portions.

The plurality of first receiving portions 231 and the plurality of second receiving portions 231 may be provided in one-to-one correspondence with the plurality of heater cores 220. With this structure, one side of the heater core 220 can be inserted into the first receiving portion 231. The other side of the heater core 220 may be inserted into the second receiving portion 241.

The first substrate 221 and the second substrate 223 can be inserted into the first gasket 230 and the second gasket 240. With this configuration, the heater core according to the embodiment can be reduced in volume, and a heater with a lighter weight due to the reduction in volume can be provided.

However, the electrode portion 225 of the heater core 220 penetrates the second receiving portion 241 downward and can extend downward. Therefore, the first electrode terminal 225a and the second electrode terminal 225b are exposed to the lower side and can be electrically connected to the power supply module.

Fig. 4a is a sectional view of a heater core according to an embodiment, fig. 4b is a sectional view of a heater core and a heat sink coupled to the heater core according to another embodiment, and fig. 5 is a sectional view taken along AA' in fig. 4 a.

Referring to fig. 4a, the heater core 220 can be provided with a first substrate 221, a first ceramic 221a, a heating element 222, a second ceramic 223a, and a second substrate 223 in this order along a first direction (X-axis direction).

The first substrate 221 may include a first ceramic 221 a. The thickness T2 of the first substrate 221 (e.g., the thickness in the first direction (X-axis direction)) may be 0.4mm to 3 mm. Preferably, the thickness T2 of the first substrate 221 may be 1mm to 3 mm. More preferably, the thickness T2 of the first substrate 221 may be 1.5mm to 2.2 mm. Thus, the first substrate 221 can prevent a bending phenomenon occurring while the first ceramic 221a and the heating element 222 are formed on the first substrate 221 by thermal spraying, and also prevent a bending phenomenon occurring at a high temperature when the heater is driven.

When the thickness T2 of the first substrate 221 is less than 0.4mm, there is a limitation in that a bending phenomenon occurs while forming the first ceramic 221a and the heating element 222 at a high temperature by thermal spraying.

In addition, when the thickness T2 of the first base plate 221 is greater than 3mm, there is a limitation in that heat transfer to the heat sink 210 is reduced, and the weight of the heater is increased due to the increase in thickness of the heater core 220, thereby having a limitation in light weight. In particular, when the heater is installed in a vehicle, there is a limitation in that the weight of the vehicle rises.

The thickness T3 (e.g., the thickness in the first direction (X-axis direction)) of the first ceramic 221a may be 50 μm to 500 μm. Preferably, the thickness T3 of the first ceramic 221a may be 100 μm to 400 μm. More preferably, the thickness T3 of the first ceramic 221a may be 150 μm to 300 μm. The first ceramic 221a may be provided on the side of the first substrate 221 that contacts the heating element 222.

Also, when the thickness of the first ceramic 221a is less than 50 μm, there is a limitation in that the withstand voltage characteristics are lowered. When the thickness T3 of the first ceramic 221a is greater than 500 μm, there is a limitation in that cracking occurs in the first substrate 221 in the case where the first ceramic 221a is formed by thermal spraying or in the case where the heater is operated at a high temperature. In addition, heat cannot be efficiently transferred from the heating element 222 to the first substrate 221, and a process time for forming the first ceramic 221a becomes long, thereby having a limitation in that the manufacturing efficiency of the heater is lowered.

The thickness T4 (e.g., the thickness in the first direction (X-axis direction)) of the heat-generating body 222 may be 10 μm to 100 μm. The thickness T4 of the heat-generating body 222 may preferably be 38 μm to 80 μm. More preferably, the thickness T4 of the heat-generating body 222 is 45 μm to 75 μm. For example, when the heat-generating body 222 contains Ni-Cr, the thickness T4 of the heat-generating body 222 may be 50 μm to 60 μm, but is not limited to such a length.

When the thickness T4 of the heat-generating body 222 is less than 10 μm, there is a limitation that the heat-generating characteristics of the heat-generating body 222 are reduced. When the thickness T4 of the heating element 222 is more than 100 μm, it is difficult to form the heating element 222 in a large area on the first ceramic 221a, and the current density becomes high, so that there is a limitation that the heating characteristics can be lowered and an electrical short circuit occurs.

The thickness T5 (e.g., the thickness in the first direction (X-axis direction)) of the second ceramic 223a may be 50 μm to 500 μm. Preferably, the thickness T5 of the second ceramic 223a may be 100 μm to 400 μm. More preferably, the thickness T5 of the second ceramic 223a may be 150 μm to 300 μm. The second ceramic 223a may be disposed at a side contacting the heating element.

When the thickness of the second ceramic 223a is less than 50 μm, there is a limitation in that the withstand voltage characteristic is lowered. When the thickness T5 of the second ceramic 223a is greater than 500 μm, there is a limitation in that cracking of the second substrate 223 occurs in the case where the second ceramic 223a is formed by thermal spraying or in the case where the heater is operated at a high temperature. In addition, heat cannot be efficiently transferred from the heating element 222 to the second substrate 223, and a process time for forming the second ceramic 223a becomes long, thereby having a limitation of reducing a manufacturing efficiency of the heater.

The thickness T6 (e.g., the thickness in the first direction (X-axis direction)) of the second substrate 223 may be 0.1mm to 3 mm. Preferably, the thickness T6 of the second substrate 223 may be 0.2mm to 2 mm. More preferably, the thickness T6 of the second substrate 223 may be 0.3mm to 1.5 mm.

The thickness of the second substrate 223 (e.g., the thickness in the first direction (X-axis direction)) is equal to or less than the thickness of the first substrate 221. Also, only if the thickness of the first substrate 221 is greater than that of the second substrate 223, the first ceramic 221a, the heating element 222, and the second ceramic 223a can be formed on the first substrate 221 at a high temperature and prevent the heater core 220 from being bent. That is, the thickness of the first substrate 221 is made greater than that of the second substrate 223, so that the heater core 220 can be prevented from being easily bent.

For example, a thickness ratio between a minimum thickness of the second substrate 223 (e.g., a thickness in the first direction (X-axis direction)) and a minimum thickness of the first substrate 221 (e.g., a thickness in the first direction (X-axis direction)) may be 1:1.1 to 1: 10. Preferably, the thickness ratio is from 1:1.8 to 1:8, more preferably, the thickness ratio may be from 1:4 to 1: 6. According to this structure, the thickness of the second substrate 223 may be sufficient to bear the supporting force of the heat sink 210 when the heat sink 210 is combined with the second substrate 223.

When the thickness ratio between the minimum thickness of the second substrate 223 and the minimum thickness of the first substrate 221 is less than 1:1.1, there is a limitation in that the second substrate 223 cannot cover the side of the first substrate 221. Further, when the thickness ratio between the minimum thickness of the second substrate 223 and the minimum thickness of the first substrate 221 is greater than 1:10, the volume of the heater core becomes large, and the heat of the heat radiator 222 cannot be sufficiently transferred to the first substrate 221, and there is a limitation that the first substrate 221 and the second substrate 223 may be separated by an external force.

When the thickness T6 (e.g., the thickness in the first direction (X-axis direction)) of the second substrate 223 is less than 0.1mm, there is a limitation in that the supporting force for the heat sink 210 is reduced and the protection against external force is reduced when being connected to the heat sink 210. When the thickness T6 of the second substrate 223 is greater than 3mm, there is a limitation in that the amount of heat transferred to the heat sink 210 is reduced.

With this configuration, the radiators 222 can be provided between the first ceramic 221a and the second ceramic 223a, and face each other with the heating element 222 as a reference.

The thermal expansion coefficient of the first ceramic 221a and the second ceramic 223a may be 4.5 × 10^-6K to 7.8 × 10^-6/K。

As described above, the first ceramic 221a and the second ceramic 223a may face each other on one surface of the first substrate 221 and the second substrate 223, respectively, with the heating element 222 interposed therebetween.

The first ceramic 221a and the second ceramic 223a can surround the heating element 222. With this configuration, even if the heating element 222 generates heat, the first ceramic 221a and the second ceramic 223a provided on both sides can prevent the heating element 222 from being separated from the first ceramic 221a and the second ceramic 223 a.

The first ceramic 221a and the second ceramic 223a can be made of alumina (Al)₂O₃) At this time, the thermal expansion coefficient of the first and

second ceramics

221a and 223a may be 4.5 × 10^-6K to 6.0 × 10^-6and/K. In contrast, when the first and

second substrates

221 and 223 include aluminum, a coefficient ratio between the thermal expansion coefficients of the first and

second substrates

221 and 223 and the thermal expansion coefficients of the first and

second ceramics

221a and 223a may be 3: 1.

Also, the heating element 222 and the first ceramic 221a may be formed between the first substrate 221 and the second substrate 223, and when the thickness of the first substrate 221 and the thickness of the second substrate 223 are different from each other, the heating element 222 may be located on one surface of the first substrate 221 having the largest thickness. At this time, in the first substrate 221, since the coefficient of thermal expansion of the surface on which the heating element 222 is located is different from that of the first ceramic 221a, the first substrate 221 may be bent toward the one surface or the other surface.

The heating element 222 of the heater core 220 of the present invention may be located between the first ceramic 221a and the second ceramic 223 a. For example, the first substrate 221 and the second substrate 223 are symmetrically disposed in the first direction with respect to the heating element 222, so that a bending phenomenon (Bowing) due to a difference in thermal expansion coefficient can be prevented.

Referring to fig. 4b, a first ceramic 221a, a heating element 222, and a second ceramic 223a may be sequentially formed on both side surfaces of the first substrate 221, based on the first substrate 221 according to another embodiment. For example, the first ceramic 221a, the heating element 222, and the second ceramic 223a may be symmetrically formed on both sides of the first substrate 221 with respect to the first substrate 221.

The heating elements 222 and the like are symmetrically formed with respect to the first substrate 221, so that heat generated from the heating elements 222 can be uniformly transferred to the first substrate. This reduces the occurrence of bending of the heater core, and the first substrate 221 receives heat from the heat generating elements 222 on both sides, and thus, when the same voltage is applied, the heat efficiency can be improved as compared with the case where the heat generating elements are formed only on one side of the first substrate 221. Table 1 is a graph showing whether or not the substrate is bent and the surface temperature of the heat generating module 200 is measured in the comparative examples and examples.

TABLE 1

Referring to table 1, it is understood that, when the first ceramic 221a, the second ceramic 223a, and the heating element 222 are formed on both sides of the first substrate 221, the bending phenomenon is improved and the surface temperature of the heating module 200 is increased, compared to when the first ceramic 221a, the second ceramic 223a, and the heating element 222 are formed only on one surface of the first substrate 221. Also, the first ceramic 221a and the second ceramic 223a may be insulating materials. With this configuration, the first ceramic 221a can electrically insulate the heating element 222 from the first substrate 221, or the second ceramic 223a can electrically insulate the heating element 222 from the second substrate 223. Therefore, the occurrence of an electrical accident is prevented, so that electrical reliability can be improved.

Referring to fig. 5, as described above, the heating element 222 may be a resistance wire (line) and may have a structure in which a shape extending along the second direction and being rolled (bent or bent) in the third direction is repeated. Wherein, the third direction (Y axle direction) is used as the direction of perpendicular to first direction (X axle direction) and second direction (Z axle direction), is applied to the utility model discloses. With this structure, the surface area of the heat-generating body 222 is increased, and the heat-generating characteristics can be improved. However, the heating element 222 is not limited to this shape, and may have a different shape.

The width P of the heat-generating body 222 (for example, the width in the third direction (Y-axis direction)) may be 0.5 to 6mm, preferably 0.8 to 4mm, more preferably 1 to 2 mm.

When the width P of the heat-generating body 222 is less than 0.5mm, there is a limitation that it is difficult to secure the heat-generating characteristics of the heat-generating body 222. In addition, there is a problem in that an electrical short occurs when the heater operates.

When the width P of the heating element 222 is larger than 6mm, the current density becomes large, which hinders the heat generation characteristics, and the thickness of the entire heater is increased, which makes it difficult to reduce the weight. Moreover, when mounted in an automobile or the like, there is a problem that the design freedom is hindered due to a large volume.

The heating element 222 may be provided on the first ceramic 221a along a first direction (X-axis direction) of the first ceramic 221a and the second ceramic 223 a. And, may be disposed on the center line. With this structure, the heat-generating bodies 222 can supply uniform heat to the first substrate 221 and the second substrate 223, respectively. Further, the heating element 200 can prevent the heating element 222 from falling off from the first substrate 221 or the second substrate 223 due to an increased internal stress caused by an imbalance in heat transfer.

FIG. 6 is a view showing a different shape of the heat generating body.

Referring to fig. 6, it can be formed on the first substrate 221 by printing, patterning, coating, or thermal spraying. For example, the heating element 222 may be formed in a pattern extending in a first direction and then repeatedly rolled up to extend in a second direction opposite to the first direction as shown in fig. 6 (a), may be formed in a zigzag shape as shown in fig. 6 (b), or may be formed in a spiral shape as shown in fig. 6 (c). In this manner, the heat-generating body 222 can include a plurality of heat-generating patterns 222-1, 222-2 connected by a predetermined pattern and arranged apart from each other.

The plurality of heat emitting patterns 222-1, 222-2 are spaced apart, and a heat conductor (not shown) may be disposed in a spaced-apart region between the plurality of heat emitting patterns 222-1, 222-2. As the number of the heat generating elements 222 to be printed increases, the amount of heat generated by the first substrate 221 and the second substrate 223 may increase. In this specification, the heating element 222 may be used in combination with a resistor, a heating pattern, or the like.

The surface area of the heating element 222 may be 10% or more, 50% or more, or 70% or more of the surface area of the upper portion of the first substrate 221. Thereby, a heat generation area on the first substrate 221 is enlarged, so that heat generation efficiency can be improved.

A heat conductor (not shown) can be disposed between the heat emitting patterns 222-1, 222-2, the heat emitting patterns 222-1, 222-2 being disposed on the first substrate 221. Further, a heat conductor (not shown) may be further provided outside the heating element 222. In this case, the area of the heat conductor (not shown) provided on the first substrate 221 may be 0.5 times or more the area of the heating element 222. When the area of the heat conductor (not shown) is less than 0.5 times the area of the heat-generating body 222, the heat conductivity of the heat generated from the heat conductor 222 may be low.

Fig. 7a is a sectional view of a heater core according to another embodiment, and fig. 7b and 7c are modifications of fig. 7 a.

Referring to fig. 7a, the width W2 of the first substrate 221 (e.g., the width in the third direction (Y-axis direction)) may be 10mm to 20 mm. And, the width W3 of the second substrate 223 may be 11mm to 23 mm.

Either one of the first substrate 221 and the second substrate 223 may be wider than the other (e.g., in the third direction (Y-axis direction)). As an example, the width W2 of the first substrate 221 may be less than the width W3 of the second substrate 223.

Also, any one of the first substrate 221 and the second substrate 223 may include a protrusion portion formed to protrude toward the other substrate. For example, the protrusion 223b may be formed to protrude from one surface of the second substrate 223 along the first direction (X-axis direction). The protrusion 223b may cover the side surfaces of the first ceramic 221a and the second ceramic 223 a. The side surface may be any one of two surfaces that are maximally spaced along the third direction (Y-axis direction).

The protrusion 223b can protect the first substrate 221, the first ceramic 221a, the heating element 222, and the second ceramic 223b from the outside.

The protruding portion 223b may be supported by the frame portion 223c and may have a shape protruding from one surface of the frame portion 223c in the first direction (X-axis direction). The protruding portion 223b can extend from the frame portion 223c of the second substrate 223 along the first direction (X-axis direction).

The height h1 (e.g., the height in the first direction (X-axis direction)) of the projection 223b may be equal to or greater than the overall thickness T7 (e.g., the thickness in the first direction (X-axis direction)) of the first ceramic 221a, the heating element 222, and the second ceramic 223 b. The protrusion 223b can wrap the side surfaces of the first ceramic 221a and the second ceramic 223 a.

The protrusion 223b can contact a surface of the first substrate 221. Thereby, the first substrate 221 and the second substrate 223 can be bonded, and physical stability of the heater core can be ensured.

In addition, the coupling force between the first substrate 221 and the second substrate 223 is improved, and the heat generating body 222 can be prevented from being separated from the first substrate 221 and the second substrate 223 by heat generation. The ceramic and the heating element 222 can be protected from moisture or external force. As shown in fig. 4b, the first ceramic 221a, the second ceramic 223a, and the heating element 222 may be formed on both sides of the first substrate 221, and in this case, the second substrate 223 may be disposed on both sides of the first substrate, and the protrusion 223b of the second substrate 223 may protrude toward the first substrate 221.

Referring to fig. 7b, as shown in fig. 7a, the width W2 of the first substrate 221 (e.g., the width in the third direction (Y-axis direction)) may be 10mm to 20 mm. Also, the width W3 of the second substrate 223 (e.g., the width in the third direction (Y-axis direction)) may be 11mm to 23 mm.

As shown in fig. 7a, either one of the first substrate 221 and the second substrate 223 may include a protrusion portion formed to protrude toward the other substrate. For example, the protrusion 223b may be formed to protrude from one surface of the second substrate 223 along the first direction (X-axis direction). The protrusion 223b may cover the side surfaces of the first ceramic 221a and the second ceramic 223 a. Wherein the side surface may be any one of two surfaces spaced apart most in the third direction.

The protruding portion 223b is formed by forming the frame portion 223c and the protruding portion 223b as one substrate and then bending both ends of the second substrate 223 in the third direction toward the first direction when the second substrate 223 is manufactured. Therefore, the second substrate 223 including the protruding portion 223b and the frame portion 223c can be efficiently manufactured.

In addition, the heights h2 (e.g., heights in the first direction (X-axis direction)) of the protruding portions 223b located at both sides of the second substrate 223 may be the same as each other. Preferably, the protruding parts 223b of both sides may have 1: 0.9 to 1:1.1 length ratio.

The protruding portion 223b can remove the exposed portions of the first and

second ceramics

221a and 223b of the first substrate 221 in the third direction. With this configuration, the first substrate 221, the first ceramic 221a, and the second ceramic 223b form flat both side surfaces along the third direction (Y-axis direction), and the first ceramic 221a and the second ceramic 223b can be protected from external impact.

The height of the protrusion 223b (e.g., the height in the first direction (X-axis direction)) may be higher than the thicknesses of the first ceramic 221a, the heating element 222, and the second ceramic 223b (e.g., the thicknesses in the first direction (X-axis direction)), and may be smaller than the thicknesses of the first ceramic 221a, the heating element 222, the second ceramic 223b, and the first substrate 221. With this structure, the coupling force between the first substrate 221 and the second substrate 223 can be improved.

The height of the projection 223b (e.g., the height in the first direction (X-axis direction)) can be higher than the thickness T10 of the first ceramic 221a and the heating element 222 (e.g., the thickness in the first direction (X-direction)). With this structure, the protrusion 223b can improve the coupling force between the first substrate 221 and the second substrate 223.

For example, the second substrate 223 can cover the whole or a part of the side surface of the first substrate 221 by the protrusion 223 b. When the second substrate 223 covers the side surface of the first substrate 221, the protrusion 223b of the second substrate 223 covers the side surface of the first substrate 221 with an area occupying 30% to 100% of the area of the side surface of the first substrate 221. The area ratio of the protrusion 223 covering the side of the first substrate 221 may be preferably 50% to 90%, more preferably 60% to 80%. As an embodiment, in the region contacting the first substrate 221, the length of the protrusion 223b in the first direction (X-axis direction) may be 30% to 100% of the length of the first substrate 221 in the first direction (X-axis direction). It may be preferably 50% to 90%, more preferably 60% to 80%.

When the height of the protrusion 223b (e.g., the height in the first direction (X-axis direction)) is less than 50% of the thickness of the first substrate 221 (e.g., the thickness in the first direction (X-axis direction)) in the region in contact with the first substrate 221, the bonding force between the first substrate 221 and the second substrate 223 is reduced to physically separate the first substrate 221 and the second substrate 223 from each other. Also, when the height of the protrusion 223b is 80% to 100% of the thickness of the first substrate 221 in the first direction (X-axis direction) in the region in contact with the first substrate 221, the length of the protrusion 223b can be controlled within a corresponding range in terms of manufacturing processes so as to adjust thermal efficiency.

The first ceramic 221a, the heating element 222, and the second ceramic 223a may be formed on the first substrate 221. As described above, the heating element 222 may be disposed between the first ceramic 221a and the second ceramic 223 a. The second ceramic 223a can be formed on the first ceramic 221a and the heating element 222 by thermal spraying (thermal spraying).

For example, even if the second ceramic 223a is formed by thermal spraying at high temperature and high pressure, it can be formed on the first ceramic 221a which is not the second substrate 223. The second ceramic 223a is not in contact with the second substrate 223, and thus the high temperature and high pressure applied when the second ceramic 223a is formed can mitigate the influence applied to the second substrate 223. In contrast, when the first ceramic 221a and the second ceramic 223a are formed on the first substrate 221, the first substrate 221 may be increased in thickness to prevent warpage because of the high temperature.

Accordingly, embodiments relate to a minimum thickness T9 (e.g., a thickness in the first direction (X-axis direction)) of the second substrate 223 that may be less than a minimum thickness T8 (e.g., a thickness in the first direction (X-axis direction)) of the first substrate 221.

For example, the minimum thickness T9 of the second substrate 223 may be 0.1mm to 3 mm. Also, the minimum thickness T8 of the first substrate 221 may be 1mm to 3 mm.

In addition, a thickness ratio between the minimum thickness of the first substrate 221 and the minimum thickness of the second substrate 223 in the first direction (X-axis direction) may be 1:0.1 to 1:1. Preferably, the thickness ratio may be 1:0.15 to 1:0.5, and more preferably, the length ratio may be 1:0.2 to 1: 0.4. When the ratio of the thickness of the first substrate 221 to the thickness of the second substrate 223 in the first direction (X-axis direction) is less than 1:0.1, the heat sink 210 adhered to the second substrate 223 cannot be supported, and there is a limitation in that the second ceramic 223a receives an external force image from the outside.

When the ratio of the thickness of the first substrate 221 to the thickness of the second substrate 223 in the first direction (X-axis direction) is greater than 1:1, there is a limitation in that heat generated at the heat radiator 222 cannot be easily transferred to the first substrate 221 and the second substrate 223 because the first substrate 221 is bent.

With this structure, the second substrate 223 is prevented from being bent due to high-temperature expansion, and the volume and weight of the heating core 220 can be reduced. Moreover, the manufacturing cost can be saved.

Referring to fig. 7c, the heating body 222 as described above can have various shapes. For example, the surface area of the heating element 222 may be secured to 10% or more, 50% or more, or 70% or more of the surface area of the first substrate 221, thereby improving the thermal efficiency and controlling the thermal efficiency of the heating module.

Fig. 8a is a sectional view of a heater core according to another embodiment, and fig. 8b is a modification of fig. 8 a.

Referring to fig. 8a, the heater core 220 according to another embodiment may be provided in the order of a first substrate 221, a first ceramic 221a, a heating element 222, a second ceramic 223a, an adhesive layer 224, and a second substrate 223.

The adhesive layer 224 can be disposed between a surface of the second substrate 223 and the second ceramic 223 a. The adhesive layer 224 can transfer heat received by the second ceramic 223a from the heating body 222 to the second substrate 223. At this time, the length of the second substrate 223 in the first direction may be less than that of the first substrate 221. Therefore, the heater can be reduced in weight. In addition, the second substrate 223 is bonded to the adhesive layer 224 provided on one side, so that a supporting force for the heat sink (not shown) connected to the other side can be improved. Also, the adhesive layer 224 can protect the second ceramic 223a from an external force.

Referring to fig. 8b, the heater core 220 according to the modification can be provided in the order of the first substrate 221, the first ceramic 221a, the heating element 222, the adhesive layer 224, the second ceramic 223a, and the second substrate 223.

The adhesive layer 224 is provided between the second ceramic 223a and the heating element 222, and can bond the second substrate 223 and the first substrate 221 on which the heating element 222 is formed. The adhesive layer 224 may be formed of a material having a similar thermal expansion coefficient to the first ceramic 221a, and can easily transfer the heat of the heating element 222 to the second ceramic 223 a.

Fig. 9a is a perspective view of a heat generating module according to another embodiment, and fig. 9b is a modification of fig. 9 a.

Referring to FIG. 9a, a sensor 290 can be provided on the heater core. The sensor 290 may include a temperature sensor. The sensor 290 can be located on one side of the heater core. However, the position is not limited to this, and the sensor may be provided on a support portion (not shown) formed in the middle of the heater.

For example, sensor 290 may be positioned at the face of the fluid discharge for accurate temperature measurement of the heater core. Also, the temperature sensor may include at least one of a thermostat and a thermocouple. But is not limited to these categories.

With this configuration, the sensor 290 is able to sense the temperature of the region of the exhaust fluid. Accordingly, the temperature of the fluid discharged through the discharge port is accurately measured, thereby enabling a user to timely control the heater 1000.

Referring to fig. 9b, the sensor can be disposed within the heater core. Therefore, the sensor can be protected from external impact. However, the present invention is not limited to this position, and may be provided on one side surface of the heater.

Fig. 10a is a cross-sectional view showing the connection portion 226 according to the embodiment, and fig. 10b and 10c are plan views of fig. 10 a.

Referring to fig. 10a, the connection part 226 is disposed on the first ceramic 221 a. The connection portion 226 may be formed to extend along the second direction (Z-axis direction) of the first substrate 221, but is not particularly limited thereto.

The heating element 222 can be provided on the first ceramic 221 a. The heating element 222 may be provided on the first ceramic 221a in various shapes.

Referring to fig. 10a (1), the heating element 222 can cover a part of the connection portion 226. The second ceramic 223a can be provided on the heating element 222. The length of the second ceramic 223a in the second direction (Z-axis direction) may be equal to or greater than the length of the heating element 222. With this structure, the second ceramic 223a can entirely receive the heat generated by the heat-generating body 222, thereby improving the thermal efficiency of the heater core.

The heating element 222 may extend in the second direction (Z-axis direction) to cover the connection portion 226. The heating element 222 may overlap the connection portion 226 in the first direction (X-axis direction). Further, a maximum length L3 (e.g., a length in the second direction (Z-axis direction)) of the heat generating element 222 in a region overlapping the connection portion 226 in the first direction (X-axis direction) may be 10% or more, 50% or more, or 80% of a maximum length L2 (e.g., a length in the second direction (Z-axis direction)) of the connection portion 226. With this configuration, the length of the heating element 222 is increased, and the entire area of the heating element 222 is increased, thereby improving the heat efficiency of the heater core.

With this configuration, the surface area of the heating element can be made 10% or more, 50% or more, or 80% or more of the surface area of the upper portion of the first substrate 221, and the thermal efficiency of the heater core can be greatly improved.

Referring to (2) of fig. 10a, the heating element 222 may be partially covered by the connection part 226. The second ceramic 223a can be provided on the heating element 222. The second ceramic 223a can cover a part of the heating element 222.

Similar to (1) of fig. 10a, the heating element 222 can overlap with the connection portion 226 in the first direction (X-axis direction). In the region where the heat-generating element 222 and the connection portion 226 overlap in the first direction (X-axis direction), the maximum length L4 (for example, the length in the second direction (Z-axis direction)) may be 10% or more, 50% or more, or 80% or more of the maximum length L2 of the connection portion 226. With this configuration, the length of the heating body 222 is increased, and the entire area of the heating body 222 is increased, so that the heat efficiency of the heater core can be improved.

Furthermore, the connection portion 226 and the heat-generating body 222 can include a region that is in contact in the first direction (X-axis direction). Therefore, it is possible to improve electrical reliability while preventing electrical separation between the connection portion 226 and the heating element 222.

In addition, one surface of the second ceramic 223a in the first direction (X-axis direction) can be formed to be the same surface as one surface of the electrode portion 225. With this structure, structural stability can be improved.

Fig. 10b and 10c are plan views of fig. 10a, and fig. 10b is a view in which the second ceramic 223a located at the uppermost surface in fig. 10c is removed.

Referring to fig. 10b and 10c, both ends of the heating element 222 can be electrically connected to the connection portion 226. The connection portion 226 may include a first connection member 226a and a second connection member 226b having different polarities from each other. For example, both end portions of the heating element 222 can be connected to the first connection member 226a and the second connection member 226b, respectively.

The minimum width W6 of the heating element 222 (e.g., the width in the third direction (Y-axis direction)) may be 10%, 50%, or 80% or more of the width W5 of the first connection member 226 a. As described above, since the heating element 222 is formed by thermal spraying, the width W6 is easily increased, and the contact area between the heating element 222 and the connection portion 226 can be increased. For example, the heating element 222 can be thermally sprayed on the first ceramic 221a in a desired region using a metal mask. That is, the heating element 222 having a desired area can be formed on the first ceramic 221a according to the area of the opening region of the mask. Therefore, 10%, 50%, or 80% or more is formed also in the region where the connection portion 226 and the heating element 222 overlap in the first direction, and thus the electrical conductivity and the electrical reliability can be improved. Further, the overlapping area is increased, so that the coupling force between the connection part 226 and the heating element 222 can be improved.

The heating elements 222 provided on the first ceramic 221a are formed to extend in a plurality of rows along the second direction (Z-axis direction), and the heating elements 222 include a pattern protruding along the third direction (Y-axis direction), so that the heat efficiency of the heater can be improved by a large-area heat-generating region.

Fig. 11 is an exploded perspective view of a heater according to an embodiment.

Referring to fig. 11, the power module 300 can be disposed at a lower portion of the case 100. The power module 300 can be combined with the case 100. The power module 300 can be electrically connected with the heat generating module. The power module 300 can control the intensity, direction, wavelength, etc. of the current supplied to the heat generating module. The power module 300 can be connected to an external device power supply device through a conductive wire (not shown) and charged or supplied with power.

The power module 300 having a rectangular frame shape may include a housing guide 310, a connection terminal 320, a first connection terminal 330, and a second connection terminal 340.

The case guide part 310 can be formed at the center of the upper surface of the power module 300. The case guide part 310 has a square groove or hole shape, and the connection terminal part 320 may be formed therein. At this time, a groove or a hole corresponding to the lower portion of the housing 100 can be formed by the four-sided groove or hole of the housing guide portion 310 and the side wall of the connection terminal portion 320. Also, the housing 100 can be guided in a shape to be inserted into the housing guide 310. As a result, the power module 300 can be aligned and disposed on the lower portion of the housing 100. At this time, the lower portion of the case 100 and the power module 300 can be coupled. The coupling of the case 100 and the power module 300 can be achieved by various means such as a machine (screw, etc.), a structure (insertion, etc.), an adhesive (adhesive layer), and the like.

The connection terminal part 320 may be a bracket formed at an inner center portion of the case guide part 310. A connection terminal groove 321 may be formed at the center of the connection terminal part 320. The first connection terminal 330 and the second connection terminal 340 may be arranged on the bottom surface of the connection terminal groove 321.

The first and

second connection terminals

330 and 340 may be plural. The first connection terminal 330 and the second connection terminal 340 may be spaced apart from each other in the front-rear direction. At this time, the first connection terminal 330 can be disposed in the front. Also, the second connection terminal 340 can be disposed at the rear. The first and

second connection terminals

330 and 340 may have a plate shape having front and rear surfaces. The plurality of first and

second connection terminals

330 and 340 can correspond one-to-one to the plurality of heater cores 220. The plurality of first connection terminals 330 and the plurality of second connection terminals 340 can correspond one-to-one to the plurality of first electrode terminals 225a and the plurality of second electrode terminals 225b in an opposing manner. Also, when the case 100 is combined with the power module 300, the first connection terminal 330 can be combined with the first electrode terminal 225a corresponding thereto. And, the second connection terminal can be coupled with the second electrode terminal 225b corresponding thereto. At this time, the first connection terminal 330 can be interposed between the first connection member 225c and the second connection member 225d of the first electrode terminal 225 a. Also, the first connection terminal 330 and the first electrode terminal 225a can be electrically connected by insertion coupling or assembly. Also, the second connection terminal 340 may be interposed between the third connection member 226c and the fourth connection member 226d of the second electrode terminal 225 b. Thereby, the second connection terminal 340 and the second electrode terminal 225b can be electrically connected by insertion bonding or assembly.

Referring to fig. 12a, the first substrate 221 can be prepared. Further, a first ceramic 221a can be formed on the first substrate 221. As described above, the first substrate 221 can include a metal having high conductivity. For example, the first substrate 221 and the second substrate 223 can include Al, Cu, Ag, Au, Mg, stainless steel, and the like. But is not limited to these materials.

The first ceramic 221a can be formed by coating an insulating film of aluminum oxide, magnesium oxide, or the like by anodic oxidation or Thermal Spraying (Thermal Spraying). The first ceramic 221a may include a material having insulation properties and thermal conductivity, but the material is not particularly limited.

For example, the thermal spraying is performed by welding in a state where the first substrate 221 is melted, but is not particularly limited thereto. The first ceramic 221a may be integrally bonded to the first substrate 221, and a portion of the first substrate 221 may be oxidized.

In addition, as described above, the first ceramic 221a easily conducts heat and has a lower thermal expansion coefficient than the substrate, so that the bending phenomenon of the substrate can be prevented.

Referring to fig. 12b, the heating element 222 may be disposed on the first ceramic 221 a. The heating element 222 can be formed on the first ceramic 221a by coating, printing, or thermal spraying. The heating element 222 may include one of nickel-chromium (Ni-Cr), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), ruthenium (Ru), silver (Ag), ito (indium Tin oxide), barium titanate (BaTiO), CNT, graphite, and carbon black.

Referring to fig. 12c, the second ceramic 223a and the second substrate 223 can be formed on the heating element 22 and the first ceramic 221 a.

For example, the first ceramic 221a, the heating element 222, and the second ceramic 223a can be formed on the first substrate 221 in this order by thermal spraying. Also, the second substrate 223 can be positioned on the second ceramic 223 a.

As described above, the second substrate 223 may further include a protrusion, and the second substrate 223 is bonded to the first substrate 221 by providing an adhesive layer between the second substrate 223 and the second ceramic 223 a.

The adhesive layer may be a glass material capable of providing a bonding function by a heat treatment of 500 to 600 ℃. Also, the adhesive layer can block an insulating function and moisture, thereby improving durability.

Further, the second ceramic 223a may be formed on the second substrate 223 and then the second ceramic 223a and the heating element 222 may be bonded to each other in the same manner as the method of forming the first ceramic 221a on the first substrate 221. The second ceramic 223a and the heating element 222 can be bonded by an adhesive layer between the second ceramic 223a and the heating element 222, but the bonding method is not limited thereto.

Further, the combined first substrate 223 and second substrate 223 can be covered with a cover. The first substrate 221 and the second substrate 223 can be bonded to a heat sink using silver epoxy, silicone, or the like. The first substrate 221 and the second substrate 223 can be bonded to the heat sink by soldering, but the bonding method is not particularly limited to this.

Referring to fig. 13, the heating system 2000 of the present embodiment can be used for various vehicles. The transportation means is not limited to land-based vehicles such as automobiles, and may include ships, airplanes, and the like. However, a case where the heating system 2000 of the present embodiment is applied to an automobile will be described as an example.

The heating system 2000 can be housed in an engine room of an automobile. The heating system 2000 includes a gas supply part 400, a flow path 500, a gas discharge part 600, and a heater 1000.

As the air supply portion 400, a different air supply device such as a fan or a pump can be used. The gas supply unit 400 can move the fluid outside the heating system 2000 to the inside of the flow path 500 described later and move the fluid along the flow path 500.

The flow path 500 may be a channel through which a fluid flows. One side of the flow path 500 may be provided with the air supply part 400, and the other side of the flow path 500 may be provided with the air discharge part 600. The flow path 500 can air-condition and connect an engine room and a room of an automobile.

The exhaust portion 600 can use a closable blade or the like. The exhaust part 600 can be provided at the other side of the flow path 500. The exhaust unit 600 can communicate with the interior of the automobile. Therefore, the fluid moving along the flow path 500 can flow into the vehicle interior through the exhaust unit 600.

As the heater 1000 of the heating system 2000, the heater 1000 of the present embodiment described above can be used. Hereinafter, description of the same technical idea will be omitted. The heater 1000 may be provided in the middle of the flow path in a partition shape. At this time, the front and rear of the heater 1000 may be the same or similar direction as the front and rear of the automobile. The cold fluid supplied to the engine room of the flow path 500 by the air supply unit 400 can be heated while passing from the front to the rear of the heater 1000, and then, the cold fluid flows along the flow path 5000 again and is supplied to the room through the exhaust unit 600.

Additionally, the heater 1000 of the present embodiment is compatible with the existing BaTiO-containing heater₃Unlike the PCT thermistor for Pb, heat transfer is possible by the heating element provided between the first ceramic and the second ceramic. Further, the thermal efficiency can be improved by utilizing a high heat generation amount of the heating element. Further, the first ceramic and the second ceramic having high thermal conductivity cover a high calorific value of the heating element, thereby achieving thermal stability and improving thermal efficiency and reliability.

Further, the heater 1000 of the present embodiment may not contain heavy metal materials such as lead (Pb), which is not only environmentally friendly, but also lightweight.

The present invention has been described above with reference to the preferred embodiments thereof, and various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present invention as set forth in the appended claims. For example, each of the components specifically shown in the embodiments can be modified and implemented. And such modifications and application-related differences should be construed as being included within the scope of the present invention as defined by the appended claims.

Claims

1. A heater core, comprising:

a first substrate;

a second substrate; and

a first ceramic, a second ceramic and a heating element provided between the first substrate and the second substrate,

the heating element is arranged between the first ceramic and the second ceramic,

in the first direction, a minimum thickness of the first substrate is greater than a minimum thickness of the second substrate.

2. Heater core according to claim 1,

a thickness ratio between a minimum thickness of the second substrate and a minimum thickness of the first substrate in the first direction is 1:1.1 to 1: 10.

3. Heater core according to claim 1,

4. Heater core according to claim 1,

5. Heater core according to claim 1,

the second substrate includes a protrusion extending in a first direction.

6. Heater core according to claim 5,

7. Heater core according to claim 5,

the protrusion contacts a side surface of the first substrate.

8. Heater core according to claim 1,

further comprising a bonding layer disposed between the second substrate and the second ceramic.

9. Heater core according to claim 1,

the first substrate and the second substrate include any one of Al, Cu, Ag, Au, Mg, SUS, and stainless steel,

the first and second ceramics include at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), and silicon (Si) and at least one of oxygen (O) and nitrogen (N).

10. A heater, comprising:

a power supply module; and

a heating module electrically connected with the power module for generating heat,

wherein the heat generating module comprises a plurality of heat radiating fins and a plurality of heater cores which are alternately arranged,

the heater core includes:

a first substrate;

a second substrate; and

11. The heater of claim 10,

12. A heating system, comprising:

a flow path for air to flow;

an air supply part for introducing air;

an exhaust portion for exhausting air into a room of a vehicle; and

a heater provided between the air supply portion and the air discharge portion in the flow path for heating air,

wherein the heater comprises:

a power supply module; and

the heat generating module includes a plurality of heat sinks and a plurality of heater cores alternately arranged,

the heater core includes:

a first substrate;

a second substrate; and