CN210518876U

CN210518876U - Heater core, heater and heating system

Info

Publication number: CN210518876U
Application number: CN201790001187.4U
Authority: CN
Inventors: 李仁宰; 金元振
Original assignee: LG Innotek Co Ltd
Current assignee: LG Innotek Co Ltd
Priority date: 2016-08-19
Filing date: 2017-07-27
Publication date: 2020-05-12
Anticipated expiration: 2027-07-27
Also published as: WO2018034442A1

Abstract

The present embodiment provides a heater core, a heater and a heating system, the heater including: a casing having an inlet and an outlet arranged to face each other and through which a heat medium passes; a heat generation module disposed inside the housing; a power module disposed at one side of the case and electrically connected to the heat generating module, the heat generating module including a plurality of fins having a shape extending from one side to the other side and a plurality of heater cores alternately arranged with each other, the heater core including: a ceramic substrate; and a heating element disposed inside the ceramic substrate, the heating element extending from one side to the other side, then being folded back and extending from the other side to the one side, and repeating this so as to be stacked and arranged along a direction in which the heating medium passes.

Description

Heater core, heater and heating system

Technical Field

The utility model relates to a heater and heating system for vehicle.

Background

The following description merely provides background information related to the present embodiments and does not describe the prior art.

The heater serves as a constituent device of the heating system and performs a heat generating function. The heater is required to be installed in a vehicle such as an automobile in response to a request from a consumer, and may be referred to as a "heater" or a "heater".

On the other hand, as concerns about environmental issues and renewable energy sources are increasing, research and development on electric vehicles are being conducted. The electric vehicle is also provided with a heating system as in a general internal combustion vehicle.

Electric vehicles generate less heat (e.g., residual heat of an engine) than internal combustion vehicles, and are therefore particularly important in reducing heat loss and improving energy efficiency.

In addition, with the advent of smart cars, smart devices having various functions and displays are mounted on the dashboard of the car. As a result, the ratio of the air supply area of the air conditioning system to the area of the dashboard decreases. That is, the energy efficiency of the heater needs to be improved in accordance with the air blowing area of the air conditioning system which is gradually reduced in accordance with the design requirement.

However, the conventional automotive heater uses a Positive temperature coefficient thermistor (thermistor), and thus has low thermal efficiency.

In addition, the heater for a vehicle generally has insufficient durability, and structural damage occurs due to vibration of the vehicle body during traveling or external force. Since such damage induces a failure of the heater system, a solution to this is also needed.

SUMMERY OF THE UTILITY MODEL

Technical problem

The present embodiment provides a heater capable of improving thermal efficiency and durability, and a heating system for a vehicle including the same.

Technical scheme

The heater according to the present embodiment includes: a casing having an inlet and an outlet arranged to face each other and through which a heat medium passes; a heat generation module disposed between the inlet and the outlet in the casing; and a power module disposed at one side of the case and electrically connected to the heat generating module, the heat generating module including a plurality of heat sinks and a plurality of heater cores alternately arranged with each other, the heater core including: a ceramic substrate portion including a first ceramic layer and a second ceramic layer disposed on the first ceramic layer; and a heating element disposed between the first ceramic layer and the second ceramic layer; and a heat diffusion plate disposed on either one of the first ceramic layer and the second ceramic layer.

The heat generating element includes: a first heat generating part extending from one side to the other side; a second heat generating portion extending from the predetermined point on the other side to one side again; and a third heat generating portion extending from a predetermined point on one side of the second heat generating portion to the other side, wherein the first, second, and third heat generating portions may be disposed to be spaced apart from each other.

The heat generating module may further include first and second spacers disposed at one side and the other side of the inside of the case, respectively.

The heater core further includes a covering portion that covers the ceramic substrate portion, the covering portion being formed to extend further toward one side and the other side than the ceramic substrate portion, one side of the covering portion being inserted into the first gasket, the other side of the covering portion being inserted into the second gasket, and the heater core being supported by the first gasket and the second gasket.

The heat generating module further includes a first electrode terminal disposed at one side and electrically connected to the heat generating element, the power module includes a first connection terminal coupled to the first electrode terminal, the first electrode terminal includes a first coupling member and a second coupling member facing each other in a direction in which a heat medium passes, the first coupling member extends to one side and has a shape curved so as to approach to and be separated from the second coupling member, the second coupling member extends to one side and has a shape curved so as to approach to and be separated from the first coupling member, and the first connection terminal is disposed between the first coupling member and the second coupling member and is capable of being coupled to the first electrode terminal.

The first thermal diffusion plate and the second thermal diffusion plate may be opposed to each other along a direction in which the heater cores are arranged.

The thermal expansion coefficients of the first thermal diffusion plate, the ceramic substrate section, and the second thermal diffusion plate may be the same as each other.

At least one of the first and second heat diffusion plates may include: a first thermal diffusion layer, a second thermal diffusion layer disposed on the first thermal diffusion layer, and a third thermal diffusion layer disposed on the second thermal diffusion layer.

The second thermal diffusion layer may include molybdenum.

The first thermal diffusion layer and the third thermal diffusion layer may include copper or aluminum.

A protrusion may be formed on a surface of at least one of the first and second heat diffusion plates.

The heat generating element may further include a heat conductor disposed between the first ceramic layer and the second ceramic layer and disposed at a side surface of the heat generating element.

The thermal conductivity of the thermal conductor may be higher than the thermal conductivities of the first ceramic layer and the second ceramic layer.

The thermal conductor may include at least one of aluminum nitride, silicon nitride, and boron nitride.

The first ceramic layer and the second ceramic layer may be bonded integrally at the edges.

The porosity of the ceramic substrate portion may be 3% or less.

A first electrode sheet and a second electrode sheet, which are disposed on the first ceramic layer or the second ceramic layer, and which are connected to a first end of the heat-generating element; the second electrode plate is connected with the second end of the heating element.

An embodiment of the utility model relates to a heating system for vehicle includes: a flow path for flowing air; an air supply part provided at one side of the flow path for introducing air from the outside; an exhaust part provided at the other side of the flow path for discharging air into a room of the vehicle; and a heater disposed between the air supply portion and the air discharge portion in the flow path, for heating air, the heater including: a casing having an inlet and an outlet arranged to face each other and through which air passes; a heat generation module disposed between the inlet and the outlet in the casing; and a power module disposed at one side of the case and electrically connected to the heat generating module, the heat generating module including a plurality of fins having a shape extending from one side to the other side and alternately arranged with each other and a plurality of heater cores, the heater core including: a ceramic substrate portion including a first ceramic layer and a second ceramic layer disposed on the first ceramic layer; and a heating element disposed between the first ceramic layer and the second ceramic layer; and a heat diffusion plate disposed on one of the first ceramic layer and the second ceramic layer.

The utility model discloses a heater core that an embodiment relates to includes: a first thermal diffusion plate; a first ceramic layer disposed on the first thermal diffusion plate; a heating element disposed on the first ceramic layer; a second ceramic layer disposed on the first ceramic layer; and a second thermal diffusion plate disposed on the second ceramic layer.

A heat conductor may be further included, the heat conductor being disposed on the first ceramic layer and on a side surface of the heat generating element.

Effect of the utility model

The present embodiment improves thermal efficiency using ceramic heaters in which heating elements are stacked in a direction in which a heating medium (air) passes. By freely stacking such heat generating elements according to design conditions, the heater size (size-up) can be increased without changing the cross-sectional area occupied by the heater on the instrument panel.

Further, the heat generating module of the present embodiment is coupled with the power module through the electrode terminals including the pair of bent coupling members. The shape of the coupling member improves the coupling force between the heat generating module and the power module, and improves the durability of the heater of this embodiment.

In addition, the present embodiment proposes design conditions for optimally adjusting the ratio of the cross-sectional area of the ceramic substrate to the cross-sectional area of the heat generating element, and the thicknesses of the heat sink and the heater core.

Further, a heating system for a vehicle including the heater of the present embodiment is provided.

Drawings

Fig. 1 is a perspective view showing a heater of the present embodiment.

Fig. 2 is a plan view showing the heat generating module of the present embodiment.

Fig. 3 is an exploded perspective view showing the heater rod of the present embodiment.

Fig. 4 is a sectional view showing the ceramic substrate, the first thermal diffusion plate, and the second thermal diffusion plate of the present embodiment.

Fig. 5 is a horizontal sectional view showing the ceramic substrate of the present embodiment.

Fig. 6 is an exploded perspective view showing the heater of the present embodiment.

Fig. 7 is a conceptual diagram illustrating a coupling shape of the first electrode terminal and the second connection terminal of the present embodiment.

Fig. 8 is a block diagram showing a heating system for a vehicle of the present embodiment.

Fig. 9 is a sectional view showing a ceramic substrate according to another embodiment of the present invention.

Fig. 10a to 10d are exploded views showing a ceramic substrate according to another embodiment of the present invention.

Fig. 11a to 11c show various shapes of the heating element disposed on the ceramic substrate plate according to another embodiment of the present invention.

Fig. 12 is a sectional view showing a ceramic substrate according to still another embodiment of the present invention.

Fig. 13 is a sectional view showing a ceramic substrate according to still another embodiment of the present invention.

Fig. 14 is a flowchart illustrating a method of manufacturing a ceramic substrate according to the embodiment of fig. 9 to 13.

Fig. 15a is a sectional view showing a ceramic substrate fabricated according to a comparative example, and fig. 15b is a sectional view showing a ceramic substrate fabricated according to an example.

Fig. 16 shows an example of a ceramic substrate having a cylindrical shape.

Fig. 17 is a sectional view showing a thermal diffusion plate and a ceramic substrate according to an embodiment of the present invention.

Fig. 18a and 18b show a heat diffusion plate according to an embodiment of the present invention.

Fig. 19 is a view showing a heater according to another embodiment of the present invention.

Detailed Description

Some embodiments of the invention are described below with reference to the accompanying exemplary drawings. In the reference numerals describing the components in the respective drawings, the same reference numerals are used as far as possible even if the same components are denoted by different drawings. In describing the embodiments of the present invention, detailed descriptions of known configurations and functions will be omitted when it is considered that the detailed descriptions may hinder understanding of the present invention.

In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), and the like may be used. Such terms are used only to distinguish one component from another component, and are not intended to limit the nature, order, or sequence of the corresponding components. When a certain component is described as being "connected to", "coupled to", or "in contact with" another component, it is to be understood that the certain component may be directly connected to, coupled to, or in contact with the other component, or that other components may be "connected to", "coupled to", or "in contact with" the certain component and the other component.

The "front-rear direction" used hereinafter is the y-axis direction indicated in the drawings. At this time, "front" is an arrow direction of the y-axis, and "up-down direction" is a z-axis direction marked in the drawing. At this time, "lower side" is an arrow direction of the z-axis. And, the "left-right direction" is the x-axis direction marked in the drawing. At this time, "left side" is the arrow direction of the x-axis.

Hereinafter, the heater structure of the present embodiment will be described with reference to the drawings. Fig. 1 is a perspective view showing a heater of the present embodiment, fig. 2 is a plan view showing a heat generating module of the present embodiment, fig. 3 is an exploded perspective view showing a heater rod of the present embodiment, fig. 4 is a sectional view showing a ceramic substrate, a first thermal diffusion plate, and a second thermal diffusion plate of the present embodiment, fig. 6 is an exploded perspective view showing a heater of the present embodiment, and fig. 7 is a conceptual view showing a coupling shape of a first electrode terminal and a second connection terminal of the present embodiment. The heater 1000 of the present embodiment may include a case 100, a heat generating module 200, and a power module 300.

The case 100 may be an exterior member of the heater 1000. The inside of the case 100 may receive the heat generating module 200. The lower side of the case 100 may be provided with a power module 300. The case 100 may be supported by the power module 300. The housing 100 and the power module 300 may be insertedly combined. At this time, the lower portion of the case 100 is received in a case guide hole 310 of the power module 300 described later, and the case 100 and the power module 300 can be inserted and coupled. At this time, lower portions of the left and right side surfaces in the front-rear direction of the casing 100 can be accommodated in the casing guide holes 310.

The housing 100 may be a hollow block shape or a cage (cage) shape. The housing 100 may include a housing front surface 110 and a housing rear surface 120. At this time, the case front surface 110 may be a surface located in front of the case 100. Also, the case rear surface 120 may be a surface located at the rear of the case 100. The housing front surface 110 may be formed with a plurality of inflow ports. In this case, the plurality of inlets may be aligned in a row in the vertical and horizontal directions. The housing rear surface 120 may be formed with a plurality of discharge ports. At this time, the plurality of discharge ports may be aligned in a row along the up-down and left-right directions and formed to correspond to the inflow ports of the case front surface 110. The external heat medium may flow into the case 100 through the inlet port of the case front surface 110, be heated by the heat generating module 200 inside the case 100, and be discharged to the outside of the case 100 through the outlet port of the case rear surface 120. That is, the external heating medium (air) can pass through the casing 100 from the front to the rear.

The heat generating module 200 may be disposed inside the case 100. The heat generating module 200 may be electrically connected with the power module 300. The heat generating module 200 may include a heat sink 210, a heater core 220, a first gasket 230, and a second gasket 240. The plurality of heat sinks 210 and the heater core 220 extending from the lower side to the upper side may be alternately arranged with each other in the heat generating module 200. At this time, the arrangement direction of the heat sink 210 and the heater core 220 may be a left-right direction. Also, the upper side of the heater core 220 may be supported by the first spacer 230. Also, the lower side of the heater core 220 may be supported by the second spacer 240.

The heat sink 210 may be disposed inside the case 100. The heat sink 210 may be plural. The plurality of fins 210 may be disposed apart from each other in the left-right direction. A plurality of heater cores 220 may be disposed between the plurality of heat sinks 210. Also, the heat sink 210 and the heater core 220 may be adjacent. At this time, the left and right side portions of the heat sink 210 and the left and right side surfaces of the heater core 220 may be bonded. The adhesive of the heat sink 210 and the heater core 220 may use silver paste or thermally conductive silicone. As a result, heat generated in the heater core 220 can be transferred to the heat sink 210.

The heat sink 210 may have a shape extending from a lower side to an upper side. The heat sink 210 may be a louvered fin (Louver fin). The shape of the heat radiating fins 210 may be a wave shape that vibrates left and right in a wave that goes from the lower side to the upper side. That is, the heat sink 210 may have a shape in which plates inclined in the left-right direction and the reverse direction are stacked in the up-down direction. Therefore, the heat sink 210 may be formed with a plurality of gaps along the front-rear direction through which the heat medium (air) can pass. The heat sink 210 increases the heat conduction area for transferring the heat generated from the heater core 220 to the heating medium (air), thereby increasing the thermal efficiency.

The heater core 220 may be disposed inside the housing 100 as a heat generating portion. The heater core 220 may be electrically connected to the power module 300. The heater core 220 may be plural. The heater 1000 of the present embodiment uses 6 heater cores 220. However, the number of the heater cores 220 may not be limited thereto. The plurality of heater cores 220 may be disposed apart from each other in the left-right direction. A plurality of fins 210 may be disposed between the plurality of heater cores 220. Thus, the heater core 220 and the heat sink 210 may be adjacent. At this time, the left and right side surfaces of the heater core 220 may be adjacent to the left and right side portions of the heat sink 210. As the adhesive for the heater core 220 and the heat sink 210, thermally conductive silicone can be used. As a result, heat generated from the heater core 220 can be transferred to the heat sink 210.

The heater core 220 may be shaped to extend from a lower side to an upper side. The heater core 220 may include a ceramic substrate portion 221, a heat generating element 222, a first heat diffusion plate 223, a second heat diffusion plate 224, a first electrode terminal 225, a second electrode terminal 226, and a covering portion 227.

The ceramic substrate 221 may house the heating element 222 as a ceramic material. The heater core 220 of the present embodiment is lighter than a ptc-thermistor by ceramic covering the heating element 222, may not contain heavy metals such as lead (Pb), may emit far infrared rays, and the like, and may have high thermal conductivity. A first thermal diffusion plate 223 may be disposed on the left side surface of the ceramic substrate portion 221. A second thermal diffusion plate 224 may be disposed on the right side of the ceramic substrate portion 221. The ceramic substrate portion 221 can be housed in the covering portion 227 together with the first thermal diffusion plate 223 and the second thermal diffusion plate 224. The ceramic substrate part 221 may include a first ceramic substrate 221a and a second ceramic substrate 221 b. The ceramic substrate portion 221 may include a left side surface and a right side surface opposite thereto. At this time, the left side surface of the ceramic substrate portion 221 may be referred to as a "first surface". Also, the right side surface of the ceramic substrate portion 221 may be referred to as "second surface".

The first ceramic substrate 221a may be disposed on the left side, and the second ceramic substrate 221b may be disposed on the right side. The right side of the first ceramic substrate 221a is configured with the heating element 222 by printing (printing), patterning (patterning), deposition, and the like. After the heating element 222 is disposed on the first ceramic substrate 221a, the first ceramic substrate 221a and the second ceramic substrate 221b are sintered 1500 to form the integrated ceramic substrate 221. At this time, the right side surface of the first ceramic substrate 221a and the left side surface of the second socket substrate 221b may be aligned (aligned) and sintered.

The first electrode terminal 225 and the second electrode terminal 226 may be disposed and bonded on a left side surface of the first ceramic substrate 221a, a right side surface of the second ceramic substrate 221b, or between the first ceramic substrate 221a and the second ceramic substrate 221 b. In this case, the first electrode terminal 225 and the second electrode terminal 226 may be disposed at the lower ends of the first ceramic substrate 221a and the second ceramic substrate 221b and bonded to each other. The first electrode terminal 225 and the second electrode terminal 226 may be electrically connected to the heating element 222. When the first electrode terminal 225 and the second electrode terminal 226 are present on the outer side surfaces of the first ceramic substrate 221a and the second ceramic substrate 221b, additional lead lines for electrical connection with the first electrode terminal 225 and the second electrode terminal 226 may extend from the heating element 222.

The heating element 222 may be disposed inside the ceramic substrate 221. The heat generating element 222 may be disposed on the right side surface of the first ceramic substrate 221a by printing, patterning, deposition, or the like. The heating element 222 may be a resistance wire (line). The heating element 222 may be a resistor such as tungsten (W), molybdenum (Mo), or the like. Therefore, the heat generating element 222 can generate heat when the electric current flows. The heating elements 222 extend from the lower side to the upper side, and then are folded (bent or bent) and extend from the upper side to the lower side, and this repetition allows the stacking arrangement along the front-rear direction (the direction in which the heating medium passes). That is, the heating element 222 includes: a first heat generating part extending from one side to the other side; and a second heat generating portion extending from a predetermined point on the other side to one side again; and a third heat generating portion extending from a predetermined point on one side of the second heat generating portion to the other side, wherein the first, second, and third heat generating portions may be disposed to be spaced apart from each other. Therefore, the heat medium (air) may sequentially pass through the heat generating portion of the heater core 220 and be heated while passing through the heat generating module 200. That is, the contact area between the heat medium (air) and the heat generated from the heater core 220 can be increased according to the arrangement shape of the heating elements 222.

Both end portions (start and end points of a line) of the heating element 222 may be electrically connected to the first electrode terminal 225 and the second electrode terminal 226, respectively. The forward end of the heating element 222 may be electrically connected to the first electrode terminal 225. The end of the heating element 222 located at the rear among both ends may be electrically connected to the second electrode terminal 226. The first electrode terminal 225 and the second electrode terminal 226 can be supplied with power from a power module 300 described later. Therefore, a current can flow in the heating element 22. As a result, the heating element 222 can generate heat. At this time, the intensity, direction, and wavelength of the current supplied to the heating element 222 may be controlled by the power module 300.

The first thermal diffusion plate 223 and the second thermal diffusion plate 224 may be bonded to and disposed on the left and right side surfaces of the ceramic substrate portion 221. The first heat diffusion plate 223 may be bonded and disposed on the left side surface of the first ceramic substrate 221 a. The second heat diffusion plate 224 may be bonded and disposed on the right side of the second ceramic substrate 221 b. In the adhesion of the first and second

heat diffusion plates

223 and 224 and the first and second

ceramic substrates

221a and 221b, an Active metal layer (Active metal) may be used. The active metal layer may be an active metal alloy of the titanium family. The active metal layer may be disposed on the left side surface of the first ceramic substrate 221a and the right side surface of the second ceramic substrate 221 b. The active metal layer and the ceramic may react to form an oxide or a nitride. As a result, the first and second

thermal diffusion plates

223 and 224 and the first and second

ceramic substrates

221a and 221b are arranged and bonded to each other.

The first thermal diffusion plate 223 may include a first thermal diffusion layer 223a, a second thermal diffusion layer 223b, and a third thermal diffusion layer 223c laminated in this order from the first ceramic substrate 221a to the outside (left side). The adhesion of the first heat diffusion layer 223a, the second heat diffusion layer 223b, and the third heat diffusion layer 223c may be formed by heat pressing (hot pressing). The second heat diffusion plate 223 may include a fourth heat diffusion layer 224a, a fifth heat diffusion layer 224b, and a sixth heat diffusion layer 224c laminated in this order from the second ceramic substrate 221b to the outer side (right side). The adhesion of the fourth heat diffusion layer 224a, the fifth heat diffusion layer 224b, and the sixth heat diffusion layer 224c may be formed by heat pressing (hot pressing).

The material of the first, third, fourth, and sixth

thermal diffusion layers

223a, 223c, 224a, and 224c may include copper (Cu) or aluminum (Al). The second and fifth heat diffusion layers 223b and 224b may be made of molybdenum (Mo). Therefore, the first heat diffusion layer 223a, the second heat diffusion layer 223b, the third heat diffusion layer 223c, the fourth heat diffusion layer 224a, the fifth heat diffusion layer 224b, and the sixth heat diffusion layer 224c have high thermal conductivity, and heat generated from the ceramic substrate portion 221 can be diffused and uniformly distributed. Further, by adjusting the thicknesses (left-right direction) of the second heat diffusion layer 223b and the fourth heat diffusion layer 224b, the thermal expansion coefficient can be adjusted. The thermal expansion coefficients of the first thermal diffusion plate 223 and the second thermal diffusion plate 224 reflect the thermal expansion coefficient of the ceramic substrate 221, and can be determined according to the set conditions. That is, the thermal expansion coefficients of the first and second

thermal diffusion plates

223, 224 may have values similar to the thermal expansion coefficient of the ceramic substrate portion 221. Also, the thermal expansion coefficients of the first and second

thermal diffusion plates

223, 224 may have values similar to the thermal expansion coefficient of the ceramic substrate portion 221. For example, when the thermal expansion coefficient of the ceramic substrate portion 221 is 7 ppm/the thermal expansion coefficients of the first thermal diffusion plate 223 and the second thermal diffusion plate 224 may be 7 ppm/respectively. At this time, the thermal conductivity of the thermal diffusion plate may be 230W/mK. Alternatively, the thermal expansion coefficients of the first thermal diffusion plate 223 and the second thermal diffusion plate 224 may be 0.8 to 1.2 times the thermal expansion coefficient of the ceramic substrate portion 221. As a result, the ceramic substrate 221 can be reinforced, and the ceramic substrate 221 has good thermal conductivity but is brittle and easily damaged by thermal shock.

The first and second

heat diffusion plates

223 and 224 may have additional structures that are changed according to design requirements. That is, any one of the first and second

heat diffusion plates

223 and 224 may be omitted in the heater core 220. The first and second

heat diffusion plates

223 and 224 may be omitted from the heater core 220.

The first electrode terminal 225 and the second electrode terminal 226 may be disposed at a lower portion of the heater core 220. The first electrode terminal 225 and the second electrode terminal 226 may be disposed below the ceramic substrate portion 221. The first electrode terminal 225 may be disposed at a lower front portion of the ceramic substrate 221. The second electrode terminal 226 may be disposed at a lower rear portion of the ceramic substrate portion 221. The first electrode terminal 225 and the second electrode terminal 226 may be electrically connected to the heating element 222. The first electrode terminal 225 and the second electrode terminal 226 may be electrically connected to the power module 300. The first electrode terminal 225 is electrically connected to a first connection terminal 330 of the power module 300, which will be described later. The second electrode terminal 226 may be electrically connected to a second connection terminal 340 of the power module 300, which will be described later.

The first electrode terminal 225 may include a first connection part 225a, a first electrode terminal body 225b, a first coupling part 225c, and a second coupling part 225 d. The first connection part 225a, the first electrode terminal body 225b, the first coupling part 225c, and the second coupling part 225d may be integrally formed. The first connection portion 225a may be a plate shape having a surface formed in the left-right direction. The first connection portion 225a may be bonded and disposed in front of a lower portion of the left side surface of the first ceramic substrate 221 a. The first connection member 225a may be bonded to and disposed in front of a lower portion of the right side surface of the first ceramic substrate 221 a. At this time, the first connection portion 225a may be disposed between the first ceramic substrate 221a and the second ceramic substrate 221 b. The first connection portion 225a may be bonded to and disposed in front of a lower portion of the right side surface of the second ceramic substrate 221 b. The first connection portion 225a may be electrically connected to a front end of both ends (start and end points of the heat generating line) of the heat generating element 222. The first electrode terminal body 225b has a block shape, and a first connection part 225a may be connected to an upper portion thereof. A first coupling part 225c may be connected to a lower front of the first electrode terminal body 225 b. A second coupling member 225d may be connected to a lower front of the first electrode terminal body 225 b. The first coupling part 225c may be a plate shape bent or bent (curved) toward the rear. The second coupling part 225d may be a plate shape bent or bent (curved) toward the front. The first coupling part 225c and the second coupling part 225d may be opposite to each other in the front-rear direction. Therefore, the first coupling part 225c may be bent or curved so as to approach and separate from the second coupling part 225d toward the lower side, and the second coupling part 225d may be bent or curved so as to approach and separate from the first coupling part 225c toward the lower side. A first connection terminal 330, which will be described later, may be inserted between the first coupling member 225c and the second coupling member 225 d. As a result, the first electrode terminal 225 and the power module 300 may be electrically connected.

The second electrode terminal 226 may include a second connection part 226a, a second electrode terminal body 226b, a third coupling part 226c, and a fourth coupling part 226 d. The second connection part 226a, the second electrode terminal body 226b, the third coupling member 226c, and the fourth coupling member 226d may be integrally formed. The second connection portion 226a may be a plate shape having a surface formed in the left-right direction. The second connection portion 226a may be bonded to and disposed behind a lower portion of the left side surface of the first ceramic substrate 221 a. The second connection portion 226a may be bonded to and disposed behind a lower portion of the right side surface of the first ceramic substrate 221 a. At this time, the second connection portion 226a may be disposed between the first and second

ceramic substrates

221a and 221 b. The second connection portion 226a may be bonded to and disposed in front of a lower portion of the right side surface of the second ceramic substrate 221 b. The second connection portion 226a may be electrically connected to a rear end of both ends (a start point and an end point of the heat generating line) of the heat generating element 222. The second electrode terminal body 226b has a block shape, and the second connection part 226a may be connected to an upper portion thereof. A third coupling member 226c may be connected to a lower front of the second electrode terminal body 226 b. A fourth coupling member 226d may be connected to a lower rear of the second electrode terminal body 225 b. The third coupling part 226c may be a plate shape bent or bent (curved) toward the rear. The fourth coupling part 226d may be a plate shape bent or bent toward the front. The third coupling member 226c and the fourth coupling member 226d may face each other in the front-rear direction. Therefore, the third coupling member 226c may be curved or bent so as to approach and separate from the fourth coupling member 226d toward the lower side, and the fourth coupling member 226d may be curved or bent so as to approach and separate from the third coupling member 226c toward the lower side. A second connection terminal 340, which will be described later, may be inserted between the third coupling member 226c and the fourth coupling member 226 d. As a result, the second electrode terminal 226 and the power module 300 can be electrically connected. The first electrode terminal 225 and the second electrode terminal 226 can supply current from the power module 300 to the heat generating element 222. As a result, the heating element 222 can generate heat.

The material of the covering portion 227 may include aluminum (Al). The covering portion 227 may be a hollow rod (bar) or a rod shape extending in the vertical direction as an exterior member of the heater rod 220. The covering portion 227 may be formed with a covering hole 227a penetrating in the vertical direction. The ceramic substrate portion 221, the heat generating element 222, the first thermal diffusion plate 223, and the second thermal diffusion plate 224 can be housed inside the cover 227. In this case, the inner surface of the cover hole 227a may be adjacent to the front and rear surfaces of the ceramic substrate 221, the left surface of the first heat diffusion plate 223, and the right surface of the second heat diffusion plate 224. The first and second

heat diffusion plates

223 and 224 may be omitted. In this case, the inner surface of the cover hole 227a may be adjacent to the four front, rear, right, and left surfaces of the ceramic substrate 221. In bonding the cover 227 and the ceramic substrate portion 221, the first heat diffusion plate 223, and the second heat diffusion plate 224, thermally conductive silicone may be used. The left side surface of the covering portion 227 may be in contact with the right side portion of the heat sink located on the left side of the covering portion 227. The right side surface of the covering portion 227 may be in contact with the left side portion of the heat sink located on the right side of the covering portion 227. In bonding the covering portion 227 and the heat sink 227, thermally conductive silicone may be used. The cover 227 can protect the ceramic substrate 221 and the first and second

heat diffusion plates

223 and 224. The covering portion 227 has high thermal conductivity and can function to diffuse heat generated from the heat generating element 222 of the ceramic substrate portion 221. Further, the covering portion 227 has good adhesiveness, and the heater rod 220 and the heat sink 210 can be easily adhered to each other.

The upper side of the cover 227 may be formed to extend upward beyond the upper sides of the ceramic substrate portion 221, the first thermal diffusion plate 223, and the second thermal diffusion plate 224. The lower side of the cover 227 may be formed to extend downward beyond the lower sides of the ceramic substrate portion 221, the first thermal diffusion plate 223, and the second thermal diffusion plate 224. That is, the vertical length of the cover 227 may be longer than the vertical lengths of the ceramic substrate 221, the first heat diffusion plate 223, and the second heat diffusion plate 224. The upper portion (upper side) of the covering portion 227 can be inserted into a first receiving hole 231 of a first gasket 230 described later. At this time, only the upper portion of the cover 227 extending beyond the ceramic substrate portion 221, the first heat diffusion plate 223, and the second heat diffusion plate 224 can be inserted into the first accommodation portion 231. Therefore, the first gasket 230 does not directly receive heat transfer from the ceramic base plate portion 221, the first thermal diffusion plate 223, and the second thermal diffusion plate 224. As a result, the first gasket 230 can be prevented from being damaged by heat. The lower portion (lower side) of the covering portion 227 can be inserted into a second receiving portion 241 of a second gasket 240 described later. At this time, the cover 227 can be inserted into the first receiving hole 231 only if it exceeds the lower portion of the ceramic substrate portion 221, the first heat diffusion plate 223, and the second heat diffusion plate 224. Therefore, the second gasket 240 does not directly receive heat transfer from the ceramic base plate portion 221, the first thermal diffusion plate 223, and the second thermal diffusion plate 224. As a result, the second gasket 240 can be prevented from being damaged by heat. However, at this time, the first electrode terminal 225 and the second electrode terminal 226 of the heater core 220 may penetrate through the lower side of the second receiving portion and be exposed downward. As a result, the first electrode terminal 225 and the second electrode terminal 226 can be electrically connected to the power module 300 located below the heater core 220. As described above, the heater core 220 is supported by the covering portions 227 inserted into the first and

second gasket pieces

230 and 240. Thus, the cover 227 may also perform the function of a support member. On the other hand, the covering portion 227 may not be an essential component of the heater core 220. That is, the cover 227 may be omitted according to design requirements. At this time, the upper and lower portions of the ceramic base plate portion 221 may be inserted into the first and

second gaskets

230 and 240. Also, the ceramic base plate portion 221 and the upper and lower portions of the first and second

heat diffusion plates

223 and 240 may be inserted into the first and

second gaskets

230 and 240.

The first gasket 230 may be located at an upper side of the inside of the case 100. The second gasket 240 may be located at a lower side of the inside of the case 100. The case 100 has a hollow box shape, and the first and

second gaskets

230 and 240 may be respectively coupled and fixed by insertion, adhesion, or the like at upper and lower portions of the case 100.

The first and

second spacers

230 and 240 may have a plurality of first and second receiving

portions

231 and 241 spaced apart from each other in the left-right direction. The first gasket 230 may have a plurality of first receiving parts 231 protruding upward. The second gasket 240 may be formed with a plurality of second receiving portions 241 protruding downward. The plurality of first receiving parts 231 and the second receiving parts 241 may be formed in one-to-one correspondence with the plurality of heater cores 220. Accordingly, the upper portion of the heater core 220 may be inserted into the corresponding first receiving portion 231. And, the lower portion of the heater core may be inserted into the corresponding second receiving portion 241. However, at this time, the first electrode terminal 225 and the second electrode terminal 226 of the heater core 220 may penetrate the second receiving portion 241 to the lower side and extend downward. Accordingly, the first and

second electrode terminals

225 and 226 may be exposed to the lower side and electrically connected to the power module 300 disposed at the lower portion of the heater core 220. As described above, the heater core 220 has a pillar shape having upper and lower portions as fixed ends, and can be safely fixed and built in the case 100.

The power module 300 may be disposed at a lower portion of the case 100. The power module 300 may be combined with the case 100. The power module 300 may be electrically connected with the heat generating module 200. The power module 300 may control the intensity, direction, wavelength, etc. of the current supplied to the heat generating module 200. The power module 300 may be connected to an external power supply device through a conductive wire (not shown) to be charged or supplied with power. The power module 300 has a block shape and may include a housing guide 310, a connection terminal 320, a first connection terminal 330, and a second connection terminal 340.

The case guide 310 may be formed at a central portion of the upper surface of the power module 300. The housing guide part 310 has a quadrangular groove or hole shape, and the inside thereof may be formed with a connection terminal part 320. At this time, a groove or a hole corresponding to the lower portion of the housing 100 may be formed by a quadrangular groove or a hole of the housing guide portion 310 and a side wall of the connection terminal portion 320. Accordingly, the housing 100 may be guided in the form of being inserted into the housing guide 310. As a result, the power module 300 can be aligned and disposed at the lower portion of the housing 100. At this time, the lower portion of the case 100 may be combined with the power module 300. The coupling of the case 100 and the power module 300 may be performed in various manners such as a machine (screw, etc.), a structure (insertion, etc.), an adhesive (bonding agent), and the like.

The connection terminal part 320 may be a bracket formed at the inner center portion of the case guide part 310. A connection terminal groove 321 may be formed at the center of the connection terminal part 320. The bottom surface of the connection terminal groove 321 may be aligned with a plurality of first and

second connection terminals

330 and 340.

There may be a plurality of the first connection terminals 330 and the second connection terminals 340. The first connection terminal 330 and the second connection terminal 340 may be spaced apart from each other in the front-rear direction. In this case, the first connection terminal 330 may be arranged in the front. Also, the second connection terminal 340 may be disposed at the rear. The first and

second connection terminals

330 and 340 may have a plate shape having front and rear surfaces. The plurality of first and

second connection terminals

330 and 340 may correspond one-to-one to the plurality of heater cores 220. The plurality of first and

second connection terminals

330 and 340 may correspond to and face the plurality of first and

second electrode terminals

225 and 226, respectively. Accordingly, when the case 100 and the power module 300 are combined, the first connection terminal 330 may be combined with the first electrode terminal 225 corresponding thereto. Also, the second connection terminal 340 may be coupled with the second electrode terminal 226 corresponding thereto. At this time, the first connection terminal 330 may be inserted between the first and

second coupling parts

225c and 225d of the first electrode terminal 225. Accordingly, the first connection terminal 330 and the first electrode terminal 225 may be insert-bonded or assembled and electrically connected. Also, the second connection terminal 340 may be inserted between the third coupling part 226c and the fourth coupling part 226d of the second electrode terminal 226. Accordingly, the second connection terminal 340 and the second electrode terminal 226 may be insert-bonded or assembled and electrically connected.

Hereinafter, the vehicle heating system according to the present embodiment will be described with reference to the drawings. Fig. 8 is a block diagram showing a heating system for a vehicle of the present embodiment.

The vehicle heating system 2000 of the present embodiment can be used for various vehicles. Here, the vehicle is not limited to a land-based vehicle such as an automobile, and may include a ship, an airplane, and the like. However, a case where the vehicle heating system 2000 of the present embodiment is used in an automobile will be described below as an example.

The vehicle heating system 2000 may be housed in an engine room of an automobile. The vehicle heating system may include a gas supply portion 1400, a flow path 1500, an exhaust portion 1600, and a heater 1000.

The air supply unit may use various air supply devices such as a blower and a pump. The air supply unit 1400 can move a heat medium (air in the engine room) outside the vehicle heating system 2000 to the inside of the flow path 1500 described later and move the heat medium along the flow path 1500.

The flow path 1500 may be a passage through which a heating medium (air) flows. The air supply part 1400 may be disposed at one side of the flow path 1500, and the air discharge part 1600 may be disposed at the other side of the flow path 1500. The flow path 1500 may connect an engine room and an interior of an automobile in an air-conditioning manner.

As the exhaust portion 1600, an openable and closable blade (blade) or the like may be used. The exhaust portion 1600 may be disposed on the other side of the flow path 1500. The exhaust 1600 may communicate with the interior of the automobile. Therefore, the heat medium (air) moving along the flow path 1500 can flow into the vehicle interior through the exhaust part 1600.

As the heater 1000 of the vehicle heating system 2000, the heater 1000 of the present embodiment can be used. The explanation of the same technical idea is omitted below. The heater 1000 may be disposed in the middle of the flow path 1500 in a partition shape. At this time, the front and rear of the heater 1000 may be the same or similar direction as the front and rear of the automobile. The cold heat medium (air) supplied to the engine room of the flow path 1500 by the air supply unit 1400 is heated while passing from the front to the rear of the heater 1000, and then flows along the flow path 1500 again to be supplied to the room through the exhaust unit 1600.

Hereinafter, the effect of the heater 1000 of the present embodiment will be described with reference to the drawings. Fig. 2 is a plan view showing a heat generating module of the present embodiment, fig. 5 is a horizontal sectional view showing a ceramic substrate of the present embodiment, and fig. 7 is a conceptual view showing a shape of coupling a first electrode terminal and a second connection terminal of the present embodiment.

Unlike the conventional ptc thermistor, the heater 1000 of the present embodiment can generate heat transfer by the resistor (heat generating element 222) covered with the ceramic substrate portion 221. The thermal efficiency can be improved by utilizing the high heat generation amount of the resistor (the heating element 222). Further, covering the resistor (heating element 222) with a ceramic having high thermal conductivity can maintain thermal efficiency while achieving thermal stability. Further, the first thermal diffusion plate 223 and the second thermal diffusion plate 224 disposed adjacent to the ceramic substrate 221 can uniformly distribute heat by diffusing heat of the main heat generating portion (the portion where the heat generating element 222 is disposed) of the ceramic substrate 221. Also, the ceramic substrate portion 221 including a brittle material may be easily damaged by heating. In order to solve this problem, the ceramic substrate portion 221 is provided with the first thermal diffusion plate 223 and the second thermal diffusion plate 224 having the same or similar thermal expansion coefficient as the ceramic substrate portion 221, and the ceramic substrate portion 221 can be thermally reinforced. Further, the heater 1000 of the present embodiment may not contain a heavy metal material such as lead (Pb), and may be lightweight.

The heater 1000 of the present embodiment has high durability. This is because the heater core 220 has a pillar structure having both ends fixed by the first and

second spacers

230 and 240. Further, as shown in fig. 7, the first coupling member 225c disposed at the front of the first electrode terminal 225 may have a shape bent or bent toward the rear. The second coupling member 225d disposed at the rear of the first electrode terminal 225 may be bent or bent toward the front. The first connection terminal 330 may be inserted between the first coupling part 225c and the second coupling part 225 d. As a result, the first connection terminal 330 is inserted into the narrowest portion between the first coupling member 225c and the second coupling member 225d, and can be firmly fixed. The first coupling member 225c and the second coupling member 225d are configured to resist front-rear vibration. This is because even if the first connection terminal 330 is separated from the narrowest portion between the first coupling member 225c and the second coupling member 225d, the first connection terminal can be easily positioned to the narrowest portion by the bent or bent structure of the first coupling member 225c and the second coupling member 225 d. Further, when the lower portions of the first and

second coupling members

225c and 225d are supported by the bottom surfaces of the connection terminal portions 320, the vibration in the front and rear directions can be more effectively coped with.

The heater 1000 of the present embodiment, which is preferably designed, will be described below with reference to fig. 5 and 7. The MAF (mass air flow) of the heater 1000 of the present embodiment should be designed to be 300 kg/h. And the room of the appropriate vehicle should be brought to the appropriate set temperature at the appropriate time. In the heat generating module 200, the size of the heater core 220 (excluding the case 227) may be 180 × 15 × 1.3 (mm, in the order of vertical direction, front-rear direction, and left-right direction). The electric power supplied to the heating element 222 in a general heavy-duty car is 7kW, and calculated based on this, the ratio of the sectional areas of the ceramic substrate portion 221 (ceramic) and the heating element (tungsten) 222, which are located at the center of the heater core 220 and in the sectional area perpendicular and in the direction in which the heater core 220 extends, may be 180:1 to 190: 1. When it is less than this range, the room cannot be brought to an appropriate temperature in an appropriate period of time. If the amount is larger than this range, the amount of heat generation is too large, and the heat generation is thermally unstable and may overheat, which is not preferable. (refer to fig. 7) in the heater core 220 according to the embodiment of the present invention, the heating elements 222 are stacked in a direction (front-rear direction) in which the heating medium (air) passes, and thus the stacking size of the heating elements 222 can be adjusted, thereby adjusting the amount of heat generation of the heater core 220 according to design requirements. Further, even if the size of the heater element 222 is increased, the length of the heater core 220 in the front-rear direction is simply increased, and the length in the left-right direction is not increased. Therefore, even if the front cross-sectional area of the heater 1000 is limited, the amount of heat generation can be freely adjusted.

The length of the single heat sink 210 and heater core 220 in the direction in which the heat sink 210 and heater core 220 are arranged (left-right direction) (P in fig. 2, excluding the covering portion 227) may be 8mm or more and 17mm or less. If the covering portion 227 is added, the length (P in fig. 2) of the heat sink 210 and the heater core 220 in the left-right direction may be 10mm or more and 19mm or less. Since the length of the heater core 220 (excluding the covering portion 227) in the left-right direction is set to about 13mm, it can be regarded as a condition of the heat sink 210 in the left-right direction. If less than this, MAF (mass air flow) of the heater 1000 is less than 300kg/h, which is not preferable. If the temperature is higher than this, the temperature cannot be appropriately reached within an appropriate time, which is not preferable.

On the other hand, according to the embodiment of the present invention, the side surface of the heating element may be further provided with a heat conductor.

Fig. 9 is a sectional view of a ceramic substrate according to another embodiment of the present invention, fig. 10a to 10d are exploded views showing the ceramic substrate according to another embodiment of the present invention, fig. 11a to 11c are sectional views showing various shapes of heating elements disposed on the ceramic substrate according to another embodiment of the present invention, fig. 12 is a sectional view showing the ceramic substrate according to still another embodiment of the present invention, and fig. 13 is a sectional view showing the ceramic substrate according to still another embodiment of the present invention.

Referring to fig. 9 to 10d, the ceramic substrate portion 221 includes a first ceramic layer 400 and a second ceramic layer 430 disposed on the first ceramic layer, and a heating element 410 and a heat conductor 420 are disposed between the first ceramic layer 400 and the second ceramic layer. The first ceramic layer 400 and the second ceramic layer 430 may correspond to the

ceramic substrate portions

221a and 221b of fig. 1 to 8, and the heating element 410 may correspond to the heating element 222 of fig. 1 to 8.

The first ceramic layer 400 and the second ceramic layer 430 may include aluminum. Alternatively, the first ceramic layer 400 and the second ceramic layer 430 may further include at least one of aluminum nitride (AIN), silicon nitride (SiN), and Boron Nitride (BN). Alternatively, the first and second

ceramic layers

400 and 430 may include glass frit, for example, selected from calcium oxide (CaO), manganese oxide (MgO), and sodium oxide (Na)₂O), silicon oxide (SiO)₂) And titanium oxide (TiO)₂) Any one of them or a mixture thereof. In this case, the first and second

ceramic layers

400 and 430 may further include metal particles, for example, copper (Cu) or silver (Ag) particles. In this way, when the first ceramic layer 400 and the second ceramic layer 430 further include copper or silver dispersed in glass frit, the thermal shock resistance can be achieved and the crack generation problem can be minimized because the difference in thermal expansion coefficient between the heat generating element 410 and the heat generating element has high thermal conductivity. In this case, the particle size of the glass frit and the particle size of the metal particles may be 1 to 10 μm, respectively, and the metal particles may be included in an amount of 1 to 20 wt% with respect to the first ceramic layer 400 and the second ceramic layer 430.

The thicknesses of the first ceramic layer 400 and the second ceramic layer 430 may be 0.5 to 2mm, respectively.

The heat generating element 410 is disposed on the first ceramic layer 400, and generates heat when current flows. The heat generating element 410 may include any one selected from tungsten (W), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), ITO (Indium Tin Oxide), and barium titanate (BaTiO), or a mixture thereof. As shown in fig. 11a to 11c, the heat generating element 410 may be printed, patterned, coated, or deposited in various shapes on the first ceramic layer 400. For example, the heat generating element 410 may be repeatedly patterned to extend in a first direction, then be folded back, and extend in a second direction opposite to the first direction, as shown in fig. 11a, may be formed in a zigzag shape, as shown in fig. 11b, or may be formed in a spiral shape, as shown in fig. 11 c. In this manner, the heat generating element 410 may include a plurality of heat generating patterns 410-1, 410-2 connected by a predetermined pattern, and the heat conductors 420 may be arranged in spaced areas between the plurality of heat generating patterns 410-1, 410-2. The wider the printing area of the heating element 410, the more the amount of heat generated by the ceramic substrate portion 221 can be increased. In this specification, the heat generating element 410 may be used in combination with a resistor, a heat generating pattern, a heat generating body, and the like.

The thermal conductor 420 is disposed on the first ceramic layer 400 and between the heat generating elements 410, and heat generated from the heat generating elements 410 can be transmitted to the outside of the ceramic substrate portion 221 through the thermal conductor 420. The heights of the heat generating element 410 and the heat conductor 420 may be 5 to 20 μm, respectively.

At this time, the thermal conductor 420 has higher thermal conductivity than the first ceramic layer 400 and the second ceramic layer 430. To this end, the thermal conductor 420 may include at least one of aluminum nitride, silicon nitride, and boron nitride. Also, at least a portion of the side surface of the heat conductor 420 and the side surface of the heat generating element 410 may contact each other. Thus, heat generated from the heat generating element 410 can be transmitted to the outside of the ceramic substrate 221 through the heat conductor 420. In this way, if the thermal conductor 420 is filled between the heat generating patterns 410-1, 410-2 constituting the heat generating element 410, it is possible to reduce the possibility of occurrence of voids due to a difference in height between the surface of the first ceramic layer 400 and the heat generating element 410 when bonding between the first ceramic layer 400 and the second ceramic layer 430. According to the embodiment of the present invention, the porosity of the ceramic substrate 221 can be reduced to 3% or less. Here, the porosity means a percentage of a pore area per unit area with respect to a cross section of the ceramic substrate portion 221. Thus, when the porosity of the ceramic substrate 221 is reduced to 3% or less, the thermal conductivity is improved, the strength is improved, and the possibility of crack generation is reduced.

The thermal conductor 420 may be disposed not only between the heat generating patterns 410-1 and 410-2 disposed on the first ceramic layer 400. And may be further disposed outside the heat generating element 410. In this case, the area of the thermal conductor 420 disposed on the first ceramic layer 400 may be 0.5 times or more the area of the heat generating element 410. When the area of the heat conductor 420 is less than 0.5 times the area of the heat generating element 410, the heat generated from the heat generating element 410 may have low thermal conductivity.

On the other hand, one end T1 of the heater element 410 may be connected to the first electrode tab 440, and the other end T2 of the heater element 410 may be connected to the second electrode tab 450. At least one of the first electrode sheet 440 and the second electrode sheet 450 may be disposed on at least one of the first ceramic layer 400 and the second ceramic layer 430.

For example, referring to fig. 10a and 10c, the first and

second electrode pads

440 and 450 are disposed on the first ceramic layer 400 and may be connected to one end T1 and the other end T2 of the heater element 410, respectively. The second ceramic layer 430 may further include through

holes

432 and 434, and the through

holes

432 and 434 may be formed to connect the first electrode tab 440 and the second electrode tab 450 to the wirings W1 and W2 connected to the power module 300, respectively. The wires W1 and W2 may correspond to the first electrode terminal 225 and the second electrode terminal 226 in fig. 1 to 8, or correspond to the first connection portion 225a of the first electrode terminal 225 and the second connection portion 226a of the second electrode terminal 226.

Alternatively, referring to fig. 10b and 10d, the first and

second electrode pads

440 and 450 may be disposed on the first ceramic layer 400 and connected to the one end T1 and the other end T2 of the heater element 410, respectively. The wires W1 and W2 connected to the power module 300 are connected to the first electrode tab 440 and the second electrode tab, respectively, and may be led out from between the first ceramic layer 400 and the second ceramic layer 430.

In addition, one of the first electrode sheet 440 and the second electrode sheet 450 may be disposed on the first ceramic layer 410, and the remaining one may be disposed on the second ceramic layer 430. At least one of the first electrode sheet 440 and the second electrode sheet 450 may be disposed on the outer surface of the first ceramic layer 400 or the second ceramic layer 430. At this time, the one end T1 of the heating element 410 and the first electrode tab 440 or the other end of the heating element 420 and the second electrode tab 450 may be connected through the through-hole formed between the first ceramic layer 410 or the second ceramic layer 430.

In this manner, the one end T1 and the other end T2 of the heating element 410 may be electrically connected to the power module 300 through the first and

second electrode tabs

440 and 450, and current may flow in the heating element 410.

Referring to fig. 12, the thickness of the heat conductor 420 disposed outside the heat generating element 410 is thinner toward the edge of the ceramic substrate portion 221. Accordingly, when the first ceramic layer 400 and the second ceramic layer 430 are bonded to each other, the possibility of occurrence of voids at the edge of the ceramic substrate portion 221 can be reduced.

Referring to fig. 13, the heat conductor 420 may be disposed on the heat generating element 410, in addition to the side surface of the heat generating element 410. Accordingly, in addition to the thermal conductivity in the side surface direction of the ceramic substrate portion 221, the thermal conductivity in the surface direction of the second ceramic layer 430 can be increased.

Referring to fig. 14, first ceramic layer S900 is prepared. As previously described, the first ceramic layer may include aluminum, and may further include one or more materials selected from the group consisting of calcium oxide (CaO), manganese oxide (MgO), and sodium oxide (Na)₂O), silicon dioxide (SiO)₂) And titanium dioxide (TiO)₂) Any one of them or a mixture thereof. The first ceramic layer may be in the shape of a printed circuit board (greenset) mixed with an organic substance.

Then, the heating element is plated or printed on the first ceramic layer S910. The heat generating element may include one or a mixture of tungsten (W), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), ITO (Indium Tin Oxide), and barium titanate (BaTiO).

Then, the first ceramic layer S920 in which the heating element is formed is dried.

Then, a heat conductor is printed between the heat generating elements S930. For this purpose, a paste or slurry containing at least one of aluminum nitride, silicon nitride, and boron nitride may be used.

Then, a second ceramic layer S940 is laminated on the heat generating element and the heat conductor, and heating and pressing S950 is performed. At this time, the heating and Pressing are performed by a Hot press forming (Hot Pressing) process, and the Pressing may be performed at a temperature of 150 to 200, for example.

Thereafter, a sintering process is performed to bond the first ceramic layer and the second ceramic layer S960. The sintering process is performed at about 1500 deg.f, and thus the first ceramic layer and the second ceramic layer may be integrated without disposing the heating element and the heat conductor.

The results of the thermal conductivity test of the ceramic substrate will be described below with reference to comparative examples and examples.

In the comparative example, a heating element was printed on a first aluminum oxide layer, and a second aluminum layer was laminated, followed by heating and pressing.

In an embodiment, the heating elements are printed on the first alumina layer, and after further printing a heat conductor between the printed heating elements, the second alumina layer is laminated, and heating and pressing are performed.

Fig. 15a is a sectional view showing a ceramic substrate fabricated according to a comparative example, and fig. 15b is a sectional view showing a ceramic substrate fabricated according to an example. Table 1 shows the thermal conductivity and porosity of the ceramic substrates according to the comparative examples and examples.

TABLE 1

Experiment number	Thermal conductivity (W/mK)	Porosity (%)
			Comparative example	18	5％
Examples	21	Less than 3%

Referring to table 1, it is understood that the ceramic substrate according to the example has lower porosity and higher thermal conductivity than the ceramic substrate according to the comparative example. The lower the porosity, the higher the strength of the ceramic substrate, and the lower the possibility of cracking.

The ceramic substrate is described as a plate shape by way of example, but not limited thereto. The ceramic substrate according to the embodiment of the present invention may have a cylindrical shape as shown in fig. 16.

Referring to fig. 16, ceramic substrate portion 221 includes first ceramic layer 400 and second ceramic layer 430. Further, a heating element 410 and a heat conductor 420 are disposed between the first ceramic layer 400 and the second ceramic layer 430.

In this case, the first ceramic layer 400 may have a cylindrical shape, and the heating element 410 and the heat conductor 420 may be disposed on the outer peripheral surface of the first ceramic layer 400. Also, the second ceramic layer 430 may be disposed to surround the outer circumferential surface of the first ceramic layer 400, the heat generating element 410, and the thermal conductor 420.

At this time, one end T1 of the heater element 410 may be connected to the first electrode tab 440, and the other end T2 of the heater element 410 may be connected to the second electrode tab 450. The wires W1 and W2 connected to the power module 300 are connected to the first tab 440 and the second tab 450, respectively. The first ceramic layer 400 and the second ceramic layer 430 may be led out to the outside. Although not shown, the second ceramic layer 430 has through holes formed therein, and the first and

second electrode tabs

440 and 450 can be connected to the wirings W1 and W2 connected to the power module 300, respectively, through the through holes.

Although not shown, a heat diffusion plate may be further disposed on the peripheral surface of the second ceramic spacer 430.

Next, the adhesive layer between the thermal diffusion plate and the ceramic substrate will be described in more detail.

Referring to fig. 17, the first adhesive layer disposed between the first thermal diffusion plate 223 and the ceramic substrate 221 and the second adhesive layer 22 disposed between the second thermal diffusion plate 224 and the ceramic substrate 221 can be confirmed.

The first adhesive layer 21 and the second adhesive layer 22 are reactive metal layers and may be formed by coating, deposition, or printing. The adhesion layers 21, 22 may utilize a titanium group active metal alloy such as titanium (Ti) or zirconium (Zr).

The thermal diffusion plate may be bonded to an active metal layer (active metal layer) formed on the ceramic substrate 221 by an oxide metal layer. The surface of the oxidized metal layer has adhesive force, so that the oxidized metal layer can be adhered to the surface of the active metal layer. The active metal layer (active metal layer) bonded to the metal oxide layer may be formed of a material selected from alumina (Al)₂O₃) Aluminum nitride (AlN), silicon nitride (SiN), or silicon carbide (SiC), or an alloy thereof. The active metal layer can be formed by coating, deposition, and printing. The metal oxide layer may contain, for example, copper oxide (CuO, Cu)₂O)。

Then, the surface of the heat diffusion plate may be formed with protrusions.

Fig. 18a shows the formation of projections 32 on the surfaces of the

heat diffusion plates

223 and 224, and the formation of embossed shapes on the surfaces, and fig. 18b shows the formation of long protrusions 34 on the surfaces of the

heat diffusion plates

223 and 224.

When the surface of the heat diffusion plate is implemented in an embossed shape, a heat diffusion plate shape of a long protrusion, as in the present embodiment, the contact area with the cooling water is increased, and thus the cooling water can be heated more efficiently.

The protrusion 32 and the long protrusion 34 are for increasing the contact area, and thus the shape of the protrusion on the surface of the heat diffusion plate is not limited, and the heat diffusion plate can be deformed into various shapes. For example, the surface of the heat diffusion plate may be formed to be curved in an irregular shape.

As described above, the heater according to the embodiment of the present invention may be a heater based on not only the air heating system but also the cooling water heating system.

Referring to fig. 19, a heating system 3000 may include: a cooling water tank 3100 for storing cooling water; the heater core 3200 according to an embodiment of the present invention is immersed in cooling water; and a heat exchanger 3300.

The cooling water 3110 cools heat generating components 3400 of the electric vehicle and is stored in a cooling water tank 3100 through a cooling water pipe 3500. The heat generating component 3400 may include a frequency converter or a motor.

The heater core 3200 may be the heater core illustrated in the aforementioned fig. 1-18 b. The heater core 3200 may be used in combination with the cooling water tank 3100, and may be replaceable. In the cooling water tank 3100, one or more heater cores may be immersed in the cooling water. Also, a part of the heater core 3200 or the entire heater core 3200 except for the electrode portion coupled to the cooling water tank may be immersed in the cooling water.

Like the utility model discloses an embodiment, when ceramic substrate portion adheres to the thermal diffusion plate, can prevent ceramic substrate portion damage. As an embodiment of the present invention, when the thermal diffusion plate is applied to the ceramic substrate portion, the heat loss is reduced to the maximum extent due to the high thermal conductivity of the thermal diffusion plate, and the heat generated in the heater core can be used for heating the cooling water as a whole due to the high thermal conductivity. Also, by bonding the heat diffusion plate, vibration, thermal shock, breakage, etc. are prevented, and the reliability of the heater itself can be improved.

The heat exchanger 3300 is used to supply heat of heated cooling water to the vehicle interior, and the heat exchanger 3300 is connected to the cooling water tank 3100 via a cooling water pipe 3500.

When the operation of the heating system is observed, the cooling water for cooling the heat generating component 3400 moves to the cooling water tank 3100 through the cooling water pipe 3500, and after the cooling water is heated by the heater core 3200, the cooling water again moves to the heat exchanger 3300 through the cooling water pipe, thereby heat exchange is performed and heat is supplied to the interior of the vehicle. The heat-exchanged cooling water moves through the cooling water pipe again, cooling the heat generating component 3400.

With this circulation structure, the cooling water cools the heat generating components, is heated by the heater core, and can provide heat into the vehicle interior.

In the present embodiment, the volume of the heater core can be reduced by 50% or more compared to the conventional heating apparatus and the thermal efficiency can be ensured by 95% or more by immersing the heater core in the cooling water.

In the above, all the constituent elements constituting the embodiments of the present invention are described as being integrated or combined and operated, but the present invention is not limited to these embodiments. That is, all the components may be selectively combined into one or more types and operated within the scope of the object of the present invention. Also, the above-mentioned terms such as "including", "constituting" or "having" should be interpreted as being able to mean that the respective constituent elements are included unless otherwise stated, and thus other constituent elements are not excluded but may be further included. All terms including technical or scientific terms, unless otherwise defined, have the same meaning as commonly understood by one of ordinary skill in the art. Terms used generally, as those defined in advance, should be interpreted as having a meaning consistent with the context of the relevant art and should not be interpreted in a different or exaggerated manner, as if not explicitly defined in the present disclosure.

The above description is only for the purpose of illustrating the technical idea of the present invention, and those skilled in the art can make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments of the present invention are not intended to limit the technical idea of the present invention, but to illustrate the technical idea of the present invention. The scope of the present invention should be construed by the appended claims, and all technical ideas within the same scope as it is interpreted are included in the scope of the claims.

Claims

1. A heater, comprising:

a casing having an inlet and an outlet arranged to face each other and through which a heat medium passes;

a heat generation module disposed between the inlet and the outlet in the casing; and

a power module disposed at one side of the housing and electrically connected to the heat generating module,

the heat generating module includes a plurality of heat sinks and a plurality of heater cores alternately arranged with each other,

the heater core includes:

a ceramic substrate portion including a first ceramic layer and a second ceramic layer disposed on the first ceramic layer;

a heating element disposed between the first ceramic layer and the second ceramic layer;

a heat diffusion plate disposed on one of the first ceramic layer and the second ceramic layer; and

and a first electrode sheet and a second electrode sheet disposed on the first ceramic layer or the second ceramic layer, the first electrode sheet being connected to a first end of the heating element, and the second electrode sheet being connected to a second end of the heating element.

2. The heater of claim 1,

the heat generating element includes:

a first heat generating part extending from one side to the other side;

a second heat generating portion extending from the predetermined point on the other side to one side again; and

a third heat generating portion extending from a predetermined point on one side of the second heat generating portion to the other side again,

the first heat generating portion, the second heat generating portion, and the third heat generating portion are disposed to be spaced apart from each other.

3. The heater of claim 1,

the heat generating module further includes a first gasket and a second gasket respectively disposed at one side and the other side of the inside of the case.

4. The heater of claim 3,

the heater core further comprises a covering portion covering the ceramic substrate portion,

the covering part is formed to extend further to one side and the other side than the ceramic substrate part,

one side of the covering portion is inserted into the first gasket, and the other side of the covering portion is inserted into the second gasket, and the heater core is supported by the first gasket and the second gasket.

5. The heater of claim 1,

the heat generating module further includes a first electrode terminal disposed at one side and electrically connected to the heat generating element,

the power supply module includes a first connection terminal combined with the first electrode terminal,

the first electrode terminal includes a first coupling member and a second coupling member opposite to each other in a direction in which the heat medium passes,

the first coupling member extends to one side and has a shape curved so as to approach and separate from the second coupling member,

the second coupling member extends to one side and has a shape curved so as to approach and separate from the first coupling member,

the first connection terminal is disposed between the first coupling member and the second coupling member, and is coupled to the first electrode terminal.

6. The heater of claim 1,

the heat diffusion plate includes a first heat diffusion plate and a second heat diffusion plate that are opposed to each other along a direction in which the heater cores are arranged.

7. The heater of claim 6,

the thermal expansion coefficients of the first thermal diffusion plate, the ceramic substrate portion, and the second thermal diffusion plate are the same as each other.

8. The heater of claim 6,

at least one of the first and second heat diffusion plates includes: a first thermal diffusion layer, a second thermal diffusion layer disposed on the first thermal diffusion layer, and a third thermal diffusion layer disposed on the second thermal diffusion layer.

9. The heater of claim 6,

at least one of the first and second heat diffusion plates has a protrusion formed on a surface thereof.

10. The heater of claim 1,

further comprising a thermal conductor disposed between the first ceramic layer and the second ceramic layer and disposed at a side surface of the heat generating element.

11. The heater of claim 10,

the thermal conductivity of the thermal conductor is higher than the thermal conductivities of the first ceramic layer and the second ceramic layer.

12. The heater of claim 10,

the first ceramic layer and the second ceramic layer are bonded into a whole at the edge.

13. The heater of claim 12,

the porosity of the ceramic substrate portion is 3% or less.

14. The heater of claim 10,

the heat generating element includes a plurality of heat generating patterns connected by a predetermined pattern, and the heat conductor is disposed between the plurality of heat generating patterns.

15. The heater of claim 14,

at least a part of a side surface of the heat generating pattern and a side surface of the heat conductor are in contact with each other.

16. A heating system for use in a vehicle, comprising:

a flow path for flowing air;

an air supply part provided at one side of the flow path for introducing air from the outside;

an exhaust part provided at the other side of the flow path for discharging air into a room of the vehicle; and

a heater disposed between the air supply portion and the air discharge portion in the flow path, for heating air,

the heater includes:

a casing having an inlet and an outlet arranged to face each other and through which air passes;

the heat generating module includes: a plurality of fins and a plurality of heater cores having a shape extending from one side to the other side and alternately arranged with each other,

the heater core includes:

17. A heater core, comprising:

a first thermal diffusion plate;

a first ceramic layer disposed on the first thermal diffusion plate;

a heating element disposed on the first ceramic layer;

a second ceramic layer disposed on the first ceramic layer; and

and a second thermal diffusion plate disposed on the second ceramic layer.

18. Heater core according to claim 17,

further comprising a thermal conductor disposed on the first ceramic layer and on a side surface of the heat generating element.