KR102292905B1 - Heater core, heater and heating system including thereof - Google Patents

Abstract

An embodiment includes a first substrate; a second substrate; and a first ceramic, a second ceramic, and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and in a first direction The minimum length of the substrate is greater than the minimum length of the second substrate, and the first direction is a thickness direction of the heater core.

Description

A heater core, a heater, and a heating system including the same

The embodiment relates to a heater and a heating system including the same.

An automobile includes an air conditioning device for providing thermal comfort in an interior, for example, a heating device that performs heating through a heater, and a cooling device that performs cooling through a refrigerant circulation.

In the case of a general internal combustion engine vehicle, since a large amount of waste heat is generated from the engine, it is easy to secure the heat required for heating therefrom. On the other hand, in the case of an electric vehicle, less heat is generated compared to an internal combustion engine vehicle, and there is a problem that heating for the battery is also required.

Accordingly, the electric vehicle requires a separate heating device, and it is important to increase the energy efficiency of the heating device.

However, the heating device is heavy, and there is a problem of low thermal efficiency due to low thermal conductivity.

The embodiment provides a heater and a heating system including the same.

In addition, there is provided a heater that is structurally stable and has improved reliability.

In addition, a light-weight and durable heater is provided.

In addition, it provides a heater with improved stability through temperature sensing with different actions.

In addition, there is provided a heater with improved thermal efficiency.

A heater core according to an embodiment of the present invention includes a first substrate; a second substrate; and a first ceramic, a second ceramic, and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and in a first direction The minimum length of the substrate is greater than the minimum length of the second substrate, and the first direction is a thickness direction of the heater core.

A length ratio of the minimum length of the first substrate to the minimum length of the second substrate in the first direction may be 1:1.1 to 1:10.

A length of the first substrate in a second direction may be smaller than a length of the second substrate, and the second direction may be perpendicular to a thickness direction of the heater core.

The second substrate may cover the first ceramic, the second ceramic, and side surfaces of the first substrate.

The second substrate may include a protrusion extending in a first direction, and the first direction may be a thickness direction of the heater core.

A length of the protrusion in the first direction may be greater than a length of the first ceramic, the heating element, and the second ceramic.

The protrusion may contact a side surface of the first substrate.

An adhesive layer disposed between the second substrate and the second ceramic may be further included.

The first substrate and the second substrate include any one of Al, Cu, Ag, Au, Mg, SUS and stainless steel, and the first ceramic and the second ceramic are aluminum (Al), copper (Cu), At least one of silver (Ag), gold (Au), magnesium (Mg), and silicon (Si) may be configured to include at least one of oxygen (O) and nitrogen (N).

A heater according to an embodiment of the present invention includes a power module; and a heat generating module electrically connected to the power module to generate heat, wherein the heat generating module includes a plurality of heat dissipation fins and a plurality of heater cores that are alternately disposed, wherein the heater core includes: a first substrate; a second substrate; and a first ceramic, a second ceramic, and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and in a first direction The minimum length of the substrate is greater than the minimum length of the second substrate, and the first direction is a thickness direction of the heater core.

The plurality of heat dissipation fins may further include an adhesive member disposed between the first substrate and the second substrate.

A heating system according to an embodiment of the present invention includes a flow path through which air moves; an air supply unit for introducing air; an exhaust unit for discharging air into the interior of the moving means; and a heater disposed between the air supply unit and the exhaust unit in the flow path to heat air, the heater comprising: a power module; and a heat generating module electrically connected to the power module to generate heat, wherein the heat generating module includes a plurality of heat dissipation fins and a plurality of heater cores that are alternately disposed, wherein the heater core includes: a first substrate; a second substrate; and a first ceramic, a second ceramic, and a heating element disposed between the first substrate and the second substrate, wherein the heating element is disposed between the first ceramic and the second ceramic, and in a first direction The minimum length of the substrate is greater than the minimum length of the second substrate, and the first direction is a thickness direction of the heater core.

According to the embodiment, it is possible to implement a lightweight and durable heater.

In addition, it is possible to manufacture a structurally stable and reliable heater.

In addition, it is possible to manufacture a heater with improved stability through different methods of temperature sensing.

In addition, it is possible to implement a heater with improved thermal efficiency.

Various and advantageous advantages and effects of the present invention are not limited to the above, and will be more easily understood in the course of describing specific embodiments of the present invention.

1 is a perspective view of a heater according to an embodiment;
2 is a plan view of a heat generating module according to the embodiment;
3 is an exploded perspective view of a heater core of a heat generating module according to an embodiment;
4A is a plan view of a heater core according to an embodiment;
4B is a plan view of a heater core and a heat dissipation fin coupled to the heater core according to another embodiment;
5 is a cross-sectional view taken along line AA' in FIG. 4A;
6 is a view showing various shapes of the heating element,
7A is a plan view of a heater core according to another embodiment;
7b and 7c are modified examples of FIG. 7a,
8A is a cross-sectional view of a heater core according to another embodiment;
Figure 8b is a modification of Figure 8a,
9A is a perspective view of a heating module according to another embodiment;
Figure 9b is a modification of Figure 9a,
Figure 10a is a cross-sectional view showing a connection according to the embodiment,
10b and 10c are top views of FIG. 10a,
11 is an exploded perspective view of a heater according to the embodiment;
12A to 12C are flowcharts illustrating a method of manufacturing a heater core according to an embodiment;
13 is a conceptual diagram illustrating a heating system according to an embodiment.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Terms including an ordinal number such as second, first, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it is understood that the other component may be directly connected or connected to the other component, but other components may exist in between. it should be On the other hand, when it is mentioned that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but regardless of the reference numerals, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted.

1 is a perspective view of a heater according to an embodiment, FIG. 2 is a plan view of a heating module according to the embodiment, and FIG. 3 is an exploded perspective view of a heater core of the heating module according to the embodiment.

Referring to FIG. 1 , the heater according to the embodiment includes a case, a heating module, and a power module.

The case 100 may be disposed outside the heater 1000 . The case 100 may be an exterior member of the heater 1000 and may have a shape surrounding the heating module 200 accommodated in the case 100 . The power module 300 may be disposed on one side of the case 100 . The case 100 may be coupled to the power module 300 .

A lower portion of the case 100 may include a receiving unit coupled to the power module 300 . For example, the case 100 and the power module 300 may be coupled to each other through a pinch coupling. However, it is not limited to this method, and various coupling methods may be applied.

In addition, the case 100 may have a hollow block-shaped accommodating portion, but is not limited thereto. For example, the case 100 may include a first surface 110 and a second surface 120 . Here, the plurality of inlets may be disposed on the first surface 110 . Accordingly, the fluid may flow into the first surface 110 . Here, the fluid may be a medium for transferring heat, for example, air. However, it is not limited to this type.

In addition, the plurality of inlets may be arranged in a predetermined row on the first surface 110 . Lengths of the plurality of inlets in the first direction (X-axis direction) may vary, but are not limited thereto.

The plurality of outlets may be disposed on the second surface 120 . The fluid introduced through the first surface 110 is heated from the heat generating module inside the case 100 , and may move through the outlet of the second surface 120 . The outlet may also be arranged to match a predetermined row on the second surface. In addition, it may be arranged to correspond to the plurality of inlets. Accordingly, the fluid introduced through the inlet may be smoothly discharged through the outlet.

And the fluid (b ₁ ) flowing into the inlet may have a lower temperature than the fluid (b- _{2) discharged through the outlet.} In addition, the length of the plurality of outlets in the first direction (X-axis direction) may vary, but is not limited thereto.

The heating module 200 may be disposed inside the case 100 . The heating module 200 may be electrically connected to the power module 300 disposed on one side of the case 100 . The heat generating module 200 may provide heat by using the power provided from the power module 300 .

The power module 300 may be disposed on one side of the case 100 . For example, the power module 300 may be disposed under the case 100 to support the case 100 and the heating module 200 . The power module 300 may be coupled to the case 100 . The power module 300 may be electrically connected to the heat generating module 200 to provide power to the heat generating module 200 . One side of the power module 300 may be connected to an external power supply. Also, the mass air flow (MAF) of the heater 1000 according to the embodiment may be 300 kg/h, but may have various values according to the volume of the heater 1000 .

Referring to FIG. 2 , the heat generating module 200 according to the embodiment may include a plurality of heater cores 220 , heat dissipation fins 210 , a first gasket 230 , and a second gasket 240 .

The heater core 220 may be disposed inside the case 100 as a heating part. The heater core 220 may receive power from the power module to generate heat. The number of heater cores 220 may be plural, but the number is not limited thereto.

_{The heater core 220 may have a length W 3} of 1 mm to 6 mm in the first direction (X-axis direction). However, the length is not limited thereto, and as the size of the heater increases, the length of the heater core 220 in the first direction (X-axis direction) may increase. Here, the first direction (X-axis direction) is a direction in which the heater core 220 and the heat dissipation fins 210 are alternately disposed, and is the same as the thickness direction of the heater core. Based on this, the first direction (X-axis direction) will be described below.

The heater according to an embodiment of the present invention is the _{maximum length (W 2} ) in the first direction (X-axis direction) of the heater by reducing the _{length (W 3 ) of the heater core 220 in the first direction (X-axis direction)} can be reduced With this configuration, other heaters may be lighter in weight and include more heater cores 220 per same size to provide improved thermal efficiency.

_{Preferably, the length W 3} in the first direction (X-axis direction) of the heater core 220 may be formed to be 1 mm or more and 5 mm or less, and more preferably 1.5 mm or more and 3 mm or less. .

The plurality of heater cores 220 may be spaced apart from each other by a predetermined distance. In addition, heat dissipation fins 210 may be disposed between the plurality of heater cores 220 .

In addition, the heater core 220 and the heat dissipation fins 210 may be alternately disposed in the first direction (X-axis direction).

That is, the heat generating module 200 may include the heat dissipation fins 210 and the heater core 220 alternately arranged in the first direction (X-axis direction). The minimum length W2 of the heat generating module 200 may be 160 mm to 200 mm. The heater core 220 and the heat dissipation fin 210 are connected to each other, so that heat generated in the heater core 220 may move to the heat dissipation fin 210 . Accordingly, the fluid passing through the heater core 220 and the heat dissipation fin 210 may receive heat to increase the temperature.

For heat transfer, a thermally conductive member (not shown) may be disposed between the heater core 220 and the heat dissipation fins 210 . The thermally conductive member (not shown) may include, but is not limited to, conductive silicon.

The heat dissipation fins 210 may be disposed inside the case 100 . The heat dissipation fins 210 may be disposed between the heater cores 220 and may be plural. The plurality of heat dissipation fins 210 may be spaced apart from each other in the first direction (X-axis direction).

The heat dissipation fin 210 may extend in the second direction (Z-axis direction) like the heater core 220 . Here, the second direction (Z-axis direction) is a direction perpendicular to the first direction (X-axis direction), which is applied hereinafter. The heat dissipation fin 210 may be a louver fin, but is not limited thereto. The heat dissipation fin 210 may have a form in which inclined plates are stacked in the second direction (Z-axis direction). Accordingly, the heat dissipation fin 210 may include a plurality of gaps through which the fluid may pass. The fluid may be provided with heat as it passes through the gap. Due to the heat dissipation fins 210 , the heat transfer area through which the heat generated in the heater core 220 is transferred to the fluid increases, so that heat transfer efficiency can be improved.

The heat dissipation fin 210 may be coupled to the heater core 220 by an adhesive member such as a silver adhesive layer 224 or aluminum (Al) brazing paste. However, it is not limited to this method.

An adhesive member (not shown) may be disposed between the heater core 220 and the heat radiation fin 210 to couple the heater core 220 and the heat radiation fin 210 to each other. The adhesive member (not shown) prevents the heater core 220 and the heating fin 210 from being detached at a high temperature generated when the heater is driven, thereby improving durability and reliability of the heater.

The length L of the heat dissipation fin 210 in the first direction (X-axis direction) may be 8 mm to 32 mm, but may be variously applied according to the size of the heater.

When the length L in the first direction (X-axis direction) of the heat dissipation fin 210 is less than 8 mm, there is a problem of reducing the MAF (mass air flow) of the heater, and the first direction (X) of the heat dissipation fin 210 is If the length (L) of the axial direction) is greater than 32 mm, heat transfer is not performed properly in the passing fluid, so there is a limit to lower the rate of temperature increase of the fluid.

_{In addition, the minimum length W 1} of the heat dissipation fin 210 in the second direction (Z-axis direction) that is perpendicular to the first direction (X-axis direction) may be 180 mm to 220 mm.

A support part (not shown) may be disposed between the heat dissipation fins 210 . The support part (not shown) may be randomly disposed between the plurality of heat dissipation fins 210 , and for example, at least one support part (not shown) may be disposed between adjacent heater cores 220 .

The support part (not shown) supports the heater core 220 and the heat radiation fin 210 to prevent bending of the heater core 220 and the heat radiation fin 210 from an external force. The length of the support part (not shown) in the first direction (X-axis direction) may be 0.4 mm to 0.6 mm. When the length of the support part (not shown) in the first direction (X-axis direction) is less than 0.4 mm, there is a limit in that the amount of fluid discharged through the heater decreases. When the length of the support part (not shown) in the first direction (X-axis direction) is greater than 0.6 mm, there is a problem in that the void of the heat dissipation fin 210 decreases, so that heat transferred to the fluid decreases.

A support (not shown) may be disposed in the center of the adjacent heater cores 220 between the heater cores 220 . By such a configuration, the damage to the heater can be minimized by distributing the force from the external force in a balanced manner.

In addition, the support (not shown) is generated by decreasing _{the length (W 3} ) of the heater core 220 without changing _{the minimum length (W 2} ) of the heat generating module 200 in the first direction (X-axis direction) may be equal to the length. That is, the support part (not shown) may be inserted into the heater while maintaining the length L of the heat dissipation fin 210 in the first direction (X-axis direction). With this configuration, when replacing a heater applied to an existing vehicle with a heater according to an embodiment of the present invention, the design (size, etc.) of the heater does not require change, so other components used in the manufacture of the existing heater can be easily manufactured and can be reused. For example, the heat dissipation fins of the conventional heater may be equally applied to the heater according to the embodiment. Accordingly, since the manufacturing process of the existing heater can be used, the heater according to the present embodiment does not change the existing manufacturing process and compatibility can be improved.

The first gasket 230 may be located on the inside of the case 100 . The second gasket 240 may be located inside the case 100 . The first gasket 230 and the second gasket 240 may be coupled to the case 100 by pinching, bonding, or the like.

A plurality of first accommodating parts 231 and second accommodating parts 241 spaced apart from each other in the first direction (X-axis direction) may be disposed on the first gasket 230 and the second gasket 240 . The first gasket 230 may include a plurality of protruding first accommodating parts 231 . The second gasket 240 may include a plurality of protruding second receiving portions 241 .

Referring to FIG. 3 , the heater core 220 according to the embodiment may include a first substrate 221 , a second substrate 223 , and a heating element 222 .

The first substrate 221 and the second substrate 223 may accommodate the heating element 222 therein.

The first substrate 221 may be disposed on one side of the heater core 220 , and the second substrate 223 may be disposed on the other side of the heater core 220 .

The first substrate 221 and the second substrate 223 may include a metal having high thermal conductivity. For example, the first substrate 221 and the second substrate 223 may include Al, Cu, Ag, Au, Mg, SUS, stainless steel, or the like. However, it is not limited to these materials.

The first ceramic 221a and the second ceramic 223a may be positioned to face each other with respect to the heating element 222 . The first ceramic 221a and the second ceramic 223a may be formed by anodizing, thermal spraying, screen printing, patterning, or the like.

The first ceramic 221a and the second ceramic 223a may include oxygen (O) in at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), magnesium (Mg), and silicon (Si). ) and nitrogen (N) may be a ceramic containing at least one.

Also, the first ceramic 221a and the second ceramic 223a may be formed as thin as 50 μm to 500 μm in the first direction (X-axis direction). Due to this configuration, the first and second ceramics 221a and 223a easily dissipate heat generated by the heating element 222 disposed between the first ceramic 221a and the second ceramic 223a, so heat dissipation is insufficient. Thus, it is possible to prevent a phenomenon such as cracks caused in the first ceramic 221a and the second ceramic 223a.

Also, the first ceramic 221a and the second ceramic 223a may be formed on the first substrate 221 by thermal spraying at a high temperature nozzle of about 10,000°C. At this time, since the temperature formed between the first ceramic 221a and the second ceramic 223a and the first substrate 221 is about 200°C, the first substrate 221 and the first ceramic 221a and the second ceramic Since the adhesion between the 223a is improved, it is possible to prevent the first ceramic 221a and the second ceramic 223a from being separated from the first substrate 221 when the heater is operated.

In addition, the same may be applied to the case of forming the second ceramic 223a through thermal spraying on the second substrate 223 as described above.

In addition, the coefficients of thermal expansion of the first and second substrates 221 and 223 may be determined according to preset conditions by reflecting the coefficients of thermal expansion of the first and second ceramics 221a and 223a. That is, the coefficients of thermal expansion of the first and second substrates 221 and 223 may have values similar to those of the first and second ceramics 221a and 223a.

Also, the coefficients of thermal expansion of the first and second substrates 221 and 223 may have the same values as those of the first and second ceramics 221a and 223a. As a result, the first and second ceramics 221a and 223a, which have good thermal conductivity but are brittle and easily damaged by thermal shock, can be reinforced.

The difference between the thermal expansion coefficients of the first substrate 221 and the second substrate 223 and the thermal expansion coefficients of the first and second ceramics 221a and 223a is the same including 0, or the ratio of the thermal expansion coefficients is 1:1 to 6 It may be in the range of :1. Preferably, a ratio of the coefficients of thermal expansion of the first and second substrates 221 and 223 to those of the first and second ceramics 221a and 223a may be in a range of 2:1 to 4:1. When the coefficient ratio of the coefficients of thermal expansion of the first substrate 221 and the second substrate 223 and the first and second ceramics 221a and 223a exceeds 6:1, the first and second ceramics 221a and 223a are formed. can be broken

In addition, the first substrate 221 and the second substrate 223 are formed to surround the heating element 222 , the first ceramic 221a and the second ceramic 223a, and the heating element 222 and the first ceramic 221a are formed to surround them. ) and the second ceramic 223a may be protected. In addition, since the first substrate 221 and the second substrate 223 use a material with high thermal conductivity such as aluminum (Al), heat generated from the heating element 22 can be easily conducted to the outside through the heat dissipation fin 210 . The heating element 222 may be disposed between the first substrate 221 and the second substrate 223 . For example, the heating element 222 may be disposed on one surface of the first substrate 221 by a method such as printing, patterning, thermal spraying, or deposition.

The heating element 222 may be disposed inside the heating module 200 . The heating element 222 may be disposed on the first substrate 221 by printing, patterning, deposition, or the like. The heating element 222 may be disposed on a surface of the first substrate 221 where the first substrate 221 and the second substrate 223 contact each other.

The heating element 222 may be a resistor line. The heating element 222 may be a resistor including nickel-chromium (Ni-Cr), molybdenum (Mo), tungsten (W), rubidium (Ru), silver (Ag), copper (Cu), or the like, but is limited thereto. it is not And the heating element 222 may generate heat when electricity flows.

The heating element 222 may be formed on the first ceramic 221a of the first substrate 221 through silk screen printing or thermal spraying.

As mentioned above, the heating element 222 may be formed on the first substrate 221 through thermal spraying at a high temperature nozzle of about 10,000°C. In addition, since the temperature formed between the first substrate 221 and the first ceramic 221a is about 200° C., the adhesion between the first substrate 221 and the first ceramic 221a is improved, so that when the heater is operated, the first substrate Separation of the first ceramic 221a from the 221 may be prevented.

The heating element 222 may extend in various directions of the first substrate 221 and may be turned up (curved or bent) in a portion of the first substrate 221 . For example, the heating element 222 may be repeatedly extended in the second direction (Z-axis direction) of the first substrate 221 . The heating element 222 may be stacked in the third direction (Y-axis direction) through which the fluid passes by repeating this extension.

With this configuration, the fluid may sequentially pass through a portion in which heat is generated in the heater core 220 while passing through the heat generating module 200 to receive heat. That is, the contact area between the fluid and the heat generated from the heater core 220 may be increased by the arrangement of the heating elements 222 .

In addition, in the case of a heater including a conventional ceramic, the area of the heating element compared to the area of the substrate was formed to be about 10%, so the thermal efficiency was low. Between the first and second substrates 221 and 223 , the area of the heating element 222 may vary. For example, it is possible to improve the thermal efficiency by securing the surface area of the heating element 222 to be 10% or more, 50% or more, or 70% or more compared to the surface area of the first substrate 221, and at the same time control the thermal efficiency of the heating module. there is also

Both ends of the heating element 222 may be electrically connected to any one of the first electrode terminal 225a and the second electrode terminal 225b, respectively.

The heating element 222 may receive power from the power module through the first electrode terminal 225a and the second electrode terminal 225b. The heating element 222 may convert electrical energy of the power module into thermal energy. For example, current may flow through the heating element 222 and generate heat. And the heating element 222 may be controlled to generate heat according to the control of the power provided by the power module.

In addition, heat diffusion plates (not shown) may be disposed on both sides of the heater core 220 . The heat diffusion plate may have a plurality of layer structures to facilitate heat diffusion. However, it is not limited to this structure.

In addition, a cover part (not shown) covering the heater core 220 may be disposed. The heat diffusion plate may be disposed on one side of the first substrate 221 and the second substrate 223 to transfer heat to the cover part. For example, the heat diffusion plate may be coupled to the side surfaces of the first substrate 221 and the second substrate 223 , respectively.

The electrode part 225 may be disposed at one end of the heater core 220 . The electrode part 225 may include a first electrode terminal 225a and a second electrode terminal 225b. For example, the first electrode terminal 225a and the second electrode terminal 225b may be disposed outside the first substrate 221 and the second substrate 223 .

The first electrode terminal 225a and the second electrode terminal 225b may be electrically connected to the heating element 222 in the first substrate 221 . Accordingly, a portion of the first electrode terminal 225a and the second electrode terminal 225b may be respectively disposed between the first substrate 221 and the second substrate 223 . The first electrode terminal 225a and the second electrode terminal 225b may have different electrical polarities.

A separate connection part for electrically connecting the first electrode terminal 225a and the second electrode terminal 225b to the heating element 222 may be disposed. Also, the first electrode terminal 225a and the second electrode terminal 225b may be electrically connected to the power module. Accordingly, the power of the power module may be provided to the heat generating module 200 .

A cover part (not shown) may surround the first substrate 221 and the second substrate 223 . And the cover part (not shown) may include an accommodation hole.

The material of the cover part (not shown) may include aluminum (Al). The cover part (not shown) is an exterior member of the heater core 220 and may be in the form of a hollow bar or rod, but is not limited thereto.

The cover part (not shown) may accommodate the first substrate 221 and the second substrate 223 , the heating element 222 , and a heat diffusion plate (not shown) therein. In this case, the inner surface of the cover part (not shown) may be in contact with at least one of the first substrate 221 , the second substrate 223 , and a heat diffusion plate (not shown).

Thermally conductive silicon may be disposed between the cover part, the first substrate 221 and the second substrate 223 , and a heat diffusion plate (not shown). The cover part may be bonded to the first substrate 221 , the second substrate 223 , and the thermal diffusion plate (not shown) by means of thermally conductive silicon. In addition, the cover part may be structurally fastened to the first substrate, the second substrate 223 and the heat diffusion plate (not shown), but is not limited thereto.

The cover part surrounds the first substrate 221 , the second substrate 223 , and the heat diffusion plate (not shown), so that the first substrate 221 , the second substrate 223 , and the heat diffusion plate (not shown) are covered. can protect With this configuration, the cover part may improve the reliability of the heater core 220 .

In addition, since the cover part has high thermal conductivity, heat generated from the heating element 222 of the first substrate 221 and the second substrate 223 may be conducted to the heat dissipation fins 210 in contact with the heater core 220 .

In addition, the cover part may be inserted into the first gasket 230 and the second gasket 240 . The cover part may be inserted into the first gasket 230 and the second gasket 240 to support the heating module 200 of the embodiment.

However, the cover part may be changed according to a design request and may have various shapes, but is not limited thereto. In addition, the cover part (not shown) may be an additional configuration that may be changed according to a design request. The cover part of the heater core 220 may be omitted. In addition, the heat diffusion plate (not shown) may be omitted, like the cover part (not shown).

The first gasket 230 may include a plurality of first accommodating parts. Also, the second gasket 240 may include a plurality of second accommodating portions.

The plurality of first accommodating parts 231 and second accommodating parts 231 may be disposed to correspond to the plurality of heater cores 220 one-to-one. With this configuration, one side of the heater core 220 may be inserted into the first receiving part 231 . Also, the other side of the heater core 220 may be inserted into the second receiving part 241 .

The first substrate 221 and the second substrate 223 may be inserted into the first gasket 230 and the second gasket 240 . With this configuration, the heater core according to the embodiment has a reduced volume and can provide a lighter weight heater due to the reduced volume.

However, the electrode part 225 of the heater core 220 may extend downward by penetrating the second receiving part 241 downward. Accordingly, the first electrode terminal 225a and the second electrode terminal 225b may be exposed downward and may be electrically connected to the power module.

4A is a plan view of a heater core according to an embodiment, FIG. 4B is a plan view of a heater core and a heat dissipation fin coupled to the heater core according to another embodiment, and FIG. 5 is a cross-sectional view taken along line AA′ in FIG. 4A .

Referring to FIG. 4A , the heater core 220 includes a first substrate 221 , a first ceramic 221a , a heating element 222 , a second ceramic 223a , and a second substrate in a first direction (X-axis direction). 223 may be arranged in this order.

The first substrate 221 may include a first ceramic 221a. _{The first substrate 221 may have a length W 4} of 0.4 mm to 3 mm in the first direction (X-axis direction). Preferably, the length W ₄ of the first substrate 221 may be 1 mm to 3 mm. More preferably, the length W ₄ of the first substrate 221 may be 1.5 mm to 2.2 mm. Accordingly, the first substrate 221 prevents the warpage that occurs while the first ceramic 221a and the heating element 222 are formed on the first substrate 221 through thermal spraying, and the warpage that occurs at a high temperature when the heater is driven. phenomenon can also be prevented.

The first substrate 221 in the first direction (X-axis direction) when the length (W ₄ ) is less than 0.4 mm, the first ceramic 221a and the heating element 222 are formed at a high temperature through thermal spraying, the bending phenomenon occurs Limitations exist.

_{In addition, when the length W 4 of} the first substrate 221 in the first direction (X-axis direction) is greater than 3 mm, there is a limit in that heat transfer to the heat dissipation fin 210 is reduced, and the heat transfer of the heater core 220 is limited. As the thickness increases and the weight of the heater increases, there is a limit to weight reduction. In particular, when the heater is installed in the vehicle, there is a limit in that the weight of the vehicle increases.

_{The first ceramic 221a may have a length W 5} of 50 μm to 500 μm in the first direction (X-axis direction). Preferably, the length W ₅ of the first ceramic 221a may be 100 μm to 400 μm. More preferably, the length W ₅ of the first ceramic 221a may be 150 μm to 300 μm. The first ceramic 221a may be disposed on a side where the first substrate 221 contacts the heating element 222 .

_{When the length W 5 of} the first ceramic 221a in the first direction (X-axis direction) is less than 50 μm, there is a limit in which the withstand voltage characteristic decreases. _{When the length W 5 of} the first ceramic 221a in the first direction (X-axis direction) is greater than 500 μm, when the first ceramic 221a is formed through thermal spraying or when the heater operates at a high temperature 1 There is a limit in which cracks occur in the substrate 221 . In addition, heat from the heating element 222 is not efficiently transferred to the first substrate 221 , and the process time for forming the first ceramic 221a increases, thereby reducing efficiency in manufacturing the heater.

_{The heating element 222 may have a length W 6} of 10 μm to 100 μm in the first direction (X-axis direction). Preferably, the length (W ₆ ) of the heating element 222 may be 38 μm to 80 μm. More preferably, the length W ₆ of the heating element 222 may be 45 μm to 75 μm. For example, when the heating element 222 includes Ni-Cr, the length W ₆ in the first direction (X-axis direction) of the heating element 222 may be 50 μm to 60 μm, but it is limited to this length. no.

When the length (W ₆ ) of the heating element 222 is less than 10 μm, the heating element 222 has a limit in which the heating characteristic decreases. When the length (W ₆ ) of the heating element 222 is greater than 100 μm, the heating element 222 is difficult to be formed in a large area on the first ceramic 221a, and the current density increases, so that the heating characteristic may be deteriorated, and an electric short may occur. There are limitations that arise.

_{The second ceramic 223a may have a length W 8} of 50 μm to 500 μm in the first direction (X-axis direction). Preferably, the length (W ₈ ) of the second ceramic 223a may be 100 μm to 400 μm. More preferably, the length W ₈ of the second ceramic 223a may be 150 μm to 300 μm. The second ceramic 223a may be disposed on a side in contact with the heating element.

Second ceramic in a longitudinal first direction (X axis direction) to the length (W ₈₎ that the first direction (X axis direction) of not more than 50um poor withstand voltage characteristic, the second ceramic (223a) of (223a) (W ₈ ) is 500 μm or more, there is a limit in that cracks occur in the second substrate 223 when the second ceramic 223a is formed through thermal spraying or when the heater operates at a high temperature. In addition, heat from the heating element 222 is not efficiently transferred to the second substrate 223 , and the process time for forming the second ceramic 223a increases, thereby reducing efficiency in manufacturing the heater.

_{The second substrate 223 may have a length W 7} of 0.1 mm to 3 mm in the first direction (X-axis direction). Preferably, the length W ₇ of the second substrate 223 may be 0.2 mm to 2 mm. More preferably, the length W ₇ of the second substrate 223 may be 0.3 mm to 1.5 mm.

The second substrate 223 may have a smaller length or the same length in the first direction (X-axis direction) than the first substrate 221 . (Hereinafter, the thickness means a length in the first direction (X-axis direction)) When the thickness of the first substrate 221 is greater than the thickness of the second substrate 223 , the first ceramic is formed on the first substrate 221 . It is possible to prevent bending of the heater core 220 while forming the 221a , the heating element 222 , and the second ceramic 223a at a high temperature. That is, by making the thickness of the first substrate 221 greater than the thickness of the second substrate 223 , the bending of the heater core 220 can be easily prevented.

For example, a length ratio of the minimum length of the second substrate 223 to the minimum length of the first substrate 221 in the first direction (X-axis direction) may be 1:1.1 to 1:10. Preferably, the length ratio may be 1:1.8 to 1:8, more preferably 1:4 to 1:6. According to this configuration, the thickness of the second substrate 223 may be sufficient to accommodate the supporting force of the heat dissipation fin 210 when the heat dissipation fin 210 and the second substrate 223 are coupled.

When the ratio of the length of the minimum length of the second substrate 223 to the minimum length of the first substrate 221 in the first direction (X-axis direction) is less than 1:1.1, the first substrate ( 221), there is a limit that cannot cover the side. And when the ratio of the minimum length of the second substrate 223 to the minimum length of the first substrate 221 in the first direction (X-axis direction) is greater than 1:10, the volume of the heater core increases and the heating element 222 ) is not sufficiently transferred to the first substrate 221 , and there is a limit in which the first substrate 221 and the second substrate 223 are detached by force.

_{When the length W 7 of} the second substrate 223 in the first direction (X-axis direction) is less than 0.1 mm, when it is connected to the heat dissipation fin 210 , the supporting force for the heat dissipation fin 210 is low and the protection against external force is reduced. there is a limit to _{When the length W 7 of} the second substrate 223 in the first direction (X-axis direction) is greater than 3 mm, there is a limit in that heat transfer to the heat dissipation fins 210 is reduced.

With this configuration, the heating element 222 may be disposed between the first ceramic 221a and the second ceramic 223a and may be disposed to face each other with respect to the heating element 222 .

내지

일 수 있다.And the first ceramic 221a and the second ceramic 223a have a coefficient of thermal expansion.

inside

can be

In addition, as described above, the first ceramic 221a and the second ceramic 223a may be formed to face each other on one surface of the first substrate 221 and the second substrate 223 with the heating element 222 interposed therebetween. have.

The first ceramic 221a and the second ceramic 223a may surround the heating element 222 . Due to this configuration, even when the heating element 222 generates heat, the heating element 222 is separated from the first ceramic 221a and the second ceramic 223a in the first ceramic 221a and the second ceramic 223a disposed on both sides. can be prevented from being

내지

일 수 있다. 이와 달리, 제1 기판(221)과 제2 기판(223)이 알루미늄을 포함하는 경우 제1 기판(221)과 제2 기판(223)의 열팽창계수와 제1 세라믹(221a)과 제2 세라믹(223a)의 열팽창계수의 계수비는 3:1일 수 있다. The first ceramic 221a and the second ceramic 223a _{may be made of aluminum oxide (Al 2} O ₃ ). In this case, the first ceramic 221a and the second ceramic 223a have a coefficient of thermal expansion of 4.5.

inside

can be In contrast, when the first substrate 221 and the second substrate 223 include aluminum, the coefficients of thermal expansion of the first substrate 221 and the second substrate 223 and the first ceramic 221a and the second ceramic ( 223a) may have a coefficient ratio of the coefficient of thermal expansion of 3:1.

In addition, the heating element 222 and the first ceramic 221a may be formed between the first substrate 221 and the second substrate 223 , and the heating element 222 may be formed between the thickness of the first substrate 221 and the second substrate. When the thicknesses of 223 are different from each other, they may be positioned on one surface of the first substrate 221 having the maximum thickness. At this time, since the coefficient of thermal expansion of the one surface on which the heating element 222 is located of the first substrate 221 is different from the coefficient of thermal expansion of the first ceramic 221a, the first substrate 221 has the one surface or the other surface. can be bent towards

In the heater core 220 of the present invention, the heating element 222 may be positioned between the first ceramic 221a and the second ceramic 223a. For example, the first substrate 221 and the second substrate 223 are disposed symmetrically in the second direction (Z-axis direction) with respect to the heating element 222 to prevent bowing caused by a difference in thermal expansion coefficient. can

Referring to FIG. 4B , a heater core according to another exemplary embodiment includes a first ceramic 221a, a heating element 222 and a second ceramic ( 223a) may be formed in this order. For example, the first ceramic 22a , the heating element, and the second ceramic 223a may be symmetrically formed on both sides of the first substrate 221 with respect to the first substrate 221 .

The heating element 222 is formed symmetrically with respect to the first substrate 221 , so that heat generated from the heating element 222 may be transferred to the first substrate in a balanced manner. Accordingly, the occurrence of warpage of the heater core is reduced, and the first substrate 221 receives heat from the heating elements 222 on both sides when the same voltage is applied than when the heating elements are formed on only one side of the first substrate 221 . Thermal efficiency may be improved. Table 1 is a table of whether substrate warpage occurs and the surface temperature of the heat generating module 200 according to Comparative Examples and Examples.

When the first and second ceramics and the heating element are formed only on one surface of the first substrate based on the first substrate When the first and second ceramics and the heating element are formed on both sides based on the first substrate Power module applied voltage (V) Bending distance when the heater core is bent 5mm 0.1mm or less 300 Heating module surface temperature (℃) 120 130 50

Referring to Table 1, in contrast to the case in which the first and second ceramics 221a and 223a and the heating element 222 are formed only on one surface based on the first substrate 221, the first and second ceramics 221a and 223a and the heating element 222 are formed on both sides of the first substrate 221 as the reference. 1, 2 It can be seen that when the ceramics 221a and 223a and the heating element 222 are formed, the warpage is improved and the surface temperature of the heating module 200 is increased.

In addition, the first ceramic 221a and the second ceramic 223a may be insulating. According to this configuration, the first ceramic 221a electrically insulates between the heating element 222 and the first substrate 221 , or the second ceramic 223a connects between the heating element 222 and the second substrate 223 . can be electrically insulated. Accordingly, it is possible to prevent an electrical accident from occurring, thereby improving electrical reliability.

Referring to FIG. 5 , as described above, the heating element 222 extends in the second direction (Z-axis direction) as a resistor line, and then turns up (curved or curved) in the third direction (Y-axis direction). bent) may be a repeated structure. Here, the third direction (Y-axis direction) is a direction perpendicular to the first direction (X-axis direction) and the second direction (Z-axis direction), which will be applied hereinafter. With this configuration, the surface area of the heating element 222 may be improved, thereby improving heating characteristics. However, the heating element 222 is not limited to this shape and may have various shapes.

The length P in the third direction (Y-axis direction) of the heating element 222 may be 0.5 mm to 6 mm, preferably 0.8 mm to 4 mm, more preferably 1 mm to 2 mm.

When the length P in the third direction (Y-axis direction) of the heating element 222 is less than 0.5 mm, the heating element 222 has a limit in which it is difficult to secure the heating characteristic. In addition, there is a problem that an electric short occurs when the heater is operated.

When the length P of the heating element 222 in the third direction (Y-axis direction) is greater than 6 mm, the current density increases to impair the heating characteristics, and there is a limit in that it is difficult to achieve weight reduction by increasing the thickness of the entire heater. In addition, there is a problem of hindering design freedom due to a large volume when mounted on a vehicle or the like.

The heating element 222 may be disposed on the first ceramic 221a in a first direction (X-axis direction) of the first ceramic 221a and the second ceramic 223a. It can also be placed on the centerline. With this configuration, the heating element 222 may uniformly provide heat to the first substrate 221 and the second substrate 223 , respectively. In addition, the heating element 200 may prevent the separation of the heating element 222 from the first substrate 221 or the second substrate 223 due to an increase in internal stress according to an imbalance in heat transfer.

6 is a view illustrating various shapes of the heating element 222 .

Referring to FIG. 6 , it may be formed on the first substrate 221 through printing, patterning, coating, or thermal spraying. For example, the heating element 222 is formed to repeat a pattern extending in a first direction and then turned up to extend in a second direction opposite to the first direction as shown in FIG. 6( a ), or FIG. It may be formed in a zigzag shape as shown in 6(b), or may be formed in a spiral shape as shown in FIG. 6(c). As such, the heating element 222 may include a plurality of heating patterns 222-1 and 222-2 that are connected in a predetermined pattern and are spaced apart from each other.

The plurality of heating patterns 222 - 1 and 222 - 2 are spaced apart from each other, and a heat conductor (not shown) may be disposed in the spaced region between the plurality of heating patterns 222 - 1 and 222 - 2 . As the area on which the heating element 222 is printed increases, the amount of heat generated by the first substrate 221 and the second substrate 223 may increase. In this specification, the heating element 222 may be used interchangeably with a resistor, a heating pattern, and the like.

In addition, the surface area of the heating element 222 may vary by 10% or more, 50% or more, or 70% or more of the upper surface area of the first substrate 221 . Accordingly, the heating efficiency can be improved by expanding the heating region on the first substrate 221 .

A heat conductor (not shown) may be disposed between the heating patterns 222-1 and 222-2 disposed on the first substrate 221 . In addition, a heat conductor (not shown) may be further disposed outside the heating element 222 . In this case, the area of the thermal conductor (not shown) disposed on the first substrate 221 may be 0.5 times or more of the area of the heating element 222 . When the area of the thermal conductor (not shown) is less than 0.5 times the area of the heating element 222 , the thermal conductivity of heat generated from the heating element 222 may be low.

7A is a plan view of a heater core according to another embodiment, and FIGS. 7B and 7C are modified examples of FIG. 7A .

Referring to FIG. 7A , the first substrate 221 may have a length W ₉ of 10 mm to 20 mm in the third direction (Y-axis direction). In addition, the second substrate 223 may have a length W ₁₀ of 11 mm to 23 mm in the third direction (Y-axis direction).

One of the first substrate 221 and the second substrate 223 may have a longer length in the third direction (Y-axis direction) than the other. For example, the length W ₉ of the first substrate 221 in the third direction (Y-axis direction) may be smaller than the _{length W 10 of the second substrate 223 in the third direction (Y-axis direction).} .

In addition, any one of the first substrate 221 and the second substrate 223 may include a protrusion formed to protrude in a direction facing the other substrate. For example, the protrusion 223b may be formed to protrude in the first direction (X-axis direction) from one surface of the second substrate 223 . The protrusion 223b may cover side surfaces of the first ceramic 221a and the second ceramic 223a. Here, the side surface may be any one of both surfaces that are maximally spaced apart in the third direction (Y-axis direction).

The protrusion 223b may protect the first substrate 221 , the first ceramic 221a , the heating element 222 , and the second ceramic 223b from the outside.

Also, the protrusion 223b may be supported by the frame 223c and protrude from one surface of the frame 223c in the first direction (X-axis direction). Also, the protrusion 223b may extend from the frame portion 223c of the second substrate 223 in the first direction (X-axis direction).

_{The protrusion 223b has a length W 11} in the first direction (X-axis direction) in the first direction (X-axis direction) of the first ceramic 221a, the heating element 222, and the second heating element 223b. W ₁₂ ) may be equal to or greater than that of W 12 ). The protrusion 223b may surround side surfaces of the first ceramic 221a and the second ceramic 223a.

The protrusion 223b may contact one surface of the first substrate 221 , through which the first substrate 221 and the second substrate 223 may be coupled, and physical stability of the heater core may be secured. have.

In addition, the bonding force between the first substrate 221 and the second substrate 223 may be improved, and the separation of the heating element 222 from the first and second substrates 221 and 223 due to heat may be prevented. . In addition, it is possible to protect the ceramic and the heating element 222 from moisture or external force.

In addition, as shown in FIG. 4B , the first ceramic 221a, the second ceramic 223a, and the heating element 222 may be formed on both sides of the first substrate 221 . In this case, the second substrate 223 may be the first It is disposed on both sides of the substrate, and the protrusion 223b of the second substrate 223 may protrude toward the first substrate 22 .

Referring to FIG. 7B , as shown in FIG. 7A , the length W _{9 of} the first substrate 221 in the third direction (Y-axis direction) may be 10 mm to 20 mm. In addition, the second substrate 223 may have a length W ₁₀ of 11 mm to 23 mm in the third direction (Y-axis direction).

As described with reference to FIG. 7A , one of the first substrate 221 and the second substrate 223 may include a protrusion formed to protrude in a direction facing the other substrate. For example, the protrusion 223b may be formed to protrude in the first direction (X-axis direction) from one surface of the second substrate 223 . The protrusion 223b may cover side surfaces of the first ceramic 221a and the second ceramic 223a. Here, the side surface may be any one of both surfaces that are maximally spaced apart in the third direction (Y-axis direction).

When the second substrate 223 is manufactured, the protrusion 223b is formed by manufacturing the frame portion 223c and the protrusion 223b as a single substrate, and then forming both ends of the second substrate 223 in the third direction (Y-axis direction). It may be formed by bending in one direction (X-axis direction). Accordingly, the second substrate 223 including both the protrusion 223b and the frame 223c may be efficiently manufactured.

Also, the protrusions 223b positioned on both sides of the second substrate 223 may have the same _{length W 15 in the first direction (X-axis direction).} Preferably, the protrusions 223b on both sides may have a length ratio of 1:0.9 to 1:1.1 times each other due to a process error.

In addition, the protrusion 223b may remove a portion in which the first ceramic 221a and the second ceramic 223b of the first substrate 221 are exposed in the third direction (Y-axis direction). With this configuration, the first substrate 221 , the first ceramic 221a , and the second ceramic 223b form flat both sides in the third direction (Y-axis direction), and the first ceramic 221 from external impact. , it is possible to easily protect the second ceramic 223b.

In addition, the protrusion 223b has a length in the first direction (X-axis direction) that is greater than the lengths of the first ceramic 221a , the heating element 222 , and the second ceramic 223b , and includes the first ceramic 221a and the heating element. 222 may be smaller than the length of the second ceramic 223b and the first substrate 221 . With this configuration, the bonding force between the first substrate 221 and the second substrate 223 may be improved.

For example, the second substrate 223 may completely or partially cover the side surface of the first substrate 221 by the protrusion 223b. When the second substrate 223 covers the side surface of the first substrate 221 , the protrusion 223b of the second substrate 223 has an area of 30% to 100% of the area of the side surface of the first substrate 221 . The side surface of the first substrate 221 may be covered. The area ratio of the protrusion 223b covering the side surface of the first substrate 221 may be preferably 50% to 90%, more preferably 60% to 80%. In an embodiment, the length in the first direction (X-axis direction) in the region where the protrusion 223b contacts the first substrate 221 is 30 of the length in the first direction (X-axis direction) of the first substrate 221 . % to 100%. Preferably, it may be 50% to 90%, more preferably 60% to 80%.

When the length of the protrusion 223b in the first direction (X-axis direction) in the area in contact with the first substrate 221 is less than 50% of the length in the first direction (X-axis direction) of the first substrate 221 Since the bonding force between the first substrate 221 and the second substrate 223 is reduced, the first gipin 221 and the second substrate 223 may be physically separated from each other. In the region where the protrusion 223b contacts the first substrate 221 , the length in the first direction (X-axis direction) is 80% to 100% of the length in the first direction (X-axis direction) of the first substrate 221 . %, the length of the protrusion 223b may be controlled within a corresponding range in the manufacturing process in order to control thermal efficiency.

A first ceramic 221a , a heating element 222 , and a second ceramic 223a may be formed on the first substrate 221 . As described above, the heating element 222 may be disposed between the first ceramic 221a and the second ceramic 223a. The second ceramic 223a may be formed on the first ceramic 221a and the heating element 222 by a thermal spraying method.

For example, the second ceramic 223a may be formed on the first ceramic 221a instead of the second substrate 223 even though it is formed by thermal spraying at high temperature and high pressure. Since the second ceramic 223a is not in contact with the second substrate 223 , the influence of high temperature and high pressure applied during the formation of the second ceramic 223a on the second substrate 223 may be reduced. On the other hand, when the first ceramic 221a and the second ceramic 223a are formed on the first substrate 221 , the first substrate 221 is affected by high temperature, and thus, in order to prevent warping, The length can be increased in the (X-axis direction).

_{Accordingly, the minimum length W 14} in the first direction (X-axis direction) of the second substrate 223 according to the embodiment is the minimum length W in the first direction (X-axis direction) of the first substrate 221 . - ₁₃ ) may be smaller.

_{For example, the minimum length W 14} in the first direction (X-axis direction) of the second substrate 223 is It may be 0.1 mm to 3 mm. _{In addition, the minimum length W-13} in the first direction (X-axis direction) of the first substrate 221 may be 1 mm to 3 mm.

In addition, a length ratio of the minimum length of the first substrate 221 to the minimum length of the second substrate 223 in the first direction (X-axis direction) may be 1:0.1 to 1:1. Preferably, the length ratio is 1:0.15 to 1:0.5, more preferably the length ratio is 1:0.2 to 1:0.4.

When the length ratio of the length of the first substrate 221 to the length of the second substrate 223 in the first direction (X-axis direction) is less than 1:0.1, the heat dissipation fin 210 attached to the second substrate 223 is supported. However, there is a limit in which the second ceramic 223a is influenced by an external force from the outside.

When the length ratio of the length of the first substrate 221 to the length of the second substrate 223 in the first direction (X-axis direction) is greater than 1:1, the bending of the first substrate 221 causes the heating element 222 to generate. There is a limit in that heat is not easily transferred to the first substrate 221 and the second substrate 223 .

According to this configuration, the second substrate 223 can be prevented from being bent due to expansion due to high temperature, and at the same time, the volume and weight of the heater core 220 can be reduced. In addition, it is possible to provide a reduction in manufacturing cost.

Referring to FIG. 7C , as mentioned above, the heating element 222 may have various shapes. For example, it is possible to improve the thermal efficiency by securing the surface area of the heating element 222 to be 10% or more, 50% or more, or 70% or more compared to the surface area of the first substrate 221, and at the same time control the thermal efficiency of the heating module. there is also

8A is a cross-sectional view of a heater core according to another embodiment, and FIG. 8B is a modified example of FIG. 8A.

Referring to FIG. 8A , the heater core 220 according to another embodiment includes a first substrate 221 , a first ceramic 221a , a heating element 222 , a second ceramic 223a , an adhesive layer 224 , and a first substrate 221 . The two substrates 223 may be sequentially disposed.

The adhesive layer 224 may be disposed between one surface of the second substrate 223 and the second ceramic 223a. The adhesive layer 224 may transfer heat provided by the second ceramic 223a from the heating element 222 to the second substrate 223 . In this case, the length of the second substrate 223 in the first direction may be smaller than the length of the first substrate 221 . Accordingly, the weight of the heater core can be reduced. In addition, since the second substrate 223 is combined with the adhesive layer 224 disposed on one side, the supporting force for the heat dissipation fins (not shown) connected to the other side may be improved. Also, the adhesive layer 224 may protect the second ceramic 223a from external force.

Referring to FIG. 8B , the heater core 220 according to the modified example includes a first substrate 221 , a first ceramic 221a , a heating element 222 , an adhesive layer 224 , a second ceramic 223a , and a second substrate. 223 may be arranged in this order.

The adhesive layer 224 may be disposed between the second ceramic 223a and the heating element 222 to couple the second substrate 223 and the first substrate 221 on which the heating element 222 is formed. The adhesive layer 224 may be made of a material having a thermal expansion coefficient similar to that of the first ceramic 221a, and may easily transfer heat from the heating element 222 to the second ceramic 223a.

9A is a perspective view of a heat generating module according to another embodiment, and FIG. 9B is a modified example of FIG. 9A.

Referring to FIG. 9A , a sensor 290 may be disposed on the heater core. The sensor 290 may include a temperature sensor. The sensor 290 may be disposed on one side of the heater core. However, it is not limited to this position, and the sensor may be disposed on a support (not shown) formed in the middle of the heater core.

For example, in order to accurately measure the temperature of the heater core, the sensor 290 may be disposed on the surface where the fluid is discharged. In addition, the temperature sensor may include at least one of a thermostat and a thermocouple. However, it is not limited to this type.

With this configuration, the sensor 290 may sense the temperature of the region where the fluid is discharged. Due to this, by accurately measuring the temperature of the fluid discharged through the outlet, the user may be able to control the heater 1000 more immediately.

Referring to FIG. 9B , the sensor may be disposed within the heater core. For this reason, it is possible to protect the sensor from external impact. However, it is not limited to this position and may be disposed on one side of the heater.

10A is a cross-sectional view illustrating a connection part 226 according to the embodiment, and FIGS. 10B and 10C are top views of FIG. 10A .

Referring to FIG. 10A , the connection part 226 may be disposed on the first ceramic 221a. The connection part 226 may be formed to extend in the second direction (Z-axis direction) of the first substrate 221 , but is not particularly limited thereto.

The heating element 222 may be disposed on the first ceramic 221a. The heating element 222 may be disposed on the first ceramic 221a in various shapes.

Referring to FIG. 10A-1 , the heating element 222 may partially cover the connection part 226 . The second ceramic 223a may also be disposed on the heating element 222 . The second ceramic 223a may have the same length in the second direction (Z-axis direction) as the length of the heating element 222 . With this configuration, the second ceramic 223a may receive all of the heat generated by the heating element 222 , so that the thermal efficiency of the heater core may be improved.

In addition, the heating element 222 may extend to cover the connection part 226 in the second direction (Z-axis direction). The heating element 222 may overlap the connection part 226 in the first direction (X-axis direction). _{In addition, the heating element 222 has a maximum length W 18} in the second direction (Z-axis direction) in the area overlapping the connection part 226 in the first direction (X-axis direction) in the second direction (Z-axis direction). It may be 10% or more, 50% or more, or 80% or more of the maximum length W _{17 of the connection part 226 .} With this configuration, the length of the heating element 222 in the second direction (Z-axis direction) increases, and the total area of the heating element 222 increases, thereby improving the thermal efficiency of the heater core.

With this configuration, the surface area of the heating element relative to the upper surface area of the first substrate 221 may be formed to be 10% or more, 50% or more, or 80% or more. Accordingly, the thermal efficiency of the heater core can be greatly improved.

Referring to FIG. 10A-2 , the heating element 222 may be partially covered by the connection part 226 . Also, the second ceramic 223a may be disposed on the heating element 222 . The second ceramic 223a may partially cover the heating element 222 .

Similar to FIG. 10A-1 , the heating element 222 may overlap the connection part 226 in the first direction (X-axis direction). _{In addition, the heating element 222 has a maximum length W 19} in the second direction (Z-axis direction) in the area overlapping the connection part 226 in the first direction (X-axis direction) in the second direction (Z-axis direction). It may be 10% or more, 50% or more, or 80% or more of the maximum length W _{17 of the connection part 226 .} With this configuration, the length of the heating element 222 in the second direction (Z-axis direction) increases, and the total area of the heating element 222 increases, thereby improving the thermal efficiency of the heater core.

With this configuration, the surface area of the heating element relative to the upper surface area of the first substrate 221 may be formed to be 10% or more, 50% or more, or 80% or more. Accordingly, the thermal efficiency of the heater core can be greatly improved.

In addition, the connection part 226 and the heating element 222 may include a contact area in the first direction (X-axis direction). Accordingly, electrical separation occurring between the connection part 226 and the heating element 222 may be prevented and electrical reliability may be improved.

In addition, one surface of the second ceramic 223a in the first direction (X-axis direction) may form the same surface as the one surface of the electrode part 225 . With this configuration, structural stability can be improved.

10B and 10C are top views of FIG. 10A , and FIG. 10B is a view in which the second ceramic 223a positioned on the uppermost surface of FIG. 10C is removed.

10B and 10C , both ends of the heating element 222 may be electrically connected to the connection part 226 . In addition, the connection part 226 may include first and second connection members 226a and 226b having different polarities. For example, both ends of the heating element 222 may be connected to the first and second connecting members 226a and 226b, respectively.

_{In addition, the length W 21} in the third direction (Y-axis direction) of the heating element 222 may be formed to be 10%, 50%, or 80% or more of _{the length W 20} of the first connecting member 226a. . Since the heating element 222 is formed by thermal spraying as described above, the length of the heating element 222 can be easily increased to improve the contact area between the heating element 222 and the connection part 226. For example, the heating element 222 is a first ceramic ( 221a) can be sprayed using a metal mask as much as a desired area. That is, the heating element 222 having a desired area may be formed on the first ceramic 221a according to the area of the opening region of the mask. Accordingly, the area where the connection part 226 and the heating element 222 overlap in the first direction (X-axis direction) is also formed to be 10%, 50%, or 80% or more, so that electrical conductivity and electrical reliability can be improved. In addition, by increasing the overlapping area, the coupling force between the connection part 226 and the heating element 222 may be improved.

In addition, the heating element 222 disposed on the first ceramic 221a may be formed to extend in the second direction (Z-axis direction) to have a plurality of columns. In addition, the heating element 222 may include a pattern protruding in the third direction (Y-axis direction) to improve the thermal efficiency of the heater from a wide heating area.

11 is an exploded perspective view of a heater according to the embodiment.

Referring to FIG. 11 , the power module 300 may be disposed under the case 100 . The power module 300 may be coupled to the case 100 . The power module 300 may be electrically connected to the heating module. The power module 300 may control the intensity, direction, wavelength, etc. of the current supplied to the heating module. The power module 300 may be charged or supplied with power by being connected to an external power supply device by a conductive line (not shown).

The power module 300 may have a block shape and include a case guide part 310 , a connection terminal part 320 , a first connection terminal 330 , and a second connection terminal 340 .

The case guide part 310 may be formed in the center of the upper surface of the power module 300 . The case guide unit 310 may have a rectangular groove or hole shape, and a connection terminal unit 320 may be formed therein. In this case, a groove or hole corresponding to the lower portion of the case 100 may be formed by the square groove or hole of the case guide part 310 and the sidewall of the connection terminal part 320 . Accordingly, the case 100 may be guided in the form of being inserted into the case guide unit 310 . As a result, the power module 300 may be aligned and disposed under the case 100 . In this case, the lower portion of the case 100 and the power module 300 may be coupled. Various methods such as mechanical (screws, etc.), structural (intercalation, etc.), adhesion (adhesive layer), etc. may be used for the coupling method between the case 100 and the power module 300 .

The connection terminal part 320 may be a support formed in the inner center of the case guide part 310 . A connection terminal groove 321 may be formed in the center of the connection terminal part 320 . A plurality of first and second connection terminals 330 and 340 may be arranged on the bottom surface of the connection terminal groove 321 .

The first and second connection terminals 330 and 340 may be plural. The first and second connection terminals 330 and 340 may be spaced apart from each other in the front-rear direction. In this case, the first connection terminal 330 may be disposed in the front. In addition, the second connection terminal 340 may be disposed at the rear. The first and second connection terminals 330 and 340 may be in the form of plates having front and rear surfaces. The plurality of first and second connection terminals 330 and 340 may correspond one-to-one with the plurality of heater cores 220 . The plurality of first and second connection terminals 330 and 340 may be opposite to each other in a one-to-one correspondence with the plurality of first and second electrode terminals 225a and 225b. Therefore, when the case 100 and the power module 300 are coupled, the first connection terminal 330 may be coupled to the corresponding first electrode terminal 225a. In addition, the second connection terminal 340 may be coupled to the corresponding second electrode terminal 225b. In this case, the first connection terminal 330 may be interposed between the first binding member 225c and the second binding member 225d of the first electrode terminal 225a. Therefore, the first connection terminal 330 and the first electrode terminal 225a may be electrically connected to each other by being pinched or assembled. Also, the second connection terminal 340 may be interposed between the third binding member 226c and the fourth binding member 226d of the second electrode terminal 225b. Therefore, the second connection terminal 340 and the second electrode terminal 225b may be electrically connected to each other by being pinched or assembled.

12A to 12C are flowcharts illustrating a method of manufacturing a heater core according to an embodiment.

Referring to FIG. 12A , a first substrate 221 may be provided. In addition, a first ceramic 221a may be formed on the first substrate 221 . As described above, the first substrate 221 may include a metal having high conductivity. For example, the first substrate 221 and the second substrate 223 may include Al, Cu, Ag, Au, Mg, stainless steel, or the like. However, it is not limited to these materials.

The first ceramic 221a may be formed by coating an insulating layer such as aluminum oxide or magnesium oxide by anodizing or thermal spraying. The first ceramic 221a includes a material having insulation and thermal conductivity, and the material is not particularly limited.

For example, thermal spraying may be performed through welding in a state in which the first substrate 221 is molten, but is not particularly limited thereto. Also, the first ceramic 221a may be integrally coupled to the first substrate 221 , and a portion of the first substrate 221 may be oxidized.

In addition, as mentioned above, the first ceramic 221a can easily conduct heat and have a lower coefficient of thermal expansion than that of the substrate, so that warpage of the substrate can be prevented.

Referring to FIG. 12B , a heating element 222 may be disposed on the first ceramic 221a. The heating element 222 may be formed on the first ceramic 221a through coating, printing, or thermal spraying. The heating element 222 includes nickel-chromium (Ni-Cr), tungsten (W), molybdenum (Mo), nickel (Ni), chromium (Cr), copper (Cu), rubidium (Ru), silver (Ag), and ITO. (Indium Tin Oxide) and barium titanate (BaTiO), CNT, graphite, may include any one of carbon black.

Referring to FIG. 12C , the second ceramic 223a and the second substrate 223 may be formed on the heating element 222 and the first ceramic 221a.

For example, the first ceramic 221a, the heating element 222, and the second ceramic 223a are formed on the first substrate 221 in the order of the first ceramic 221a, the heating element 222, and the second ceramic 223a. It can be formed through a warrior. In addition, the second substrate 223 may be positioned on the second ceramic 223a.

As described above, the second substrate 223 may include a protrusion, and by disposing an adhesive layer between the second substrate 223 and the second ceramic 223a, the second substrate 223 and the first substrate ( 221) can be combined.

The adhesive layer may be made of a glass material, and may provide a bonding function through heat treatment at 500°C to 600°C. In addition, the adhesive layer can improve durability by blocking the insulating function and moisture.

In addition, after the second ceramic 223a is formed on the second substrate 223 in the same manner as the above-described method of forming the first ceramic 221a on the first substrate 221 , the second ceramic 223a is formed. and the heating element 222 may be combined. The second ceramic 223a and the heating element 222 may be bonded to each other through an adhesive layer between the second ceramic 223a and the heating element 222 , but the bonding method is not limited thereto.

Additionally, the combined first substrate 221 and the second substrate 223 may be covered with a cover part. In addition, the first substrate 221 and the second substrate 223 may be combined with the heat dissipation fins using silver epoxy, silicone resin, or the like. In addition, the first substrate 221 and the second substrate 223 may be coupled to the heat dissipation fins by a brazing method, and the coupling method is not particularly limited.

13 is a conceptual diagram illustrating a heating system according to an embodiment.

Referring to FIG. 13 , the heating system 2000 of this embodiment may be used in various moving means. Here, the means of transportation is not limited to vehicles running on land, such as automobiles, and may include ships, airplanes, and the like. However, in the following, a case in which the heating system 2000 of the present embodiment is used in a vehicle will be described as an example.

The heating system 2000 may be accommodated in an engine room of a vehicle. The heating system 2000 may include an air supply unit 400 , a flow path 500 , an exhaust unit 600 , and a heater 1000 .

Various air supply devices such as a blower fan and a pump may be used as the air supply unit 400 . The air supply unit 400 moves the fluid from the outside of the heating system 2000 to the inside of the flow path 500 to be described later, and may move along the flow path 500 .

The flow path 500 may be a passage through which a fluid flows. The air supply unit 400 may be disposed on one side of the flow path 500 , and the exhaust unit 600 may be disposed on the other side of the flow path 500 . The flow path 500 may air-conditionally connect the engine room and the interior of the vehicle.

A blade that can be opened and closed may be used as the exhaust unit 600 . The exhaust unit 600 may be disposed on the other side of the flow path 500 . The exhaust unit 600 may communicate with the interior of the vehicle. Accordingly, the fluid moving along the flow path 500 may be introduced into the interior of the vehicle through the exhaust unit 600 .

As the heater 1000 of the heating system 2000, the heater 1000 of the present embodiment described above may be used. Hereinafter, a description of the same technical idea will be omitted. The heater 1000 may be disposed in the form of a partition wall in the middle of the flow path 500 . In this case, the front and rear of the heater 1000 may be in the same or similar direction to the front and rear of the vehicle. The cold fluid in the engine room supplied to the flow path 500 through the air supply unit 400 is heated while passing through the heater 1000 from the front to the rear, and then flows again along the flow path 500 through the exhaust unit 600 . It can be supplied indoors.

Additionally, unlike the conventional PCT thermistor, the heater 1000 of the present embodiment may conduct heat by a heating element disposed between the first ceramic and the second ceramic. In addition, it is possible to increase the thermal efficiency by using the high calorific value of the heating element. In addition, it is possible to achieve thermal stability and improve thermal efficiency and reliability by covering the high calorific value of the heating element with the first and second ceramics having a high heat transfer rate.

Furthermore, the heater 1000 of this embodiment is free from heavy metal materials such as lead (Pb), so it is environmentally friendly and may be lightweight.

Although the embodiment has been described above, it is only an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are not exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

1000: heater
2000: heating system
100: case
200: heat module
210: heat dissipation fin
220: heater core
221: first substrate
221a: first ceramic
222: heating element
223: second substrate
223a: second ceramic
224: adhesive layer
225: electrode part
225a: first electrode terminal
225b: second electrode terminal
230: first gasket
231: first receiving unit
240: second gasket
241: second accommodation unit
300: power module

Claims (12)

a first substrate;
a second substrate; and
A first ceramic and a second ceramic and a heating element disposed between the first substrate and the second substrate,
The heating element is disposed between the first ceramic and the second ceramic,
A minimum length of the first substrate in a first direction is greater than a minimum length of the second substrate, and the first direction is a thickness direction;
The first ceramic, the heating element, and the second ceramic are formed on the first substrate,
The heater core further comprising an adhesive layer disposed between the second substrate and the second ceramic.
According to claim 1,
A ratio of the minimum length of the second substrate to the minimum length of the first substrate in the first direction is 1:1.1 to 1:10.
According to claim 1,
The length of the first substrate in the second direction is smaller than the length of the second substrate,
The second direction is a direction perpendicular to a thickness direction of the heater core.
According to claim 1,
The second substrate is a heater core covering the first ceramic, the second ceramic, and side surfaces of the first substrate.
The method of claim 1
The second substrate includes a protrusion extending in the first direction,
The first direction is a thickness direction of the heater core.
6. The method of claim 5,
A heater core in which a length of the protrusion in the first direction is greater than a length of the first ceramic, the heating element, and the second ceramic.
6. The method of claim 5,
The protrusion is a heater core in contact with a side surface of the first substrate.
According to claim 1,
The first ceramic, the heating element, and the second ceramic are disposed on both surfaces of the first substrate.
According to claim 1,
The first substrate and the second substrate include any one of Al, Cu, Ag, Au, Mg, SUS and stainless steel,
The first ceramic and the second ceramic may include oxygen (O) and nitrogen ( A heater core comprising at least one of N).
power module; and
Including; a heating module that is electrically connected to the power module to generate heat;
The heating module is
A plurality of heat dissipation fins and a plurality of heater cores are alternately arranged,
The heater core is
a first substrate;
a second substrate; and
A first ceramic and a second ceramic and a heating element disposed between the first substrate and the second substrate,
The heating element is disposed between the first ceramic and the second ceramic,
A minimum length of the first substrate in a first direction is greater than a minimum length of the second substrate, and the first direction is a thickness direction of the heater core,
The first ceramic, the heating element, and the second ceramic are formed on the first substrate,
The heater further comprising an adhesive layer disposed between the second substrate and the second ceramic.
11. The method of claim 10,
The plurality of heat dissipation fins further include an adhesive member disposed between the first substrate and the second substrate.
flow path through which air travels;
an air supply unit for introducing air;
an exhaust unit for discharging air into the interior of the moving means; and
and a heater disposed between the air supply part and the exhaust part in the flow path to heat the air,
The heater is
power module; and
Including; a heating module that is electrically connected to the power module to generate heat;
The heating module is
A plurality of heat dissipation fins and a plurality of heater cores are alternately arranged,
The heater core is
a first substrate;
a second substrate; and
A first ceramic and a second ceramic and a heating element disposed between the first substrate and the second substrate,
The heating element is disposed between the first ceramic and the second ceramic,
A minimum length of the first substrate in a first direction is greater than a minimum length of the second substrate, and the first direction is a thickness direction of the heater core,
The first ceramic, the heating element, and the second ceramic are formed on the first substrate,
The heating system further comprising an adhesive layer disposed between the second substrate and the second ceramic.

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