CN211152323U - 电路基板 - Google Patents

电路基板 Download PDF

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Publication number
CN211152323U
CN211152323U CN201920946804.9U CN201920946804U CN211152323U CN 211152323 U CN211152323 U CN 211152323U CN 201920946804 U CN201920946804 U CN 201920946804U CN 211152323 U CN211152323 U CN 211152323U
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CN
China
Prior art keywords
layer
main surface
resin
color
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920946804.9U
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English (en)
Chinese (zh)
Inventor
岩田朗宏
川田雅树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201920946804.9U 2018-06-25 2019-06-21 电路基板 Active CN211152323U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-119775 2018-06-25
JP2018119775A JP6981372B2 (ja) 2018-06-25 2018-06-25 回路基板の製造方法

Publications (1)

Publication Number Publication Date
CN211152323U true CN211152323U (zh) 2020-07-31

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ID=69100378

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920946804.9U Active CN211152323U (zh) 2018-06-25 2019-06-21 电路基板

Country Status (2)

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JP (1) JP6981372B2 (ja)
CN (1) CN211152323U (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220181A (ja) * 1990-11-05 1992-08-11 Mitsubishi Electric Corp レーザマーキング加工されたプリント基板およびその加工方法
JP3495627B2 (ja) * 1999-01-19 2004-02-09 イビデン株式会社 ビルドアップ多層プリント配線板およびその製造方法
JP3901430B2 (ja) * 2000-06-16 2007-04-04 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US6896944B2 (en) * 2001-06-29 2005-05-24 3M Innovative Properties Company Imaged articles comprising a substrate having a primed surface
JP2006225569A (ja) * 2005-02-21 2006-08-31 Techno Polymer Co Ltd レーザーマーキング用熱可塑性共重合体組成物及びマーキング部を備えた成形品
JP4867378B2 (ja) * 2005-02-21 2012-02-01 テクノポリマー株式会社 レーザーマーキング用の積層体
JP2007053352A (ja) * 2005-07-22 2007-03-01 Showa Denko Kk 発光ダイオード光源
JP2009056606A (ja) * 2007-08-30 2009-03-19 Toyo Ink Mfg Co Ltd レーザ光用記録材
KR101022871B1 (ko) * 2009-08-11 2011-03-16 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP4905612B2 (ja) * 2010-07-15 2012-03-28 東洋製罐株式会社 レーザーマーキングフィルム
WO2012096277A1 (ja) * 2011-01-12 2012-07-19 株式会社村田製作所 樹脂封止型モジュール
JP6099902B2 (ja) * 2012-08-29 2017-03-22 日本特殊陶業株式会社 配線基板の製造方法

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Publication number Publication date
JP2020004762A (ja) 2020-01-09
JP6981372B2 (ja) 2021-12-15

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