CN211152323U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN211152323U CN211152323U CN201920946804.9U CN201920946804U CN211152323U CN 211152323 U CN211152323 U CN 211152323U CN 201920946804 U CN201920946804 U CN 201920946804U CN 211152323 U CN211152323 U CN 211152323U
- Authority
- CN
- China
- Prior art keywords
- layer
- main surface
- resin
- color
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model provides a circuit substrate. A circuit board (10) is provided with: a resin substrate (110) which is composed of a thermoplastic resin layer on which circuit patterns (CP2, CP3) are formed, and which has a 1 st main surface (101) and a 2 nd main surface (102) that faces the 1 st main surface (101); and a color changing layer (130) formed on the 1 st main surface (101) of the resin substrate (110). The printing pattern (135) formed on the color-changing layer by light irradiation has a recessed portion. The bottom of the recessed portion is not in direct contact with the thermoplastic resin.
Description
Technical Field
The utility model relates to a circuit substrate with thermoplasticity.
Background
Conventionally, as shown in patent document 1, various structures have been devised in which printing is performed by irradiating a resin composition with laser light.
In the structure shown in patent document 1, an epoxy resin composition is used as an insulating coating material. Thus, when the resin surface is irradiated with laser light, printing is performed without degrading electrical characteristics and the like.
Prior art documents
Patent document
Patent document 1: japanese laid-open patent publication No. 4-28754
However, when printing is performed on a substrate made of a thermoplastic resin with the structure described in patent document 1, if laser irradiation with high thermal energy is performed, the substrate may be deformed due to the influence of the thermal energy.
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
Accordingly, an object of the present invention is to provide a structure for efficiently printing on a surface of a substrate having thermoplasticity.
Means for solving the problems
The utility model discloses a circuit substrate possesses: a resin substrate composed of a thermoplastic resin layer on which a circuit pattern is formed, and having a 1 st main surface and a 2 nd main surface opposed to the 1 st main surface; and a color changing layer formed on the 1 st main surface of the resin substrate. The print pattern formed on the color-changing layer by light irradiation has a recessed portion. The bottom of the recessed portion is not in direct contact with the thermoplastic resin.
In this structure, the print pattern is formed by irradiating light to the color-changing layer, thereby forming the recessed portion. Since the bottom of the recessed portion is not in direct contact with the thermoplastic resin layer, the thermoplastic resin layer is not directly irradiated with light, and the influence on the circuit board can be suppressed.
Effect of the utility model
According to the present invention, a structure for efficiently printing characters on a substrate surface having thermoplasticity can be provided.
Drawings
Fig. 1(a) is an external perspective view of a circuit board 10 according to embodiment 1, and fig. 1(B) is a cross-sectional view of the circuit board 10 according to embodiment 1.
Fig. 2 is an external perspective view showing a manufacturing process of the resin substrate 110.
Fig. 3(a) to 3(D) are external perspective views sequentially showing the manufacturing process of the circuit module 1 including the circuit board 10.
Fig. 4 is a flowchart showing a manufacturing process of the circuit board 10.
Fig. 5(a) is an external perspective view of the circuit board 10 according to embodiment 1, and fig. 5(B) is a cross-sectional view taken along line a-a of fig. 5 (a).
Fig. 6(a) is an external perspective view of the resin substrate 110A according to embodiment 2 having the protective layer 120A formed thereon, and fig. 6(B) is a plan view of fig. 6(a) as viewed from the 3 rd principal surface 103 side.
Fig. 7 is an external perspective view showing a manufacturing process of a resin substrate 110A according to embodiment 2.
Fig. 8(a) to 8(E) are external perspective views sequentially showing the manufacturing process of the circuit module 1A including the circuit board 10A.
Fig. 9 is a flowchart showing a manufacturing process of the circuit board 10A.
Description of the reference numerals
CP1 … electrode pattern;
CP2, cp3.. circuit pattern;
thickness;
d1.. depth;
d2... thickness;
1. 1a … circuit module;
10. 10a.
Mounting a substrate;
1 st major face;
102.. 2 major face;
103.. 3 rd major face;
110. a resin substrate;
111. 111A, 112, 113.. resin sheet;
120. a protective layer;
an opening;
mounting an electrode;
a color shifting layer;
a surface;
printing a pattern;
a recess;
a bottom;
a surface mount component;
an electrode for mounting.
Detailed Description
A plurality of modes for carrying out the present invention will be described below with reference to the drawings and specific examples. In the drawings, the same reference numerals are given to the same parts. The embodiments are separately shown for convenience in view of ease of explanation or understanding of the points, but partial replacement or combination of the structures shown in different embodiments can be made. In embodiment 2 and thereafter, descriptions of common matters with embodiment 1 are omitted, and only differences will be described. In particular, the same operational effects based on the same structure will not be mentioned successively in each embodiment. In the drawings shown in the following embodiments, the shapes of the respective components are partially or wholly exaggerated for ease of explanation.
(embodiment 1)
The circuit board according to embodiment 1 will be described with reference to the drawings. Fig. 1(a) is an external perspective view of a circuit board 10 according to embodiment 1, and fig. 1(B) is a cross-sectional view of the circuit board 10 according to embodiment 1. Fig. 2 is an external perspective view showing a manufacturing process of the resin substrate 110. Fig. 3(a) to 3(D) are external perspective views sequentially showing the manufacturing process of the circuit module 1 including the circuit board 10. Fig. 4 is a flowchart showing a manufacturing process of the circuit board 10. Fig. 5(a) is an external perspective view of the circuit board 10 according to embodiment 1, and fig. 5(B) is a cross-sectional view taken along line a-a of fig. 5 (a).
As shown in fig. 1(a) and 1(B), the circuit board 10 includes a resin substrate 110, a protective layer 120, and a color changing layer 130. The resin substrate 110 is a rectangular flat plate and includes a 1 st main surface 101 and a 2 nd main surface 102 opposed to each other.
The resin substrate 110 is a resin base material (thermoplastic resin) having thermoplasticity, and is a sheet material mainly made of, for example, a liquid crystal polymer (L CP). in the present embodiment, the resin substrate 110 is a laminate of a plurality of sheet materials, and is composed of a laminate body as a thermoplastic resin layer.
A plurality of circuit patterns CP2 and CP3 are formed inside the resin substrate 110. The circuit patterns CP2 and CP3 are conductor patterns such as Cu foil, for example. The mounting electrode 600 is formed on the 2 nd main surface 102 of the resin substrate 110. The mounting electrode 600 is used for mounting on another substrate or a mounting member.
The protective layer 120 is formed to abut against the 1 st main surface 101 of the resin substrate 110. The protective layer 120 has a smaller amount of deformation due to heat of light irradiation (e.g., UV irradiation) than the resin substrate 110, that is, the deformation temperature of the protective layer 120 is higher than that of the resin substrate 110. In other words, the protective layer 120 is made of a material having higher heat resistance than the resin substrate 110. Alternatively, the protective layer 120 is made of a thermosetting material. The protective layer 120 is, for example, an epoxy resin or a polyimide resin which is a thermosetting resin, and is formed by inkjet printing, screen printing, or the like.
The color changing layer 130 is formed on the 3 rd main surface 103 of the protective layer 120 on the opposite side to the 1 st main surface 101 side. In other words, the color changing layer 130 is formed on the resin substrate 110 with the protective layer 120 interposed therebetween. A printed pattern 135 is formed on the surface 131 (the surface opposite to the 3 rd main surface 103) of the color changing layer 130 by UV irradiation or the like.
The color changing layer 130 is formed of a material that changes color by UV irradiation. More specifically, the color-changing layer 130 includes acrylic resin, titanium oxide. The color-changing layer 130 can realize deterioration caused by UV irradiation of low energy by containing acrylic resin. The color changing layer 130 is formed of white color by containing titanium oxide. In addition, the valence number of titanium oxide contained in the color-changing layer 130 is changed by UV irradiation. Thereby, the portion of the color-changing layer 130 irradiated with UV changes to black. The UV irradiation is, for example, green laser using the 2 nd harmonic wave with a wavelength of 532 nm. This enables formation of a more precise print pattern 135.
The print pattern 135 is, for example, a two-dimensional bar code, and includes information related to manufacturing, a lot number, and the like.
As described above, the color changing layer 130 is preferably white, whereas the print pattern 135 is preferably black. This can improve the contrast of the printed pattern 135 with respect to the color-changing layer 130. That is, the print pattern 135 having a high resolution can be formed, and the print pattern 135 can be recognized more easily. However, the contrast between the color-changing layer 130 and the print pattern 135 can be recognized as long as the contrast is equal to or higher than a certain value.
With such a configuration, the printed pattern 135 can be formed on the color changing layer 130 (circuit board 10) by UV irradiation. This prevents the resin substrate 110 from being directly heated, and prevents the resin substrate 110 from being damaged by printing using UV irradiation. Further, by forming the protective layer 120 on the resin substrate 110, a portion to which a thermal load is easily applied can be protected, and a change in characteristics when the print pattern 135 is formed by UV irradiation can be further suppressed.
The protective layer 120 has higher heat resistance than the resin substrate 110, or the protective layer 120 is thermosetting, so that the protective effect of the resin substrate 110 is improved. Further, the protective layer 120 is thermosetting, and thus deformation of the protective layer 120 during UV irradiation is less likely to occur. Further, by using UV irradiation, printing with low energy can be performed, and clear printing that is easy to recognize can be realized without damaging the resin substrate 110.
A specific method for forming the resin substrate 110 will be described with reference to fig. 2. The resin substrate 110 has a structure in which a plurality of resin sheets 111, 112, and 113 are stacked. As described above, the resin sheets 111, 112, 113 have thermoplasticity. The resin sheet 111 has a 1 st major surface 101, and the resin sheet 113 has a 2 nd major surface 102. A plurality of circuit patterns CP2 are formed on the resin sheet 112, and a plurality of circuit patterns CP3 are formed on the resin sheet 113. The circuit pattern CP2 and the circuit pattern CP3 are connected by an interlayer connection conductor or the like.
The resin substrate 110 is integrally formed by heating and pressing the resin sheets 111, 112, 113.
The steps of manufacturing the circuit module 1 including the circuit board 10 are sequentially shown with reference to fig. 3(a) to 3 (D). As shown in fig. 3(a), the protective layer 120 is formed to abut on the 1 st main surface 101 of the resin substrate 110. The protective layer 120 has a 3 rd main surface 103. As described above, the 3 rd main surface 103 is a surface against which the resin substrate 110 does not abut.
As shown in fig. 3(B), the discoloring layer 130 is formed on the 3 rd main surface 103 of the protective layer 120.
As shown in fig. 3(C), a printed pattern 135 is formed by UV irradiation of the surface 131 of the color-changing layer 130.
As shown in fig. 3(D), the circuit board 10 is mounted on the mounting board 20. The circuit board 10 is mounted on the mounting board 20 via the mounting electrodes 600 (see fig. 1B) formed on the 2 nd main surface 102. Thereby, the circuit module 1 is realized.
The circuit board 10 having such a structure is manufactured by the following manufacturing method. Fig. 4 is a flowchart showing a method of manufacturing the circuit board 10 according to embodiment 1 of the present invention.
First, the resin substrates 110 are formed by heating and pressing the resin sheets 111, 112, 113 (S101). As described above, the resin sheet 111 has the 1 st major surface 101, and the resin sheet 113 has the 2 nd major surface 102.
Next, the protective layer 120 is formed on the 1 st main surface 101 side of the resin substrate 110 (S102).
Next, the discoloring layer 130 is formed on the 3 rd main surface 103 of the protective layer 120, in other words, on the surface side of the protective layer 120 which is not in contact with the resin substrate 110 (S103).
Next, UV irradiation is performed on the surface 131 of the color-changing layer 130 to form a print pattern 135 (S104).
Thus, by using the above-described manufacturing method, a portion to which a thermal load is likely to be applied when the print pattern 135 is formed by UV irradiation can be protected, and the circuit board 10 with high reliability can be manufactured. Further, the circuit board 10 on which the print pattern 135 is formed can be manufactured by a simple process.
A specific structure of the print pattern 135 formed by UV irradiation will be described with reference to fig. 5(a) and 5 (B). Fig. 5(B) is a cross-sectional view of the circuit board 10 shown in fig. 5(a) taken along line a-a. In addition, by UV irradiation to the surface 131 of the color-changing layer 130, the color-changing layer 130 is recessed from the surface 131 side. The recessed portion is a recess 136. At this time, the print pattern 135 is formed by the discolored portion.
As shown in fig. 5(B), in the print pattern 135, the depth of the concave portion 136 etched by UV irradiation is D1, and the thickness of the portion remaining in the discoloration layer 130 is D2. The bottom 137 of the recess 136 is the deepest portion formed by etching with UV irradiation.
In the case where the thickness D (D ═ D1+ D2) of the discoloration layer 130 is 25 μm, the depth D1 of the etched recess 136 is preferably formed in the range of about 5 ± 3 μm. Further, the thickness D2 of the remaining portion is preferably formed to be thicker than the depth D1 of the etched recess 136. More specifically, for example, the depth D1 of the recessed portion 136 is preferably set to 10 μm or less. This can suppress the influence of the heat irradiation on the resin substrate 110.
In this way, by leaving a predetermined thickness to etch, in other words, by not directly contacting the bottom 137 of the recessed portion 136 with the resin substrate 110, the resin substrate 110 can be protected from the thermal load, and the characteristic change at the time of forming the print pattern 135 by UV irradiation can be suppressed. That is, the reliability of the circuit board 10 is improved.
(embodiment 2)
The circuit board according to embodiment 2 will be described with reference to the drawings. Fig. 6(a) is an external perspective view of the resin substrate 110A according to embodiment 2 having the protective layer 120A formed thereon, and fig. 6(B) is a plan view of fig. 6(a) as viewed from the 3 rd principal surface 103 side. Fig. 7 is an external perspective view showing a manufacturing process of a resin substrate 110A according to embodiment 2. Fig. 8(a) to 8(E) are external perspective views sequentially showing the manufacturing process of the circuit module 1A including the circuit board 10A. Fig. 9 is a flowchart showing a manufacturing process of the circuit board 10A.
The circuit board 10A in the present embodiment is different from the circuit board 10 according to embodiment 1 in that: an electrode pattern CP1 is formed on the resin substrate 110A; an opening 125 is formed in the protective layer 120A. The other configurations of the circuit board 10A are the same as those of the circuit board 10 according to embodiment 1, and the description of the same parts is omitted.
As shown in fig. 6(a) and 6(B), a plurality of openings 125 are formed in the protective layer 120A. As shown in fig. 6(B), an opening 125 is formed at a position where the electrode pattern CPI is exposed. In addition, the portion of the electrode pattern CPI exposed through the opening 125 is a mount electrode 126.
More specifically, the area of the mounting electrode 126, i.e., the opening area of the opening 125, is smaller than the area of the electrode pattern CP1 when the protective layer 120A is viewed in plan. The color changing layer 130 is formed at a position not overlapping the mounting electrode 126 and the electrode pattern CP 1.
A specific method for forming the resin substrate 110A will be described with reference to fig. 7. The resin substrate 110A has a structure in which a plurality of resin sheets 111A, 112, 113 are stacked. The resin sheet 111A has a 1 st major surface 101, and the resin sheet 113 has a 2 nd major surface 102. A plurality of electrode patterns CP1 are formed on the resin sheet 111A. The electrode pattern CP1, the circuit pattern CP2, and the circuit pattern CP3 are connected by an interlayer connection conductor or the like.
The resin substrate 110A is integrally formed by heating and pressing the resin sheets 111A, 112, 113.
The steps of manufacturing the circuit module 1A including the circuit board 10 are sequentially shown with reference to fig. 8(a) to 8 (E). As shown in fig. 8(a), the protective layer 120A is formed on the 1 st main surface 101 of the resin substrate 110A such that the opening 125 exposes the electrode pattern CP 1. The protective layer 120A abuts on the 1 st main surface 101. As described above, the portion of the electrode pattern CPl exposed through the opening 125 is the mount electrode 126.
As shown in fig. 8(B), the discoloring layer 130 is formed on the 3 rd main surface 103 of the protective layer 120A. At this time, the color changing layer 130 is formed on the 3 rd main surface 103 of the protective layer 120A with the opening 125 of the protective layer 120A as an alignment mark. With such a configuration, the color changing layer 130 can be formed at a position that does not affect the mounting.
As shown in fig. 8(C), the color changing layer 130 is UV-irradiated, thereby forming a print pattern 135. As shown in fig. 6(B), the electrode pattern CP1 is irradiated with UV light as an alignment mark. At this time, for example, the UV irradiation may be performed using a portion of the electrode pattern CP1 that is visible through the alignment mark.
When the conductivity of a portion of the color changing layer 130 that changes color by UV irradiation (color changing portion) is high, the color changing portion is easily coupled to a nearby conductor pattern, and the electrical characteristics are easily affected. However, by forming the print pattern 135 based on the electrode pattern CPl using the alignment mark as described above, the distance between the color-changing layer 130 and the electrode pattern CP1 can be easily controlled, and the electrical characteristics are stabilized. Further, the print pattern 135 can be formed with high accuracy.
As shown in fig. 8(D), the surface mount component 150 is mounted on the mounting electrode 126 using solder or the like. At this time, since the color changing layer 130 is appropriately separated from the mounting electrode 126 and the print pattern 135 is formed on the color changing layer 130 by UV irradiation, deformation of the mounting region of the circuit substrate 10A can be suppressed. In addition, the resin flows due to the heating press at the time of forming the resin substrate 110A, and thus, misalignment of the pattern is likely to occur. However, since the electrode pattern CP1 is large compared to the opening 125, the position and area of the electrode pattern CP1 exposed through the opening 125 are not substantially changed. Therefore, mounting failure of the surface mount component 150 can be suppressed. In addition, although the surface mount component 150 is mounted on the mounting electrode 126 in the present embodiment, the mounting electrode 126 may be joined to another member.
As shown in fig. 8(E), the circuit board 10A is mounted on the mounting board 20. The circuit board 10A is mounted on the mounting board 20 via the mounting electrodes 600 formed on the 2 nd main surface 102, thereby realizing the circuit module 1A.
The circuit board 10A having such a structure is manufactured by a manufacturing method as described below. Fig. 9 is a flowchart showing a method of manufacturing the circuit board 10A according to embodiment 2 of the present invention.
First, the resin substrates 110 are formed by heating and pressing the resin sheets 111A, 112, 113 (S201). As described above, the resin sheet 111A has the 1 st major surface 101, and the resin sheet 113 has the 2 nd major surface 102.
Next, the protective layer 120A patterned to have the opening 125 is formed on the 1 st main surface 101 of the resin substrate 110A (S202).
Next, the color-changing layer 130 is formed on the 3 rd main surface 103 of the protective layer 120A, in other words, on the surface side where the protective layer 120A and the resin substrate 110A do not abut against each other (S203). More specifically, the color-changing layer 130 is formed using the opening 125 as an alignment mark.
Next, the color changing layer 130 is irradiated with UV light to form a print pattern 135 (S204). More specifically, the electrode pattern CP1 is used as an alignment mark to form the print pattern 135. At this time, the electrode pattern CP1 not covered with the protective layer 120A may be used as an alignment mark. In addition, the alignment mark need not be a shape that defines a function for only performing position alignment, and the shape of the alignment mark and the position of the alignment mark are not defined.
Thus, by using the above-described manufacturing method, a portion to which a thermal load is likely to be applied when the print pattern 135 is formed by UV irradiation can be protected, and the circuit board 10A with high reliability can be manufactured.
In this embodiment, it is also preferable that the thickness D2 of the remaining portion is formed thicker than the depth D1 to be etched. This can suppress the influence of the heat irradiation on the resin substrate 110A.
Further, by using the alignment mark, the distance between the electrode pattern CP1 and the color-changing layer 130 (print pattern 135) can be secured. This can reduce the amount of electric coupling, and suppress variations in electric characteristics.
In the above-described embodiment, the description has been made using an example in which a plurality of resin sheets are stacked to form a resin substrate, but a plurality of resin sheets may be used, or a single resin sheet may be used.
In addition, although the protective layer in the above-described embodiment has been described as a shape covering the entire surface of the resin substrate, the protective layer does not need to be a shape covering the entire surface of the resin substrate. In other words, the color-changing layer may have a shape that covers at least the portion where the color-changing layer is formed.
Claims (6)
1. A circuit board is characterized by comprising:
a resin substrate composed of a thermoplastic resin layer on which a circuit pattern is formed, and having a 1 st main surface and a 2 nd main surface opposed to the 1 st main surface; and
a color changing layer formed on the 1 st main surface of the resin substrate,
the printing pattern formed on the color-changing layer by light irradiation has a concave portion,
the bottom of the recessed portion is not directly contiguous with the thermoplastic resin layer.
2. The circuit substrate of claim 1,
a protective layer is formed between the 1 st main surface of the resin substrate and the color changing layer,
a deformation temperature of the protective layer caused by the light irradiation to the discoloration layer is higher than a deformation temperature of the resin substrate.
3. The circuit substrate of claim 1,
a protective layer is formed between the 1 st main surface of the resin substrate and the color changing layer,
the protective layer is a thermosetting resin.
4. The circuit substrate according to any one of claims 1 to 3,
the depth of the recessed portion of the print pattern formed in the color-changing layer by etching with the light irradiation is smaller than the thickness of the color-changing layer remaining by the etching.
5. The circuit substrate according to claim 2 or 3,
at least a part of the circuit pattern has an electrode pattern formed on the 1 st main surface,
the protective layer is provided with an opening,
the opening is formed to partially expose the electrode pattern,
the circuit board includes:
the color changing layer is formed by taking the patterned protective layer as a reference; and
and a print pattern formed on the basis of the electrode pattern.
6. The circuit substrate according to claim 5,
the portion of the electrode pattern exposed through the opening is joined to another member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-119775 | 2018-06-25 | ||
| JP2018119775A JP6981372B2 (en) | 2018-06-25 | 2018-06-25 | Circuit board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211152323U true CN211152323U (en) | 2020-07-31 |
Family
ID=69100378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920946804.9U Active CN211152323U (en) | 2018-06-25 | 2019-06-21 | Circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6981372B2 (en) |
| CN (1) | CN211152323U (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04220181A (en) * | 1990-11-05 | 1992-08-11 | Mitsubishi Electric Corp | Printed board marked by laser beam and its machining method |
| JP3495627B2 (en) * | 1999-01-19 | 2004-02-09 | イビデン株式会社 | Build-up multilayer printed wiring board and method of manufacturing the same |
| JP3901430B2 (en) * | 2000-06-16 | 2007-04-04 | イビデン株式会社 | Printed wiring board and printed wiring board manufacturing method |
| US6896944B2 (en) * | 2001-06-29 | 2005-05-24 | 3M Innovative Properties Company | Imaged articles comprising a substrate having a primed surface |
| JP4867378B2 (en) * | 2005-02-21 | 2012-02-01 | テクノポリマー株式会社 | Laminate for laser marking |
| JP2006225569A (en) * | 2005-02-21 | 2006-08-31 | Techno Polymer Co Ltd | Laser marking thermoplastic copolymer composition and molded product furnished with marking part |
| JP2007053352A (en) * | 2005-07-22 | 2007-03-01 | Showa Denko Kk | Light emitting diode light source |
| JP2009056606A (en) * | 2007-08-30 | 2009-03-19 | Toyo Ink Mfg Co Ltd | Recording material for laser beams |
| KR101022871B1 (en) * | 2009-08-11 | 2011-03-16 | 삼성전기주식회사 | Printed circuit board and fabricating method of the same |
| US8597774B2 (en) * | 2010-07-15 | 2013-12-03 | Toyo Seikan Kaisha, Ltd. | Laser-marking film |
| WO2012096277A1 (en) * | 2011-01-12 | 2012-07-19 | 株式会社村田製作所 | Resin sealed module |
| JP6099902B2 (en) * | 2012-08-29 | 2017-03-22 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
-
2018
- 2018-06-25 JP JP2018119775A patent/JP6981372B2/en active Active
-
2019
- 2019-06-21 CN CN201920946804.9U patent/CN211152323U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6981372B2 (en) | 2021-12-15 |
| JP2020004762A (en) | 2020-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5860845B2 (en) | Touch sensor and method of manufacturing touch sensor | |
| EP0530840B1 (en) | Electric circuit board module and method for producing electric circuit board module | |
| EP2657964B1 (en) | Electronic component and electronic apparatus | |
| US10855010B2 (en) | Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable | |
| KR101193803B1 (en) | Manufacturing method and manufacturing device for electronic component | |
| US10177012B2 (en) | Wiring substrate and electronic component device | |
| WO2011129130A1 (en) | Board and method for manufacturing board | |
| US8952408B2 (en) | Light-emitting element mounting package, light-emitting element package, and method of manufacturing these | |
| CN107851616B (en) | Wiring substrate and electronic device | |
| JP2015046422A (en) | Ceramic electronic component | |
| EP2965596B1 (en) | The invention relates to a method for producing a printed circuit board with multilayer sub-areas in sections | |
| JP5481675B2 (en) | Chip resistor for built-in substrate and manufacturing method thereof | |
| CN211152323U (en) | Circuit board | |
| US8779561B2 (en) | LED backlight unit without printed circuit board and method of manufacturing the same | |
| US20210167046A1 (en) | Surface-emitting light source and method of manufacturing the same | |
| JP4871694B2 (en) | Light emitting diode package | |
| JP5663804B2 (en) | Chip resistor for built-in substrate and manufacturing method thereof | |
| JP2016105488A (en) | Solder mounted structure of ceramic electronic component | |
| JP5589314B2 (en) | Manufacturing method of electronic component module | |
| JPH06350230A (en) | Printed wiring board and production thereof | |
| JP2016190463A (en) | Thermal print head and thermal printer | |
| WO2022113779A1 (en) | Laminated substrate, and manufacturing method for laminated substrate | |
| JP2007165358A (en) | Chip-type capacitor | |
| CN115413120A (en) | Circuit board and device with circuit board | |
| JP2006120738A (en) | Multilayered ceramic substrate and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |