CN209568000U - 基板切割装置 - Google Patents

基板切割装置 Download PDF

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Publication number
CN209568000U
CN209568000U CN201821911679.XU CN201821911679U CN209568000U CN 209568000 U CN209568000 U CN 209568000U CN 201821911679 U CN201821911679 U CN 201821911679U CN 209568000 U CN209568000 U CN 209568000U
Authority
CN
China
Prior art keywords
substrate
supporting part
module
mobile
conveyer belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821911679.XU
Other languages
English (en)
Chinese (zh)
Inventor
郑下震
朴智雄
朴修训
朴常得
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Application granted granted Critical
Publication of CN209568000U publication Critical patent/CN209568000U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201821911679.XU 2018-05-24 2018-11-20 基板切割装置 Active CN209568000U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0059110 2018-05-24
KR1020180059110A KR102158035B1 (ko) 2018-05-24 2018-05-24 기판 절단 장치

Publications (1)

Publication Number Publication Date
CN209568000U true CN209568000U (zh) 2019-11-01

Family

ID=68319302

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821911679.XU Active CN209568000U (zh) 2018-05-24 2018-11-20 基板切割装置

Country Status (2)

Country Link
KR (1) KR102158035B1 (ko)
CN (1) CN209568000U (ko)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3149868B2 (ja) * 1999-02-24 2001-03-26 日本電気株式会社 Ｃｄｍａ受信装置の受信パス・サーチ方法およびサーチャー回路
CN100572004C (zh) 2004-03-15 2009-12-23 三星钻石工业株式会社 基片切割系统、基片制造设备、基片划线方法以及基片切割方法
JP3149868U (ja) * 2009-02-05 2009-04-16 マルシン産業株式会社 搬送用ベルト
KR101579598B1 (ko) * 2013-11-14 2015-12-23 주식회사 탑 엔지니어링 스크라이브 장치 및 스크라이브 방법
KR102180460B1 (ko) * 2015-04-24 2020-11-18 세메스 주식회사 벨트 신장 장치
KR102605917B1 (ko) * 2016-04-07 2023-11-27 주식회사 탑 엔지니어링 스크라이빙 장치

Also Published As

Publication number Publication date
KR20190134006A (ko) 2019-12-04
KR102158035B1 (ko) 2020-09-22

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