CN209496897U - 存储装置 - Google Patents
存储装置 Download PDFInfo
- Publication number
- CN209496897U CN209496897U CN201821257268.3U CN201821257268U CN209496897U CN 209496897 U CN209496897 U CN 209496897U CN 201821257268 U CN201821257268 U CN 201821257268U CN 209496897 U CN209496897 U CN 209496897U
- Authority
- CN
- China
- Prior art keywords
- layer
- roughness
- ferromagnetic
- state change
- nonmagnetic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003860 storage Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 70
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 3
- 230000003746 surface roughness Effects 0.000 claims description 24
- 239000004020 conductor Substances 0.000 abstract description 24
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000005291 magnetic effect Effects 0.000 description 36
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000012212 insulator Substances 0.000 description 18
- 238000010276 construction Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000013039 cover film Substances 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 4
- 230000005415 magnetization Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052798 chalcogen Inorganic materials 0.000 description 2
- 150000001787 chalcogens Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
- H10N70/235—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect between different crystalline phases, e.g. cubic and hexagonal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Debugging And Monitoring (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
Description
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-052630 | 2018-03-20 | ||
JP2018052630A JP2019165139A (ja) | 2018-03-20 | 2018-03-20 | 記憶装置および記憶装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209496897U true CN209496897U (zh) | 2019-10-15 |
Family
ID=67985444
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821257268.3U Active CN209496897U (zh) | 2018-03-20 | 2018-08-06 | 存储装置 |
CN201810886873.5A Active CN110311034B (zh) | 2018-03-20 | 2018-08-06 | 存储装置及存储装置的制造方法 |
CN202310613258.8A Pending CN116406220A (zh) | 2018-03-20 | 2018-08-06 | 存储装置的制造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810886873.5A Active CN110311034B (zh) | 2018-03-20 | 2018-08-06 | 存储装置及存储装置的制造方法 |
CN202310613258.8A Pending CN116406220A (zh) | 2018-03-20 | 2018-08-06 | 存储装置的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10475851B2 (zh) |
JP (1) | JP2019165139A (zh) |
CN (3) | CN209496897U (zh) |
TW (2) | TWI725331B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110311034A (zh) * | 2018-03-20 | 2019-10-08 | 东芝存储器株式会社 | 存储装置及存储装置的制造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5590278B2 (ja) * | 2008-03-31 | 2014-09-17 | 株式会社三洋物産 | 遊技機 |
JP5590279B2 (ja) * | 2008-03-31 | 2014-09-17 | 株式会社三洋物産 | 遊技機 |
US10825987B2 (en) * | 2018-06-06 | 2020-11-03 | Micron Technology, Inc. | Fabrication of electrodes for memory cells |
JP6836221B2 (ja) * | 2019-09-11 | 2021-02-24 | 株式会社三洋物産 | 遊技機 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004047966A (ja) * | 2002-05-13 | 2004-02-12 | Nec Corp | 半導体記憶装置およびその製造方法 |
US6839271B1 (en) | 2003-10-15 | 2005-01-04 | Hewlett-Packard Development Company, L.P. | Magnetic memory device |
JP4221660B2 (ja) * | 2003-10-16 | 2009-02-12 | ソニー株式会社 | 細孔構造体及びその製造方法、メモリ装置及びその製造方法、吸着量分析装置、並びに磁気記録媒体 |
US7522446B2 (en) | 2003-10-31 | 2009-04-21 | Samsung Electronics Co., Ltd. | Heating MRAM cells to ease state switching |
JP5502302B2 (ja) | 2008-09-26 | 2014-05-28 | ローム株式会社 | 半導体装置およびその製造方法 |
US7829923B2 (en) | 2008-10-23 | 2010-11-09 | Qualcomm Incorporated | Magnetic tunnel junction and method of fabrication |
US8273582B2 (en) | 2009-07-09 | 2012-09-25 | Crocus Technologies | Method for use in making electronic devices having thin-film magnetic components |
US8895323B2 (en) * | 2011-12-19 | 2014-11-25 | Lam Research Corporation | Method of forming a magnetoresistive random-access memory device |
JP2014049497A (ja) | 2012-08-29 | 2014-03-17 | Toshiba Corp | 不揮発性半導体記憶装置及びその動作方法 |
US9865806B2 (en) * | 2013-06-05 | 2018-01-09 | SK Hynix Inc. | Electronic device and method for fabricating the same |
US9281471B2 (en) * | 2014-04-30 | 2016-03-08 | Micron Technology, Inc. | Phase change memory stack with treated sidewalls |
KR20170099214A (ko) * | 2016-02-23 | 2017-08-31 | 삼성전자주식회사 | 가변 저항 메모리 소자 및 그 제조 방법 |
KR102453349B1 (ko) * | 2016-02-25 | 2022-10-07 | 삼성전자주식회사 | 가변 저항 메모리 장치 및 이의 제조 방법 |
KR102584288B1 (ko) * | 2016-08-03 | 2023-09-27 | 삼성전자주식회사 | 비휘발성 메모리 장치 |
JP2019165139A (ja) * | 2018-03-20 | 2019-09-26 | 東芝メモリ株式会社 | 記憶装置および記憶装置の製造方法 |
-
2018
- 2018-03-20 JP JP2018052630A patent/JP2019165139A/ja active Pending
- 2018-08-06 CN CN201821257268.3U patent/CN209496897U/zh active Active
- 2018-08-06 TW TW107127256A patent/TWI725331B/zh active
- 2018-08-06 CN CN201810886873.5A patent/CN110311034B/zh active Active
- 2018-08-06 CN CN202310613258.8A patent/CN116406220A/zh active Pending
- 2018-08-06 TW TW110110386A patent/TWI773212B/zh active
- 2018-08-31 US US16/120,075 patent/US10475851B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110311034A (zh) * | 2018-03-20 | 2019-10-08 | 东芝存储器株式会社 | 存储装置及存储装置的制造方法 |
CN110311034B (zh) * | 2018-03-20 | 2023-06-13 | 铠侠股份有限公司 | 存储装置及存储装置的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110311034A (zh) | 2019-10-08 |
TWI773212B (zh) | 2022-08-01 |
CN116406220A (zh) | 2023-07-07 |
US10475851B2 (en) | 2019-11-12 |
TW201941367A (zh) | 2019-10-16 |
JP2019165139A (ja) | 2019-09-26 |
US20190296078A1 (en) | 2019-09-26 |
TW202203383A (zh) | 2022-01-16 |
TWI725331B (zh) | 2021-04-21 |
CN110311034B (zh) | 2023-06-13 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220218 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |