CN208542776U - 一种芯片冲压装置 - Google Patents
一种芯片冲压装置 Download PDFInfo
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- CN208542776U CN208542776U CN201820502069.8U CN201820502069U CN208542776U CN 208542776 U CN208542776 U CN 208542776U CN 201820502069 U CN201820502069 U CN 201820502069U CN 208542776 U CN208542776 U CN 208542776U
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- cabinet
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- stamping device
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- 239000000446 fuel Substances 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000002828 fuel tank Substances 0.000 claims description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 abstract description 20
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000010257 thawing Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000010992 reflux Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820502069.8U CN208542776U (zh) | 2018-04-10 | 2018-04-10 | 一种芯片冲压装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820502069.8U CN208542776U (zh) | 2018-04-10 | 2018-04-10 | 一种芯片冲压装置 |
Publications (1)
Publication Number | Publication Date |
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CN208542776U true CN208542776U (zh) | 2019-02-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820502069.8U Expired - Fee Related CN208542776U (zh) | 2018-04-10 | 2018-04-10 | 一种芯片冲压装置 |
Country Status (1)
Country | Link |
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CN (1) | CN208542776U (zh) |
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2018
- 2018-04-10 CN CN201820502069.8U patent/CN208542776U/zh not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190723 Address after: 518000 First Floor, No. 54, No. 2 Road, Dalangshan Industrial Zone, Wanfeng, Shajing Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Shi Pu precision hardware and Plastic Co., Ltd. Address before: 518000 Wangke Passenger Creation Space, 6th Floor, Meiran Palace Building, Yannan Road, Futian District, Shenzhen City, Guangdong Province Patentee before: Chen Guoxu |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 Termination date: 20200410 |