CN206600639U - Lighting device - Google Patents
Lighting device Download PDFInfo
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- CN206600639U CN206600639U CN201621165662.5U CN201621165662U CN206600639U CN 206600639 U CN206600639 U CN 206600639U CN 201621165662 U CN201621165662 U CN 201621165662U CN 206600639 U CN206600639 U CN 206600639U
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- Prior art keywords
- substrate
- lighting device
- light
- peripheral framework
- emitting component
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A kind of lighting device is provided, its heat that efficiently light-emitting component for being configured in substrate can occur radiates.The lighting device possesses：Substrate (11), be configured in substrate (11) the first face (11a) light-emitting component (12) and keep substrate (11) peripheral framework (20), substrate (11) is contacted with the state of peripheral framework (20) with second face (11b) of the first face (11a) opposite side with substrate (11), and is fixed on peripheral framework (20).
Description
Technical field
The utility model is related to light emitting diode (LED：Light Emitting Diode) etc. light-emitting component photograph
Bright device.
Background technology
The semiconductor light-emitting elements such as LED due to it is small-sized, efficiently and the characteristics of long lifespan, therefore be used for various systems
The light source of product.For example, the lighting device (LED illumination) of LED as light source has been practical.
There is the bulb-shaped LED (LED of the conventional lamp-bulb type fluorescent lamp of known replacement, incandescent lamp bulb as LED illumination
Bubble), or substitute the straight tube LED with lamp holder of straight-pipe fluorescent lamp etc..In addition, it is also known as LED illumination
The ligthing paraphernalia such as ceiling lamp, Down lamp or shot-light.
For example, conventional LED bulb possesses：Light emitting module is constituted by substrate and the LED element for being installed in substrate；Cover
The enclosed globe shade of lid light emitting module；Base station (module board) for loading light emitting module；Support the framework of base station；And lamp holder (example
As with reference to patent document 1).LED bulb is turned by the alternating current received from lamp holder in the circuit unit being accommodated in framework
Direct current is changed to, and is supplied to light emitting module and carrys out lighting.
(prior art literature)
(patent document)
The Japanese Unexamined Patent Publication 2015-076281 publications of patent document 1
In lighting device, because heat can occur for the light-emitting component as light source, it is therefore desirable to efficiently radiated.Especially
It is in the case of employing the semiconductor light-emitting elements such as LED as light-emitting component, because of the heating of semiconductor light-emitting elements itself
Luminous efficiency can be reduced, and reduce light output.Therefore, the heat that semiconductor light-emitting elements occur efficiently is radiated
It is very important.
Utility model content
The utility model is in order to solve above-mentioned this problem, it is therefore intended that providing one kind can be efficiently to being configured in base
The lighting device that the heat that the light-emitting component of plate occurs is radiated.
In order to reach above-mentioned purpose, a form of the lighting device involved by the utility model is to possess：Substrate；
Light-emitting component, is configured in the first face of the substrate；And peripheral framework, the substrate is kept, the substrate is with the base
The state that second face of plate is contacted with the peripheral framework, is fixed on the peripheral framework, the second face of the substrate be with
The face of first face opposite side.
In addition, a form of the lighting device involved by the utility model is that the peripheral framework is with opening portion
Tubular cylinder, the opening portion set with mounting surface mounting portion, for loading the substrate, the substrate passes through
The mounting surface is placed in the way of covering the opening portion, so as to be contacted with the peripheral framework.
In addition, a form of the lighting device involved by the utility model is, the mounting surface has to be opened described in composition
The plane of the ring-type of the end face of oral area.
In addition, a form of the lighting device involved by the utility model is, the peripheral framework has along described
The inner surface of peripheral framework, and from the opening portion of the peripheral framework to the rib of inboard extension, the end of a side of the rib
Face constitutes a part for the mounting surface.
In addition, a form of the lighting device involved by the utility model is, the rib is along the peripheral framework
The circumference of inner surface is equipped with multiple.
In addition, a form of the lighting device involved by the utility model is, at least a portion of the light-emitting component
It is relative with the rib across the substrate.
In addition, a form of the lighting device involved by the utility model is at least to be provided with a rib
The screw extended on the cylinder axis direction of the peripheral framework, through hole is provided with the substrate, the substrate with it is described outer
Peripheral frame body is, by through hole described in screw break-through, and to be screwed into the screw and be fixed together.
In addition, a form of the lighting device involved by the utility model is, and in the case of vertical view, the screw ratio
The light-emitting component is located at outside.
In addition, a form of the lighting device involved by the utility model is to be passed through in the axle portion of the screw with described
Gap is provided between through hole.
In addition, a form of the lighting device involved by the utility model is, the lighting device is also equipped with covering institute
State the diffuser of light-emitting component.
In addition, a form of the lighting device involved by the utility model is, the diffuser is glass system.
In addition, a form of the lighting device involved by the utility model is to be formed with ring-type in the opening portion
Groove portion, the groove portion of the ring-type is located at outside than the mounting portion, and the end of the opening portion of the diffuser is configured in the groove
Portion.
In addition, a form of the lighting device involved by the utility model is, the diffuser and the peripheral framework
Fixed by being filled in the sticker of the groove portion.
In addition, a form of the lighting device involved by the utility model is that the groove portion is formed into and institute always
State the relative position in second face of substrate.
In addition, a form of the lighting device involved by the utility model is, the lighting device is also equipped with being used to make
The luminous circuit unit of the light-emitting component, the circuit unit is incorporated in the peripheral framework.
In addition, a form of the lighting device involved by the utility model is that the circuit unit is only incorporated in institute
State peripheral framework.
In addition, a form of the lighting device involved by the utility model is that the lighting device is also equipped with lamp holder, should
Lamp holder receives the electric power for making the light-emitting component luminous, and the lamp holder is being installed in the peripheral framework with the opening portion phase
The part of anti-side.
In addition, a form of the lighting device involved by the utility model is, the peripheral framework is resin-made.
By the utility model, the heat that efficiently light-emitting component for being configured in substrate can occur radiates.
Brief description of the drawings
Fig. 1 is the outward appearance oblique view of the LED bulb involved by embodiment 1.
Fig. 2 is the exploded perspective view of the LED bulb involved by embodiment 1.
Fig. 3 is the section oblique view of the LED bulb involved by embodiment 1.
Fig. 4 is the major part amplification sectional view of the LED bulb involved by embodiment 1.
Fig. 5 is the major part amplification sectional view of the LED bulb involved by the variation of embodiment 1.
Fig. 6 is the section oblique view of the LED bulb involved by embodiment 2.
Fig. 7 is the oblique view of the peripheral framework of the LED bulb involved by embodiment 2.
Fig. 8 is the major part amplification sectional view of the LED bulb involved by embodiment 2.
Fig. 9 is the major part amplification sectional view of the LED bulb involved by the variation of embodiment 2.
Symbol description
1st, 1A, 2 LED bulbs (lighting device)
11 substrates
The faces of 11a first
The faces of 11b second
11c through holes
12 light-emitting components
20th, the peripheral frameworks of 20A
21st, 22 opening portion
21a mounting portions
21a1 mounting surfaces
21b groove portions
23 ribs
23a screws
24 stickers
30 enclosed globe shades (diffuser)
40 circuit units
50 lamp holders
60 screws
Embodiment
(embodiment)
Embodiment of the present utility model is illustrated below.Also, the embodiment that will be discussed below is this
One preferred specific example of utility model.Therefore, numerical value shown in following embodiment, shape, material, composition will
Order of element, the allocation position of inscape and connected mode and process and process etc. is an example, and purport is not
It is that the utility model is defined.Therefore, for shown in the inscape of following embodiment it is of the present utility model most
The inscape do not recorded in the technical scheme of upperseat concept, illustrates as arbitrary inscape.
Also, each figure is ideograph, not rigorous diagram.In addition, for substantially having identical work(in each figure
The composition of energy assigns identical symbol, and the explanation of repetition is omitted or simplified.
In the following embodiments, as an example of lighting device, to as lamp-bulb type fluorescent lamp or incandescent lamp
The LED bulb of substitute illustrate.
(embodiment 1)
[LED bulb]
All constitute of the LED bulb 1 involved by embodiment 1 is illustrated using Fig. 1, Fig. 2 and Fig. 3.Fig. 1 is
The outward appearance oblique view of LED bulb 1 involved by embodiment 1.Fig. 2 is the exploded perspective view of the LED bulb 1.Fig. 3 is Fig. 1
The section oblique view of the LED bulb 1 at III-III lines.
As shown in Figure 1 to Figure 3, LED bulb 1 possesses：LED module 10；Keep the peripheral framework 20 of LED module 10；Covering
The enclosed globe shade 30 of LED module 10；For making the luminous circuit unit 40 of LED module 10；And lamp holder 50.As shown in figure 1, LED
Bulb 1 constitutes peripheral device by peripheral framework 20, enclosed globe shade 30, lamp holder 50.
The detailed composition of LED bulb 1 is illustrated following with Fig. 1 to Fig. 3 and Fig. 4.Fig. 4 is the institute of embodiment 1
The major part amplification sectional view for the LED bulb 1 being related to, shows the structure for the region X that Fig. 3 dotted line is irised out.
[LED module]
LED module 10 is an example of the light emitting module for the light for releasing defined color, for example, release white light.Such as Fig. 3
Shown, LED module 10 is configured in the inner space of enclosed globe shade 30, and the electric power provided by circuit unit 40 lights.
LED module 10 is fixed on peripheral framework 20.Specifically, LED module 10 is to cover the opening of peripheral framework 20
The mode in portion 21, is fixed on the opening portion 21 of peripheral framework 20.
As shown in FIG. 2 and 3, LED module 10 is made up of substrate 11, the light-emitting component 12 for being configured in substrate 11.
Substrate 11 is the installation base plate for installing light-emitting component 12, as shown in Figure 3 and 4, luminous first with installing
The first face (front) 11a of part 12 and the second face (back side) 11b with the first face 11a opposite side.Substrate 11 is for example flat
Face regard in the case of as all generally circular tabulars substrate, the shape of substrate 11 is not limited by this, and can be rectangle
Etc. polygonal.Also, the thickness of substrate 11 is, for example, 0.5mm~5mm, without special restriction.In addition, as shown in Fig. 2 in base
Plate 11 is formed with the directional plane that a part for circular substrate is cut off.
As shown in figure 4, substrate 11 is fixed on peripheral framework 20 with the second face 11b with the state that peripheral framework 20 is contacted.
Specifically, substrate 11 is placed in the load for being arranged on opening portion 21 in the way of covering the opening portion 21 of peripheral framework 20
Face 21a1 is put, so as to be contacted with peripheral framework 20.That is, substrate 11 is supported by the mounting portion 21a of peripheral framework 20.
Also, substrate 11 is provided with through hole 11c.In through hole 11c by the break-through of screw 60, the screw 60 is used for base
Plate 11 is fixed with peripheral framework 20.In the present embodiment, by two screws 60 come to substrate 11 and peripheral framework 20
It is fixed, substrate 11 is provided with two through hole 11c.
It can such as be used as substrate 11, by covering exhausted on the basic components being made up of the metal material such as aluminium or copper
The ceramic substrate of the sintered body of the ceramic materials such as substrate, the aluminum oxide of metallic substrates formed by velum or by resin material structure
Into resin substrate etc.., can be using wherein thermal conductivity from the viewpoint of the heat that light-emitting component 12 occurs radiates
The substrate of highest metallic substrates.In addition, it can also be flexible substrate that substrate 11, which can be hard substrate,.
Also, the first face 11a of substrate 11 central portion as shown in FIG. 2 and 3, is provided with connection terminal 13, with
As power supply.A part of through substrate 11 of connection terminal 13, links in the second face 11b sides with circuit unit 40.Though in addition,
Do not illustrate so, be formed with the first face 11a of substrate 11 for being electrically connected to connection terminal 13 and light-emitting component 12
Metal line (not shown).
Light-emitting component 12 is configured in the first face 11a of substrate 11.In the present embodiment, multiple light-emitting components 12 are with circle
The arrangement of ring-type and be installed in substrate 11.In addition, in the present embodiment, although be to be mounted with six light-emitting components 12, but
It is that the installation number of light-emitting component 12 is not limited or one by above-mentioned.
Light-emitting component 12 in present embodiment is the surface mount (SMD after each packedization：Surface Mount
Device) the LED element of type, as shown in figure 3, having：Container (encapsulation) 12a；By once mounting to the LED core in container 12a
Piece 12b；Sealed seal member 12c is carried out to LED chip 12b.Light-emitting component 12 as the LED element of SMD type is secondary
It is installed to substrate 11.
Container 12a is the device for ceramic shaped products of the resin forming product that white resin is constituted or white, with inverse truncated cone shape
Recess (cavity).Recess is configured to medial surface inclination, so as to which the light from LED chip 12b is reflected upward.
LED chip 12b is installed in the bottom surface of container 12a recess.LED chip 12b is sent out by defined direct current
One example of the semiconductor light-emitting elements of light, is the bare chip for sending monochromatic visible light.LED chip 12b is, for example, to be powered
When send the blue LED die of blue light.
Seal member 12c is the insulative resin material that silicones etc. has translucency.Sealing in present embodiment
Part 12c includes the fluorophor as wavelength shifter, and line translation is entered to the wavelength of the light from LED chip 12b.That is sealing
Part 12c is containing fluorophor to contain phosphor resin in translucent resin, is rule by the optical wavelength conversion from LED chip 12b
Fixed wavelength (colour switching).Seal member 12c is filled in container 12a recess.
As seal member 12c, such as in the case where LED chip 12b is blue LED die, in order to obtain white light, and
Can use by the yellow fluorophor particle of YAG (yttrium, aluminium, garnet) system be distributed to silicones contain phosphor resin.Accordingly,
Yellow fluorophor particle releases sodium yellow by the blue light stimulus of blue LED die, the Huang released from yellow fluorophor particle
The synthesis light for the blue light that coloured light is released with blue LED die, is released as white light from seal member 12c.In addition, in sealing
The photodiffusion materials such as silica or filler etc. can also be disperseed in part 12c.
Multiple light-emitting components 12 of this composition are for example connected in series with more than, via connection terminal 13, by from electricity
The direct current that road unit 40 is supplied lights.Also, multiple light-emitting components 12 connected mode (be connected in series, be connected in parallel, with
And the combination connection for being connected in series and being connected in parallel etc.) without special restriction.
[peripheral framework]
As shown in FIG. 2 and 3, peripheral framework 20 is the cylinder of tubular, with the opening for being arranged at the side of enclosed globe shade 30
Portion 21 (the first opening portion) and the opening portion 22 (the second opening portion) for being arranged at the side of lamp holder 50.The external diameter ratio of opening portion 21
The external diameter of opening portion 22 is big, and the cylinder for constituting peripheral framework 20 is the substantially cylindrical shape that external diameter is gradually changed.Peripheral framework 20
The peripheral components of LED bulb 1 are constituted, the outer surface of peripheral framework 20 is exposed on the external (in air).In addition, peripheral framework 20 by with
Put between enclosed globe shade 30 and lamp holder 50.
Peripheral framework 20 has the function of supporting member, and LED module 10 is supported.LED module 10 is fixed on outer
Peripheral frame body 20, is supported by peripheral framework 20.
Specifically, as shown in figure 4, setting the mounting portion with mounting surface 21a1 in the opening portion 21 of external surrounding frame body 20
21a, the substrate 11 for loading LED module 10.Contacted in mounting surface 21a1 with the second face 11b of substrate 11 for face.
In the present embodiment, mounting surface 21a1 has the plane of the ring-type for the end face for constituting opening portion 21.That is, mounting surface
A 21a1 part turns into the plane of the ring-type for the end face for constituting opening portion 21, is, for example, circular plane.So, due to carrying
The face 21a1 of putting has the plane of ring-type, and substrate 11 turns into only outer region and contacted with peripheral framework 20 (mounting portion 21a).Also,
Second face 11b of substrate 11 middle section is relative with the opening of opening portion 21, the middle section of substrate 11 not with peripheral framework
20 contacts.
As shown in Figures 2 to 4, peripheral framework 20 has the inner surface along peripheral framework 20, from opening for peripheral framework 20
The rib 23 that oral area 21 extends to inboard (side of lamp holder 50).That is, rib 23 is that internally space is protruded from the inner surface of peripheral framework 20,
And be the convex strip portions extended from the opening portion 21 of peripheral framework 20 to opening portion 22.
In the present embodiment, the end face (end face of the side of enclosed globe shade 30) of a side of rib 23 constitutes mounting portion 21a mounting
A face 21a1 part.That is, the end of a side of rib 23 and mounting portion 21a are in the same plane, at the end of a side of rib 23
Face is also contacted with the second face 11b of substrate 11 for face.
Rib 23 is circumferentially equipped with multiple in the inner surface of external surrounding frame body 20.As shown in Fig. 2 in the present embodiment
There is provided two ribs 23.Two ribs 23 are relative and put.That is, two ribs 23 external surrounding frame body 20 inner surface circumferentially with 180 °
Interval and be set.
Screw 23a is provided with each of two ribs 23, is extended on the cylinder axis direction of external surrounding frame body 20.Such as Fig. 3
And shown in Fig. 4, the through hole 11c of break-through substrate 11 screw 60 is screwed into screw 23a.Therefore, screw 23a direction of principal axis with
Through hole 11c direction of principal axis is consistent.Substrate 11 is screwed into rib 23 with peripheral framework 20 by break-through through hole 11c screw 60
Screw 23a and fixed.So, LED module 10 is fixed by substrate 11 with peripheral framework 20 by screw 60, and by external surrounding frame
Body 20 is kept.Screw 60 is, for example, metal primary screw.
The screw 23a of rib 23 screw 60 is screwed into, in the case where plane is regarded (from the first face 11a's of substrate 11
When from the point of view of normal direction), outside is located at compared with light-emitting component 12.Specifically, the through hole 11c of substrate 11 is arranged on base
The outer region of plate 11, screw 60 is mounted in the way of pushing down the outer region of substrate 11.That is, screw 60 is located at from composition
The near position of the outer wall of the cylinder of peripheral framework 20.
As shown in figure 4, being provided with gap between the axle portion of screw 60 and the through hole 11c of substrate 11.In present embodiment
In, through hole 11c internal diameter is bigger than the screw 23a of rib 23 internal diameter.
Also, the groove portion 21b for the ring-type for being located at outside than mounting portion 21a is formed with opening portion 21.Enclosed globe shade 30 is opened
The end of oral area 31 is configured in groove portion 21b.Enclosed globe shade 30 and peripheral framework 20 are by being filled in groove portion 21b sticker 24
Fixed.As being filled in groove portion 21b sticker 24 for example with the sticker being made up of silicones.
In the present embodiment, groove portion 21b is formed into the position relative with the second face 11b of substrate 11.That is, groove portion
21b is formed into the back side of substrate 11, and the peripheral end as substrate 11 protrudes into the state of groove portion 21b recess.So, quilt
The second face 11b (back side of substrate 11) of substrate 11 can be reached by being filled into groove portion 21b sticker 24.
Also, it is formed with the outer surface of opening portion 22 (opening portion of the side of lamp holder 50) for installing screwing up for lamp holder 50
Portion.Lamp holder 50 is screwed into opening portion 22.
Peripheral framework 20 radiates in opening portion 21 and the thermal of LED module 10 with the heat that LED module 10 occurs
Thermal component (radiator) function.Therefore, peripheral framework 20 due to can to LED module 10 (light-emitting component 12) occur
Heat efficiently radiated, therefore can using the high material of the pyroconductivity such as high resin material of metal material or thermal conductivity come
Constitute.For example, peripheral framework 20 can be made up of the material higher than the pyroconductivity of substrate 11.In the present embodiment, it is peripheral
Framework 20 is formed from a resin, and is constituted such as the insulative resin material by polybutylene terephthalate (PBT).Also, periphery
Framework 20 is integrally formed product.
As shown in figure 3, being configured with circuit unit 40 in the inside of external surrounding frame body 20.Therefore, peripheral framework 20 can be to electricity
Heat produced by road unit 40 is radiated.In the present embodiment, peripheral framework 20 directly surrounds circuit unit 40.I.e., outside
Peripheral frame body 20 has the function for the circuit case (insulation shell) that insulation protection is carried out to circuit unit 40.
Also, peripheral framework 20 also has the function of the retainer of holding circuit unit 40.Specifically, as shown in figure 3,
The opening portion 22 of external surrounding frame body 20 inner surface as the structure for circuit substrate 41 to be fixed, and being formed with has
The convex portion 25 in gap.Circuit unit 40 is so that circuit substrate 41 is sandwiched in the state in gap and is engaged by convex portion 25, so that by periphery
Framework 20 is kept.
[enclosed globe shade]
As shown in Figure 3 and 4, enclosed globe shade 30 is an example of the diffuser of covering luminous element 12.In this implementation
In mode, enclosed globe shade 30 is configured to cover whole LED module 10.That is, the covering of enclosed globe shade 30 substrate 11.
Enclosed globe shade 30 is configured to, and the light released from LED module 10 (light-emitting component 12) can be fetched into the outside of lamp.
That is, the light of the LED module 10 of the inner surface of enclosed globe shade 30 is incided, the outer of enclosed globe shade 30 is fetched to through enclosed globe shade 30
Portion.
Enclosed globe shade 30 is the hollow part with opening portion 31, and substantially in hemispherical, with the opposite side of opening portion 31
Top seal.Enclosed globe shade 30 is, for example, hollow rotating body, the shape reduced as opening portion 31.
Enclosed globe shade 30 is fixed on the opening portion 21 of peripheral framework 20.In the present embodiment, the opening portion of enclosed globe shade 30
31 end is configured in groove portion 21b, and groove portion 21b is arranged at the opening portion 21 of peripheral framework 20, by being filled in groove portion 21b
Sticker 24 fix enclosed globe shade 30 and peripheral framework 20.
As the material of enclosed globe shade 30, it can use for glass material or propylene such as the fused silicas of visible transparent
The translucent material of the compositions such as the resin materials such as acid resin (PMMA), makrolon (PC).In the present embodiment, enclosed globe shade
30 are formed using the high glass material of the pyroconductivity than resin material.
The DIFFUSION TREATMENT of the light diffusion for releasing LED module 10 can also be carried out in enclosed globe shade 30.For example, by
The inner surface of enclosed globe shade 30 or outer surface form optical diffusion film (light diffusion layer), so that enclosed globe shade 30 has light diffusion function.
Specifically, it is spherical by the way that resin or Chinese white containing the photodiffusion material such as silica or calcium carbonate etc. are filled
The inner surface of cover 30 or outer surface, so as to form milky optical diffusion film.Or, by forming multiple in enclosed globe shade 30
Light diffusion point or multiple small depressions, can also make enclosed globe shade 30 have light diffusion function.So, by having enclosed globe shade 30
There is light diffusion function, so as to make to be spread from the light that LED module 10 incides enclosed globe shade 30, therefore, it is possible to expand luminous intensity distribution
Angle.Also,, can be because of multiple light-emitting components if LED to be used as to the light source of light-emitting component 12 because the directive property of LED light is stronger
12 (LED elements) and produce granular sensation (brightness irregularities), therefore, by make enclosed globe shade 30 have light diffusion function, so as to
It is enough to suppress because of the granular sensation that multiple light-emitting components 12 are produced.
Alternatively, it is also possible to not make enclosed globe shade 30 hold light diffusion function, and enclosed globe shade 30 is set to turn into transparent, with can be visual
To internal LED module 10.Also, the shape of enclosed globe shade 30 can also be ellipsoid of revolution or oblate spheroid, and or
According to A types bulb it is general bulb-shaped.
[circuit unit]
Circuit unit 40 shown in Fig. 2 and Fig. 3 is the driving electricity for being used to make LED module 10 (light-emitting component 12) luminous
Road.That is, circuit unit 40 is by for making the luminous power supply of LED module 10 to LED module 10.In the present embodiment, it is electric
Road unit 40 is the lamp circuit for making the lighting of LED module 10 and turning off the light, and constitutes power subsystem (power circuit).Circuit list
The alternating current supplied from lamp holder 50 is for example converted into direct current by member 40, and the direct current is supplied into LED module 10.By from
The direct current of circuit unit 40 (lamp circuit) supply, LED module 10 (light-emitting component 12) carries out lighting or turned off the light.
Circuit unit 40 has circuit substrate 41 and is installed in multiple electronic units 42 of the circuit substrate 41.Electricity
Road unit 40 is configured between LED module 10 and lamp holder 50.Specifically, circuit unit 40 is incorporated in peripheral framework 20.
In the present embodiment, circuit unit 40 is only incorporated in peripheral framework 20.As shown in figure 3, circuit unit 40 passes through circuit base
Plate 41 is slideably inserted into the gap for the convex portion 25 for being arranged on peripheral framework 20 and then is locked on convex portion 25, so that by peripheral framework
20 keep.Also, the fixing means of circuit substrate 41 is not limited by this, circuit substrate 41 can be fixed on by screw etc.
Peripheral framework 20.
Circuit substrate 41 is that the face (solder side) of side is formed with the printed circuit board (PCB) (PCB) of the metal lines such as copper foil.Quilt
Installed in multiple electronic units 42 of circuit substrate 41, it is electrically connected each other by being formed on the metal line of circuit substrate 41
Connect.
Circuit substrate 41 is provided with lead-out terminal 43 and input terminal (not shown).Lead-out terminal 43 is with being arranged at
The connection terminal 13 of the substrate 11 of LED module 10 is electrical connection to be mechanically linked.Also, in input terminal and a pair of lead wires
Connection (not shown).The other end for being connected to a pair of lead wires of input terminal is connected with lamp holder 50.
Circuit substrate 41 is for example configured in the mode (longitudinal) almost parallel with the cylinder axle of peripheral framework 20.Also,
Circuit substrate 41 is not limited by longitudinal configuration mode, can also be with the interarea of the circuit substrate 41 and the cylinder of peripheral framework 20
The substantially vertical mode of axle (horizontal) and be configured.Also, being formed on the metal line of circuit substrate 41 not only can only shape
Into on the face (unilateral) of the side in circuit substrate 41, and the two sides in circuit substrate 41 can also be formed.That is, circuit substrate
41 can be double-sided wiring board.
The electronic unit 42 for being installed in circuit substrate 41 is for making multiple circuit elements of the lighting of LED module 10, example
In this way the resistive element such as the capacity cell such as electrolytic capacitor, ceramic capacitor, resistor, convertor circuit element, coil part, grip
Semiconductor elements such as streamline circle (choke transformer), noise filter, diode or integrated circuit component etc..
Circuit unit 40 with above-mentioned composition by being incorporated in the peripheral framework 20 being made up of dielectric resin material,
Its insulating properties is guaranteed.In addition, the luminance in order to suppress LED module 10, can combine tune in circuit unit 40
Light control circuit, the radio communication circuit such as optical circuit or toning circuit etc..
[lamp holder]
Lamp holder 50 shown in Fig. 2 and Fig. 3 is power receiving section, for receiving to make (the light-emitting component of LED module 10 outside lamp
12) luminous electric power.Lamp holder 50 is installed in the part with the opposite side of opening portion 21 in peripheral framework 20.Specifically, lamp
First 50 are installed in the opening portion 22 of peripheral framework 20.
The portion of screwing up is formed with the inner peripheral surface of lamp holder 50, for screwing up for the opening portion 22 with being formed on peripheral framework 20
Portion is screwed up.Lamp holder 50 screws up portion by be screwed into opening portion 22, so as to be embedded in external surrounding frame body 20 outside.
LED bulb 1 is by the way that the lamp holder 50 for being embedded in external surrounding frame body 20 outside to be for example installed to the appliance body of ligthing paraphernalia
Socket, so as to be installed to appliance body.Specifically, it is formed with the outer peripheral face of lamp holder 50 for being screwed into appliance body
Socket screws up portion.Lamp holder 50 can be connect by being installed in the socket of appliance body so that lamp holder 50 turns into from appliance body
By the state of electric power.The alternating current from source power supply is for example supplied with lamp holder 50.Lamp holder 50 in present embodiment leads to
Cross two contacts and receive alternating current, the electric power received in lamp holder 50 is input into the input of circuit unit 40 via a pair of lead wires
Son.
Lamp holder 50 be, for example, it is metal have bottomless drum shape shape, as shown in figure 3, with the shell portion 51 that outer peripheral face is the portion that screws up,
And the eyelet portion 53 in shell portion 51 is installed in by insulation division 52.Insulation division 52 is for example made up of cullet.It is connected to electricity
A pair of lead wires of road unit 40 a, side is connected with the shell portion 51 of lamp holder 50, and a side is connected with the eyelet portion 53 of lamp holder 50.
The species of lamp holder 50 does not have special restriction, in the present embodiment using Edison-type (E types) lamp of screw-in
Head.For example, E26 shapes, E17 shapes or E16 shapes etc. can be included as lamp holder 50.Also, lamp holder 50 may not be Edison
Type, and can be bayonet type (plug-in type).
[effect etc.]
Then, the characteristic to the LED bulb 1 in present embodiment is constituted and action effect is illustrated.
As shown in figure 4, LED bulb 1 possesses：Substrate 11, be configured in substrate 11 the first face 11a light-emitting component 12,
And the peripheral framework 20 of substrate 11 is kept, substrate 11 is fixed on outer with the second face 11b with the state that peripheral framework 20 is contacted
Peripheral frame body 20.
That is, in conventional LED bulb, it is configured with base station (module board) between substrate 11 and peripheral framework 20, and
LED bulb 1 in present embodiment, not using conventional base station, but substrate 11 is directly connected with peripheral framework 20.
So, LED bulb 1 in the present embodiment, due to no use base station (module board), with employing base station
Conventional LED bulb is compared, and can reduce the thermal resistance from substrate 11 to peripheral framework 20.Accordingly, occur in light-emitting component 12
Heat is directly transferred to peripheral framework 20 from substrate 11, and is exported to outside (in air) from peripheral framework 20.Therefore, it is possible to efficient
The heat that light-emitting component 12 occurs on ground radiates.So, efficient LED bulb 1 can either be realized, can easily be realized again
High power.
It is additionally, since without using base station (module board), therefore number of components can be reduced compared with conventional LED bulb.
Therefore, by the LED bulb 1 in present embodiment, component costs and assembling procedure can be reduced.Also, due to without using
Base station, therefore, it is possible to realize the lightweight of LED bulb 1.
Also, in the present embodiment, peripheral framework 20 is the cylinder of the tubular with opening portion 21, is set in opening portion 21
It is equipped with mounting surface 21a1, for loading substrate 11 mounting portion 21a.Also, by substrate 11 to cover opening portion 21
Mode and be placed in mounting surface 21a1, so as to be contacted with peripheral framework 20.
Accordingly, by making substrate 11 be contacted with mounting portion 21a mounting surface 21a1 for face, so as to will efficiently conduct
Light-emitting component 12 to substrate 11 is thermally conducted to peripheral framework 20.Therefore, it is possible to further light-emitting component 12 occurs
Heat is radiated.
Also, in the present embodiment, mounting portion 21a mounting surface 21a1 has the opening portion 21 for constituting peripheral framework 20
End face ring-type plane.
Accordingly, substrate 11 is contacted as the outer region in substrate 11 with peripheral framework 20 (mounting portion 21a).That is, substrate
11 with the peripheral ring-like contact of framework 20.In the present embodiment, substrate 11 and the contact surface of peripheral framework 20 are circular.This
Sample, because substrate 11 and periphery framework 20 are ring-like contact, therefore can be equably in substrate in the heat that light-emitting component 12 occurs
11 circumference on disperse conduction, so as to further efficiently light-emitting component 12 occurs heat radiate.
Also, in the present embodiment, peripheral framework 20 has the inner surface along peripheral framework 20, from peripheral framework 20
Opening portion 21 to the rib 23 of inboard (side of lamp holder 50) extension, the end face of a side of rib 23 constitutes mounting portion 21a mounting surface
A 21a1 part.
Accordingly, there is provided the part of rib 23, as making substrate 11 and the contact surface of peripheral framework 20 connect increased part, because
This heat that further efficiently light-emitting component 12 can occur radiates.
Also, the rib 23 of peripheral framework 20 can set multiple in the circumference of the inner surface along peripheral framework 20.
Accordingly, due to the contact area with peripheral framework 20 can be increased, therefore, it is possible to further efficiently to luminous member
Heat produced by part 12 is radiated.Now, by increasing the height (thickness) of rib 23, then thermal diffusivity can further be improved.
Hereby it is possible to realize the LED bulb 1 of more power.
Also, the screw extended on the cylinder axis direction of external surrounding frame body 20 in the present embodiment, is provided with rib 23
23a, is provided with through hole 11c on the substrate 11.Also, substrate 11 is by break-through through hole 11c and quilt with peripheral framework 20
Screw 23a screw 60 is screwed into fix.
Hereby it is possible to which using rib 23, substrate 11 is fixed with peripheral framework 20.It is additionally, since metal screw
60 is bigger than the pyroconductivity of resinous peripheral framework 20, therefore by using screw 60, screw 60 can play conducting path
Effect.Therefore, it is possible to further efficiently light-emitting component 12 occurs heat radiate.
Also, in the present embodiment, screw 60 is in the case of vertical view, than the position that light-emitting component 12 is located at outside.
So, by the way that the screw 60 of the function with heat conduction path is configured than the outer side of light-emitting component 12, from
And can be by the thermal conductivity occurred in light-emitting component 12 laterally.Therefore, it is possible to further efficiently to occurring in light-emitting component 12
Heat radiated.
Also, in the present embodiment, it is provided with gap between the axle portion of screw 60 and the through hole 11c of substrate 11.
Accordingly, it is that produced stress can be absorbed and be relaxed by the gap tightening screw 60.
Also, in the present embodiment, LED bulb 1 possesses the enclosed globe shade 30 of covering luminous element 12.
Hereby it is possible to light-emitting component 12 be protected, so as to realize the LED bulb 1 of high reliability.
In this case, enclosed globe shade 30 compared with for resin be preferably glass system.
Accordingly, for compared with resin-made, by increasing capacitance it is possible to increase the pyroconductivity of enclosed globe shade 30.Therefore, it is possible to further efficiently
The heat occurred in light-emitting component 12 is radiated.Actually when measuring junction temperature (Ts) of light-emitting component 12, glass is being employed
The situation of the enclosed globe shade 30 of glass, than the situation using resinous enclosed globe shade 30, can make the junction temperature of light-emitting component 12 reduces
About 9 DEG C.
Also, in the present embodiment, it is formed with the opening portion 21 of external surrounding frame body 20 than mounting portion 21a close to outside
The groove portion 21b of ring-type, the end of the opening portion 31 of enclosed globe shade 30 is configured in groove portion 21b.
Accordingly, due to the position of enclosed globe shade 30 can be easily determined by, enclosed globe shade 30 is fixed therefore, it is possible to high precision
To peripheral framework 20.
Also, in the present embodiment, enclosed globe shade 30 and peripheral framework 20 are by being filled in the opening of peripheral framework 20
The groove portion 21b in portion 21 sticker 24 and fixed.
Accordingly, by sticker 24, enclosed globe shade 30 can be fixed with peripheral framework 20 with gap with not leaving, because
This can suppress insect or moisture etc. and enter in enclosed globe shade 30.
Also, in the present embodiment, groove portion 21b is formed into the position relative with the second face 11b of substrate 11 always.
Accordingly, until the second face 11b sides (back side) of substrate 11 can fill sticker 24.So, it is viscous after solidification
Agent 24 turns into the composition for the peripheral end that can hang over substrate 11, so as to suppress enclosed globe shade 30 and sticker 24 from periphery
Framework 20 comes off.
Also, in the present embodiment, LED bulb 1 is also equipped with for making the luminous circuit unit 40 of light-emitting component 12, electricity
Road unit 40 is incorporated in peripheral framework 20.
So, by storing circuit unit 40 with external surrounding frame body 20, so as to realize the LED of built-in circuit unit 40
Bulb 1.
Also, in the present embodiment, circuit unit 40 is only incorporated in peripheral framework 20.
Accordingly, circuit unit 40 can be protected by peripheral framework 20.That is, peripheral framework 20 can not only be used as LED bulb 1
Peripheral components utilize, and can be utilized as circuit case.Therefore, it is possible to reduce the quantity of part.In addition, at this
In the case of kind, in order to ensure the insulation of circuit unit 40 is pressure-resistant, peripheral framework 20 can be made up of insulating materials.
Also, in the present embodiment, LED bulb 1 is also equipped with lamp holder 50, for the electricity for receiving to make light-emitting component 12 luminous
Power, lamp holder 50 is installed in the part with the opposite side of opening portion 21 in peripheral framework 20.Specifically, lamp holder 50 is mounted
In the opening portion 22 of external surrounding frame body 20.
Hereby it is possible to realize the LED bulb 1 of the socket of the removable appliance body loaded on ligthing paraphernalia.
Also, in the present embodiment, peripheral framework 20 is resin-made.
Hereby it is possible to cheap into making safe LED bulb 1 originally.
(variation of embodiment 1)
Fig. 5 is the amplification sectional view for the major part for showing the LED bulb 1A involved by the variation of embodiment 1.
LED bulb 1A in this variation is compared with the LED bulb 1 in above-mentioned embodiment 1, light-emitting component 12 and quilt
The relative position relation of rib 23 for being arranged at peripheral framework 20 is different.For composition in addition, this variation and above-mentioned reality
Apply mode 1 identical.
Specifically, the LED bulb 1 in above-mentioned embodiment 1, in the case where overlooking substrate 11, light-emitting component
12 do not have overlapping, the LED bulb 1A in this variation with rib 23, in the case where overlooking substrate 11, as shown in figure 5, luminous
Element 12 is overlapping with rib 23.That is, at least a portion of light-emitting component 12 is relative to the rib 23 of external surrounding frame body 20 across substrate 11, hair
Optical element 12 is configured with rib 23 in the way of clipping substrate 11.
For example, a part for light-emitting component 12 is located at the surface of rib 23 across substrate 11.In other words, rib 23 is across base
Plate 11 is located at the underface of a part for light-emitting component 12.
So, by making at least a portion of light-emitting component 12 relative with the rib 23 of peripheral framework 20 across substrate 11, from
And the heat conduction path from light-emitting component 12 to rib 23 can be shortened.Therefore, because will efficiently can be sent out in light-emitting component 12
Raw is thermally conducted to peripheral framework 20, so as to further light-emitting component 12 occurs heat radiate.
Also, in the case where making light-emitting component 12 overlapping with rib 23, it can be located at rib 23 and constitute light-emitting component 12
LED chip 12b underface.Accordingly, because the heat that can further shorten from the LED chip 12b as thermal source to rib 23 is passed
Guiding path, therefore, it is possible to further efficiently be radiated to the heat occurred in light-emitting component 12.
(embodiment 2)
Then, the LED bulb 2 involved by embodiment 2 is illustrated using Fig. 6 to Fig. 8.Fig. 6 is the institute of embodiment 2
The section oblique view for the LED bulb 2 being related to.Fig. 7 is the oblique view of the peripheral framework 20A in the LED bulb 2.Fig. 8 is the LED
The major part amplification sectional view of bulb 2, shows the structure for the region Y that Fig. 6 dotted line is irised out.Also, eliminate electricity in Fig. 6
The diagram of road unit 40.
The difference of LED bulb 2 in present embodiment and the LED bulb 1 in above-mentioned embodiment 1 is external surrounding frame
The shape of body.In addition, embodiment 2 is identical with the composition of embodiment 1.
Specifically, it is also same with embodiment 1 in the present embodiment, external surrounding frame body 20 is provided with multiple ribs 23.
In embodiment 1, screw 23a is each formed with two ribs 23, and in the present embodiment, 10 are set on external surrounding frame body 20
Individual rib 23, two ribs 23 therein are formed with screw 23a, remaining eight ribs 23 and do not form screw 23a.I.e. in this implementation
In mode, only screw 23a is formd at least one of rib 23 of multiple ribs 23.
The rib 23 for not forming screw 23a and the rib 23 for being formed with screw 23a are same, the end face (side of enclosed globe shade 30 of a side
End face) constitute mounting portion 21a mounting surface 21a1 a part.I.e. as shown in figure 8, not forming screw 23a rib
The end face of 23 side is contacted with the second face 11b of substrate 11 for face.
So, in the present embodiment, the quantity of rib 23 is added compared with the LED bulb 1 of embodiment 1.Accordingly, rib
The increased part of 23 quantity, can make substrate 11 and the contact area increase of peripheral framework 20.Therefore, with embodiment 1
LED bulb 1 compare, can further efficiently to light-emitting component 12 occur heat radiate.
Also, by increasing the quantity of rib 23, so as to increase the thermal capacity of peripheral framework 20, it can so improve outer
The heat dispersion of peripheral frame body 20.Moreover, rib 23 extends in the direction from opening portion 21 to opening portion 22, therefore, it is possible to easily will
The heat transfer of light-emitting component 12 of peripheral framework 20 is transmitted to the side of lamp holder 50.In such manner, it is possible to further efficiently in hair
The heat that optical element 12 occurs is radiated.
Also, the rib 23 for not forming screw 23a and the rib 23 for being formed with screw 23a are same, along peripheral framework 20
Inner surface it is circumferentially disposed multiple.Specifically, do not form screw 23a rib 23 and be formed with screw 23a rib 23
Set at equal intervals along the circumference of the inner surface of peripheral framework 20.That is, all ribs 23 are equally spaced to be configured to put
Penetrate shape.
Accordingly, in the hot due to can radially be transmitted to substrate 11 of the generation of light-emitting component 12, therefore, it is possible to efficiently
The heat occurred in light-emitting component 12 is radiated.
Also,, can be with the case where overlooking substrate 11 as shown in figure 9, be also same in the present embodiment
Make light-emitting component 12 overlapping with rib 23.That is, at least a portion of light-emitting component 12 can be across substrate 11 and with peripheral framework
20 rib 23 is relative.In this case, the rib 23 relative with light-emitting component 12 be as shown in figure 9, screw 23a can not be formed,
Screw 23a can also be formed.
So, by making at least a portion of light-emitting component 12 relative with the rib 23 of peripheral framework 20 across substrate 11, because
This can shorten the heat conduction path from light-emitting component 12 to rib 23.Therefore, it is possible to further efficiently in light-emitting component 12
The heat of generation is radiated.
Also, it is also same in this case, rib 23 can also be present in the LED chip 12b for constituting light-emitting component 12
Underface.
(other variations etc.)
The lighting device involved by the utility model is illustrated based on embodiment and variation above, still
The utility model is not limited by above-mentioned embodiment and each variation.
For example in above-mentioned embodiment 1,2 and variation, although being adopted to substrate 11 with peripheral fixing for framework 20
With two screws 60, but the screw 60 of more than three can also be used to substrate 11 and the fixation of peripheral framework 20.As above
Shown in the embodiment 1,2 stated, in the case where substrate 11 is fixed with peripheral framework 20 using two screws 60, by
Lighting and produced thermal stress of turning off the light in lighting device, and the reflex action of substrate 11 (module substrate) can be caused.In this regard,
In the case of substrate 11 is fixed with peripheral framework 20 using at least three screws 60, it can reduce because above-mentioned heat should
Power and the reflex action of substrate 11 caused.Moreover, entering by using the screw 60 of more than three to substrate 11 with peripheral framework 20
Row is fixed, and so as to suppress to produce gap between substrate 11 and peripheral framework 20, and can also be reduced even if there is gap
Its interval, therefore, it is possible to improve the thermal conductivity from substrate 11 to peripheral framework 20.
Also, the utility model acts not only as LED bulb to realize, and can as possess LED bulb and
The ligthing paraphernalia for installing the appliance body of the LED bulb is realized.The lamp holder of mounted LED lamp bubble is provided in appliance body
Socket.Also, ligthing paraphernalia can possess the lampshade of the translucency of covering LED bulb.
Also, in above-mentioned embodiment 1,2 and variation, although be illustrated by taking LED bulb as an example, still
The utility model can also be applied to substitute the straight tube LED of straight-pipe fluorescent lamp or with GX53 lamp holders or GH76p lamp holders
Deng plate LED etc. there is the LEDs of other lamp holders.
Also, in above-mentioned embodiment 1,2 and variation, as lighting device to install and be used in luminaire
It is illustrated exemplified by the lighting device with lamp holder of tool, but the lighting device involved by the utility model can be used as photograph
Funerary objects tool is realized in itself.This lighting device can include the Down lamp for being arranged on ceiling, shot-light, ceiling lamp or desk lamp
Deng ligthing paraphernalia.
Also, in above-mentioned embodiment 1,2 and variation, although substrate 11 is with screw 60 with peripheral framework 20
And by fixed, the fixing means of substrate 11 and peripheral framework 20 is not fixed by screw to be limited, sticker etc. can also be passed through
Other fixing means fix substrate 11 and peripheral framework 20.
Also, in above-mentioned embodiment 1,2 and variation, light-emitting component 12 employs SMD type LED element, but
It is not to be limited by this.For example, it is also possible to using bare chip to be mounted directly to COB (the Chip On of (once mounting) to substrate
Board：Chip on board) type LED module.That is, can be using LED chip in itself as light-emitting component 12.In this case,
By seal member multiple LED chips can be carried out with sealing in the lump or individually sealing.It can contain in seal member as more than
Described yellow fluorophor equiwavelength's coversion material.
Also, in above-mentioned embodiment 1,2 and variation, although light-emitting component 12 is by blue LED die
The White LED element of the B-Y types of white light is released with yellow fluorophor, but is not limited by this.It is for instance possible to use containing
Red-emitting phosphors and green-emitting phosphor contain phosphor resin, it is combined with blue LED die and is released white light.Also,
In the case of in order to improve color rendering, red-emitting phosphors or green-emitting phosphor can also be mixed into addition to yellow fluorophor.And
And, the blue light released than blue LED die can for example be used using the LED chip for sending the color beyond blueness
The short UV LED chip for sending ultraviolet light of wavelength, mainly by uv light induction, by release blue light, red light and
Blue emitting phophor, green-emitting phosphor and the red-emitting phosphors of green light and release white light.
Also, in above-mentioned embodiment 1,2 and variation, LED module 10 can also be configured to carry out
Brightness adjustment control and/or may be mixed colours and be controlled.For example, LED module 10 sends the red LED light source of red light, hair by possessing
The green LED light source for going out green light and the blue led light source for sending blue light, thus allow for RGB controls.Accordingly, energy
Enough realize can carry out the LED module of toning control.
Also, in above-mentioned embodiment 1,2 and variation, enter as the light source of light-emitting component 12 by taking LED as an example
Go explanation, but can be using semiconductor light-emitting elements, organic EL (Electro Luminescence such as semiconductor lasers：
Electroluminescent) or other solid-state light emitting elements such as inorganic EL.
In addition, for each above-mentioned embodiment and variation implement those skilled in the art it is conceivable that shape
State is being wanted in the range of not departing from purport of the present utility model to the composition in each above-mentioned embodiment and variation
The form that element and function arbitrarily combine to realize is all contained in the range of the utility model.
Claims (18)
1. a kind of lighting device, it is characterised in that
The lighting device possesses：
Substrate；
Light-emitting component, is configured in the first face of the substrate；And
Peripheral framework, keeps the substrate,
The state that the substrate is contacted with the second face of the substrate with the peripheral framework, is fixed on the peripheral framework,
Second face of the substrate is the face with first face opposite side.
2. lighting device as claimed in claim 1, it is characterised in that
The peripheral framework is the cylinder of the tubular with opening portion,
In the opening portion, the mounting portion with mounting surface is set, for loading the substrate,
The substrate by way of covering the opening portion to be placed in the mounting surface, so as to be connect with the peripheral framework
Touch.
3. lighting device as claimed in claim 2, it is characterised in that
The mounting surface has the plane of the ring-type for the end face for constituting the opening portion.
4. lighting device as claimed in claim 2, it is characterised in that
The peripheral framework has the inner surface along the peripheral framework, and from the opening portion of the peripheral framework inwards
The rib of side extension,
The end face of one side of the rib constitutes a part for the mounting surface.
5. lighting device as claimed in claim 4, it is characterised in that
The circumference of inner surface of the rib along the peripheral framework is equipped with multiple.
6. lighting device as claimed in claim 4, it is characterised in that
At least a portion of the light-emitting component is relative with the rib across the substrate.
7. the lighting device as described in any one of claim 4 to 6, it is characterised in that
The screw extended on the cylinder axis direction of the peripheral framework is at least provided with a rib,
The substrate is provided with through hole,
The substrate and the peripheral framework are, by through hole described in screw break-through, and to be screwed into the screw and fixed
Together.
8. lighting device as claimed in claim 7, it is characterised in that
In the case of vertical view, the screw is located at outside than the light-emitting component.
9. lighting device as claimed in claim 7, it is characterised in that
Gap is provided between the axle portion and the through hole of the screw.
10. lighting device as claimed in claim 2, it is characterised in that
The lighting device is also equipped with covering the diffuser of the light-emitting component.
11. lighting device as claimed in claim 10, it is characterised in that
The diffuser is glass system.
12. lighting device as claimed in claim 10, it is characterised in that
The groove portion of ring-type is formed with the opening portion, the groove portion of the ring-type is located at outside than the mounting portion,
The end of the opening portion of the diffuser is configured in the groove portion.
13. lighting device as claimed in claim 12, it is characterised in that
The diffuser is fixed with the peripheral framework by being filled in the sticker of the groove portion.
14. lighting device as claimed in claim 13, it is characterised in that
The groove portion is formed into the position relative with second face of the substrate always.
15. lighting device as claimed in claim 1, it is characterised in that
The lighting device is also equipped with for making the luminous circuit unit of the light-emitting component,
The circuit unit is incorporated in the peripheral framework.
16. lighting device as claimed in claim 15, it is characterised in that
The circuit unit is only incorporated in the peripheral framework.
17. lighting device as claimed in claim 2, it is characterised in that
The lighting device is also equipped with lamp holder, and the lamp holder receives the electric power for making the light-emitting component luminous,
The lamp holder is installed in the part with the opening portion opposite side of the peripheral framework.
18. lighting device as claimed in claim 1, it is characterised in that
The peripheral framework is resin-made.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015210160A JP6803553B2 (en) | 2015-10-26 | 2015-10-26 | Lighting device |
| JP2015-210160 | 2015-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206600639U true CN206600639U (en) | 2017-10-31 |
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ID=58713104
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621165662.5U Active CN206600639U (en) | 2015-10-26 | 2016-10-25 | Lighting device |
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|---|---|
| JP (1) | JP6803553B2 (en) |
| CN (1) | CN206600639U (en) |
Families Citing this family (2)
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|---|---|---|---|---|
| JP2019079602A (en) * | 2017-10-20 | 2019-05-23 | パナソニックＩｐマネジメント株式会社 | Lighting device |
| JP2020021691A (en) * | 2018-08-03 | 2020-02-06 | 東芝ライテック株式会社 | Lamp device and illuminating device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010029515A1 (en) * | 2010-05-31 | 2011-12-01 | Osram Gesellschaft mit beschränkter Haftung | A semiconductor lamp, a method of manufacturing a bulb for a semiconductor lamp, and a method of manufacturing a semiconductor lamp |
| JP5276239B1 (en) * | 2012-02-23 | 2013-08-28 | パナソニック株式会社 | lamp |
| JP2013242986A (en) * | 2012-05-18 | 2013-12-05 | Toshiba Lighting & Technology Corp | Lamp with cap and lighting fixture |
| CN204922541U (en) * | 2012-12-20 | 2015-12-30 | 松下知识产权经营株式会社 | Lamp and lighting device |
| JP6436702B2 (en) * | 2013-09-27 | 2018-12-12 | 三菱電機株式会社 | Composite housing and lighting lamp |
| JP6239415B2 (en) * | 2014-03-19 | 2017-11-29 | 株式会社東芝 | Lighting device |
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| JP6803553B2 (en) | 2020-12-23 |
| JP2017084534A (en) | 2017-05-18 |
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