CN109140265B - Light source for illumination and illumination device - Google Patents

Light source for illumination and illumination device Download PDF

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Publication number
CN109140265B
CN109140265B CN201710498579.2A CN201710498579A CN109140265B CN 109140265 B CN109140265 B CN 109140265B CN 201710498579 A CN201710498579 A CN 201710498579A CN 109140265 B CN109140265 B CN 109140265B
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CN
China
Prior art keywords
heat sink
module
hole
light
mounting surface
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CN201710498579.2A
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Chinese (zh)
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CN109140265A (en
Inventor
黄娟
戴忻
川越进也
植本隆在
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to CN201710498579.2A priority Critical patent/CN109140265B/en
Publication of CN109140265A publication Critical patent/CN109140265A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The invention provides a light source for illumination and an illumination device. A bulb-shaped lamp (1) as a light source for illumination, comprising: an LED module (10); a drive circuit (30) for causing the LED module (10) to emit light; a heat sink (20) having a mounting surface (21a) on which the LED module (10) is mounted and an annular outer peripheral portion surrounding the mounting surface (21a), the heat sink accommodating the drive circuit (30) on the side opposite to the LED module (10) with respect to the mounting surface (21 a); and an information acquisition module (40) that is connected to the drive circuit (30) and acquires information for controlling light emission of the LED module (10), wherein the heat sink (20) is provided with a through hole (22c) that penetrates a part of the heat sink (20) at the outer peripheral portion thereof, and the information acquisition module (40) is configured such that at least a part thereof overlaps the through hole (22c) when viewed in the penetrating direction of the through hole (22 c).

Description

Light source for illumination and illumination device
Technical Field
The present invention relates to a light source for illumination and an illumination device.
Background
Conventionally, a bulb-shaped lamp (LED lamp) including a semiconductor Light Emitting element such as a Light Emitting Diode (LED) is known (for example, see patent document 1). The LED lamp described in patent document 1 includes a human detection sensor, and is turned on when a human is detected and turned off when a human is not detected. Accordingly, reduction in power consumption is attempted.
Patent document 1: japanese patent laid-open publication No. 2012-204213
In the conventional LED lamp, however, the motion sensor is disposed inside a spherical cap in the shape of a spherical shell that transmits light from the light source device and emits the light to the outside of the lamp. Therefore, there is a problem that the mounting area of the light emitting element is reduced in the globe, and the light distribution performance is degraded. Further, there is a problem that heat emitted from the light emitting element reaches the human detection sensor, and the sensor function is degraded.
Disclosure of Invention
Accordingly, an object of the present invention is to provide an illumination light source and an illumination device that suppress a decrease in light distribution performance and ensure an acquisition function of information for controlling light emission.
In order to achieve the above object, an illumination light source according to one embodiment of the present invention includes: a light emitting module; a driving circuit for making the light emitting module emit light; a heat sink having a mounting surface on which the light emitting module is mounted and an annular outer peripheral portion surrounding the mounting surface, the heat sink housing the drive circuit on a side opposite to the light emitting module with respect to the mounting surface; and an information obtaining module connected to the drive circuit and configured to obtain information for controlling light emission of the light emitting module, wherein the heat sink is provided with a through hole that penetrates a part of the heat sink at the outer peripheral portion, and the information obtaining module is located on a side opposite to the light emitting module with respect to the placement surface, and at least a part of the information obtaining module overlaps the through hole when viewed in a penetrating direction of the through hole.
Further, an illumination device according to an embodiment of the present invention includes the illumination light source.
According to the present invention, it is possible to provide an illumination light source and an illumination device that suppress a decrease in light distribution performance and ensure an acquisition function of information for controlling light emission.
Drawings
Fig. 1 is a cut-out oblique view of a part of an LED lamp according to embodiment 1.
Fig. 2 is a sectional view of an LED lamp according to embodiment 1.
Fig. 3 is a sectional view showing a part of an LED lamp according to modification 1 of embodiment 1.
Fig. 4 is a sectional view showing a part of an LED lamp according to modification 2 of embodiment 1.
Fig. 5 is a sectional view of an LED lamp according to modification 3 of embodiment 1.
Fig. 6 is a sectional view of an LED lamp according to modification 4 of embodiment 1.
Fig. 7 is a sectional view of an LED lamp according to embodiment 2.
Fig. 8 is a sectional view showing a part of an LED lamp according to embodiment 2.
Fig. 9 is a sectional view of an LED lamp according to modification 1 of embodiment 2.
Fig. 10 is a sectional view of an LED lamp according to modification 2 of embodiment 2.
Fig. 11 is a sectional view of an LED lamp according to modification 3 of embodiment 2.
Fig. 12 is a sectional view of a lighting device according to embodiment 3.
Description of the symbols
1. 101, 102, 103, 104, 201, 202, 203, 204 bulb-shaped lamp (light source for lighting)
2 Lighting device
10 LED Module (luminous module)
20. 120, 125, 220 heat sink
21a carrying surface
21c, 221c flange
23. 123, 123a, 123b, 128a, 128b, 128c, 223 through hole
24. 224, 225 insulating films (insulating resin member, heat insulating resin member)
30 drive circuit
40. 43 information acquisition module (sensor module, wireless communication module)
50 spherical cover
50a edge
60 lamp holder
70. 71, 72, 270 cover member
222a edge (outboard end)
Detailed Description
Hereinafter, an illumination light source and an illumination device according to an embodiment of the present invention will be described in detail with reference to the drawings. The embodiments described below are all specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement and connection forms of the constituent elements, steps, order of the steps, and the like shown in the following embodiments are merely examples and do not limit the spirit of the present invention. Therefore, among the constituent elements of the following examples, constituent elements that are not described in the embodiments showing the uppermost concept of the present invention are described as arbitrary constituent elements.
Each drawing is a schematic drawing, and is not necessarily a strictly illustrated drawing. Therefore, for example, the scale in each drawing does not necessarily coincide. In the drawings, substantially the same components are denoted by the same reference numerals, and redundant description is omitted or simplified.
In the present specification, terms indicating the relationship between elements such as parallel or orthogonal, terms indicating the shape of elements such as circular, and numerical ranges are not expressions that only have strict meanings, but expressions that include substantially equivalent ranges with a difference of, for example, about several%.
In the following embodiments, a bulb-shaped LED lamp (LED bulb) that is a substitute for a bulb-shaped fluorescent lamp or an incandescent bulb will be described as an example of a light source for illumination.
(example 1)
[ Structure ]
First, the overall structure of the bulb-shaped lamp according to embodiment 1 will be described with reference to fig. 1 and 2.
Fig. 1 is a cut-out oblique view of a part of an LED lamp 1 according to the present embodiment. Fig. 2 is a sectional view of the LED lamp 1 according to the present embodiment. In fig. 1, a part of the globe 50 is cut away to show the LED module 10 in the globe 50.
In fig. 1 and 2, a lamp axis (central axis) J of the bulb-shaped lamp 1 is shown by a chain line drawn in the vertical direction of the drawing. In the present embodiment, the lamp axis J coincides with the axis of the globe 50 (globe axis). The lamp axis J is an axis that becomes a rotation center when the bulb-shaped lamp 1 is attached to a socket of the lighting device, and coincides with a rotation axis of the base 60.
As shown in fig. 1, the bulb-shaped lamp 1 includes an LED module 10, a heat sink 20, a globe 50, and a base 60. As shown in fig. 2, the bulb-shaped lamp 1 further includes a drive circuit 30, an information acquisition module 40, and a cover member 70.
In the present embodiment, the bulb-shaped lamp 1 is a surround composed of the heat sink 20, the globe 50, and the base 60. As shown in fig. 1, the LED module 10 is mounted on the heat sink 20 and covered with a globe 50. As shown in fig. 2, the drive circuit 30 and the information acquisition module 40 are housed in the heat sink 20. The heat sink 20 is provided with a through hole 23 at a position closer to the LED module 10 than the base 60. The cover member 70 closes the through-hole 23.
Hereinafter, the components of the bulb-shaped lamp 1 according to the present embodiment will be described with reference to fig. 1 and 2.
[ LED Module (light emitting Module) ]
The LED module 10 is a light emitting module (light emitting device) that emits light of a predetermined color (wavelength). The LED module 10 according to the present embodiment is configured to emit white light.
The LED module 10 is disposed inside the globe 50. The LED module 10 is mounted on the base 21 of the heat sink 20, and emits light by power supplied from the drive circuit 30.
As shown in fig. 1 and 2, the LED module 10 includes a substrate 11 and a light emitting element 12 mounted on the substrate 11. In the present embodiment, the substrate 11 is disposed in a posture orthogonal to the lamp axis J.
The substrate 11 is a mounting substrate for mounting the light emitting element 12. The substrate 11 is, for example, a plate-like substrate fixed to a substantially circular shape in plan view, and is fixed to the base 21. As the substrate 11, for example, a metal substrate obtained by applying an insulating coating to a metal base material such as aluminum, a ceramic substrate which is a sintered body of a ceramic material such as alumina, a resin substrate made of a resin material, or the like is used. The shape of the substrate 11 is not limited to a circular shape, and a rectangular substrate may be used.
A pair of electrode terminals (not shown) as power supply portions are provided on the surface of the substrate 11. Each of the pair of electrode terminals is connected to a pair of lead wires 31 led out from the drive circuit 30. On the surface of the substrate 11, metal wiring for electrically connecting the electrode terminals to the plurality of light emitting elements 12 is patterned.
In the present embodiment, a through hole 11a for passing the pair of leads 31 is provided in the center of the substrate 11 in a plan view. The through-hole 11a is, for example, a circular through-hole, but may be a rectangular through-hole. The lamp shaft J passes through the through hole 11 a. The through hole 11a may be provided at an end of the substrate 11, and may have a shape cut inward from an outer peripheral end of the substrate 11, for example.
A plurality of light emitting elements 12 are mounted on one surface of the substrate 11. In the present embodiment, the plurality of light emitting elements 12 are arranged on the circumference around the lamp axis J on the upper surface of the substrate 11. The plurality of light emitting elements 12 are mounted in such a posture that the main light emission direction thereof is directed forward of the bulb-shaped lamp 1. Here, the front direction is a direction from the base 60 toward the LED module 10 along the lamp axis J.
Each of the plurality of light emitting elements 12 is a Surface Mount (SMD) type LED element that is packaged. Specifically, the SMD type LED element includes a container (package) having a recess formed therein, an LED chip disposed in the recess, and a sealing member sealing the LED chip.
The LED chip is, for example, a blue LED chip that emits blue light when energized. The sealing member is made of a light-transmitting insulating resin material such as silicone resin, and contains a wavelength conversion member that converts the wavelength of light from the LED chip. The wavelength conversion member is, for example, a phosphor that converts blue light into yellow light. For example, the sealing member is a phosphor-containing resin in which yellow phosphor particles such as YAG (yttrium aluminum garnet) are dispersed. White light is emitted as a composite light of the blue light emitted from the LED chip and the yellow light emitted from the yellow phosphor particles excited by the blue light. The sealing member may contain a light diffusing material (light scattering material) such as silica.
The light emitted from the light emitting element 12 may be monochromatic light such as blue light or red light, instead of white light. The sealing member may not contain the wavelength conversion material. The light emitting element 12 may not include a sealing member.
In the present embodiment, the LED module 10 may have at least one of a dimming function and a color adjusting function. For example, the LED module 10 emits light with a dimming ratio selected from the range of 0% (light off) to 100% (full light on). The dimming ratio is an example of a parameter showing the intensity (irradiance) of light. For example, the LED module 10 emits light having a color temperature selected from the range of 2700K to 6500K. Color temperature is an example of a parameter showing the matching of colors of light. The indication of the selected dimming ratio and the color temperature is included in the information obtained by the information obtaining module 40.
Further, the LED module 10 may emit each of red light (R), green light (G), and blue light (B) independently. The LED modules 10 may be controlled (RGB-controlled) in their respective light outputs by control information.
[ Heat sink ]
The heat sink 20 is a member that dissipates heat generated by the LED module 10 during light emission to the outside. As shown in fig. 2, the heat sink 20 includes a mounting surface 21a on which the LED module 10 is mounted, and an annular outer peripheral portion surrounding the mounting surface 21 a. The heat sink 20 houses the driving circuit 30 on the side opposite to the LED module 10 with respect to the mounting surface 21 a.
The heat sink 20 is provided with a through hole 23 penetrating a part of the heat sink 20 at the outer peripheral portion. In the present embodiment, the through hole 23 penetrates the outer peripheral casing 22 corresponding to a side wall portion that is a part of the outer peripheral portion in a direction parallel to the placement surface 21 a.
In the present embodiment, the heat sink 20 has a bottomed cylindrical shape. Specifically, as shown in fig. 2, the heat sink 20 includes a base (module board) 21 and a peripheral case 22. The base 21 corresponds to the bottom of the heat sink 20. The outer case 22 corresponds to a cylindrical side wall portion of the heat sink 20.
The base 21 is a substantially disk-shaped support member (support base) that supports the LED module 10. Specifically, the base 21 has a mounting surface 21a on which the LED module 10 is mounted. The mounting surface 21a is, for example, a plane orthogonal to the lamp axis J, and has a substantially circular shape in plan view. The LED module 10 is fixed to the base 21 by a fixing metal component, a screw, an adhesive, or the like. The mounting surface 21a is a bottom surface of the heat sink 20, is a surface of the base 21, and is also a surface opposite to the opening (base 60) of the heat sink 20.
As shown in fig. 2, a through hole 21b for passing the pair of leads 31 is provided in the center of the mounting surface 21 a. The through-hole 21b is, for example, a circular through-hole, but may be a rectangular through-hole. The lamp shaft J passes through the through hole 21 b. The through-hole 21b is provided at a position overlapping with the through-hole 11a of the substrate 11 of the LED module 10 when the mounting surface 21a is viewed in plan.
In the present embodiment, as shown in fig. 1 and 2, the base 21 has an annular flange portion 21c extending outward from the outer periphery of the mounting surface 21 a. The annular flange 21c is a recess recessed from the mounting surface 21 a. That is, a step is provided between the mounting surface 21a and the flange 21 c. The edge 50a of the opening of the globe 50 is disposed in the flange portion 21c (recess).
The flange portion 21c constitutes a connection portion with the outer case 22. The flange portion 21c is fitted inside the outer case 22, and the outer peripheral surface of the flange portion 21c contacts the inner peripheral surface of the outer case 22. Accordingly, heat conducted from the LED module 10 to the base 21 can be efficiently conducted to the outer case 22.
In the present embodiment, the flange portion 21c forms an annular outer peripheral portion surrounding the mounting surface 21a together with the outer peripheral case 22. That is, the outer peripheral portion of the heat sink 20 includes the flange portion 21c of the base 21 and the outer peripheral case 22. The outer case 22 corresponds to a side wall portion that is erected from the outer end of the flange portion 21c toward the side opposite to the LED module 10 with respect to the mounting surface 21 a.
The outer case 22 is a cylindrical body configured to surround the drive circuit 30. The outer shell 22 has openings on both the globe 50 side and the base 60 side. The edge portion 22a of the opening on the spherical cover 50 side is configured to surround the flange portion 21c of the base 21. The cap 60 is fixed to the opening of the bottomed cylindrical heat sink 20 at the edge 22b of the opening on the cap 60 side.
The opening area of the outer shell 22 is gradually reduced from the opening on the globe 50 side to the opening on the base 60 side. Specifically, the outer casing 22 has a substantially frustoconical tubular shape.
A drive circuit 30 is housed inside the outer case 22. In the present embodiment, an information acquisition module 40 is also housed inside the outer case 22.
In the present embodiment, an insulating film 24 is formed on the inner surface of the outer case 22. And an insulating film 24 provided between the peripheral casing 22 and the drive circuit 30 and the information obtaining module 40. The insulating film 24 is an example of an insulating resin member that electrically insulates the drive circuit 30 and the information acquisition module 40 from the outer case 22. The insulating film 24 is formed of an insulating resin material such as silicone resin, for example. Alternatively, the insulating film 24 may be a metal oxide film such as aluminum oxide.
The insulating film 24 may be formed of a heat insulating resin material having low thermal conductivity. The insulating film 24 may be an example of a heat insulating resin member that suppresses heat transfer from the peripheral casing 22 to the information acquisition module 40.
The insulating film 24 may be provided on a surface opposite to the placement surface 21a of the base 21 (i.e., a surface on the inside of the heat sink 20). The insulating film 24 achieves at least one of a function of electrically insulating the heat sink 20 from the information acquisition module 40 and a function of suppressing heat transfer from the heat sink 20 to the information acquisition module 40.
In the present embodiment, the through hole 23 is provided in the outer case 22. Specifically, the through hole 23 is provided at a position closer to the edge 22a of the opening on the globe 50 side than to the edge 22b of the opening on the base 60 side. For example, the through-hole 23 is provided in a portion including the edge portion 22a when the outer jacket 22 is divided into four portions evenly along a dividing line orthogonal to the lamp axis J. That is, the through-hole 23 is provided close to the connecting portion of the base 21 and the outer case 22.
The base 21 and the outer case 22 are each formed of a metal material or a resin material having high thermal conductivity as a part of the heat sink 20. For example, each of the base 21 and the outer case 22 is formed of aluminum. Specifically, each of the base 21 and the outer case 22 is an aluminum die cast product, a press-worked product of an aluminum plate, or the like. In the present embodiment, the example in which the heat sink 20 is constituted by two members, the base 21 and the outer case 22, has been described, but the base 21 and the outer case 22 may be integrally constituted and the heat sink 20 may be constituted by one member.
[ drive Circuit ]
The drive circuit 30 is a circuit unit for causing the LED module 10 to emit light. In the present embodiment, the driving circuit 30 supplies power for causing the LED module 10 (specifically, the light emitting element 12) to emit light (light) to a lighting circuit (power supply circuit) of the LED module 10. Specifically, the driving circuit 30 converts the ac power supplied from the base 60 via the pair of lead wires 32 into the dc power, and supplies the converted dc power to the LED module 10 via the pair of lead wires 31.
In the present embodiment, the driving circuit 30 is connected to the information obtaining module 40 via the lead wire 33. The drive circuit 30 controls light emission of the LED module 10 based on the information for controlling light emission of the LED module 10 obtained by the information obtaining module 40.
In the present embodiment, the drive circuit 30 includes a circuit board and a plurality of electronic components (not shown) mounted on the circuit board. The drive circuit 30 is housed in the heat sink 20, and is fixed to the heat sink 20 by screw fastening, adhesion, engagement, or the like.
The circuit board is a printed circuit board in which metal wiring is patterned. A plurality of electronic components mounted on the circuit board are electrically connected by the metal wiring. The circuit board is arranged, for example, in parallel (vertically) to the lamp axis J.
The plurality of electronic components are a plurality of circuit elements for lighting the LED module 10, for example, a capacitor element such as an electrolytic capacitor or a ceramic capacitor, a resistor element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a diode, an integrated circuit element, or the like.
The leads 31 to 33 are, for example, copper alloy leads, and include core wires made of copper alloy and an insulating resin coating film covering the core wires. The lead wire 31 connects the driver circuit 30 and the LED module 10, and supplies the dc power converted by the driver circuit 30 to the LED module 10. The lead wire 32 connects the base 60 and the driver circuit 30, and supplies the alternating current received by the base 60 to the driver circuit 30. And a lead 33 connecting the driving circuit 30 and the information obtaining module 40, and supplying the information obtained by the information obtaining module 40 to the driving circuit 30.
[ information acquisition Module ]
The information obtaining module 40 is a module that obtains information for controlling light emission of the LED module 10. In the present embodiment, the information obtaining module 40 is connected to the driving circuit 30 via the lead wire 33.
The information for controlling the light emission of the LED module 10 is, specifically, control information included in a signal transmitted from another device. For example, the control information includes a lighting instruction, a lighting-out instruction, a dimming ratio, a color temperature, and the like of the LED module 10.
In the present embodiment, the information acquisition module 40 is a wireless communication module that performs wireless communication and receives a wireless signal from an operation terminal such as a remote controller or a touch panel operated by a user, or a device such as a portable information terminal such as a smartphone. The wireless communication is communication using radio waves (i.e., excluding visible light and infrared light). Specifically, the information obtaining module 40 is, for example, a wireless communication module that receives a signal according to the Bluetooth (registered trademark) standard. The wireless communication module is not limited to Bluetooth, and may perform wireless communication according to standards such as Wi-Fi and ZigBee (registered trademark).
In the present embodiment, the information obtaining module 40 has a transmission function in addition to a reception function. For example, the information obtaining module 40 transmits the received signal to other lighting devices. That is, the information acquisition module 40 may relay a signal from the operation terminal to another device. In this way, a device remote from the operation terminal (specifically, a device not located in the communication range of the operation terminal) can be caused to receive the signal transmitted from the operation terminal.
As shown in fig. 2, the information acquisition module 40 includes a substrate 41 and a transmission/reception unit 42. The substrate 41 is, for example, a printed wiring board, and the transmission/reception unit 42 is mounted thereon. The transmission/reception unit 42 is, for example, a chip antenna or a pattern antenna, and transmits and receives a radio signal.
The signal received by the information obtaining module 40 includes, for example, illumination control information related to turning on or off the LED module 10. The lighting control information includes a lighting instruction for lighting the LED module 10, a lighting-off instruction for lighting off the LED module 10, an instruction for selecting a dimming ratio or a color temperature of the LED module 10, and the like.
The driving circuit 30 controls light emission of the LED module 10 based on the information obtained by the information obtaining module 40. Specifically, the driving circuit 30 adjusts the power supplied to the LED module 10 based on the illumination control information included in the signal received by the information obtaining module 40. For example, when the illumination control information indicates a lighting instruction of the LED module 10, the driving circuit 30 supplies power to the LED module 10 to light the LED module 10. When the lighting control information indicates a light-off instruction of the LED module 10, the drive circuit 30 stops supplying power to the LED module 10, thereby turning off the LED module 10. When the lighting control information indicates an instruction to select the dimming ratio or the color temperature of the LED module 10, the drive circuit 30 controls the LED module 10 to emit light indicating the selected dimming ratio or color temperature indicated by the lighting control information.
Further, the information obtaining module 40 may be a sensor module that detects a physical quantity around the bulb-shaped lamp 1, instead of the wireless communication module. The sensor module is, for example, a human detection sensor module that detects a human, an illuminance sensor module that detects brightness (illuminance), an image sensor module that obtains a visible light image, or the like. The human body motion sensor module includes, for example, an infrared detection unit instead of the transmission/reception unit 42. The illuminance sensor module includes a light receiver such as a photodiode instead of the transmission/reception unit 42. The image sensor module includes, for example, an image sensor array element instead of the transmission/reception unit 42.
In this case, the driving circuit 30 controls light emission of the LED module 10 based on the detection result of the information obtaining module 40. For example, when the information acquisition module 40 is a human sensor module, the drive circuit 30 turns on the LED module 10 when a human is detected, and turns off the LED module 10 when a human is not detected. For example, when the information obtaining module 40 is an illuminance sensor module, the driving circuit 30 may adjust the amount of light emitted from the LED module 10 so that the detected illuminance becomes a predetermined value.
The information acquisition module 40 is at least partially overlapped with the through hole 23 when viewed from the penetrating direction of the through hole 23. The information obtaining module 40 is disposed on the side opposite to the LED module 10 with respect to the mounting surface 21a, that is, on the same side as the driver circuit 30.
In the present embodiment, the information acquisition module 40 is housed inside the heat sink 20. The information acquisition module 40 is disposed inside the heat sink 20 and close to the through hole 23. For example, a part of the information obtaining module 40 may be in contact with the insulating film 24 formed on the inner surface of the heat spreader 20.
The information obtaining module 40 obtains predetermined information from the outside through the through hole 23. Specifically, the information obtaining module 40 receives or receives the radio signal, light (visible light or infrared light), and the like that have passed through the through hole 23. The through-hole 23 is provided, and therefore, even in the case where the heat sink 20 is formed of a metal material, the information obtaining module 40 can receive a wireless signal (radio wave). Even when the heat sink 20 is made of a light-shielding material, the information acquisition module 40 can receive light such as visible light.
Also, in the present embodiment, the information obtaining module 40 is configured in a posture in which the substrate 41 is parallel to the lamp axis J, but is not limited thereto. The information obtaining module 40 may be disposed in an attitude in which the substrate 41 is orthogonal to the lamp axis J, that is, in an attitude parallel to the mounting surface 21 a.
[ spherical cover ]
The globe 50 is a translucent cover that covers the LED module 10, and is configured to extract light emitted from the LED module 10 to the outside of the lamp. Specifically, light emitted from the LED module 10 enters the inner surface of the globe 50, passes through the globe 50, and is extracted to the outside.
The spherical cap 50 is a hollow member having an opening, and has a shape in which a top portion on the opposite side of the opening is closed. The globe 50 is, for example, a hollow rotating body having the lamp axis J as an axis, and is configured in a substantially hemispherical shape with a constricted opening in the present embodiment.
The opening edge 50a of the globe 50 is fixed to the flange 21c of the heat sink 20. Specifically, the edge 50a of the opening is fixed to the flange 21c of the heat sink 20 with an adhesive 51. The adhesive 51 is, for example, silicone resin or the like.
The globe 50 may be made of a light-transmitting material such as a glass material such as silica glass, or a resin material such as acrylic (PMMA) or Polycarbonate (PC).
In the globe 50, a diffusion process for diffusing light emitted from the LED module 10 may also be performed. For example, a light diffusion film (light diffusion layer), a plurality of light diffusion dots, fine irregularities, or the like may be formed on the inner surface or the outer surface of the globe 50. Alternatively, the globe 50 may be formed of a transparent material to allow the inside to be seen.
[ Lamp holder ]
The base 60 is a power receiving unit that receives power for lighting the LED module 10 from outside the lamp. The base 60 is mounted, for example, in a socket of a lighting fixture. Accordingly, the base 60 can receive power from the socket of the lighting fixture when the bulb-shaped lamp 1 is turned on. The base 60 supplies the received power to the drive circuit 30 via the lead wire 32.
The base 60 is fixed to the edge portion 22b so as to cover the opening of the heat sink 20. Specifically, the base 60 is formed in a cap shape, and a female screw is formed on an inner surface thereof. The internal thread of the base 60 is screwed with the external thread provided at the rim portion 22b of the opening of the heat sink 20, so that the base 60 is fixed to the rim portion 22 b.
In the present embodiment, the base 60 is a screw-type edison-type (E-type) base, and is, for example, E26, E17, E16, or the like. Alternatively, the base 60 may be a plug-in base.
[ cover Member ]
The cover member 70 is a resin cover member that closes the through hole 23 provided in the heat sink 20. In this embodiment, the cover member 70 fills the through-hole 23. For example, the cover member 70 is formed of a light-transmitting resin material such as silicone resin.
A cover member 70 is provided, whereby the inside of the heat sink 20 is spaced apart from the outside. Therefore, it is possible to suppress entry of moisture, foreign matter, and the like into the heat sink 20, and to suppress occurrence of a failure due to a short circuit or the like of the drive circuit 30. Further, when a person touches the bulb-shaped lamp 1, the information acquisition module 40 disposed near the through hole 23 can be prevented from touching.
[ Effect and the like ]
As described above, the bulb-shaped lamp (illumination light source) 1 according to the present embodiment includes: an LED module 10; a drive circuit 30 for causing the LED module 10 to emit light; a heat sink 20 having a mounting surface 21a on which the LED module 10 is mounted and an annular outer peripheral portion surrounding the mounting surface 21a, and accommodating the drive circuit 30 on a side opposite to the LED module 10 with respect to the mounting surface 21 a; and an information obtaining module 40 connected to the driving circuit 30 and obtaining information for controlling light emission of the LED module 10. The heat sink 20 is provided with a through hole 23 penetrating a part of the heat sink 20 at the outer peripheral portion. The information obtaining module 40 is located on the opposite side of the LED module 10 with respect to the mounting surface 21a, and at least a part thereof overlaps the through-hole 23 when viewed in the penetrating direction of the through-hole 23.
Accordingly, since the information obtaining module 40 is located on the opposite side of the mounting surface 21a from the LED module 10, it is difficult to block the light emitted from the LED module 10, and a decrease in light distribution performance can be suppressed. Further, a large mounting area of the light emitting element 12 of the LED module 10 can be secured without being obstructed by the information acquisition module 40. Further, since at least a part of the information acquisition module 40 overlaps the through-hole 23, even when the heat sink 20 blocks radio waves, light, or the like to hinder the acquisition of information, information can be acquired through the through-hole 23. Further, since the heat sink 20 can efficiently dissipate heat from the LED module 10, it is possible to suppress a decrease in the function of obtaining information by the information obtaining module 40 due to the influence of heat.
As described above, according to the present embodiment, it is possible to provide the bulb-shaped lamp 1 that suppresses a decrease in light distribution performance and ensures an acquisition function of information for controlling light emission.
The information acquisition module 40 is a wireless communication module that receives a signal according to the Bluetooth (registered trademark) standard, for example. The driving circuit 30 controls light emission of the LED module 10 based on a signal received by the wireless communication module.
Accordingly, the information obtaining module 40 is a wireless communication module for obtaining information included in the signal through wireless communication. Therefore, when the heat sink 20 is formed of a material that does not pass radio waves, such as metal, the wireless communication by the information acquisition module 40 may be obstructed.
In contrast, according to the bulb-shaped lamp 1 of the present embodiment, since the through-hole 23 is provided in the heat sink 20, the signal can be transmitted and received through the through-hole 23. Therefore, according to the present embodiment, wireless communication by the information obtaining module 40 is possible, and information for controlling the LED module 10 such as a lighting instruction can be obtained.
In particular, a wireless communication module based on the Bluetooth standard has directivity in a communication range. Therefore, for example, by matching the axial direction of the through hole 23 with the direction in which the communication performance is high, even in a state in which the installation position of the information acquisition module 40 is housed inside the heat sink 20, sufficient communication performance can be achieved.
For example, the information acquisition module 40 may be a human detection sensor module that detects a human. The drive circuit 30 controls light emission of the LED module 10 based on the detection result of the human detection sensor module.
Accordingly, the information obtaining module 40 is a human detection sensor module that detects heat (infrared light) or the like generated by a human, thereby obtaining information on the presence or absence of the human. Therefore, when the heat sink 20 is formed of a light-shielding material such as metal, the detection of a person by the information acquisition module 40 may be hindered.
In contrast, according to the light bulb shaped lamp 1 of the present embodiment, since the through hole 23 is provided in the heat sink 20, infrared light can be detected through the through hole 23, and information on the presence or absence of a person can be obtained.
The heat sink 20 is formed of a metal material, for example.
Accordingly, the heat sink 20 is formed of a metal material having high thermal conductivity, and the thermal conductivity of the heat sink 20 can be improved. Therefore, heat transfer to the information obtaining module 40 can be suppressed, and therefore, a decrease in the function of obtaining information by the information obtaining module 40 due to the influence of heat can be suppressed. Further, heat generated from the LED module 10 can be efficiently dissipated, and a decrease in light emission performance of the LED module 10 can be suppressed.
The light bulb shaped lamp 1 further includes an insulating film 24 (insulating resin member) provided between the heat sink 20 and the information obtaining module 40 and electrically insulating the heat sink 20 and the information obtaining module 40, for example.
Accordingly, since conduction between the information obtaining module 40 and the heat sink 20 can be suppressed, occurrence of a failure due to a short circuit of the information obtaining module 40 can be suppressed.
The light bulb shaped lamp 1 further includes an insulating film 24 (heat insulating resin member) provided between the heat sink 20 and the information obtaining module 40 and suppressing heat transfer from the heat sink 20 to the information obtaining module 40.
Accordingly, the heat transmitted from the LED module 10 to the heat sink 20 can be sufficiently suppressed from reaching the information obtaining module 40. Therefore, the decrease in the information acquisition function due to the heat of the information acquisition module 40 can be sufficiently suppressed.
The outer peripheral portion includes, for example, an annular flange portion 21c extending outward from the outer periphery of the mounting surface 21a, and a side wall portion (outer peripheral case 22) standing from an outer end of the flange portion 21c toward the side opposite to the LED module 10 with respect to the mounting surface 21 a.
Accordingly, since the side wall portion (specifically, the outer case 22) can cover the drive circuit 30, the protection performance of the drive circuit 30 can be improved, and occurrence of a failure can be suppressed.
The through hole 23 penetrates the side wall portion in a direction parallel to the mounting surface 21a, for example.
Accordingly, the side wall portion of the through hole 23 is provided, and a large mounting surface 21a can be secured. Therefore, for example, the light emitting region (mounting region of the light emitting element 12) can be increased, and thus the light output of the bulb-shaped lamp 1 can be increased.
The bulb-shaped lamp 1 further includes a cover member 70 made of resin for closing the through hole 23, for example.
Accordingly, the through-holes 23 are closed by the cover member 70, and therefore, it is possible to suppress entry of moisture and foreign matter into the interior of the heat sink 20 through the through-holes 23. Therefore, it is possible to suppress the occurrence of a failure in the drive circuit 30 and the information obtaining module 40 due to the entering moisture or foreign matter.
The heat sink 20 has, for example, a bottomed cylindrical shape. The mounting surface 21a is a bottom surface of the heat sink 20. The bulb-shaped lamp 1 further includes a base 60 that receives power for lighting the LED module 10, supplies the power to the driving circuit 30, and is fixed to the heat sink 20 so as to cover the opening of the heat sink 20.
Accordingly, the entire periphery of the drive circuit 30 can be covered with the heat sink 20 and the base 60, and therefore, the protection performance of the drive circuit 30 can be further improved. Therefore, occurrence of failure can be suppressed, and the bulb-shaped lamp 1 with high reliability can be provided.
In the present embodiment, the outer casing 22 may be formed of a resin material having high heat conductivity. When the outer case 22 has an insulating property, the insulating film 24 may not be provided.
(modification of embodiment 1)
Next, a modification of example 1 will be described. In the following description, differences from embodiment 1 will be mainly described, and common points will be omitted or simplified in description.
[ modified examples 1-1 ]
First, modification 1 of embodiment 1 will be described with reference to fig. 3. Fig. 3 is a sectional view showing a part of a bulb-shaped lamp 101 according to the present modification. Specifically, fig. 3 is an enlarged cross-sectional view showing the flange portion 21c and the vicinity of the through hole 23 of the bulb-shaped lamp 1.
As shown in fig. 3, in the bulb-shaped lamp 101 according to the present modification, the information acquisition module 40 is located in the through hole 23. Specifically, the transmission/reception unit 42 of the information acquisition module 40 is entirely located inside the through hole 23, a part of the substrate 41 is located inside the through hole 23, and the remaining part is located inside the heat sink 20. Further, only the transceiver 42 may be positioned in the through-hole 23, or both the transceiver 42 and the substrate 41 may be completely positioned in the through-hole 23.
In the present modification, the cover member 71 fills the through hole 23 to mold the information acquisition module 40 located in the through hole 23. The cover member 71 is formed of a resin material having at least one of insulating properties and heat insulating properties. For example, the cover member 71 is an example of an insulating resin member that is provided between the heat sink 20 and the information obtaining module 40 and electrically insulates the heat sink 20 and the information obtaining module 40 from each other. The cover member 71 is an example of a heat insulating resin member that suppresses heat transfer from the heat sink 20 to the information acquisition module 40, for example.
According to the bulb-shaped lamp 101 of the present modification, since the information obtaining module 40 is positioned in the through hole 23, a large communication range or detection range of the information obtaining module 40 can be secured. Therefore, according to the present modification, the function of obtaining information of the bulb-shaped lamp 101 can be further improved.
[ modified examples 1 and 2]
Next, modification 2 of example 1 will be described with reference to fig. 4. Fig. 4 is a sectional view showing a part of a bulb-shaped lamp 102 according to the present modification. Specifically, fig. 4 is an enlarged cross-sectional view showing the flange portion 21c of the bulb-shaped lamp 102 and the vicinity of the through hole 23.
As shown in fig. 4, in the bulb-shaped lamp 102 according to the present modification, the transmission/reception unit 42 of the information acquisition module 43 is located outside the heat sink 20. The transceiver 42 is located at a position overlapping the through hole 23 when the through hole 23 is viewed in the penetrating direction.
In the present modification, the information acquisition module 43 includes the transmission/reception unit 42 and a base 44 that supports the transmission/reception unit 42. The base 44 is disposed to penetrate the through hole 23. On the base 44, metal wiring is formed on the surface or inside the same as the substrate 41 according to example 1, and the lead 33 is electrically connected to the transmission/reception unit 42.
As shown in fig. 4, the bulb-shaped lamp 102 according to the present modification includes the cover member 72. The cover member 72 covers the transceiver 42 protruding outside the heat sink 20. The cover member 72 is, for example, a resin member such as acrylic or polycarbonate.
In the present modification, the cover member 71 filling the through-hole 23 is not provided, but a resin member filling the space between the through-hole 23 and the base 44 may be provided. The resin member may be a heat insulating resin member or an insulating resin member.
According to the bulb-shaped lamp 102 of the present modification, since the information obtaining module 40 is located outside the heat sink 20, the communication range or the detection range of the information obtaining module 40 can be made larger. Further, since the cover member 72 is provided, it is possible to suppress adhesion of moisture and foreign matter to the information obtaining module 40 and to suppress contact of a person with the information obtaining module 40.
[ modified examples 1 to 3]
Next, modification 3 of embodiment 1 will be described with reference to fig. 5. Fig. 5 is a sectional view of a bulb-shaped lamp 103 according to the present modification.
As shown in fig. 5, the bulb-shaped lamp 103 according to the present modification includes a heat sink 120. The heat sink 120 includes a base 21, a peripheral case 122, and a circuit box 124.
The circuit box 124 is a box member (inner case) for housing the drive circuit 30. The circuit case 124 is an insulating cylindrical body (insulating case) configured to surround the drive circuit 30, and is formed of an insulating resin material such as polybutylene terephthalate (PBT). The circuit case 124 has a frustoconical shape with an opening area gradually decreasing from the LED module 10 to the base 60. The drive circuit 30 is held and supported by, for example, a projection or a groove provided on the inner surface of the circuit case 124.
In the present modification, a through hole 123 is provided that penetrates both the outer case 122 and the circuit box 124. Specifically, the through-hole 123 includes a through-hole 123a penetrating the peripheral case 122 and a through-hole 123b penetrating the circuit box 124. The through holes 123a and 123b have the same through axis.
Further, in the case where the information obtaining module 40 is a wireless communication module, the circuit box 124 is formed of a resin material, and therefore, the through hole 123b does not need to be provided. Also, as shown in fig. 5, a gap is provided between the peripheral case 122 and the circuit box 124, but the peripheral case 122 and the circuit box 124 may be provided in contact.
In the present modification, the cap 60 is fixed to the edge 22b of the opening of the heat sink 120 at the cap 60-side end of the circuit case 124. And a peripheral housing 122 sandwiched and held between the circuit box 124 and the base 60. The shapes of the circuit box 124 and the outer case 122 are not limited to these. As in embodiment 1, the base 60 may be fixed to the outer case 122.
According to the bulb-shaped lamp 103 of the present modification, the circuit box 124 formed of an insulating resin material is provided between the metal outer case 122 and the information acquisition module 40. Accordingly, occurrence of a failure due to electrical conduction (short circuit) between the information obtaining module 40 and the drive circuit 30 and the peripheral housing 122 can be suppressed.
[ modified examples 1 to 4]
Next, modification 4 of example 1 will be described with reference to fig. 6. Fig. 6 is a sectional view of a bulb-shaped lamp 104 according to the present modification.
As shown in fig. 6, the bulb-shaped lamp 104 according to the present modification includes a heat sink 125. The heat sink 125 includes a base 21, a peripheral case 126, a circuit box 124, and a metal case 127. The circuit box 124 is the same as in modification 3 of embodiment 1.
The outer case 126 is formed of an insulating resin material. As the resin material, for example, PBT or the like can be used. The shape and size of the outer case 126 are the same as those of the outer case 122 according to modification 3 of embodiment 1.
The metal case 127 is a cylindrical body configured to surround the drive circuit 30 and the circuit box 124. The metal case 127 is formed of a metal material such as aluminum, for example. The metal case 127 has a truncated cone shape in which the opening area gradually decreases from the LED module 10 to the base 60.
The metal case 127 is connected to the base 21 at an end on the LED module 10 side. Accordingly, heat conducted from the LED module 10 to the base 21 can be efficiently conducted to the metal case 127.
In the present modification, a through hole 128 is provided to penetrate all of the outer case 126, the metal case 127, and the circuit box 124. Specifically, the through hole 128 includes a through hole 128a penetrating the outer case 126, a through hole 128c penetrating the metal case 127, and a through hole 128b penetrating the circuit box 124. The through holes 128a to 128c have through axes matching each other.
In addition, in the case where the information acquisition module 40 is a wireless communication module, since the peripheral case 126 and the circuit box 124 are formed of a resin material, the through holes 128a and 128b do not need to be provided. When the through hole 128a is not provided, the cover member 70 may not be provided.
According to the bulb-shaped lamp 104 according to the present modification, since the circuit box 124 is provided, it is possible to suppress occurrence of a failure due to electrical conduction (short circuit) of the drive circuit 30 and the information obtaining module 40. Further, since the outer case 126 is formed using an insulating resin material, electric shock or the like when a person touches the outer case 126 can be suppressed, and safety can be improved.
(example 2)
Next, example 2 is explained.
In the bulb-shaped lamp according to embodiment 1 and the modification thereof, an example is shown in which a through hole penetrating in a direction parallel to the mounting surface is provided in a side wall portion (specifically, a surrounding case) of the bulb-shaped lamp. In contrast, in the bulb-shaped lamp provided in example 2, the flange portion surrounding the mounting surface was provided with a through hole penetrating in a direction orthogonal to the mounting surface.
Fig. 7 is a sectional view of a bulb-shaped lamp 201 according to the present embodiment. Fig. 8 is a sectional view showing a part of a bulb-shaped lamp 201 according to the present embodiment. Specifically, fig. 8 is an enlarged sectional view showing the flange portion 221c of the bulb-shaped lamp 201.
As shown in fig. 7, the bulb-shaped lamp 201 is different from the bulb-shaped lamp 1 according to embodiment 1 in that a heat sink 220 and a cover member 270 are provided instead of the heat sink 20 and the cover member 70. Hereinafter, the differences from embodiment 1 will be mainly explained, and common parts will be omitted or simplified in explanation.
[ Heat sink ]
The heat sink 220 includes a base (module board) 221 and a peripheral case 222. In the present embodiment, the base 221 is provided with a through hole 223. The peripheral case 222 is different from the peripheral case 22 according to embodiment 1 in that no through-hole 23 is provided.
The base 221 is a substantially disk-shaped support member (support base) that supports the LED module 10. The base 221 includes a mounting surface 21a on which the LED module 10 is mounted, and an annular flange 221c extending outward from the outer periphery of the mounting surface 21 a.
The annular flange 221c is a recess recessed from the mounting surface 21 a. That is, a step is provided between the mounting surface 21a and the flange 221 c. The edge 50a of the opening of the globe 50 is disposed on the flange portion 221 c.
In the present embodiment, as shown in fig. 7 and 8, the flange portion 221c of the heat sink 220 is provided with a through hole 223. The through hole 223 penetrates the flange 221c in a direction perpendicular to the mounting surface 21 a. The flange 221c as the recess has an annular bottom. The through hole 223 penetrates the bottom of the flange 221c (recess).
In the present embodiment, the through hole 223 is located outside the globe 50. Specifically, as shown in fig. 8, the through hole 223 is located between the edge 50a of the opening of the globe 50 and the edge 22a of the opening of the peripheral housing 222. The edge portion 22a corresponds to the outer end of the flange portion 221 c.
As shown in fig. 7 and 8, the information acquisition module 40 overlaps the through hole 223 when the through hole 223 is viewed in the penetrating direction. In the present embodiment, the information obtaining module 40 is configured in an attitude in which the substrate 41 is parallel to the placement surface 21 a. The transmitting/receiving portion 42 mounted on the substrate 41 overlaps the through hole 223 in the penetrating direction. Further, the information obtaining module 40 may be configured in such a posture that the substrate 41 is parallel to the lamp axis J.
The information obtaining module 40, as shown in fig. 8, the information obtaining module 40 is configured to be close to the base station 221. Therefore, in order to ensure insulation between the information obtaining module 40 and the base 221, an insulating film 224 is formed on the surface of the base 221 opposite to the placement surface 21 a.
Specifically, the insulating film 224 is provided between the base 221 and the drive circuit 30 and the information obtaining module 40. The insulating film 224 is an example of an insulating resin member that electrically insulates the drive circuit 30 and the information acquisition module 40 from the base 221. The insulating film 224 is formed using an insulating resin material such as silicone resin, for example. Alternatively, the insulating film 224 may be a metal oxide film such as aluminum oxide. The insulating film 224 may be formed using a heat insulating resin material having low thermal conductivity. The insulating film 224 may be an example of a heat insulating resin member that suppresses heat transfer from the base 221 to the information acquisition module 40.
[ cover Member ]
The cover member 270 is a resin cover member that closes the through-hole 223 provided in the heat sink 220. In the present embodiment, the cover member 270 fills the through-hole 223. For example, the cover member 270 is formed using a light-transmitting resin material such as silicone resin.
A cover member 270 is provided according to which the inside of the heat sink 220 is spaced apart from the outside. Therefore, it is possible to suppress entry of moisture, foreign matter, and the like into the heat sink 220, and to suppress occurrence of a failure due to a short circuit or the like of the drive circuit 30. Further, when a person touches the bulb-shaped lamp 201, the information obtaining module 40 disposed near the through hole 223 can be prevented from being touched.
In the present embodiment, the through-holes 223 may be filled with an adhesive 51 for fixing the spherical cap 50 to the heat sink 220, instead of the cover member 270. That is, the adhesive 51 may function as a cover member for blocking the through-hole 223.
[ Effect and the like ]
As described above, in the bulb-shaped lamp 201 according to the present embodiment, for example, the through hole 223 penetrates the flange portion 221c in the direction perpendicular to the mounting surface 21 a.
Accordingly, since the through hole 223 penetrates the flange portion 221c in the direction orthogonal to the mounting surface 21a, a large communication range or detection range of the information obtaining module 40 can be easily formed also in the direction orthogonal to the mounting surface 21 a. The direction perpendicular to the mounting surface 21a is a direction in which light from the LED module 10 is emitted, and is, for example, a direction toward a space such as a room in which the bulb-shaped lamp 201 is mounted. Therefore, the information acquisition module 40 can easily detect a person present in the room, acquire an operation signal from the person, and the like.
In the present embodiment, the information acquisition module 40 is also housed inside the heat sink 220 and is located at a position where it does not interfere with the light from the LED module 10. Therefore, according to the present embodiment, it is possible to provide the bulb-shaped lamp 201 that suppresses a decrease in light distribution performance and ensures an obtaining function of information for controlling light emission.
The bulb-shaped lamp 201 includes a translucent globe 50 having an opening and covering the LED module 10, for example. The edge 50a of the opening of the globe 50 is fixed to the flange 221 c. The through hole 223 is located outside the spherical cap 50, for example.
Accordingly, the communication range or the detection range of the information obtaining module 40 can be easily formed outside the globe 50, and therefore, a decrease in the communication performance or the detection performance of the information obtaining module 40 can be suppressed.
In the present embodiment, the through hole 223 penetrates the flange 221c of the base 221, but the present invention is not limited thereto. For example, the through hole 223 may be formed as a gap between the base 221 and the outer case 222. Specifically, the flange portion 221c of the base 221 may be notched inward (toward the lamp axis J) from the outer peripheral end. The flange portion 221c is fixed in contact with the outer case 222, and the notch provided in the flange portion 221c functions as a through hole penetrating in the direction orthogonal to the mounting surface 21 a.
Alternatively, a groove (recess) extending in a direction orthogonal to the placement surface 21a may be provided in a portion of the inner surface of the outer case 222 that contacts the flange portion 221 c. The flange portion 221c is fixed in contact with the outer casing 222, and the groove provided on the inner surface of the outer casing 222 functions as a through hole penetrating in the direction orthogonal to the placement surface 21 a.
(modification of embodiment 2)
Next, a modification of example 2 will be described. Hereinafter, the differences from embodiment 2 will be mainly explained, and common parts will be omitted or simplified in explanation.
[ modification 2-1 ]
First, modification 1 of embodiment 2 will be described with reference to fig. 9. Fig. 9 is a sectional view showing a part of a bulb-shaped lamp 202 according to the present modification. Specifically, fig. 9 is an enlarged sectional view showing the flange portion 221c of the bulb-shaped lamp 202.
As shown in fig. 9, in the bulb-shaped lamp 202 according to the present modification, the height from the bottom of the flange portion 221c to the outer end of the flange portion 221c is lower than the height from the bottom of the flange portion 221c to the mounting surface 21 a. In the present modification, the outer end of the flange portion 221c is an edge portion 222a of the opening of the outer case 222. The edge portion 222a may be formed flush with the bottom of the flange portion 221 c. Alternatively, the edge portion 222a may be located lower than the bottom portion of the flange portion 221 c.
As described above, in the bulb-shaped lamp 202 according to the present modification example, the flange portion 221c is a recessed portion recessed with respect to the mounting surface 21a, and the height from the bottom of the flange portion 221c to the outer end portion (edge portion 222a) of the flange portion 221c is lower than the height from the bottom of the flange portion 221c to the mounting surface 21 a.
Accordingly, the communication range or the detection range of the information acquisition module 40 is hardly obstructed by the outer end portion of the flange portion 221c (specifically, the edge portion 222a of the opening of the peripheral case 222). Therefore, it is possible to suppress a decrease in the communication performance or the detection performance of the information acquisition module 40, and to secure the information acquisition function by the bulb-shaped lamp 202.
[ modified examples 2-2 ]
Next, modification 2 of embodiment 2 will be described with reference to fig. 10. Fig. 10 is a sectional view showing a part of a bulb-shaped lamp 203 according to the present modification. Specifically, fig. 10 is an enlarged sectional view showing the flange portion 221c of the bulb-shaped lamp 203.
In the bulb-shaped lamp 203 according to the present modification, the information acquisition module 40 is located outside the heat sink 220. Specifically, as shown in fig. 10, the information obtaining module 40 is provided in the flange portion 221 c. More specifically, the substrate 41 of the information acquisition module 40 is placed on the bottom surface of the concave flange portion 221 c. For example, the information acquisition module 40 may be fixed to the flange portion 221c by an adhesive 51 for fixing the globe 50.
In the present modification, in order to ensure insulation between the base 221 and the information obtaining module 40, an insulating film 225 is provided between the base 221 and the information obtaining module 40. Specifically, the insulating film 225 is provided on the flange portion 221c of the base 221. As shown in fig. 10, the insulating film 225 is formed only on the bottom surface of the flange portion 221c, but may be formed on the through-hole 223 and the side surface of the flange portion 221 c.
The insulating film 225 electrically insulates the information acquisition module 40 from the base 221, for example. The insulating film 225 is formed using an insulating resin material such as silicone resin, for example. Alternatively, the insulating film 225 may be a metal oxide film such as aluminum oxide. The insulating film 225 may be formed using a heat insulating resin material having low thermal conductivity. And an insulating film 225 for suppressing heat transfer from the base 221 to the information acquisition module 40.
As described above, according to the bulb-shaped lamp 203 according to the present modification, since the communication range or the detection range of the information obtaining module 40 is hardly obstructed by the heat sink 20, it is possible to suppress a decrease in the communication performance or the detection performance of the information obtaining module 40.
The bulb-shaped lamp 203 according to the present modification may further include a cover member that covers the information obtaining module 40.
[ modified examples 2 to 3]
Next, modification 3 of embodiment 2 will be described with reference to fig. 11. Fig. 11 is a sectional view of a bulb-shaped lamp 204 according to the present modification.
In the bulb-shaped lamp 204 according to the present modification, the through hole 223 is located inside the globe 50. Specifically, the through hole 223 is located between the edge 50a of the opening of the globe 50 and the placement surface 21 a.
Accordingly, since the through-hole 223 is covered with the globe 50, the globe 50 can prevent foreign matter from entering the inside of the heat sink 220 through the through-hole 223. In this case, since it is not necessary to provide a cover member or the like for closing the through hole 223, the number of components can be reduced.
(example 3)
Hereinafter, an illumination device including the bulb-shaped lamp according to embodiments 1 and 2 and the modifications will be described with reference to fig. 12. Fig. 12 is a sectional view of the lighting device 2 according to the present embodiment.
As shown in fig. 12, the lighting device 2 according to the present embodiment is used by being mounted on, for example, an indoor ceiling or the like. The lighting device 2 includes, for example, a bulb-shaped lamp 1 and a lighting fixture 3.
The lighting fixture 3 is used for lighting and lighting off the bulb-shaped lamp 1, and includes a fixture body 4 mounted on a ceiling, and a cover 5 covering the bulb-shaped lamp 1.
The fixture body 4 includes a socket 4a as a receptacle (socket) for attaching the base 60 of the bulb-shaped lamp 1 and for supplying power to the bulb-shaped lamp 1. The base 60 of the bulb-shaped lamp 1 is screwed into the socket 4a and an alternating current is supplied to the bulb-shaped lamp 1 via the socket 4 a. Further, a translucent plate may be provided in the opening of the globe 5.
As described above, in the light bulb shaped lamp 1, the through hole 23 and the information acquisition module 40 are provided at a position close to the base 21, that is, close to the LED module 10. Therefore, even if the globe 5 or the like is provided around the bulb-shaped lamp 1, a communication range or a detection range equivalent to the irradiation range of the light from the LED module 10 can be secured without being obstructed by the globe 5.
As described above, the lighting device 2 according to the present embodiment includes, for example, the bulb-shaped lamp 1, and thus can secure the function of obtaining information for controlling light emission while suppressing a decrease in light distribution performance.
(others)
The bulb-shaped lamp (illumination light source) and the illumination device according to the present invention have been described above based on the above-described embodiments and modifications thereof, but the present invention is not limited to the above-described embodiments.
For example, in the embodiment described, an example is shown in which the bulb-shaped lamp is provided with only one information obtaining module, but it is not limited thereto. The bulb-shaped lamp may include a plurality of information acquisition modules. The plurality of information acquisition modules may be the same kind of information acquisition module or different kinds of information acquisition modules. For example, the bulb-shaped lamp may include two or more wireless communication modules, two or more human detection sensor modules, one wireless communication module, and one human detection sensor module.
When the bulb-shaped lamp includes a plurality of information acquisition modules of the same kind, the plurality of information acquisition modules may be arranged at symmetrical positions around the lamp axis J, for example. Here, the symmetry may be, for example, point symmetry or rotational symmetry about the lamp axis J, or line symmetry about the lamp axis J.
In addition, when the bulb-shaped lamp includes a plurality of information obtaining modules, through holes may be provided in one-to-one correspondence with the plurality of information obtaining modules. Alternatively, one through hole may be arranged in association with a plurality of information acquisition modules.
For example, although the above-described embodiment shows an example in which the light emitting element is an SMD type LED element, the present invention is not limited to this. For example, the LED module may be a cob (chip On board) type module in which a bare chip is directly mounted On a substrate. That is, the LED chip itself may be used as the light emitting element. In this case, the plurality of LED chips may be collectively or individually sealed by the sealing member. The sealing member may contain a wavelength conversion material such as yellow phosphor particles.
For example, although the above-described embodiment shows an example of a bulb-shaped lamp as the illumination light source, the present invention is not limited to this. The illumination light source may be a straight tube LED lamp or a circular or elongated LED lamp. The lighting device is not limited to a down lamp, but may be a ceiling lamp, a spotlight, a wall lamp, a floor lamp, or the like.
The present invention also includes an embodiment obtained by implementing various modifications of the embodiments, and an embodiment obtained by arbitrarily combining the constituent elements and functions of the embodiments without departing from the scope of the present invention.

Claims (9)

1. A light source for illumination, comprising:
a light emitting module;
a driving circuit for making the light emitting module emit light;
a heat sink having a mounting surface on which the light emitting module is mounted and an annular outer peripheral portion surrounding the mounting surface, the heat sink housing the drive circuit on a side opposite to the light emitting module with respect to the mounting surface; and
an information obtaining module connected to the driving circuit and obtaining information for controlling light emission of the light emitting module,
the heat sink is provided with a through hole penetrating a part of the heat sink at the outer peripheral portion,
the information acquisition module is housed in the heat sink, is positioned on the opposite side of the mounting surface from the light-emitting module, and at least partially overlaps the through-hole when viewed in the direction in which the through-hole passes,
the shape of the heat sink is a bottomed cylindrical shape,
the carrying surface is a bottom surface of the heat sink,
the light source for illumination further comprises a lamp cap,
the base receives power for lighting the light emitting module and supplies the power to the driving circuit, the base is fixed to the heat sink so as to cover the opening of the heat sink,
the outer peripheral portion has:
an annular flange portion extending outward from an outer periphery of the mounting surface; and
a side wall portion erected from an outer end portion of the flange portion toward a side opposite to the light emitting module with respect to the mounting surface,
the through hole penetrates the flange portion in a direction orthogonal to the mounting surface,
the flange portion is a recessed portion recessed with respect to the mounting surface,
the height from the bottom of the recess to the outer end of the flange is lower than the height from the bottom of the recess to the mounting surface,
the illumination light source further comprises a translucent spherical cover,
the light-transmitting globe has an opening and covers the light emitting module,
the edge of the opening of the spherical cap is fixed to the flange portion,
the adhesive for fixing the spherical cap blocks the through hole.
2. The light source for illumination according to claim 1,
the heat sink is formed using a metal material.
3. The light source for illumination according to claim 2,
further comprises an insulating resin member which is provided with a resin layer,
the insulating resin member is provided between the heat sink and the information acquisition module, and electrically insulates the heat sink from the information acquisition module.
4. The light source for illumination according to claim 2,
further comprises a heat-insulating resin member having a heat-insulating property,
and a heat insulating resin member provided between the heat sink and the information acquisition module, the heat insulating resin member suppressing heat transfer from the heat sink to the information acquisition module.
5. The light source for illumination according to claim 1,
the through hole is positioned on the outer side of the spherical cover.
6. The light source for illumination according to claim 1,
the through hole is positioned on the inner side of the spherical cover.
7. The illumination light source according to any one of claims 1 to 6,
the information obtaining module is a wireless communication module for receiving signals according to the Bluetooth standard,
and the driving circuit controls the light emitting of the light emitting module according to the signal received by the wireless communication module.
8. The illumination light source according to any one of claims 1 to 6,
the information obtaining module is a human detection sensor module for detecting human,
the drive circuit controls light emission of the light emitting module based on a detection result of the human detection sensor module.
9. A lighting device is provided, which comprises a lighting unit,
the lighting device is provided with the lighting light source according to any one of claims 1 to 8.
CN201710498579.2A 2017-06-27 2017-06-27 Light source for illumination and illumination device Active CN109140265B (en)

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Application Number Priority Date Filing Date Title
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CN109140265B true CN109140265B (en) 2021-12-28

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Citations (7)

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CN101986016A (en) * 2009-07-28 2011-03-16 松下电工株式会社 Illumination fixture
CN202349635U (en) * 2011-10-25 2012-07-25 东莞巨扬电器有限公司 Improved inductive light emitting diode (LED) bulb
CN103322420A (en) * 2012-03-21 2013-09-25 鹤山健豪灯饰企业有限公司 Portable mini night lamp with human body induction function
CN203734891U (en) * 2013-02-18 2014-07-23 松下电器产业株式会社 Light source for lighting and lighting device
CN104429163A (en) * 2012-07-13 2015-03-18 松下知识产权经营株式会社 Illumination control device, light source for illumination, and illumination system
CN204437872U (en) * 2015-03-17 2015-07-01 重庆绿照科技有限公司 A kind of intelligent human-body infrared induction lamp

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101541121A (en) * 2008-03-18 2009-09-23 株式会社世明电子 Sensor switch using hotline sensor
CN101986016A (en) * 2009-07-28 2011-03-16 松下电工株式会社 Illumination fixture
CN202349635U (en) * 2011-10-25 2012-07-25 东莞巨扬电器有限公司 Improved inductive light emitting diode (LED) bulb
CN103322420A (en) * 2012-03-21 2013-09-25 鹤山健豪灯饰企业有限公司 Portable mini night lamp with human body induction function
CN104429163A (en) * 2012-07-13 2015-03-18 松下知识产权经营株式会社 Illumination control device, light source for illumination, and illumination system
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CN204437872U (en) * 2015-03-17 2015-07-01 重庆绿照科技有限公司 A kind of intelligent human-body infrared induction lamp

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