CN206272953U - A kind of circuit board of high cooling efficiency - Google Patents
A kind of circuit board of high cooling efficiency Download PDFInfo
- Publication number
- CN206272953U CN206272953U CN201621461272.2U CN201621461272U CN206272953U CN 206272953 U CN206272953 U CN 206272953U CN 201621461272 U CN201621461272 U CN 201621461272U CN 206272953 U CN206272953 U CN 206272953U
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- radiating
- circuit board
- substrate
- cooling efficiency
- heat dissipating
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Abstract
The utility model provides a kind of circuit board of high cooling efficiency, including substrate, conductive layer, insulating barrier and heat dissipating layer, the conductive layer, insulating barrier, heat dissipating layer, substrate are arranged in order, and the substrate also includes through hole, and the high power original paper on circuit board is arranged on the vicinity of through hole；Also include radiating core, the radiating core is strip and is connected with heat dissipating layer that the radiating core extends to the opposite side of substrate from through hole, and is connected with radiating wire；The radiating wire is also connected with metallic plate.Solve the problems, such as that the radiating of available circuit plate is not enough.
Description
Technical field
The utility model is related to circuit board manufacturing area, more particularly to a kind of flexible PCB of high cooling efficiency.
Background technology
In the utilization of large power supply wiring board, if radiating is bad may to trigger overtemperature protection device and breakpoint stops work
Make, What is more can influence the service life and reliability of component, in the prior art, to ensure that powerful component sends
Heat can fast and effeciently distribute, large area fin and high power fan are typically pretended on pcb board, by heat
The mode of convection current is radiated.Existing radiating mode serves preferable thermolysis to general pcb board, but is directed to
High power circuit plate, however it remains the not enough problem of radiating.
The content of the invention
The technical problems to be solved in the utility model, is to provide a kind of circuit board of high cooling efficiency, including substrate, is led
Electric layer, insulating barrier and heat dissipating layer, the conductive layer, insulating barrier, heat dissipating layer, substrate are arranged in order, and the substrate also includes through hole,
High power original paper on circuit board is arranged on the vicinity of through hole；
Also include radiating core, the radiating core is strip and is connected with heat dissipating layer that the radiating core is extended to from through hole
The opposite side of substrate, and be connected with radiating wire；The radiating wire is also connected with metallic plate.
Further, the radiating wire is set to latticed.
Specifically, the area of the metallic plate is 2-4 times of substrate.
Preferably, the number of openings is multiple.
Preferably, the radiating core is copper.
Further, the metallic plate is Copper Foil.
Preferably, the heat dissipating layer includes radiating paillon foil and wire jumper, and the wire jumper is connected with radiating core, the radiating paillon foil
It is correspondingly arranged with high-power components position.
Brief description of the drawings
Fig. 1 is the board layer level structure figure described in the utility model specific embodiment.
Description of reference numerals：
1st, substrate；
11st, through hole；
2nd, conductive layer；
3rd, insulating barrier；
4th, heat dissipating layer；
41st, radiating core；
42nd, radiating wire；
43rd, metallic plate；
5th, high-power components.
Specific embodiment
To describe technology contents of the present utility model, structural feature, the objects and the effects in detail, below in conjunction with implementation
Mode simultaneously coordinates accompanying drawing to be explained in detail.
Fig. 1 is referred to, is a kind of hierarchical structure of the circuit board of high cooling efficiency of the utility model, included as shown in FIG.
Substrate 1, conductive layer 2, insulating barrier 3 and heat dissipating layer 4, the conductive layer 2, insulating barrier 3, heat dissipating layer 4, substrate 1 are arranged in order, described
Substrate also includes through hole 11, and the high power original paper 5 on circuit board is arranged on the vicinity of through hole 11；From figure it will be seen that
High-power components are designed to close from through hole, and heat can be quickly conducted by heat dissipating layer, and radiating core 41 is additionally provided with through hole,
The radiating core is strip, and material can be most of metal, preferably copper；Radiating core is connected with heat dissipating layer, the radiating core
Passed through from through hole, and extend to the opposite side of substrate, the opposite side of substrate is provided with radiating wire, radiating core also with radiating wire 42
Connection；The radiating wire 42 is also connected with metallic plate 43.So, heat dissipating layer can take away what a part of electronic component was produced
Heat, another part, the heat that high power electronic element is produced exports to the radiating of substrate back by the radiating core in through hole
On silk, by the more quick water conservancy diversion of this partial heat, hence it is evident that improve the radiating efficiency of circuit board, protect circuit board component
Safe operation, with good effect.
In a further embodiment, the radiating wire 42 is arranged to latticed, and latticed radiating wire increases it
With the contact area of air.The effect for increasing radiating efficiency can preferably be reached, additionally it is possible to be physically circuit board
There is provided certain supporting role so that use process of the present utility model more safety.
In specific some embodiments, radiating wire also is connected to accelerate heat conduction with metallic plate, it is preferable that metallic plate can be with
It is a piece of Copper Foil to select, and the area of metallic plate is set to 2-4 times of substrate.The metallic plate of large area can more significantly improve big work(
The radiating efficiency of rate component.In some preferred embodiments, radiating wire is welded on a metal plate, more by the block tin of bulk
Further increasing air contact area and radiating efficiency.
In some preferred embodiments shown in Fig. 1, the quantity of the through hole 11 is set to multiple, high-power electronics
Device is evenly provided on around through hole respectively, and the design of multiple through holes causes that more heats share conduction by radiating wire, more
Solve the problems, such as heat dissipation for circuit board well.
In some other embodiment, the metallic plate is Copper Foil.There is good heat conductivility using Copper Foil, can accelerate
Distributing for this partial heat of wire water conservancy diversion, preferably solves the problems, such as heat dissipation for circuit board.
In some preferred embodiments shown in Fig. 1, the heat dissipating layer include radiating paillon foil and wire jumper, the wire jumper with
Radiating core is connected, and the radiating paillon foil is correspondingly arranged with high-power components position.Heat dissipating layer can be spread all over whole substrate one
Layer metal, can only include some radiating paillon foils corresponding with high-power components position, and radiating paillon foil is located under high-power components
The correspondence position of side, so alleviates the weight of heat dissipating layer, but radiating efficiency can decline, and heat dissipating layer can also be both
Including individual layer heat transmission metal, and the radiating paillon foil including being arranged near high-power components, by radiating paillon foil targetedly
High-power components are carried out with water conservancy diversion, then by wire jumper heat conduction to radiating core, accelerating the conduction of heat, preferably solves electricity
The problem of road plate high efficiency heat radiation.
Embodiment of the present utility model is the foregoing is only, scope of patent protection of the present utility model is not thereby limited,
Equivalent structure or equivalent flow conversion that every utilization the utility model specification and accompanying drawing content are made, or directly or indirectly fortune
Used in other related technical fields, similarly it is included in scope of patent protection of the present utility model.
Claims (7)
1. a kind of circuit board of high cooling efficiency, it is characterised in that described to lead including substrate, conductive layer, insulating barrier and heat dissipating layer
Electric layer, insulating barrier, heat dissipating layer, substrate are arranged in order, and the substrate also includes through hole, and the high power original paper on circuit board is arranged on
The vicinity of through hole；
Also include radiating core, the radiating core is strip and is connected with heat dissipating layer that the radiating core extends to substrate from through hole
Opposite side, and be connected with radiating wire；The radiating wire is also connected with metallic plate.
2. the circuit board of high cooling efficiency according to claim 1, it is characterised in that the radiating wire is set to grid
Shape.
3. the circuit board of high cooling efficiency according to claim 1, it is characterised in that the area of the metallic plate is substrate
2-4 times.
4. the circuit board of high cooling efficiency according to claim 1, it is characterised in that the number of openings is multiple.
5. the circuit board of high cooling efficiency according to claim 1, it is characterised in that the radiating core is copper.
6. high cooling efficiency circuit board according to claim 1, it is characterised in that the metallic plate is Copper Foil.
7. high cooling efficiency circuit board according to claim 1, it is characterised in that the heat dissipating layer include radiating paillon foil and
Wire jumper, the wire jumper is connected with radiating core, and the radiating paillon foil is correspondingly arranged with high-power components position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621461272.2U CN206272953U (en) | 2016-12-29 | 2016-12-29 | A kind of circuit board of high cooling efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621461272.2U CN206272953U (en) | 2016-12-29 | 2016-12-29 | A kind of circuit board of high cooling efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206272953U true CN206272953U (en) | 2017-06-20 |
Family
ID=59048160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621461272.2U Active CN206272953U (en) | 2016-12-29 | 2016-12-29 | A kind of circuit board of high cooling efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206272953U (en) |
-
2016
- 2016-12-29 CN CN201621461272.2U patent/CN206272953U/en active Active
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