CN205864936U - 电子设备散热结构 - Google Patents

电子设备散热结构 Download PDF

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CN205864936U
CN205864936U CN201620719695.3U CN201620719695U CN205864936U CN 205864936 U CN205864936 U CN 205864936U CN 201620719695 U CN201620719695 U CN 201620719695U CN 205864936 U CN205864936 U CN 205864936U
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radiating structure
electronic equipment
butt connector
casing
connector
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林庆其
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Lotes Guangzhou Co Ltd
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
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    • G—PHYSICS
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    • H—ELECTRICITY
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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    • H05K1/02—Details
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract

本实用新型公开了一种电子设备散热结构，包括：一机壳，所述机壳一侧设有一开口，所述开口周围设有多个散热孔；一风扇，安装于所述机壳内；一电连接器，对应安装于所述机壳内，所述电连接器显露于所述开口；一对接连接器，位于所述机壳外，所述对接连接器通过所述开口对应插接所述电连接器；藉由所述风扇将空气透过所述散热孔吹向所述对接连接器，使得所述对接连接器温度下降。

Description

电子设备散热结构
技术领域
本实用新型涉及一种电子设备散热结构，尤其涉及一种能够降低线缆连接器温度的电子设备散热结构。
背景技术
业界常用的线缆连接器包括一电路板，一接头电性连接于该电路板的一端，以及一软性排线电性连接所述电路板的另一端。目前，由于电子设备功能越来越强大，电连接器的信号传输要求也越来越高，为了使线缆连接器能够有更大的数据传输宽带，以备传输无压缩的音频信号及高分辨率视频信号的能力，通常会在所述电路板上安装一芯片，增强所述线缆连接器的解码能力，然而，所述芯片在工作时会产生大量的热量，若该热量不能及时排除，将会使所述芯片温度过高失效，破坏所述线缆连接器，导致整个电子设备失效。
因此有必要设计一种改良的电子设备散热结构，以克服上述问题。
发明内容
针对背景技术所面临的问题，本实用新型的目的在于提供一种藉由机壳内的风扇将空气吹向线缆连接器，降低所述线缆连接器温度的电子设备散热结构。
为实现上述目的，本实用新型采用以下技术手段：一种电子设备散热结构，其特征在于，包括：一机壳，所述机壳一侧设有一开口，所述开口周围设有多个散热孔；一风扇，安装于所述机壳内；一电连接器，对应安装于所述机壳内，所述电连接器显露于所述开口； 一对接连接器，位于所述机壳外，所述对接连接器通过所述开口对应插接所述电连接器；藉由所述风扇将空气透过所述散热孔吹向所述对接连接器，使得所述对接连接器温度下降。
进一步，所述散热孔的中心线与所述开口的中心线相交于一点，且其交点位于所述对接连接器上；
进一步，在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，所述对接连器遮挡至少部分所述散热孔；
进一步，一导风件，套设于所述风扇，所述导风件具有一出风口，所述出风口正对所述开口和所述散热孔；
进一步，所述导风件具有圆形的一罩部，所述罩部套设所述风扇，所述罩部顶面设有多个进风口，自所述罩部一边向靠近所述散热孔方向延伸形成所述出风口；
进一步，所述进风口相对所述罩部顶面的中心呈一圈对称布置，且其宽度向靠近所述罩部顶面的中心的方向逐渐减小；
进一步，所述进风口的数量和所述风扇的叶片数量相同；
进一步，所述对接连接器包括一插头和与所述插头连接的一电路板，所述电路板上安装一芯片；
进一步，一内金属壳包覆所述电路板，一线缆焊接于所述电路板，一弹簧套设于所述线缆的一端，所述弹簧一端向靠近内金属壳方向延伸有一导热部，所述导热部接触所述内金属壳的外表面；
进一步，所述内金属壳表面设有至少一凸点，一外金属壳，包覆所述内金属壳，所述外金属壳的内表面接触所述凸点且其外表面设有多个凹槽；
进一步，在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，所述散热孔部分显露于所述凹槽；
进一步，相邻的凹槽之间设有一隔栏， 在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，相邻的至少两个所述隔栏遮挡同一个所述凹槽；
进一步，一主板，固定于所述机壳内，所述风扇、所述电连接器安装于所述主板上，所述电连接器为能正反插的USB Type C母端，所述对接连接器为USB Type C公端的线缆连接器。
与现有技术相比，本实用新型具有以下有益效果：
本电子设备散热结构中，由于所述风扇可藉由所述散热孔将所述冷空气吹向所述对接连接器外铁壳，使所述对接连接器温度下降，避免所述芯片温度过高失效，有效的改善了所述对接连接器的工作稳定性，增强整个所述电子设备的可靠性。
【附图说明】
图1为本实用新型电子设备散热结构第一实施例的部分立体图分解图；
图2为本实用新型电子设备散热结构第一实施例的立体图；
图3为本实用新型电子设备散热结构第一实施例的部分剖视图；
图4为本实用新型电子设备散热结构第一实施例朝所述散热孔看的正视图；
图5为本实用新型电子设备散热结构中所述对接连接器的立体分解图；
图6为本实用新型电子设备散热结构中所述对接连接器的部分立体分解图；
图7为本实用新型电子设备散热结构第二实施例俯视剖视图；
图8为本实用新型电子设备散热结构第二实施例正视剖视图。
具体实施方式的附图标号说明
电子设备散热结构100 机壳1 侧壁11 开口12
散热孔13 主板2 风扇3 扇叶31
导风件4 出风口41 罩部42 进风口421
电连接器5 对接连接器6 插头61 电路板62
内金属壳63 凸点631 线缆64 弹簧65
导热部651 塑胶壳体66 外金属壳67 凹槽671
隔栏672 芯片68
【具体实施方式】
为便于更好的理解本实用新型的目的、结构、特征以及功效等，现结合附图和具体实施方式对本实用新型作进一步说明。
如图1和图2所示，本实用新型电子设备散热结构100包括一机壳1；一主板2，固定于所述机壳1内；一风扇3，安装于所述主板2上；一导风件4，位于所述机壳1内，套设所述风扇3；一电连接器5，收容于所述机壳1，电性连接于所述主板2表面；一对接连接器6，位于所述机壳1外，与所述电连接器5插接。
如图1至图3所示，为本实用新型电子设备散热结构100的第一实施例，所述机壳1具有一侧壁11，所述侧壁11上设有一开口12，所述电连接器5显露于所述开口12，使所述对接连接器6可通过所述开口12与所述电连接器5插接；所述开口12周围设有多个散热孔13，所述导风件4具有一出风口41，所述出风口41正对所述开口12和所述散热孔13，使所述风扇3能够将空气透过所述散热孔13吹向所述对接连接器6，使所述对接连接器6温度下降，为使所述风扇4的吹出的空气最大范围的覆盖所述对接连接器6，加快所述对接连接器6的散热速率，所述散热孔13的中心线与所述开口12的中心线相交于一点，且其交点位于所述对接连接器6上。在本实施例中，所述风扇3设有八个扇叶31，最大程度的保证所述风扇3的稳定性；所述导风件4还具有圆形的一罩部42，所述罩部42套设所述风扇3，所述罩部42的顶面设有八个进风口421，八个所述进风口421相对所述罩部42顶面的中心呈一圈对称布置，所述进风口421的宽度向靠近所述罩部42中心的方向逐渐减小，如此使所述风扇3的所述扇叶31数量与所述进风口421的数量相同，便不会因为所述进风口421数量过多而使所述罩部42强度不够，或者所述进风口421数量过少，进风量不够，减少所述散热孔13的出风量。在其它实施例中，所述扇叶31的数量，所述进风口421的形状、大小、数量只要能够满足所述对接连接器6散热所需的风量即可，在此并不为限。
如图2、图4、图5和图6所示，所述对接连接器6包括一插头61，所述插头61通过所述开口12与所述电连接器5插接；一电路板62，与所述插头61电性连接；一内金属壳63，包覆所述电路板62，所述内金属壳63上表面和下表面各设有四个凸点631；一线缆64，焊接于所述电路板62；一弹簧65套设于所述线缆64的一端，避免所述线缆64弯折时，与所述电路板62接触不良，进一步，所述弹簧65一端向靠近所述内金属壳63方向延伸有一导热部651，所述导热部651接触所述内金属壳63的外表面，将所述内金属壳63上的部分热量传导至空气中，加强所述对接连接器6的散热能力，提高其稳定性；一塑胶壳体66，注塑成型于所述内金属壳63外，所述凸点631显露于所述塑胶壳体66；一外金属壳67，包覆所述塑胶壳体66，且其内表面接触所述凸点631，使所述内金属壳63的热量可通过所述凸点631传导至所述外金属壳67，提供所述对接连接器6热量散发的另一路径。另外，所述外金属壳67外表面设有多个凹槽671， 增大所述外金属壳67的外表面积，强化其散热能力，在所述对接连接器6和所述电连接器5插接的方向上，朝向所述机壳1看，所述散热孔13部分显露于所述凹槽671，进一步，相邻的凹槽671之间设有一隔栏672，在所述对接连接器6和所述电连接器5插接的方向上，朝向所述机壳1看，相邻的至少两个所述隔栏672遮挡同一个所述散热孔13，使从所述散热孔13吹出的空气正好吹过所述凹槽671，冷却所述外金属壳67。为增强所述对接连接器6的信号传输能力，所述电路板上还安装有一芯片68。在本实施例中，所述电连接器5为能正反插的USB Type C母端，所述对接连接器6为USB Type C公端，在其它实施中，所述电连接器5和所述对接连接器6的类型可根据需要任意改变，在此并不为限。
如图7和图8所示，为本实用新型的第二实施例，第二实施例与第一实施例的根本不同在于，在本实施例中，所述散热孔13的中心线和所述开口12的中心线平行，但是，在所述对接连接器6和所述电连接器5插接的方向上，朝向所述机壳1看，所述对接连接器6遮挡一半所述散热孔13的面积，如此便可保证确保所述对接连接器6正好位于从所述散热孔13吹出空气的路径上 ，使得从所述散热孔13吹出的空气吹过所述外金属壳67，在其他实施中，只需所述对接连接器6遮挡至少部分所述散热孔13，使从所述散热孔13吹出的空气吹过所述外金属壳67即可，在此并不为限。
如图1和图2所示，本实用新型电子设备散热结构100在组装的过程中，先将所述主板2固定于所述机壳1，所述电连接器5焊接于所述主板2，再将所述风扇3安装于所述主板2，所述导风件4罩设于所述风扇3上，最后盖上所述机壳1的上盖，插接上所述对接连接器6即可。
综上所述，本实用新型电子设备散热结构100有下列有益效果：
(1)所述开口12周围设有多个所述散热孔13，使所述风扇3可将空气从所述散热孔13吹向所述对接连接器6，使所述对接连接器6温度下降，避免所述芯片68温度过高，提高所述对接连接器6的电性传输性能；
(2）所述散热孔13的中心线与所述开口12的中心线相交于一点，其交点位于所述对接连接器6上，使从所述散热孔13吹出的空气定向吹至所述对接连接器6，增强散热效果；
(3）所述对接连接器6和所述电连接器5插接的方向上，朝向所述机壳1看，所述对接连接器6遮挡部分所述散热孔13，确保所述对接连接器6正好位于从所述散热孔13吹出空气的路径上，使得从所述散热孔13吹出的空气吹过所述对接连接器6；
(4）所述弹簧65设有的所述导热部651接触所述内金属壳63，使所述内金属壳63的热量可通过所述弹簧65散发出来，补充增强所述对接连接器6的散热能力；
(5)所述外金属壳67通过所述凸点631接触所述内金属壳63，提供所述对接连接器6散热的另一路径；
(6）所述外金属壳67表面设有的所述凹槽671，增加了所述外金属壳67的散热面积。
上详细说明仅为本实用新型之较佳实施例的说明，非因此局限本实用新型的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本实用新型的专利范围内。

Claims (13)

1.一种电子设备散热结构，其特征在于，包括：
一机壳，所述机壳一侧设有一开口，所述开口周围设有多个散热孔；
一风扇，安装于所述机壳内；
一电连接器，对应安装于所述机壳内，所述电连接器显露于所述开口；
一对接连接器，位于所述机壳外，所述对接连接器通过所述开口对应插接所述电连接器；
藉由所述风扇将空气透过所述散热孔吹向所述对接连接器，使得所述对接连接器温度下降。
2.如权利要求1所述的电子设备散热结构，其特征在于：所述散热孔的中心线与所述开口的中心线相交于一点，且其交点位于所述对接连接器上。
3.如权利要求1所述的电子设备散热结构，其特征在于：在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，所述对接连器遮挡至少部分所述散热孔。
4.如权利要求1所述的电子设备散热结构，其特征在于：一导风件，套设于所述风扇，所述导风件具有一出风口，所述出风口正对所述开口和所述散热孔。
5.如权利要求4所述的电子设备散热结构，其特征在于：所述导风件具有圆形的一罩部，所述罩部套设所述风扇，所述罩部顶面设有多个进风口，自所述罩部一边向靠近所述散热孔方向延伸形成所述出风口。
6.如权利要求5所述的电子设备散热结构，其特征在于：多个所述进风口相对所述罩部顶面的中心呈一圈对称布置，且其宽度向靠近所述罩部顶面的中心的方向逐渐减小。
7.如权利要求6所述的电子设备散热结构，其特征在于：所述进风口的数量和所述风扇的叶片数量相同。
8.如权利要求1所述的电子设备散热结构，其特征在于：所述对接连接器包括一插头和与所述插头连接的一电路板，所述电路板上安装一芯片。
9.如权利要求8所述的电子设备散热结构，其特征在于：一内金属壳包覆所述电路板，一线缆焊接于所述电路板，一弹簧套设于所述线缆的一端，所述弹簧一端向靠近所述内金属壳方向延伸有一导热部，所述导热部接触所述内金属壳的外表面。
10.如权利要求9所述的电子设备散热结构，其特征在于：所述内金属壳表面设有至少一凸点，一外金属壳，包覆所述内金属壳，所述外金属壳的内表面接触所述凸点且其外表面设有多个凹槽。
11.如权利要求10所述的电子设备散热结构，其特征在于：在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，所述散热孔部分显露于所述凹槽。
12.如权利要求10所述的电子设备散热结构，其特征在于：相邻的凹槽之间设有一隔栏， 在所述对接连接器和所述电连接器插接的方向上，朝向所述机壳看，相邻的至少两个所述隔栏遮挡同一个所述散热孔。
13.如权利要求1所述的电子设备散热结构，其特征在于：一主板，固定于所述机壳内，所述风扇、所述电连接器安装于所述主板上，进一步，所述电连接器为能正反插的USB TypeC母端，所述对接连接器为USB Type C公端的线缆连接器。
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