CN108306144B - 电连接器组合 - Google Patents

电连接器组合 Download PDF

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Publication number
CN108306144B
CN108306144B CN201810021460.0A CN201810021460A CN108306144B CN 108306144 B CN108306144 B CN 108306144B CN 201810021460 A CN201810021460 A CN 201810021460A CN 108306144 B CN108306144 B CN 108306144B
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China
Prior art keywords
inner membrance
electric connector
metal shell
heat dissipation
connector combination
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Application number
CN201810021460.0A
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CN108306144A (zh
Inventor
林庆其
罗振伟
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CN201810021460.0A priority Critical patent/CN108306144B/zh
Priority to US15/892,743 priority patent/US10135198B2/en
Publication of CN108306144A publication Critical patent/CN108306144A/zh
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Publication of CN108306144B publication Critical patent/CN108306144B/zh
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    • H—ELECTRICITY
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    • H01R12/70—Coupling devices
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    • H01R12/732—Printed circuits being in the same plane
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Abstract

本发明公开了一种电连接器组合，其特征在于，包括：一电路板；一连接器，与所述电路板电性连接；一芯片设置于所述电路板，与所述电路板电性连接；一金属壳体，包覆所述连接器及所述电路板；一内膜，由高导热材料制成，包覆所述芯片及所述电路板且位于所述金属壳体和所述电路板之间，当所述芯片产生大量的热量时，所述内膜作为一个媒介能将热量快速吸收并传导到所述金属壳体上以将热量散发到外部。

Description

电连接器组合
技术领域
本发明涉及一种电连接器组合，尤其是指一种散热性能良好的电连接器组合。
背景技术
随着现今科学技术的发展，对电连接器的要求越来越高，电连接器的传输速率也一直在提高，而伴随着连接器传输速度的提升，通常需要为连接器另外配置芯片，依靠芯片的性能来实现提高传输速率的目的，但是在加入芯片提高了处理速度的同时，由于芯片在运作时会产生大量的热量，如果芯片温度持续过高将会影响芯片的处理速度，因此如何解决散热又成了另一个难题。公知的一种连接器组合，包括电路板，焊接于电路板上的连接器和芯片以及电缆，包围在连接器、电路板、芯片之外的金属壳体，在芯片产生热量时，热量会通过金属壳体内的空气间接传输到金属壳体上，再由金属壳体将热量散发到空气当中以完成散热。然而，在电连接器长期使用时，金属壳体内的空气温度会升高，导致芯片将热量传导到金属壳体上的速度非常慢，在芯片产生大量热量的时候，无法达到真正的散热效果，实际上散热问题仍然存在，因此最终易导致连接器温度过高而影响正常功能。
因此，有必要设计一种新的电连接器组合，以克服上述问题。
发明内容
本发明的创作目的在于提供一种散热性能良好的电连接器组合。
为了达到上述目的，本发明采用如下技术方案：
一种电连接器组合，其特征在于，包括：一电路板；一连接器，与所述电路板电性连接；一芯片设置于所述电路板，与所述电路板电性连接；一金属壳体，包覆所述连接器及所述电路板；一内膜，由高导热材料制成，注塑成型包覆所述芯片及所述电路板且位于所述金属壳体和所述电路板之间，与所述金属壳体接触且显露于所述金属壳体外。
进一步，所述内膜与所述金属壳体接触。
进一步，所述内膜与所述金属壳体的所有内表面均有接触。
进一步，所述连接器具有一外壳，所述内膜与所述外壳接触。
进一步，所述内膜与所述外壳的所有外表面均有接触。
进一步，所述连接器具有至少一端子，所述端子焊接于所述电路板上，所述内膜与所述端子接触。
进一步，一散热元件，包覆所述金属壳体，一导热部位于所述金属壳体与所述散热元件之间。
进一步，所述导热部设置于所述金属壳体或所述散热元件，所述导热部与所述散热元件或所述金属壳体接触。
进一步，所述散热元件外壁面具有至少两鳍片，所述鳍片之间具有至少一凹槽。
进一步，所述鳍片为横向设置或纵向设置或斜向设置。
进一步，所述内膜部分显露于所述金属壳体外且包覆所述金属壳体。
进一步，一散热元件，包覆所述金属壳体，所述内膜位于所述金属壳体和所述散热元件之间且与所述散热元件接触。
进一步，所述内膜与所述散热元件的所有内壁面均有接触。
进一步，一线缆，具有一线芯，所述线芯焊接于所述电路板，所述内膜与所述线芯接触。
进一步，一散热弹簧套设于所述线缆，所述散热弹簧具有一主体部，所述主体部与所述金属壳体接触。
进一步，所述散热弹簧具有自所述主体部延伸入所述金属壳体的一散热部，所述内膜与所述散热部接触。
进一步，所述内膜由绝缘材料和导电材料组成，所述导电材料的比例占所述内膜的比例的一半以下。
进一步，所述金属壳体具有至少一通孔，所述内膜显露于所述通孔。
进一步，所述內膜完全包覆所述电路板。
进一步，所述内膜由石墨材料和绝缘材料组成，所述石墨材料的比例占所述内膜的比例的一半以下。
与现有技术相比，本发明采用一种高导热材料制成的内膜，将所述内膜注塑成型于所述金属壳体内，将所述芯片与所述电路板包覆，而所述金属壳体包覆所述内膜且与所述内膜的多个面接触，因此能够将所述芯片上产生的热量更多更快地传输至所述内膜，同时又能够通过所述内膜进一步将热量快速地传输到所述金属壳体上；而所述内膜还包括包覆所述金属壳体的另一部分，因此使得所述内膜能够与所述散热元件直接接触，又提供了另一散热路径，进一步提高了散热效果，因此最终使散热性能得到了很大的提高。
【附图说明】
图1为本发明电连接器组合的立体图；
图2为本发明电连接器组合部分元件的立体分解图；
图3为本发明电连接器组合的部分立体分解图；
图4为本发明电连接器组合的另一部分立体分解图；
图5为图1沿A-A方向的剖视图；
图6为图5沿B-B方向的剖视图；
图7为另一实施例的部分立体分解图；
图8为另一实施例的立体剖视图；
图9为图7元件组合后沿C-C方向的剖视图。
具体实施方式的附图标号说明：
连接器1 外壳11 外表面111 端子12
焊脚121 电路板2 芯片3 内膜4
金属壳体5 内表面50 上壁51 下壁52
前壁53 后壁54 左壁55 右壁56
收容空间57 导热部58 通孔59 散热元件6
顶壁61 底壁62 侧壁63 鳍片64
凹槽65 内壁面66 外壁面67 线缆7
胶芯71 线芯72 散热弹簧73 主体部731
散热部732 电连接器组合100
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
请参照图1至图6，为本发明的一种电连接器组合100的主要实施例，其包括一连接器1、一电路板2、一芯片3、一内膜4、一金属壳体5、一散热元件6和一线缆7。其中,所述内膜4作为将所述芯片3的热量传导至外部的一个媒介。
请参照图2、图3，所述连接器1位于所述电路板2的前方，所述连接器1包括一外壳11和多个端子12(在本实施例为多个，在其它实施例可以为一个)，所述外壳11具有多个外表面111，每一所述端子12具有一焊脚121，所述端子12收容于所述外壳11，所述焊脚121凸伸出所述外壳11而焊接于所述电路板2。
请参照图2、图3，在所述连接器1的后方设置有所述芯片3，所述芯片3设置于所述电路板2的一侧且电性连接于所述电路板2。
请参照图2至图5，在所述芯片3的后方设置有所述线缆7，所述线缆7具有一胶芯71和多个线芯72(在本实施例中所述线芯72为多个，其它实施例中可以为一个)以及套设于所述胶芯71的一散热弹簧73。所述线芯72收容于所述胶芯71且向所述电路板2方向部分凸出所述胶芯71，所述线芯72焊接于所述电路板2上，所述散热弹簧73具有一主体部731以及自所述主体部731向所述电路板2方向延伸的一散热部732。
请参照图3至图6，所述金属壳体5具有上下相对设置的一上壁51和一下壁52以及位于前后方向连接所述上壁51和所述下壁52的一前壁53和一后壁54,同时还包括以连接所述上壁51、下壁52和所述前壁53、后壁54且相对设置的一左壁55和一右壁56，所述上壁51、下壁52、前壁53、后壁54、左壁55和右壁56围设成一收容空间57，所述上壁51、下壁52、前壁53、后壁54、左壁55和右壁56均具有一内表面50。所述收容空间57收容所述电路板2和所述芯片3，部分收容所述外壳11、所述胶芯71和所述主体部731以及所述散热部732，其中所述上壁51和所述下壁52以及所述后壁54的具有连通外部和所述收容空间57的多个通孔59，同时朝远离所述电路板2的方向凸伸有多个导热部58，在本实施例中所述通孔59和所述导热部58为多个，所述导热部58设置于所述金属壳体5上，在其它实施例中可以为一个，所述导热部58可以只设置于所述散热元件6上或在所述金属壳体5和所述散热元件6上均设置所述导热部58，所述后壁54与所述主体部731接触。
请参照图4至图6，所述散热元件6包围所述金属壳体5和部分所述外壳11及部分所述散热弹簧73，所述散热元件6具有上下相对设置的一顶壁61和一底壁62以及连接所述顶壁61及所述底壁62的两侧壁63，所述顶壁61、底壁62和两侧壁63均具有一内壁面66和一外壁面67，所述外壁面67具有多个鳍片64。在本实施例中所述鳍片64为多个且为沿前后方向纵向排列，在其它实施例中所述鳍片可以为两个，可以为横向排列或斜向排列，每两所述鳍片64之间设置有多个凹槽65，本实施例中所述凹槽65为多个，其它实施例中所述凹槽65可以为一个，位于上下相对设置的两所述内壁面66与所述导热部58以及所述主体部731接触，位于下方的所述内壁面66进一步与所述散热部732接触。
请参照图2、图5和图6，将所述内膜4注塑成型于所述收容空间57内，所述内膜4可以为导热胶、导热膏、导热银胶或由导热胶与其它材料组成的混合物、导热膏与其它材料组成的混合物、导热银胶与其它材料组成的混合物；同时所述内膜4也可以由绝缘材料和导电材料混合而成，又或者由绝缘材料和石墨材料混合而成，因此所述内膜4的热传导能力将高于一般的塑胶材料和空气，具有很好的导热性能。同时导电材料的比例占所述内膜4的比例的一半以下，石墨材料的比例也占所述内膜4的比例的一半以下，由此保证所述内膜4不具有导电功能而只具备所需要的散热功能。所述绝缘材料可以为聚乙烯、聚氯乙烯、聚氨酯、TPE(热塑性弹性体材料)、AB胶、环氧树脂、热熔胶等材料，但不局限于此还可以包括其他热塑性塑料或热固性塑料；所述导电材料可以为金属粉末、钻石粉等，但不局限于此还可以包括其它导电材料。通过将所述内膜4注塑成型于所述收容空间57，使得所述内膜4与所有所述内表面50均有接触，所述内膜4包覆所述芯片3和所述电路板2的四周，部分包覆所述连接器1和所述胶芯71，使得所述内膜4与所述芯片3和所述电路板2的多个表面接触，以将所述芯片3产生的热更多更快地传导到所述内膜4上，同时所述内膜4还与所有所述外表面111接触，与所述焊脚121和所述线芯72以及所述散热部732接触，所述内膜4显露于所述通孔59。
请参照图7至图9，为本发明的另一实施例，与主要实施例的不同之处仅在于所述内膜4进一步包覆所述金属壳体5，覆盖所述上壁51、下壁52、前壁53、后壁54、左壁55和所右壁56，因此所述内膜4位于所述金属壳体5与所述散热元件6之间且填充了所述散热元件6与所述金属壳体5之间的间隙，使得所述内膜4进一步与所有所述内壁面66以及所述主体部731接触。
综上所述，本发明的电连接器组合100具有以下有益效果：
1.在所述收容空间57内注塑成型所述内膜4，所述内膜4由高导热材料制成，热导率高于一般的塑胶材料和空气，因此更有利于提高散热性能。
2.所述内膜4包覆所述芯片3，使得所述芯片3的多个表面与所述内膜4接触，增加了所述芯片3与所述内膜4之间的接触面积，使得所述芯片3产生的热量能够更快速的传导到所述内膜4上，因此更有利于散热效果的提升。
3.所述内膜4注塑成型于所述收容空间57内，在所述内膜4包覆所述芯片3的基础上，进一步使得所述内膜4与所有所述内表面50均有接触，增大了所述内膜4与所述金属壳体5之间的接触面积，使得所述内膜4能够更快速地将从所述芯片3得到的热量传导到所述金属壳体5，进而将热量散发到空气当中，因此进一步提升了散热效果。
4.另外添加的所述散热元件6，设置多个所述导热部58与所述散热元件6接触，使得所述金属壳体5的热量能够传导到所述散热元件6上，再一步增加散热效果。
5.所述散热部732凸伸至所述金属壳体5内与所述内膜4接触，使得所述内膜4能够将从所述芯片3上得到的热量通过所述散热部732传导到所述散热弹簧73上，提供了一新的散热途径。
6.所述主体部731与所述后壁54接触，使得所述金属壳体5的热量除通过所述导热部58传导到所述散热元件6外还能够直接传导到所述散热弹簧73上，又提供另一新的散热途径。
7.所述内膜4注塑成型于所述收容空间57内，与所述线芯72和所述焊脚121接触，能起到固定所述线芯72和所述焊脚121的作用。
8.所述散热元件6设置所述鳍片64和所述凹槽65，能够增大所述散热元件6与空气的接触面积，使热量更快的散发到空气中，增强散热效果。
9.由于所述内膜4显露于所述通孔59，因此所述内膜4除了能够将所述芯片3产生的热量传导到所述金属壳体5之外还能散发到空气当中，提供又一新的散热途径。
10.所述内膜4与所有所述外表面111接触，能够将由所述芯片3得到的热量传导到所述外壳11上，以将热量散发到空气当中，提供另一新的散热路径。
在另一实施例中，还进一步提高散热效果：
11.所述内膜4与所有所述内壁面66均有接触，因此能够将所述芯片3产生的热量通过所述内膜4直接传导到所述散热元件6，又提供了新的散热途径。
12.所述内膜4由于覆盖所述金属壳体5而与所述主体部731接触，因此所述内膜4除了将从所述芯片3得到的热量传导到所述金属壳体5和所述散热元件6之外，还能将热量直接传导到所述散热弹簧73上，因此提供了又一新的散热路径。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明之专利范围，所以，凡运用本创作说明书及图示内容所为之等效技术变化，均包含于本创作之专利范围内。

Claims (20)

1.一种电连接器组合，其特征在于，包括：
一电路板；
一连接器，与所述电路板电性连接；
一芯片设置于所述电路板，与所述电路板电性连接；
一金属壳体，包覆所述连接器及所述电路板；
一内膜，由高导热材料制成，注塑成型包覆所述芯片及所述电路板且位于所述金属壳体和所述电路板之间，与所述金属壳体接触且显露于所述金属壳体外。
2.如权利要求1所述的电连接器组合，其特征在于：所述内膜与所述金属壳体接触。
3.如权利要求1所述的电连接器组合，其特征在于：所述内膜与所述金属壳体的所有内表面均有接触。
4.如权利要求1所述的电连接器组合，其特征在于：所述连接器具有一外壳，所述内膜与所述外壳接触。
5.如权利要求4所述的电连接器组合，其特征在于：所述内膜与所述外壳的所有外表面均有接触。
6.如权利要求1所述的电连接器组合，其特征在于：所述连接器具有至少一端子，所述端子焊接于所述电路板上，所述内膜与所述端子接触。
7.如权利要求1所述的电连接器组合，其特征在于：一散热元件，包覆所述金属壳体，一导热部位于所述金属壳体与所述散热元件之间。
8.如权利要求7所述的电连接器组合，其特征在于：所述导热部设置于所述金属壳体或所述散热元件，所述导热部与所述散热元件或所述金属壳体接触。
9.如权利要求7所述的电连接器组合，其特征在于：所述散热元件外壁面具有至少两鳍片，所述鳍片之间具有至少一凹槽。
10.如权利要求9所述的电连接器组合，其特征在于：所述鳍片为横向设置或纵向设置或斜向设置。
11.如权利要求1所述的电连接器组合，其特征在于：所述内膜部分显露于所述金属壳体外且包覆所述金属壳体。
12.如权利要求11所述的电连接器组合，其特征在于：一散热元件，包覆所述金属壳体，所述内膜位于所述金属壳体和所述散热元件之间且与所述散热元件接触。
13.如权利要求12所述的电连接器组合，其特征在于：所述内膜与所述散热元件的所有内壁面均有接触。
14.如权利要求1所述的电连接器组合，其特征在于：一线缆，具有一线芯，所述线芯焊接于所述电路板，所述内膜与所述线芯接触。
15.如权利要求14所述的电连接器组合，其特征在于：一散热弹簧套设于所述线缆，所述散热弹簧具有一主体部，所述主体部与所述金属壳体接触。
16.如权利要求15所述的电连接器组合，其特征在于：所述散热弹簧具有自所述主体部延伸入所述金属壳体的一散热部，所述内膜与所述散热部接触。
17.如权利要求1所述的电连接器组合，其特征在于：所述内膜由绝缘材料和导电材料组成，所述导电材料的比例占所述内膜的比例的一半以下。
18.如权利要求1所述的电连接器组合，其特征在于：所述金属壳体具有至少一通孔，所述内膜显露于所述通孔。
19.如权利要求1所述的电连接器组合，其特征在于：所述内 膜完全包覆所述电路板。
20.如权利要求1所述的电连接器组合，其特征在于：所述内膜由石墨材料和绝缘材料组成，所述石墨材料的比例占所述内膜的比例的一半以下。
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