TWM252987U - Heat radiating structure of computer casing - Google Patents

Description

M252987

[Technical Field of New Type] This creation is to provide a computer and the electronic components of the computer with the air flow inside the electronic components to bring out the heat to achieve the [previous technology] box heat dissipation structure, especially a type that can be added to the front Board and the mainframe for better heat dissipation. News from J3: Technology is booming and progressing, and the setting of brain-related fields is mainly based on labor, technology, knowledge, and small. Especially after the miniaturization of the computer mainframe, the operating space enjoyed by users has become It is more spacious and comfortable; however, 'Yu = reduces the size of the mainframe of the computer, coupled with the computer system's south speed and south frequency development' makes the heat generation inside the mainframe increase even more, so it can provide good heat dissipation. The effect of the chassis structure is an important subject for research and development personnel engaged in this industry. The conventional computer case heat dissipation structure, as shown in the first figure, mainly includes a front plate 11a '-a rear plate 12a, a bottom plate 13a, and a set of support frames Ha, wherein the front plate 1 1 a and the rear plate 1 2 a It is connected to the bottom plate in parallel and correspondingly to 3a. Two support frames 14a are provided on the opposite sides of the bottom plate 1 3a. The support frames 1 4a are respectively connected to the front plate 11a and the rear plate 12a, and Form a rectangular hexahedral frame 10a; and a grid-like opening 121a is provided above the rear plate 12a, and a plurality of holes 1 22a are provided in the middle thereof; in the mainframe of the computer There are various electronic components with different functions inside, such as hard disks, optical drives, power supplies, etc. The cooling fan of the power supply is located at the grid-like openings 1 2 1 a on the rear panel 1 2a for use The airflow of the cooling fan is used to draw the cold airflow through the holes 1 2 a of the frame 10 a and then exhaust them through the grid-shaped openings 1 2 1 a on the rear panel 12 a to exhaust the entire computer. Electronic elements inside the host

M252987 Ma, creation said that the piece is for cooling. The problem of the heat dissipation structure of the conventional computer case still exists in practical use is described below: Since the grid-shaped opening 12a and the hole 122a are provided on the rear plate, the airflow circulation path It is limited to the electronic components behind the host computer, and the heat generated by the electronic components in the middle and the square of the machine cannot be removed by the flowing airflow. Second, there is an open space on the left and right sides of the frame 1 Oa. The conventional computer case heat dissipation structure is that the peripheral boards (not shown) on the sides are provided with a large number of perforations to assist heat dissipation. However, because the main unit of the computer is provided with a large number of components such as memory modules, graphics cards or sound cards, or because of the surrounding environment of the main unit (such as leaning against the wall), it is possible to There is a limit to the amount of airflow that can enter the pierce. The reason is that the creator felt the above problem points and years of experience in the industry, and aimed at the inconvenience and problem points of improvement. He focused on research and matched the practical application. In the spirit of excellence, he finally proposed a design. Reasonably and effectively improve the original creation of the above problems. [What's New] The main purpose of this creation is to provide a computer case heat dissipation structure, which uses the front panel's heat dissipation holes to allow the airflow outside the frame to be introduced into the mainframe of the computer to direct it in front and in the middle. The heat of the electronic components is taken out, and the gas flow energy inside the computer host can be enhanced to achieve a better heat dissipation effect. In order to achieve the above purpose ’, this creative department provides a computer case

Page 6 M252987

The thermal structure includes a front plate, a rear plate, a bottom plate and a support frame, wherein the front plate and the rear plate are in parallel correspondence and connected to the bottom plate, and two support frames 'Xiao and other branches' are arranged on opposite sides of the bottom plate The racks are respectively connected above the front plate and the rear plate, and form a rectangular six-sided frame; the front plate is provided with a plurality of accommodating slots for the storage of the magnetic disk drive, the optical disk drive and various connectors. Many cooling holes are provided at the intervals of these accommodation slots, so as to achieve the above purpose. [Implementation] In order to allow your review committee to better understand the characteristics and technical content of this creation, please refer to the following about this creation. The detailed description and drawings are provided for reference and explanation only, and are not intended to limit the creation. Please refer to the second figure, which is a schematic diagram of the frame combination of this creation. This creation provides a computer chassis heat dissipation structure, which mainly includes a front plate 11, a rear plate, a bottom plate 13 and a set of support frames 14, among which · The front plate 11 and the rear plate 12 are parallel to each other and are connected to the bottom plate 13. Two support frames 4 are provided on the opposite sides of the bottom plate 13, and these branch frames 4 are respectively connected to the front plate. 11 and the rear plate 12 form a rectangular ^ hexahedral frame 10. The front plate 11 is stamped and formed from a metal plate. A first receiving slot 111, a second receiving slot 112, and a third receiving slot 113 are provided on the bean plate. The first receiving slot U1 is used for a memory card. Connectors are installed. The second receiving slot 11 2 can be used for a disk drive or an optical disk drive, and the third receiving slot 11 3 can be used for various connectors with different functions. A plurality of spaces are provided at a space between the one containing groove 111, the second containing groove 112 and the third containing groove 113.

M252987 IV. Creation Instructions (4) ^ --- The heat dissipation holes 11 4. These heat dissipation holes 丨 4 can be circular, rectangular or polygonal. This embodiment is a circular heat dissipation hole. In addition, the rear plate 2 is also stamped and formed from a metal plate. Two grid-like openings 1 2 1 are provided at the upper part, and a circular hole 1 2 2 is set at the middle. Please refer to the third figure, which is a schematic diagram of the combination of the preferred embodiment of the present invention. A memory card connection is provided on the first receiving slot 丨 丨 of the Liban 1 1, and the first receiving slot 112 There are an optical disk drive and a magnetic disk drive respectively, and the third receiving slot 113 is provided with connectors of various functions; and a computer motherboard is fixed on the bottom plate 13 and a processor is provided on the motherboard. Modules, memory modules, sound cards and display cards, and other electronic components with different functions, and 'the grid-like openings on the rear panel 12 2 2 2 fixed sets of fans, dotted lines (dotted lines) A power supply is provided below the cooling fans. The cooling fan of the power supply is located on the hole 12 of the rear plate 12 to form an internal structure of the computer host. Please refer to the fourth and fifth figures, which are the combination diagram of the creation and the case and the state of use diagram, respectively. It also includes a case 20, which is located in the frame 10. The outer surface includes a front panel 2 丨, a door-shaped top panel 22, and left and right side panels 23, wherein the front panel 21 is provided on the surface of the front panel 11 and may be a plastic material or porous The top plate 2 2 covers the front plate 1 1, the rear plate 丨 2 and the support frame 丨 4. On the top surface, the dragon is connected with the two supporting frames 14; the other side plates 23 are fixed on the plane formed by the front plate 11, the rear plate 12, the bottom plate 13, and the supporting frame 14. When set on the rear plate 1, When the cooling fan on 2 is running, it can be viewed from the slot 2 丨 1 on the front panel 2 丨 1 and M252987 IV. Creation instructions (5) The clearance between each of the receiving slots 111, 1 12, 113 on the front panel 11, or 4 The gap between the front panel 2 1 and the top panel 22 and the side panel 23 allows the airflow to flow through the heat dissipation holes 11 4 of the front panel 11 so as to place the electronic components in the front and middle of the computer host. The generated heat is taken away to achieve an improvement in overall cooling efficiency. As mentioned above, according to the present invention, a computer case heat dissipation structure has at least the following advantages: Since the front panel is provided with a large number of heat dissipation holes to correspond in parallel with the heat dissipation fan of the rear panel, it can effectively introduce air flow into the computer mainframe. Inside, with the heat band generated by the electronic components located in the front and middle

f This heat dissipation hole is located on the front panel, which can avoid obstructions such as memory modules and graphics cards, and can effectively solve the environment where the host computer is located = sentence limitation; moreover, the front The panel is a porous material and has air permeability, so that the cold air flow from the outside can be smoothly introduced into the inside of the chassis to achieve the best heat dissipation effect. Zhang Li ^ 14 stated that when I know that the computer case cooling structure of this creation has been produced and new and progressive, and the structure of this creation has never been seen in = use ... in line with the new patent application requirements, follow the rules and regulations: as an example. Not so

The related technical fields are all covered in the same way and used indirectly in other combinations to Chen Ming. 3 To the extent covered by this creation,

M252987 Schematic description [Schematic description] The first diagram is a schematic diagram of a conventional computer frame. The second picture is a schematic diagram of the frame combination of this creation. The third figure is a combined schematic diagram of a preferred embodiment of the creation. The fourth picture is the combined diagram of the creative frame and shell. The fifth picture is a state diagram of the use of this creation. [Element Representative Symbol] [Knowledge]

Page 10 Frame 10a Front plate 11a Rear plate 12a Grid-like opening 121a Hole 122a Base plate 13a Support frame 14a [Creation] Frame 10 Front plate 11 First receiving groove 111 Second receiving groove 112 Third receiving Slot 113 Radiating hole 114 Rear plate 12 Grid-like opening 121 Hole 122 Floor plate 13 Support frame 14 Housing 20 Front panel 21 Notch 211 Top plate 22 Side plate 23

Claims (1)

M252987 5. Scope of patent application --- 1 · A computer case heat dissipation structure, including a front plate, a rear plate, a bottom plate and a supporting frame 'wherein' the front plate and the rear plate are in parallel correspondence and connected to the bottom plate, where On the opposite side of the bottom plate, there are two support frames. These support frames are respectively connected above the front plate and the rear plate and form a rectangular six-sided frame. In addition, a plurality of receiving grooves are provided on the uranium plate. The magnetic disk drive, the optical disk drive and various connectors are accommodated, and a plurality of heat dissipation holes are provided at intervals between the accommodation slots. …, 2. The heat dissipation structure of the computer case according to item 1 of the scope of patent application, wherein the heat dissipation hole of the front plate is a circular heat dissipation hole. 3. The heat dissipation structure of the computer case according to item 1 of the scope of patent application, wherein the heat dissipation hole of the front plate is a polygonal heat dissipation hole. 4. The heat dissipation structure of the computer case as described in item 1 of the scope of the patent application, wherein the rear plate is provided with an opening and a cooling fan, and the cooling fan is correspondingly provided with the opening; and the opening is parallel to the cooling hole of the front plate Set to make the air flow inside the host more smooth. 5. The heat dissipation structure of the computer case as described in item 1 of the scope of patent application, further comprising a casing, which is arranged on the surface of the casing. 6 · The heat dissipation structure of the computer case according to item 5 of the scope of patent application, wherein the case includes a front panel, a top panel and a side panel, wherein the front panel is provided on the front panel, and the top panel is provided on the front panel, The top surface of the back plate and the support frame is fastened and connected with each other, and the side plate is arranged on a plane formed by the front plate, the rear plate, the bottom plate and the support frame. 7. The heat dissipation structure of a computer case as described in item 6 of the scope of patent application, wherein the front panel of the case is a porous material.