CN110350334A - 电互连系统 - Google Patents

电互连系统 Download PDF

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Publication number
CN110350334A
CN110350334A CN201910266253.6A CN201910266253A CN110350334A CN 110350334 A CN110350334 A CN 110350334A CN 201910266253 A CN201910266253 A CN 201910266253A CN 110350334 A CN110350334 A CN 110350334A
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Prior art keywords
end socket
socket connector
electric interconnection
interconnection system
row
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特伦斯·F·李托
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Publication of CN110350334A publication Critical patent/CN110350334A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/20—Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

一种电互连系统，其包括周边侧、系统侧及若干连接所述周边侧和系统侧的线缆，所述周边侧包括第一电路板，若干安装在所述第一电路板上的外壳，若干设置于外壳内以收容若干模组的收容腔及若干分别位于所述收容腔的后端的线端插座连接器，所述系统侧包括第二电路板，安装在所述第二电路板上的IC芯片及若干安装在所述第二电路板上的板端插座连接器，所述线缆连接线端插座连接器与板端插座连接器，所述板端插座连接器排布成上排和下排，并安装在所述第二电路板的上表面和与上表面相对的下表面。

Description

电互连系统
【技术领域】
本发明涉及一种电互连系统，尤其涉及通过线缆代替电路板以传输高速信号的插座连接器。
【背景技术】
传统设计的插座连接器和CPU通过安装CPU插座的电路板上的导电路径，插座连接器位于外壳后端以与QSFP或其它类型的模组耦合。无论如何，电路板上的导电路径对于高速高频限号传输具有其自身的限制。
因此，需要一种新设计，使QSFP或其它类型不通过电路板上的导电路径，而是通过导线连接。
【发明内容】
本发明的主要目的在于提供一种通过线缆与插座连接器连接以增强传输速率的电互连系统。
为解决上述技术问题，本发明采用如下技术方案：一种电互连系统，其包括周边侧、系统侧及若干连接所述周边侧和系统侧的线缆，所述周边侧包括第一电路板，若干安装在所述第一电路板上的外壳，若干设置于外壳内以收容若干模组的收容腔及若干分别位于所述收容腔的后端的线端插座连接器，所述系统侧包括第二电路板，安装在所述第二电路板上的IC芯片及若干安装在所述第二电路板上的板端插座连接器，所述线缆连接线端插座连接器与板端插座连接器，所述板端插座连接器排布成上排和下排，并安装在所述第二电路板的上表面和与上表面相对的下表面。
与现有技术相比，本发明具有如下有益效果：通过线缆与插座连接器连接以提高电互连系统的传输速率。
【附图说明】
图1是符合本发明实施例的电连接器组件或电互连系统的立体图。
图2是图1所示的电互连系统的另一视角的立体图。
图3是图1所示的电互连系统的又一视角的立体图。
图4是图1所示的电互连系统的再一视角的立体图。
图5是图1所示的电互连系统的仰视图。
图6是图1所示的电互连系统的俯视图。
图7是图1所示的电互连系统的正视图。
图8是图1所示的电互连系统的侧视图。
图9是图1所示的电互连系统的分解图。
图10是图9所示的电互连系统的另一视角的分解图。
图11是图2所示的电互连系统的周边侧的一部分的放大图。
图12是图4所示的电互连系统的系统侧的一部分的放大图。
图13是图1所示的电互连系统的系统侧的一部分的放大图。
图14是图1所示的电互连系统的周边侧的分解图。
图15是图14所示的电互连系统的周边侧的另一视角的分解图。
图16是图1所示的电互连系统的周边侧的剖视图。
图17是图1所示的电互连系统的系统侧的剖视图，所述系统侧在主板的上表面的周围。
图18是图1所示的电互连系统的系统侧的剖视图，所述系统侧在主板的下表面的周围。
图19是图1所示的电互连系统的线端插座连接器与相应的SFP模组的对接舌板的立体图。
图20是图1所示的电互连系统的线端插座连接器与相应的SFP模组的对接舌板的另一视角的立体图。
图21是图19所示的电互连系统的线端插座连接器以分离的形式与相应的SFP模组的对接舌板的立体图。
图22是图1所示的电互连系统的线端插座连接器(端子为VCC，未图示)设有线缆的分解图。
图23是图22所示的电互连系统的线端插座连接器设有线缆的另一视角的分解图。
图24是图22所示的电互连系统的线端插座连接器设有属于VCC的端子的又一视角的分解图。
图25是图22所示的电互连系统的线端插座连接器设有线缆的进一步的分解图。
图26是图25所示的电互连系统的线端插座连接器设有线缆的另一视角的分解图。
图27是图25所示的电互连系统的线端插座连接器设有线缆的进一步的分解图。
图28是图27所示的电互连系统的线端插座连接器设有线缆的另一视角的分解图。
图29是图21所示的电互连系统的线端插座连接器和相应的SFP模组的对接舌板的仰视图。
图30是图29所示的电互连系统的线端插座连接器和相应的SFP模组的对接舌板的俯视图。
图31是图29所示的电互连系统的线端插座连接器和相应的SFP模组的对接舌板的剖视图，其中，所述对接舌板插入至线端连接器的对接槽中。
图32是图29所示的电互连系统的线端插座连接器和相应的SFP模组的对接舌板的另一位置的剖视图，其中，所述对接舌板插入至线端连接器的对接槽中。
图33是图1所示的电互连系统的板端插座连接器的立体图。
图34是图33所示的电互连系统的板端插座连接器的另一视角的立体图。
图35是图33所示的电互连系统的板端插座连接器的分解图。
图36是图35所示的电互连系统的板端插座连接器的另一视角的分解图。
图37是图1所示的电互连系统的板端插座连接器的端子模组的分解图。
图38是图33所示的电互连系统的板端插座连接器的另一视角的分解图。
图39是图33所示的电互连系统的板端插座连接器的剖视图。
图40是图33所示的板端插座连接器的端子模组子组件的仰视图。
图41是图34所示的板端插座连接器的端子模组子组件的俯视图。
图42是图1所示的电互连系统的板端插座连接器和插头连接器的相应的对接舌板的立体图。
【具体实施方式】
如图1-18所示，电连接器500包括周边侧502及与所述周边侧502相连接的系统侧702。所述周边侧502包括电路板510，所述电路板510设有第一表面512及在竖直方向上与所述第一表面512相对的第二表面514。第一金属外壳520通过安装脚(未图示)安装在第一表面512上，第二金属外壳522通过安装脚(未图示)安装在第二表面514上。每个所述第一金属外壳520和第二金属外壳522均包括主体部524，底盖526及若干组装在一起形成若干收容腔532以收容相应的SFP模组(未图示)的间隔件528。所述底盖526包括与插入的SFP模组(未全示，仅显示其中的对接舌板)配合的可偏转的锁扣片。第一金属外壳520和第二金属外壳522围绕收容腔532相应的前开口，金属垫圈521围绕每个第一金属外壳520和第二金属外壳522。
如图19-32所示，线端插座连接器600位于每个所述收容腔532的后端，其包括设有对接槽604和收容空间606的绝缘本体602。所述对接槽604位于绝缘本体602的前端以收容插入的SFP模组(未全示，仅显示其中的对接舌板)的对接部，所述收容空间606位于绝缘本体602的后端以收容端子模组610。若干底层通道612和顶层通道614设置在绝缘本体602内。若干底层端子固持于相应的底层通道612内。每个所述底层端子616设有延伸进对接槽604的前连接部613及安装到电路板510上的后连接部615。可以理解的是，所述端子模组610包括若干一体成型于绝缘体620内并延伸进相应顶层通道614内的顶层端子618。每个顶层端子618包括延伸进对接槽604的前连接部617及后连接部619。所述顶层端子618设置于两个高速组，每个高速组具有四根端子618，其中中间两根端子618的后连接部619机械和电性连接到差分对芯线650，而外侧的两根端子618与接地片G一体成型，差分对芯线650的地线652和/或编织箔654连接在接地片G上。值得注意的是，所述中间两根端子在两个高速组之间，属于VCC。本体630安装在绝缘体620上以保护差分对芯线650与设有接地片G的顶层端子618的后连接部619的连接。
如图33-42所示，若干板端插座连接器170安装在主板710上。每个板端插座连接器170包括设有收容空间174的绝缘壳体172以收容端子模组176。所述端子模组176包括上端子单元178，下端子单元180及夹在上端子单元178和下端子单元180之间的中间接地单元182。其中，上端子单元178包括若干一体成型于上绝缘体179的上端子177，下端子单元180包括若干一体成型于下绝缘体183的下端子181。所述上端子177和下端子181设有相应的连接部，所述连接部延伸进绝缘壳体172的对接槽171以与相应的线缆连接器192的对接舌板190对接。所述上绝缘体179包括凹槽189以收容下绝缘体183相应的突起187，用于固持上端子单元178和下端子单元180。基座185位于下端子单元180的下面，并组装进绝缘壳体172里以调节上端子单元178和下端子单元180两者的尾部，以便安装到主板710上。值得注意的是，两排板端插座连接器170分别安装在主板710的上表面和与上表面相对的下表面。在垂直于竖直方向和前后方向的横向方向上观察，所述两排板端插座连接器170在前后方向上和从CPU或IC芯片散热器组100的两侧分别相互偏移，以便于主板710上的导电迹线布线。在仰视角，前排(在主板710的上表面)的所述板端插座连接器170在前后方向上分别与后排(在主板710的下表面)的所述板端插座连接器170对齐。
如图1-32所示，若干线缆840沿前后方向与插头连接器192和相应的线端插座连接器连接。每个线缆840位于系统侧702周围的一端连接一插头连接器192以与一板端插座连接器170对接，同时位于周边侧502周围的另一端通过四组差分芯线对650分别与四个线端连接器600连接。其中，每组差分芯线对650有两对，如图9最左边的线缆840、图10最右边的线缆840所示，以机械和电性连接到相应的两内对端子618(如图25、26所示)。值得注意的是，所述四个线端插座连接器600对应同一个线缆840，并设置在上金属外壳520的两个相邻对接腔532和下金属外壳522的两个相邻对接腔532内，所述下金属外壳522的两个相邻对接腔532与上金属外壳520的两个相邻对接腔532在竖直方向上对齐。此外，所述线缆840的一端排布成一排位于电路板510后边缘的边缘以与所述四个线端插座连接器600耦合，所述线缆840排布成两排依次位于系统侧702的周围，以交替的方式设置在主板710的上表面和下表面，以便有效地使用周边侧502和系统侧702两者中的可用空间，而不弄乱线缆840。
本发明的技术特征是将线缆840扇型的方式排布在48端口的周边侧(即2x24)和12端口的系统侧(即2x6)之间。换句话来说，周边侧端口组件的横向尺寸约为系统侧端口组件的横向尺寸的五倍。同样，两排板端插座连接器170分别位于散热组件100的两侧，有利于小型化连接到散热器组100下方的CPU或IC芯片的导电路径。

Claims (10)

1.一种电互连系统，其包括周边侧、系统侧及若干连接所述周边侧和系统侧的线缆，所述周边侧包括第一电路板，若干安装在所述第一电路板上的外壳，若干设置于外壳内以收容若干模组的收容腔及若干分别位于所述收容腔的后端的线端插座连接器，所述系统侧包括第二电路板，安装在所述第二电路板上的IC芯片及若干安装在所述第二电路板上的板端插座连接器，所述线缆连接线端插座连接器与板端插座连接器，其特征在于：所述板端插座连接器排布成上排和下排，并安装在所述第二电路板的上表面和与上表面相对的下表面。
2.如权利要求1所述的电互连系统，其特征在于：所述外壳和线端插座连接器排布在上排和下排，并安装在所述第一电路板的上表面和与上表面相对的下表面。
3.如权利要求2所述的电互连系统，其特征在于：每个所述线缆的一端与相应的一个板端插座连接器连接，另一端与上排的至少两个线端插座连接器连接。
4.如权利要求2所述的电互连系统，其特征在于：每个所述线缆的一端与相应的一个板端插座连接器连接，另一端与下排的至少两个线端插座连接器连接。
5.如权利要求2所述的电互连系统，其特征在于：每个所述线缆的一端与相应的一个板端插座连接器连接，另一端与上排两个相邻的线端插座连接器和下排两个相邻的线端插座连接器连接。
6.如权利要求1所述的电互连系统，其特征在于：所述上排两个相邻的线端插座连接器与下排两个相邻的线端插座连接器在竖直方向上对齐，所述线缆包括四组差分信号对，每组差分信号对包括两对差分端子对。
7.如权利要求1所述的电互连系统，其特征在于：每个所述线缆一体连接到相应的线端插座连接器，同时通过与相应的板端插座连接器配合的插头连接器可拆卸地连接到相应的板端插座连接器。
8.如权利要求1所述的电互连系统，其特征在于：所述上排的板端插座连接器在前后方向上与下排的板端插座连接器偏离。
9.如权利要求1所述的电互连系统，其特征在于：所述线缆以交替的方式依次连接到上排的板端插座连接器和下排的板端插座连接器。
10.如权利要求1所述的电互连系统，其特征在于：在仰视角度上，所述上排的板端插座连接器与下排的板端插座连接器在前后方向上相互对齐。
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