CN204927324U - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
CN204927324U
CN204927324U CN201390001130.6U CN201390001130U CN204927324U CN 204927324 U CN204927324 U CN 204927324U CN 201390001130 U CN201390001130 U CN 201390001130U CN 204927324 U CN204927324 U CN 204927324U
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China
Prior art keywords
distribution
light
sealing
emitting component
wall member
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Expired - Lifetime
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CN201390001130.6U
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English (en)
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日野清和
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本实用新型提供一种照明装置，包括：基板；配线图案，设置于所述基板的表面，且具有配线焊垫；发光元件，设置于所述配线图案上，且在与设置于所述配线图案的一侧为相反侧的面具有电极；包围壁构件，以包围所述发光元件的方式而设置；配线，连接所述配线焊垫与所述电极；以及密封部，设置于所述包围壁构件的内侧，且覆盖所述发光元件与所述配线。并且，将所述基板的由所述包围壁构件包围的部分的中心位置与所述配线连接于所述配线焊垫的位置予以连结的线段和所述配线所成的角度为0°以上且45°以下或者135°以上且180°以下。本实用新型的照明装置能够提高对温度变化的耐受性。

Description

照明装置
技术领域
本实用新型主要涉及一种照明装置。
背景技术
有一种照明装置，其包括：基板；配线图案(pattern)，设置在基板的表面；多个发光二极管(LightEmittingDiode，LED)，设置在配线图案上；多根配线，分别连接多个发光二极管与配线图案；包围壁构件，以包围多个发光二极管的方式而设置在基板的表面；以及密封部，设置在包围壁构件的内侧。
在此种照明装置中，由于发光二极管的点亮与熄灭，密封部会产生热变形(因温度变化而引起的膨胀与收缩)。并且，当为了实现高光量而使用多个发光二极管时，密封部的尺寸(size)/体积变大，热变形的影响变得更大。而且，在车载用的照明装置中，进而加上环境温度的变化大(例如-40℃与+85℃的范围)，热变形的影响将变得更大。
并且，若密封部的热变形变大，则连接发光二极管与配线图案的配线容易发生断线。
因此，期望开发一种能够提高对温度变化的耐受性的照明装置。
现有技术文献
专利文献
专利文献1：日本专利特开2013-25935号公报
实用新型内容
实用新型所要解决的问题
本实用新型所要解决的问题在于提供一种照明装置，能够提高对温度变化的耐受性。
解决问题的技术手段
实施方式的照明装置包括：基板；配线图案，设置于所述基板的表面，且具有配线焊垫；发光元件，设置于所述配线图案上，且在与设置于所述配线图案的一侧为相反侧的面具有电极；包围壁构件，以包围所述发光元件的方式而设置；配线，连接所述配线焊垫与所述电极；以及密封部，设置于所述包围壁构件的内侧，且覆盖所述发光元件与所述配线。并且，将所述基板的由所述包围壁构件包围的部分的中心位置与所述配线连接于所述配线焊垫的位置予以连结的线段、和所述配线所成的角度为0°以上且45°以下或者135°以上且180°以下。
本实用新型的照明装置，优选的是，所述包围壁构件的线膨胀系数为所述密封部的线膨胀系数以下。
本实用新型的照明装置，优选的是，从所述发光元件的上表面到所述配线的线环的上端为止的高度为160μm以下。
本实用新型的照明装置，优选的是，还包括：供电端子，与所述配线图案电连接；以及灯座，与所述供电端子嵌合。
实用新型的效果
本实用新型可提供一种能够提高对温度变化的耐受性的照明装置。
附图说明
图1是用于例示本实施方式的照明装置1的示意立体图。
图2是用于例示本实施方式的照明装置1的示意立体分解图。
图3是发光部20的示意平面图。
图4是另一实施方式的发光部20的示意平面图。
图5(a)、图5(b)是用于例示密封部27的热变形的影响的示意剖面图。
图6是用于例示比较例的配线25的配置的示意平面图。
图7是用于例示连接于配线焊垫24c的配线25的端部的示意立体图。
图8是用于例示配线25的设置角度θ的示意图。
图9是用于例示配线25的线环(loop)高度h的示意图。
附图标记说明：
1：照明装置；
10：本体部；
11：收纳部；
12：凸缘部；
13：鳍片；
20：发光部；
21：基板；
22：发光元件；
23：控制元件；
24：配线图案；
24a：输入端子；
24b：安装焊垫；
24c：配线焊垫；
25：配线；
25a：压溃的部分；
25b：颈部；
26：包围壁构件；
26a：中央部；
26b：侧壁面；
27：密封部；
28：接合部；
29：电极；
30：供电部；
31：供电端子；
40：灯座；
100：中心位置；
F：横向负载；
h：线环高度；
θ：设置角度。
具体实施方式
第1实用新型是一种照明装置，其包括：基板；配线图案，设置于所述基板的表面，且具有配线焊垫；发光元件，设置于所述配线图案上，且在与设置于所述配线图案的一侧为相反侧的面具有电极；包围壁构件，以包围所述发光元件的方式而设置；配线，连接所述配线焊垫与所述电极；以及密封部，设置于所述包围壁构件的内侧，且覆盖所述发光元件与所述配线。
并且，将所述基板的由所述包围壁构件包围的部分的中心位置与所述配线连接于所述配线焊垫的位置予以连结的线段、和所述配线所成的角度为0°以上且45°以下或者135°以上且180°以下。
根据该照明装置，能够提高对温度变化的耐受性。
第2实用新型是根据第1实用新型的照明装置，其中所述包围壁构件的线膨胀系数为所述密封部的线膨胀系数以下。
根据该照明装置，能够进一步提高对温度变化的耐受性。
第3实用新型是根据第1实用新型的照明装置，其中从所述发光元件的上表面到所述配线的线环的上端为止的高度为160μm以下。
根据该照明装置，能够进一步提高对温度变化的耐受性。
第4实用新型是根据第1实用新型的照明装置，还包括：供电端子，与所述配线图案电连接；以及灯座(socket)，与所述供电端子嵌合。
以下，参照附图来例示实施方式。另外，各附图中，对于同样的构成要素标注相同的符号，并适当省略详细说明。
图1及图2是用于例示本实施方式的照明装置1的示意立体图。
另外，图1是照明装置1的示意立体图，图2是照明装置1的示意立体分解图。
而且，在图1及图2中，为了便于观察图，省略了密封部27的描绘。
图3是发光部20的示意平面图。
图4是另一实施方式的发光部20的示意平面图。
另外，图3与图4中，发光元件22的数量、及配线25的设置形态不同。
如图1及图2所示，照明装置1设置有本体部10、发光部20、供电部30及灯座40。
本体部10设置有收纳部11、凸缘(flange)部12及鳍片(fin)13。
收纳部11呈圆筒状，并从凸缘部12的其中一个面突出。在收纳部11的内侧，收纳有发光部20。而且，在收纳部11的内侧，突出有供电部30的供电端子31。
凸缘部12呈圆板状，且在其中一面设置有收纳部11，在另一面设置有鳍片13。
鳍片13是从凸缘部12的面突出地设置有多个。多个鳍片13呈板状，且作为散热鳍片发挥功能。
本体部10具有：收纳发光部20及供电部30等的功能；以及将由发光部20及供电部30产生的热散发到照明装置1外部的功能。
因此，考虑到将热散发到外部，可使本体部10由导热率高的材料形成。例如，本体部10可由铝、铝合金、高导热性树脂等形成。高导热性树脂例如是在聚对苯二甲酸乙二醇酯(PolyethyleneTerephthalate，PET)或尼龙(nylon)等树脂中，混合有导热率高的碳或氧化铝等的纤维或粒子而成。
此时，也可使鳍片13等将热散发到外部的部分由导热率高的材料形成，而使其他部分由树脂等形成。
而且，在本体部10的主要部分由导电性材料所构成的情况下，为了确保供电端子31与本体部10的导电性材料之间的电绝缘，也可采用如下结构：利用绝缘材料(未图示)来覆盖供电端子31的周围，进而，在其周围配置导电性材料。绝缘材料例如优选为树脂等且导热率高的材料。而且，本体部10也可设置有可装卸地安装于车辆用灯具的安装部。
如图3或图4所示，发光部20设置有基板21、发光元件22、控制元件23、配线图案24、配线25、包围壁构件26、密封部27及接合部28。
基板21设置在本体部10的收纳部11的内侧。
基板21呈板状，且在表面设置有配线图案24。
基板21的材料或结构并无特别限定。例如，基板21可由氧化铝或氮化铝等无机材料(陶瓷(ceramics))、酚醛纸(paperphenol)或环氧玻璃(glassepoxy)等有机材料等形成。而且，基板21也可为由绝缘体包覆金属板表面而成的基板。另外，在由绝缘体包覆金属板表面的情况下，绝缘体既可由有机材料所构成，也可由无机材料所构成。
此时，在发光元件22的发热量大的情况下，考虑到散热的观点，优选使用导热率高的材料来形成基板21。作为导热率高的材料，例如可例示如氧化铝或氮化铝等陶瓷、高导热性树脂、由绝缘体包覆金属板表面而成的材料等。
而且，基板21既可为单层，也可为多层。
发光元件22在设置于基板21表面的配线图案24上安装有多个。
发光元件22可采用在与设置于配线图案24的一侧为相反侧的面(上表面)具有电极29的发光元件(参照图8)。另外，电极29既可设置在设置于配线图案24的一侧的面(下表面)和与设置于配线图案24的一侧为相反侧的面(上表面)，也可仅设置在与设置于配线图案24的一侧为相反侧的面(上表面)。
设置在发光元件22下表面的电极29经由银膏(paste)等导电性的热固化材料而与设置于配线图案24的安装焊垫24b电连接。设置在发光元件22上表面的电极29经由配线25而与设置于配线图案24的配线焊垫24c电连接。
发光元件22例如可采用发光二极管、有机发光二极管、激光二极管(laserdiode)等。
发光元件22的光的出射面即上表面朝向照明装置1的正面侧，且主要朝向照明装置1的正面侧来出射光。
发光元件22的数量或大小等并不限定于例示的，可根据照明装置1的大小或用途等来适当变更。
控制元件23被安装于配线图案24上。
控制元件23对流经发光元件22的电流进行控制。即，控制元件23控制发光元件22的发光。
控制元件23的数量及大小等并不限定于例示的，可根据发光元件22的数量或规格等来适当变更。
配线图案24设置于基板21的至少一个表面。
配线图案24也可设置于基板21的两个面，但为了降低制造成本，优选设置在基板21的一个面。
在配线图案24中，设置有输入端子24a。
输入端子24a设置有多个。供电部30的供电端子31电连接于输入端子24a。因此，发光元件22经由配线图案24而与供电部30电连接。
配线25将设置在发光元件22上表面的电极29与设置于配线图案24的配线焊垫24c予以电连接。
配线25例如可采用以金为主成分的线。但是，配线25的材料并不限定于以金为主成分的材料，例如也可为以铜为主成分的材料或者以铝为主成分的材料等。
配线25例如通过超声波熔接或者热熔接，而电连接于设置在发光元件22上表面的电极29与设置于配线图案24的配线焊垫24c。配线25例如可使用打线接合(wirebonding)法，而电连接于设置在发光元件22上表面的电极29与设置于配线图案24的配线焊垫24c。
另外，可根据需要来适当设置未图示的电路零件等。
未图示的电路零件例如是能够安装于配线图案24上的零件。
包围壁构件26以包围多个发光元件22的方式而设置于基板21上。包围壁构件26例如具有环状形状，且在中央部26a配置有多个发光元件22。
包围壁构件26例如可由聚对苯二甲酸丁二醇酯(polybutyleneterephthalate，PBT)或聚碳酸酯(polycarbonate，PC)等树脂或者陶瓷等形成。
而且，在将包围壁构件26的材料设为树脂的情况下，可混合氧化钛等的粒子，以提高对从发光元件22出射的光的反射率。
另外，并不限定于氧化钛的粒子，只要混合由对从发光元件22出射的光的反射率高的材料所构成的粒子即可。
而且，包围壁构件26例如也可由白色的树脂形成。
包围壁构件26的中央部26a侧的侧壁面26b为斜面。从发光元件22出射的光的一部分被包围壁构件26的侧壁面26b反射后，朝向照明装置1的正面侧出射。
而且，从发光元件22朝向照明装置1的正面侧出射的光的一部分且在密封部27的上表面(密封部27与外界空气的界面)发生了全反射的光被包围壁构件26的中央部26a侧的侧壁面26b反射后，再次朝向照明装置1的正面侧出射。
即，包围壁构件26可采用一并具备反射器(reflector)功能的构件。另外，包围壁构件26的形态并不限定于例示的，可适当变更。
密封部27被设置在包围壁构件26的中央部26a。密封部27以覆盖包围壁构件26的内侧的方式而设置。即，密封部27设置在包围壁构件26的内侧，且覆盖发光元件22与配线25。
密封部27是由具有透光性的材料形成。密封部27例如可由硅酮(silicone)树脂等形成。
密封部27例如可通过向包围壁构件26的中央部26a填充树脂而形成。树脂的填充例如可使用分注器(dispenser)等液体定量喷出装置来进行。
若向包围壁构件26的中央部26a填充树脂，则能够抑制从外部对发光元件22、配置于包围壁构件26的中央部26a的配线图案24及配线25等的机械接触。而且，能够抑制空气/水分等附着于发光元件22、配置于包围壁构件26的中央部26a的配线图案24及配线25等。因此，能够提高对照明装置1的可靠性。
而且，可使密封部27含有荧光体。荧光体例如可采用YAG系荧光体(钇铝石榴石(yttriumaluminumgarnet)系荧光体)。
例如，当发光元件22为蓝色发光二极管且荧光体为YAG系荧光体时，YAG系荧光体受到从发光元件22出射的蓝色光激发，从而从YAG系荧光体放射出黄色的荧光。并且，通过蓝色光与黄色光混合，从而从照明装置1出射白色光。另外，荧光体的种类或发光元件22的种类并不限定于例示的，可根据照明装置1的用途等来适当变更，以获得所需的发光色。
接合部28将包围壁构件26与基板21予以接合。
接合部28呈膜状，且设置在包围壁构件26与基板21之间。
接合部28例如可采用通过使硅酮系粘合剂或环氧(epoxy)系粘合剂固化而形成的构件。
接合部28例如可通过以下的流程来形成。
首先，在基板21表面的要设置包围壁构件26的区域，涂布硅酮系粘合剂或环氧系粘合剂。
例如，使用分注器等，向基板21表面的要设置包围壁构件26的区域涂布粘合剂。
然后，通过使溶剂等蒸发而使粘合剂固化，以形成接合部28，并且将包围壁构件26与基板21予以接合。
例如，首先，在所涂布的粘合剂上载置包围壁构件26。
接着，按压包围壁构件26以使粘合剂密接于包围壁构件26，并且调整包围壁构件26的位置(粘合剂的厚度)。
随后，通过使溶剂等蒸发而使粘合剂固化。
此处，粘合剂固化前的粘度优选为1Pa·s～15Pa·s。若设为此种粘度，则在使用分注器等来进行涂布时，容易涂布成任意形状。
而且，若设为此种粘度，则在使粘合剂固化时，能够使包围壁构件26的位置稳定。
供电部30设置有多个供电端子31。
多个供电端子31在收纳部11及凸缘部12的内侧延伸。
多个供电端子31的其中一个端部从收纳部11的底面突出，并与配线图案24的输入端子24a电连接。多个供电端子31的另一端部从本体部10的与设置基板21的一侧为相反的一侧露出。
另外，供电端子31的数量、配置、形态等并不限定于例示的，可进行适当变更。
而且，供电部30也可采用具备未图示的基板以及电容器(condenser)及电阻等电路零件的构件。另外，未图示的基板及电路零件例如可设置在收纳部11或者凸缘部12的内部。
灯座40嵌合于在本体部10的与设置基板21的一侧为相反的一侧露出的多个供电端子31的端部。
未图示的电源等电连接于灯座40。
因此，通过将灯座40嵌合于供电端子31的端部，将未图示的电源等与发光元件22予以电连接。
灯座40例如可使用粘合剂等而接合于本体部10侧的要素。
此处，由于发光元件22的点亮与熄灭等，密封部27会产生热变形(膨胀/收缩)。
图5(a)、图5(b)是用于例示密封部27的热变形的影响的示意剖面图。
另外，图5(a)是用于例示基板21、配线25、包围壁构件26及密封部27的温度低时的密封部27的热变形的示意剖面图。
图5(b)是用于示例基板21、配线25、包围壁构件26及密封部27的温度高时的密封部27的热变形的示意剖面图。
而且，图5(a)、图5(b)中的箭头的朝向表示密封部27的变形方向。
图5(a)、图5(b)中的箭头的长度表示在密封部27中产生的应力的大小或密封部27的变形量。例如，箭头的长度越长，则表示在密封部27中产生的应力的大小越大，或者表示密封部27的变形量越大。
例如，当使用陶瓷来形成基板21时，基板21的线膨胀系数为7ppm/K左右。若使用金来形成配线25，则配线25的线膨胀系数为14ppm/K左右。若使用PBT来形成包围壁构件26，则包围壁构件26的线膨胀系数为90ppm/K左右。若使用PC来形成包围壁构件26，则包围壁构件26的线膨胀系数为65ppm/K左右。若使用硅酮树脂来形成密封部27，则密封部27的线膨胀系数为200ppm/K左右。
因此，密封部27的因温度变化而造成的膨胀量与收缩量最大。
例如，密封部27的膨胀量与收缩量为基板21的膨胀量与收缩量的29倍左右。
当温度低时，如图5(a)所示，相对地，密封部27朝向基板21收缩，密封部27朝上表面凹陷的方向变形。而且，从基板21的由包围壁构件26包围的部分(包围壁构件26的内侧部分)的中心位置100越朝密封部27的周缘方向远离，则密封部27产生的应力及变形量越大。而且，从基板21的表面越朝密封部27的上表面方向远离，则密封部27产生的应力及变形量越大。
当温度高时，如图5(b)所示，相对地，密封部27朝向与存在基板21的一侧为相反的一侧膨胀，密封部27朝上表面鼓出的方向变形。而且，从基板21的由包围壁构件26包围的部分的中心位置100越朝密封部27的周缘方向远离，则密封部27产生的应力及变形量越大。而且，从基板21的表面越朝密封部27的上表面方向远离，则密封部27产生的应力及变形量越大。
此时，在密封部27中存在配线25。因此，当密封部27产生热变形时，外力将作用于配线25。
并且，当为了实现高光量而使用多个发光元件22时，密封部27的尺寸/体积将变大，因此热变形的影响变得更大。而且，在照明装置1为车载用的情况下，进而加上环境温度的变化大(例如-40℃与+85℃的范围)，热变形的影响将变得更大。
图6是用于例示比较例的配线25的配置的示意平面图。
图7是用于例示连接于配线焊垫24c的配线25的端部的示意立体图。
如上所述，因密封部27产生的热变形而外力作用于配线25。而且，如图5(a)、图5(b)所例示那样，密封部27在平面方向上的变形方向从基板21的由包围壁构件26包围的部分的中心位置100来看为大致矢径方向。
因此，由矢径方向的分力与上下方向的分力所构成的外力作用于配线25。
此处，如图6所示，将中心位置100与使配线25连接于配线焊垫24c的位置(例如，第二接合(secondbonding)的位置)予以连结的线段、和配线25的轴线(配线25所延伸的方向的线段)所成的角度(下文称作配线25的设置角度)设为θ。
此时，将中心位置100与使配线25连接于配线焊垫24c的位置予以连结的线段所延伸的方向是矢径方向的分力发生作用的方向。
因此，配线25的设置角度θ越接近90°，作用于与配线25的轴线正交的方向的力越大。即，配线25的设置角度θ越接近90°，对配线25的横向负载越大。
并且，如图7所示，配线25的配线焊垫24c侧的端部因被施加负载与超声波而压溃。因此，压溃的部分25a与未压溃的部分之间的部分(颈(neck)部)25b在结构上变得脆弱。
因此，若横向负载F过大，则有可能在颈部25b处发生断线。
此时，如后所述，若使配线25的设置角度θ处于规定的范围内，便能够抑制横向负载F，因此能够抑制配线25的断线。
图8是用于例示配线25的设置角度θ的示意图。
如图8所示，配线25的设置角度θ为0°以上且180°以下。
此时，配线25的设置角度θ越接近90°，则对配线25的横向负载越大，因此越容易发生断线。
表1是表示配线25的设置角度θ与断线的关系的表。
表1是进行热冲击测试而求出配线25的设置角度θ与断线的关系。
在热冲击测试中，将发光部20于-40℃的环境中放置30分钟，随后，将发光部20于+85℃的环境中放置30分钟，并且将发光元件22点亮。并且，将此流程反复进行500次。
而且，各制作10个配线25的设置角度θ不同的样品，根据有无发生断线与发生了断线的个数，来判定对温度变化的耐受性。
另外，在判定时，将配线25未断线的情况标为“○”，将发生了断线的个数为1/10个～5个/10个的情况标为“△”，将发生了断线的个数为6/10个～10个/10个的情况标为“×”。
[表1]
由表1可知，若使配线25的设置角度θ为0°以上且45°以下或者135°以上且180°以下，则能够使断线的发生概率极低。
而且，如前所述，从基板21的表面越朝密封部27的上表面方向远离，则密封部27产生的应力及变形量将越大。
因此，越接近密封部27的上表面，作用于配线25的上下方向的分力将越大。
并且，若上下方向的分力过大，则有可能在配线25与电极29的接合部分附近发生断线。
图9是用于例示配线25的线环高度h的示意图。
如图9所示，配线25的线环高度h是从发光元件22的上表面到配线25的线环上端为止的高度。
根据本实用新型的发明人所获得的见解，若将配线25的线环高度h设为160μm以下，则能够使配线25与电极29的接合部分附近的断线的发生概略极低。
而且，若包围壁构件26的线膨胀系数为密封部27的线膨胀系数以上，则会助长密封部27的热变形，导致配线25容易发生断线。
此时，若使包围壁构件26的线膨胀系数为基板21的线膨胀系数以上且为密封部27的线膨胀系数以下，则可抑制密封部27的热变形。
例如，当使用陶瓷(7ppm/K左右)来形成基板21，并使用硅酮树脂来形成密封部27时，可使用PBT(90ppm/K左右)或PC(65ppm/K左右)来形成包围壁构件26。
以上，例示了本实用新型的若干个实施方式，但这些实施方式仅为例示，并不意图限定实用新型的范围。这些新颖的实施方式能以其他的各种形态来实施，在不脱离实用新型的主旨的范围内，可进行各种省略、替换、变更等。这些实施方式及其变形例包含在实用新型的范围或主旨内，并且包含在权利要求书所记载的实用新型及其均等的范围内。而且，前述的各实施方式可彼此组合而实施。

Claims (4)

1.一种照明装置，其包括：
基板；
配线图案，设置于所述基板的表面，且具有配线焊垫；
发光元件，设置于所述配线图案上，且在与设置于所述配线图案的一侧为相反侧的面具有电极；
包围壁构件，以包围所述发光元件的方式而设置；
配线，连接所述配线焊垫与所述电极；以及
密封部，设置于所述包围壁构件的内侧，且覆盖所述发光元件与所述配线，
将所述基板的由所述包围壁构件包围的部分的中心位置与所述配线连接于所述配线焊垫的位置予以连结的线段、和所述配线所成的角度为0°以上且45°以下或者135°以上且180°以下。
2.根据权利要求1所述的照明装置，其中所述包围壁构件的线膨胀系数为所述密封部的线膨胀系数以下。
3.根据权利要求1所述的照明装置，其中从所述发光元件的上表面到所述配线的线环的上端为止的高度为160μm以下。
4.根据权利要求1所述的照明装置，还包括：
供电端子，与所述配线图案电连接；以及
灯座，与所述供电端子嵌合。
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