CN203820443U

CN203820443U - Mems packaging

Info

Publication number: CN203820443U
Application number: CN201320429248.0U
Authority: CN
Inventors: 张睿; 吴志江; 孟珍奎
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2013-07-18
Filing date: 2013-07-18
Publication date: 2014-09-10
Anticipated expiration: 2023-07-18

Abstract

The utility model provides MEMS packaging comprising a base plate, an ASIC chip on the base plate and electrically connected with the base plate and at least two MEMS pressure sensors on the base plate and electrically connected with the ASIC chip. The at least two MEMS pressure sensors and the single ASIC chip are packaged on the base plate, so that overlay treatment can be conducted to output signals of each MEMS pressure sensor and collected by the ASIC chip; and random error and noise of product signals output can be naturally decreased, so overall signal input strength of the ASIC chip can be enhanced, product output signal precision can be increased and product performance can be improved.

Description

MEMS encapsulation

[technical field]

The utility model relates to a kind of MEMS(Micro of utilization Electro Mechanical System) sensor (MEMS sensor) that technology is manufactured, relate in particular to a kind of MEMS encapsulation.

[background technology]

MEMS (Micro Electro Mechanical Systems) refers to the Micro Electro Mechanical System that integrates microsensor, actuator, signal processor, control circuit, interface circuit, communication and power supply.It relates to multiple subject and the technology such as electronics, machinery, material, physics, chemistry, biology, medical science, has broad application prospects.MEMS sensor is to adopt microelectronics and the produced novel sensor of micromachining technology.Compare with traditional sensor, it has, and volume is little, lightweight, cost is low, low in energy consumption, reliability is high, be suitable for mass production, be easy to integrated and realize intelligentized feature.Meanwhile, the characteristic size in micron dimension makes it can complete the irrealizable function of some traditional mechanical pick-up device.

Wherein, micro-electromechanical pressure transducer (MEMS pressure sensor) is the micromechanics product of early start development, is also product the most ripe in micro mechanical technology, early start industrialization.With other sensor class seemingly, in MEMS pressure sensor when work, is converted into signal of telecommunication output by pressure.General MEMS pressure sensor adopts Bulk micro machining to make, and also has and adopts surface silicon processing technology to make.Common MEMS pressure sensor is divided into pressure resistance type and condenser type two classes.

MEMS encapsulation of the prior art, encapsulates to realize corresponding function by single MEMS pressure sensor and asic chip based on pcb board conventionally, but under this structure, random error and noise that single MEMS pressure sensor produces cannot be subdued.

Therefore, be necessary to provide a kind of novel MEMS encapsulation.

[utility model content]

The purpose of this utility model is to provide a kind of structure more compact and can under less package dimension, realize the MEMS encapsulation of more perfect function.

The technical solution of the utility model is as follows: a kind of MEMS encapsulation, it comprises substrate, be located on described substrate and the asic chip being electrically connected to described substrate and at least two are located on described substrate and the MEMS pressure sensor being electrically connected to described asic chip.

Preferably, this MEMS encapsulation also comprises that at least one is located on described substrate and the MEMS microphone being electrically connected to described asic chip.

Preferably, this MEMS encapsulation also comprises that described MEMS microphone is electrically connected to described asic chip by described binding gold thread for connecting the binding gold thread of described MEMS microphone and described asic chip.

Preferably, described substrate is pcb board, and described pcb board is provided with wire, and described MEMS microphone is electrically connected to described asic chip by the wire on described pcb board.

Preferably, this MEMS encapsulation also comprises that described MEMS pressure sensor is electrically connected to described asic chip by described binding gold thread for connecting the binding gold thread of described MEMS pressure sensor and described asic chip.

Preferably, described substrate is pcb board, and described pcb board is provided with wire, and described MEMS pressure sensor is electrically connected to described asic chip by the wire on described pcb board.

The beneficial effects of the utility model are: at least two MEMS pressure sensors and single asic chip are encapsulated based on substrate, be conducive to asic chip the signal of each MEMS pressure sensor output collecting is carried out to overlap-add procedure, the natural attenuation of realization to random error in product output signal and noise, therefore can effectively increase the whole intensity of input signal of asic chip and the precision of product output signal, improve the performance of product.

[accompanying drawing explanation]

Fig. 1 is the structural representation that a kind of MEMS of the utility model encapsulates the first embodiment;

Fig. 2 is the structural representation that a kind of MEMS of the utility model encapsulates the second embodiment.

[specific embodiment]

Below in conjunction with drawings and embodiments, the utility model is described in further detail.

As shown in Figure 1, in the first embodiment of the present utility model, this MEMS encapsulation 100 comprises substrate 101, be located on substrate 100 and the asic chip 102 being electrically connected to substrate 101 and at least two are located on substrate 101 and the MEMS pressure sensor 103 being electrically connected to asic chip 102.

Preferably, this MEMS encapsulation 100 also comprises for connecting the binding gold thread 104(bonding line of MEMS pressure sensor 103 and asic chip 102), MEMS pressure sensor 103 is electrically connected to asic chip 102 by binding gold thread 104.

MEMS pressure sensor 103 can also be electrically connected to asic chip 102 by other means, for example, when substrate 101 is pcb board, because pcb board is provided with wire, so MEMS pressure sensor 103 can be electrically connected to asic chip 102 by the wire on pcb board.

At least two MEMS pressure sensors and single asic chip are encapsulated based on substrate, be conducive to asic chip the signal of each MEMS pressure sensor output collecting is carried out to overlap-add procedure, the natural attenuation of realization to random error in product output signal and noise, therefore can effectively increase the whole intensity of input signal of asic chip and the precision of product output signal, improve the performance of product.

As shown in Figure 2, in the second embodiment of the present utility model, this MEMS encapsulation 100 still comprises substrate 101, be located on substrate 101 and the asic chip 102 being electrically connected to substrate 101 and at least two are located on substrate 101 and the MEMS pressure sensor 103 being electrically connected to asic chip 102.Different from a upper embodiment, in this embodiment, MEMS encapsulation 100 also comprises that at least one is located on substrate 101 and the MEMS microphone 105 being electrically connected to substrate 101.In Fig. 2, only illustrate a MEMS microphone 105, understandable, can also form array by a plurality of MEMS microphones 105.

In addition, this MEMS encapsulation 100 can also comprise that, for connecting the binding gold thread 106 of MEMS microphone 105 and asic chip 102, MEMS microphone 105 is electrically connected to asic chip 102 by this binding gold thread 106.Or when substrate 101 is pcb board, because pcb board is provided with wire, so MEMS microphone 105 can be electrically connected to asic chip 102 by the wire on pcb board.

Identical with a upper embodiment, MEMS pressure sensor 103 both can be electrically connected to asic chip 102 by binding gold thread 104, when substrate 101 is pcb board, also can be electrically connected to asic chip 102 by the wire on PCB.

Exist on the basis of a plurality of MEMS pressure sensors, MEMS pressure sensor and MEMS microphone are realized to signal by single asic chip to be processed, not only can realize the Natural Attenuation to random error in output signal and noise, also realized more compact structure, can under less package dimension, realize more perfect function, situation about encapsulating respectively with respect to MEMS pressure sensor and MEMS microphone, can further reduce production cost thereby can reduce encapsulating material.

In above-mentioned each preferred embodiment, asic chip 102 is all electrically connected to substrate 101 by binding gold thread, understandable, when substrate 101 is pcb board, also can be electrically connected to pcb board by the wire on PCB.

Above-described is only embodiment of the present utility model; at this, it should be pointed out that for the person of ordinary skill of the art, do not departing under the prerequisite of the utility model creation design; can also make improvement, but these all belong to protection domain of the present utility model.

Claims

1. MEMS encapsulation, is characterized in that, it comprises substrate, be located on described substrate and the asic chip being electrically connected to described substrate and at least two are located on described substrate and the MEMS pressure sensor being electrically connected to described asic chip.

2. MEMS according to claim 1 encapsulation, is characterized in that, this MEMS encapsulation also comprises that at least one is located on described substrate and the MEMS microphone being electrically connected to described asic chip.

3. MEMS encapsulation according to claim 2, is characterized in that, this MEMS encapsulation also comprises that described MEMS microphone is electrically connected to described asic chip by described binding gold thread for connecting the binding gold thread of described MEMS microphone and described asic chip.

4. MEMS encapsulation according to claim 2, is characterized in that, described substrate is pcb board, and described pcb board is provided with wire, and described MEMS microphone is electrically connected to described asic chip by the wire on described pcb board.

5. according to the MEMS encapsulation described in claim 1-4 any one, it is characterized in that, this MEMS encapsulation also comprises that described MEMS pressure sensor is electrically connected to described asic chip by described binding gold thread for connecting the binding gold thread of described MEMS pressure sensor and described asic chip.

6. according to the MEMS encapsulation described in claim 1-4 any one, it is characterized in that, described substrate is pcb board, and described pcb board is provided with wire, and described MEMS pressure sensor is electrically connected to described asic chip by the wire on described pcb board.