CN105101024A - Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure - Google Patents
Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure Download PDFInfo
- Publication number
- CN105101024A CN105101024A CN201410163452.1A CN201410163452A CN105101024A CN 105101024 A CN105101024 A CN 105101024A CN 201410163452 A CN201410163452 A CN 201410163452A CN 105101024 A CN105101024 A CN 105101024A
- Authority
- CN
- China
- Prior art keywords
- acoustics
- sensing cell
- microphone structure
- condenser microphone
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to the field of electronic technology, and especially to a microphone structure. A multi-diaphragm MEMS microphone structure comprises an acoustic cavity, the acoustic cavity is internally provided at least two acoustic sensing units, and multiple acoustic back cavities independent from each other are arranged between the acoustic sensing units. The microphone structure is provided with the at least two acoustic sensing units and the acoustic back cavities independent from each other, so that signals of the acoustic sensing units are not correlated; and the uncorrelated signals can be superposed to effectively eliminate noises and optimize the signal-to-noise ratio.
Description
Technical field
The present invention relates to electronic technology field, be specifically related to a kind of microphone structure.
Background technology
MEMS (Micro-Electro-MechanicalSystem, MEMS (micro electro mechanical system)) microphone refers to and utilizes manufacture of semiconductor or other micro-microtechnics, integrate the technology of the various function such as electronics, machinery in a micro element or device simultaneously, have that apparent size is little, kwh loss is low, for surrounding environment interference, there is the advantages such as better rejection ability, become the main flow of market development.The internal structure of traditional MEMS microphone package body as shown in Figure 1, printed circuit base board 1 is arranged single acoustics sensing element 2 and ASIC (ApplicationSpecificIC, application-specific integrated circuit (ASIC)) chip 3 and other circuit elements, but the microphone of this single acoustics sensing element will realize high s/n ratio has difficulties.
In order to improve the performance of microphone, a kind of microphone of double diaphragm is disclosed in prior art, Same Physical mechanism is arranged the first vibrating diaphragm and the second vibrating diaphragm, first vibrating diaphragm and the second vibrating diaphragm share acoustical back chamber, first vibrating diaphragm obtains high sound press (HighSoundPressureLevel) signal, second vibrating diaphragm is high s/n ratio (HighSoundtoNoiseRatio) vibrating diaphragm, be responsible for highly sensitive sound, combine after the first vibrating diaphragm is processed respectively with the voice signal of the second vibrating diaphragm, realize reducing background noise, obtain the sound quality improved.But, due to the elastic film that vibrating diaphragm is soft, in the course of the work, except producing except vibration when being subject to acoustic pressure effect, in acoustical back chamber, molecule constantly moves in atmosphere and also can clash into vibrating diaphragm, there is correlation due to the effect being subject to Brownian movement in two vibrating diaphragms of same substrate, cannot directly utilize the energy supposition principle of incoherent signal to offset noise, makes existing microphone structure there is restriction in raising signal-to-noise performance.
Summary of the invention
The object of the invention is to, a kind of many vibrating diaphragms MEMS condenser microphone structure is provided, solves above technical problem.
Technical problem solved by the invention can realize by the following technical solutions:
Many vibrating diaphragms MEMS condenser microphone structure, wherein, comprise an acoustics cavity, the inside of described acoustics cavity is provided with at least two acoustics sensing cells, acoustics sensing cell described in one and have independently incoherent acoustical back chamber described in another between acoustics sensing cell.
Preferably, described in each, acoustics sensing cell comprises a silicon substrate, and described silicon substrate arranges vibrating diaphragm, and the seal cavity that described vibrating diaphragm is formed in described acoustics cavity forms described acoustical back chamber.
Preferably, also comprise a signal processing circuit, described signal processing circuit comprises an add circuit, and described add circuit is connected with described acoustics sensing cell, for carrying out read group total to the signal of described acoustics sensing cell.
Preferably, described signal processing circuit comprises a bias voltage circuit, and for providing bias voltage, the output of described bias voltage circuit is connected with described acoustics sensing cell.
Preferably, described signal processing circuit comprises an amplifier circuit, and described amplifier circuit is connected with the output of described add circuit, for amplifying the signal of the described acoustics sensing cell after addition.
Preferably, described signal processing circuit also comprises a Circuit tuning, and described Circuit tuning is connected with described bias voltage circuit, for adjusting the size of described bias voltage, and/or described Circuit tuning is connected with described amplifier circuit, for adjusting the gain size of described amplifier circuit.
Preferably, acoustics sensing cell described in has identical sensitivity with acoustics sensing cell described in another.
Preferably, the top of described acoustics cavity or bottom or side arrange acoustics through hole.
Preferably, described acoustics cavity is encapsulated by a printed circuit board and a crown cap and forms, or described acoustics cavity is encapsulated by a printed circuit board, metal top cover and the side plate between described printed circuit board and metal top cover and forms.
Preferably, described acoustics sensing cell adopts the acoustics sensing cell that silica-base material is made.
Beneficial effect: owing to adopting above technical scheme, the present invention is by arranging at least two acoustics sensing cells, and there is independently incoherent acoustical back chamber, make the signal between acoustics sensing cell uncorrelated, by superposing incoherent signal, can stress release treatment effectively, optimize signal to noise ratio.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of prior art;
Fig. 2 is structural representation of the present invention;
Fig. 3 is circuit connection diagram of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
It should be noted that, when not conflicting, the embodiment in the present invention and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
With reference to Fig. 2, Fig. 3, many vibrating diaphragms MEMS condenser microphone structure, wherein, comprise an acoustics cavity 28, the inside of acoustics cavity 28 is provided with at least two acoustics sensing cells, with reference to Fig. 2, has independently incoherent acoustical back chamber between an acoustics sensing cell and another acoustics sensing cell.
As a kind of preferred embodiment of the present invention, also comprise a signal processing circuit 23, signal processing circuit 23 comprises an add circuit 24, and add circuit 24 is connected with acoustics sensing cell, for carrying out read group total to the signal of acoustics sensing cell.
As a kind of preferred embodiment of the present invention, each acoustics sensing cell comprises a silicon substrate 211, silicon substrate 211 is arranged vibrating diaphragm 212, and the seal cavity that vibrating diaphragm 212 is formed in acoustics cavity 28 forms acoustical back chamber 213.
Acoustics sensing cell is when sensing sound, vibrating diaphragm 212 is subject to acoustic pressure effect can extrude acoustical back chamber 213, reverse active force can be produced to vibrating diaphragm 212 after sealing air in acoustical back chamber 213 is compressed, known by Analytical Mechanics model, acoustical back chamber 213 volume is larger, sensitivity can be promoted, therefore in prior art, multiple vibrating diaphragm 212 can share same acoustical back chamber, but, as mentioned in the background art, sharing same acoustical back chamber can make the lifting of signal-to-noise performance there is restriction, acoustics cavity 28 of the present invention is by arranging at least two acoustics sensing cells, and there is independently incoherent acoustical back chamber, can by the signal to noise ratio realizing improving of carrying out suing for peace to the signal of multiple acoustics sensing element and noise.
As arranged two acoustics sensing cells, be acoustics sensing cell A and acoustics sensing cell B respectively, the acoustic signal of two acoustics sensing cells is relevant, and the output voltage of its total acoustic signal is V=V
a+ V
b, wherein V
afor the acoustic signal that acoustics sensing cell A catches, V
bfor the acoustic signal that acoustics sensing cell B catches, and the noise signal in acoustic signal is uncorrelated, total noise signal N
2=N
a 2+ N
b 2, wherein, N
afor the noise signal in the acoustic signal of acoustics sensing cell A, N
bfor the noise signal in the acoustic signal of acoustics sensing cell B, when two noise signal matched well, N
aequal N
bsignal to noise ratio is obtained by the ratio of the voltage N of the output voltage V with total noise signal that calculate total acoustic signal, to be easy to draw when two acoustics sensing cells are set that signal to noise ratio snr compares single acoustics sensing cell and to improve Sqrt (2) doubly, namely 3dB is approximated, be easy to calculate simultaneously, the signal to noise ratio of three acoustics sensing cells is adopted to promote 4.7dB, adopt the signal to noise ratio of three acoustics sensing cells to promote 6dB, the degree that signal to noise ratio is improved improves along with the increase of acoustics sensing element quantity.
As a kind of preferred embodiment of the present invention, signal processing circuit 23 can comprise a bias voltage circuit 25, and for providing bias voltage, the output of bias voltage circuit 25 is connected with acoustics sensing cell.
As a kind of preferred embodiment of the present invention, signal processing circuit 23 comprises an amplifier circuit 26, and amplifier circuit 26 is connected with the output of add circuit 24, for amplifying the signal of the acoustics sensing cell after addition.
As a kind of preferred embodiment of the present invention, signal processing circuit 23 also comprises a Circuit tuning 27, Circuit tuning 27 is connected with bias voltage circuit 25, for adjusting the size of bias voltage, and/or Circuit tuning 27 is connected with amplifier circuit 26, for adjusting the gain size of amplifier circuit 26.
Signal processing circuit 23 of the present invention can be positioned on a dedicated IC chip.
As a kind of preferred embodiment of the present invention, an acoustics sensing cell 21 has identical sensitivity with another acoustics sensing cell 22.An acoustics sensing cell 21 can be realized by Circuit tuning 27, with another acoustics sensing cell 22, there is identical sensitivity.
As a kind of preferred embodiment of the present invention, acoustics cavity 28 is encapsulated by a printed circuit board 30 and a crown cap 31 and forms, or acoustics cavity 28 is formed by the encapsulation of a printed circuit board, side plate and metal top cover.As a kind of preferred embodiment of the present invention, the top of acoustics cavity 28 or bottom or side arrange acoustics through hole 29.Acoustics through hole 29 can be positioned on printed circuit board or on crown cap or metal top cover or side plate, with the passage providing sound to enter acoustics cavity 28 inside.
In order to ensure the independence in acoustical back chamber, each acoustics sensing cell can arrange independent installation base plate, between each installation base plate and another installation base plate, buffer unit is set, to realize mechanical isolation, all acoustics sensing cells are connected on printed circuit board by corresponding jockey or buffer unit.
As a kind of preferred embodiment of the present invention, the acoustics sensing cell that acoustics sensing cell adopts silica-base material to make.
The foregoing is only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilizations specification of the present invention and diagramatic content and apparent change obtain in protection scope of the present invention.
Claims (10)
1. more than vibrating diaphragm MEMS condenser microphone structure, it is characterized in that, comprise an acoustics cavity, the inside of described acoustics cavity is provided with at least two acoustics sensing cells, acoustics sensing cell described in one and have independently incoherent acoustical back chamber described in another between acoustics sensing cell.
2. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, it is characterized in that, described in each, acoustics sensing cell comprises silicon substrate, and described silicon substrate arranges vibrating diaphragm, and the seal cavity that described vibrating diaphragm is formed in described acoustics cavity forms described acoustical back chamber.
3. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, it is characterized in that, also comprise a signal processing circuit, described signal processing circuit comprises an adder unit, described adder unit is connected with described acoustics sensing cell, for carrying out read group total to the signal of described acoustics sensing cell.
4. many vibrating diaphragms MEMS condenser microphone structure according to claim 3, it is characterized in that, described signal processing circuit comprises a bias voltage circuit, and for providing bias voltage, the output of described bias voltage circuit is connected with described acoustics sensing cell.
5. many vibrating diaphragms MEMS condenser microphone structure according to claim 4, it is characterized in that, described signal processing circuit comprises an amplifier circuit, and described amplifier circuit is connected with the output of described adder unit, for amplifying the signal of the described acoustics sensing cell after addition.
6. many vibrating diaphragms MEMS condenser microphone structure according to claim 5, it is characterized in that, described signal processing circuit also comprises a Circuit tuning, described Circuit tuning is connected with described bias voltage circuit, for adjusting the size of described bias voltage, and/or described Circuit tuning is connected with described amplifier circuit, for adjusting the gain size of described amplifier circuit.
7. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, is characterized in that, acoustics sensing cell described in has identical sensitivity with acoustics sensing cell described in another.
8. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, is characterized in that, the top of described acoustics cavity or bottom or side arrange acoustics through hole.
9. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, is characterized in that,
Described acoustics cavity is encapsulated by a printed circuit board and a crown cap and forms, or described acoustics cavity is encapsulated by a printed circuit board, metal top cover and the side plate between described printed circuit board and metal top cover and forms.
10. many vibrating diaphragms MEMS condenser microphone structure according to claim 1, is characterized in that, the acoustics sensing cell that described acoustics sensing cell adopts silica-base material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410163452.1A CN105101024A (en) | 2014-04-22 | 2014-04-22 | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410163452.1A CN105101024A (en) | 2014-04-22 | 2014-04-22 | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101024A true CN105101024A (en) | 2015-11-25 |
Family
ID=54580391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410163452.1A Pending CN105101024A (en) | 2014-04-22 | 2014-04-22 | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101024A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110441240A (en) * | 2018-05-04 | 2019-11-12 | 英飞凌科技股份有限公司 | Optoacoustic gas sensor and the method for operating optoacoustic gas sensor |
| WO2020000374A1 (en) * | 2018-06-29 | 2020-01-02 | 深圳市大疆创新科技有限公司 | Acoustic vibration detection device and racing remote control car |
| CN112055973A (en) * | 2018-04-26 | 2020-12-08 | 深圳市韶音科技有限公司 | Device and method for removing vibration of double-microphone earphone |
| WO2022110421A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Mems microphone and working control method therefor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187685A (en) * | 2008-10-14 | 2011-09-14 | 美商楼氏电子有限公司 | Microphone having multiple transducer elements |
| CN102595294A (en) * | 2012-03-06 | 2012-07-18 | 歌尔声学股份有限公司 | Micro-electro-mechanical-system (MEMS) microphone |
| CN102811411A (en) * | 2011-05-11 | 2012-12-05 | 英飞凌科技股份有限公司 | Microphone arrangement |
| WO2012175593A1 (en) * | 2011-06-24 | 2012-12-27 | Oce-Technologies B.V. | Inkjet print head |
| CN203883991U (en) * | 2014-04-22 | 2014-10-15 | 钰太芯微电子科技（上海）有限公司 | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure |
-
2014
- 2014-04-22 CN CN201410163452.1A patent/CN105101024A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187685A (en) * | 2008-10-14 | 2011-09-14 | 美商楼氏电子有限公司 | Microphone having multiple transducer elements |
| CN102811411A (en) * | 2011-05-11 | 2012-12-05 | 英飞凌科技股份有限公司 | Microphone arrangement |
| WO2012175593A1 (en) * | 2011-06-24 | 2012-12-27 | Oce-Technologies B.V. | Inkjet print head |
| CN102595294A (en) * | 2012-03-06 | 2012-07-18 | 歌尔声学股份有限公司 | Micro-electro-mechanical-system (MEMS) microphone |
| CN203883991U (en) * | 2014-04-22 | 2014-10-15 | 钰太芯微电子科技（上海）有限公司 | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055973A (en) * | 2018-04-26 | 2020-12-08 | 深圳市韶音科技有限公司 | Device and method for removing vibration of double-microphone earphone |
| CN110441240A (en) * | 2018-05-04 | 2019-11-12 | 英飞凌科技股份有限公司 | Optoacoustic gas sensor and the method for operating optoacoustic gas sensor |
| WO2020000374A1 (en) * | 2018-06-29 | 2020-01-02 | 深圳市大疆创新科技有限公司 | Acoustic vibration detection device and racing remote control car |
| WO2022110421A1 (en) * | 2020-11-30 | 2022-06-02 | 瑞声声学科技(深圳)有限公司 | Mems microphone and working control method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101686711B1 (en) | System and method for a mems transducer | |
| US20150181346A1 (en) | Directional mems microphone and receiver device | |
| US9264815B2 (en) | Silicon condenser microphone | |
| US20180041840A1 (en) | Differential-capacitance type mems microphone | |
| CN204652659U (en) | A kind of differential capacitance type MEMS microphone | |
| KR20130060932A (en) | Microphone | |
| CN102349311B (en) | Device comprising microphone and accelerometer, manufacturing method and using method | |
| CN110267183A (en) | System and method for sonic transducer and environmental sensor component | |
| US20110235841A1 (en) | Microphone unit | |
| US20120288130A1 (en) | Microphone Arrangement | |
| CN203883991U (en) | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure | |
| CN109413554B (en) | Directional MEMS microphone | |
| CN105101024A (en) | Multi-diaphragm MEMS (Micro-Electro-Mechanical System) microphone structure | |
| CN203840541U (en) | Directional MEMS (Micro Electro Mechanical Systems) microphone and sound receiving device | |
| US11895452B2 (en) | Bone conduction microphone | |
| CN209526835U (en) | A kind of encapsulating structure of microphone and environmental sensor | |
| WO2023160719A1 (en) | Vibration sensor, electronic device, and vibration detection method | |
| US9420365B2 (en) | Silicon condenser microphone | |
| CN211570110U (en) | MEMS chip and MEMS sensor | |
| CN215187378U (en) | Vibration sensor | |
| CN114786104A (en) | Microphone structure and voice communication equipment | |
| CN210183545U (en) | Combined sensor device | |
| US20160157024A1 (en) | Flip-chip mems microphone | |
| CN216600075U (en) | Reverse heart-shaped electret capacitor microphone | |
| CN201657309U (en) | Silicon microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |