CN104766831B - A kind of encapsulating structure of integrated sensor - Google Patents
A kind of encapsulating structure of integrated sensor Download PDFInfo
- Publication number
- CN104766831B CN104766831B CN201510181957.5A CN201510181957A CN104766831B CN 104766831 B CN104766831 B CN 104766831B CN 201510181957 A CN201510181957 A CN 201510181957A CN 104766831 B CN104766831 B CN 104766831B
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- sensor
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- encapsulation
- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000005538 encapsulation Methods 0.000 claims abstract description 40
- 238000009413 insulation Methods 0.000 abstract description 6
- 230000002452 interceptive effect Effects 0.000 abstract description 6
- 239000002184 metal Substances 0.000 description 3
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- ROXBGBWUWZTYLZ-UHFFFAOYSA-N [6-[[10-formyl-5,14-dihydroxy-13-methyl-17-(5-oxo-2h-furan-3-yl)-2,3,4,6,7,8,9,11,12,15,16,17-dodecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4-methoxy-2-methyloxan-3-yl] 4-[2-(4-azido-3-iodophenyl)ethylamino]-4-oxobutanoate Chemical compound O1C(C)C(OC(=O)CCC(=O)NCCC=2C=C(I)C(N=[N+]=[N-])=CC=2)C(OC)CC1OC(CC1(O)CCC2C3(O)CC4)CCC1(C=O)C2CCC3(C)C4C1=CC(=O)OC1 ROXBGBWUWZTYLZ-UHFFFAOYSA-N 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The present invention proposes a kind of encapsulating structure of integrated sensor, including：First substrate；The multiple sensors being arranged on the first substrate, each sensor include MEMS sensor chip and the asic chip electrically connected with the MEMS sensor chip；And at least one the first encapsulation cavity surrounded by the first shell and the first substrate, the first encapsulation inside cavity are provided with least one the second encapsulation cavity surrounded by second housing and the first substrate；Wherein, it is provided with least one sensor in each second package cavity body.The present invention is discrete by cavity, each sensor unit of integrated sensor is subjected to insulation package, or the sensitive sensor unit being easily interfered is subjected to insulation package, it is interfering with each other between each sensor unit of integrated sensor to mask, effectively improve the properties of product of integrated sensor.
Description
Technical field
The present invention relates to a kind of encapsulating structure of integrated sensor.
Background technology
Integrated sensor is a kind of sensor chip for being internally integrated multiple sensor units (such as by pressure sensor
The integrated sensor that unit and temperature sensor unit integrate), and a variety of sensing functions can be realized simultaneously as one
Independent chip is used.The encapsulation of integrated sensor is usually by the MEMS sensor core of its each sensor unit at present
Piece and asic chip are mounted on substrate, are finally encapsulated in a cavity and are integrated, such as shown in Fig. 1 and Fig. 2：Shell 2
It is covered on first substrate 1 and surrounds a big cavity, the two sensor lists of attachment on first substrate 1 is provided with cavity
Member.One of sensor unit includes MEMS sensor chip 3 and asic chip 5, is electrically connected between the two by lead 4,
AISC chips 5 are connected to first substrate 1 by lead.Another sensor unit includes MEMS sensor chip 8 and ASIC cores
Piece 7, is electrically connected again by lead between the two, and AISC chips 7 are connected to first substrate 1 by lead.Shell 2 is provided with sensing
Opening 6 needed for device unit sensing, the back side of first substrate 1 are provided with pad 9, and sensor unit passes through pad 9 and external circuit
Electrical connection.
This packaged type of existing integrated sensor is that all sensors unit of integrated sensor is encapsulated in into one
In cavity, easily cause electricity, magnetic, heat, light etc. between different sensors unit in this case and interfere, have a strong impact on integrated
The overall performance of sensor.
The content of the invention
In order to solve the above-mentioned technical problem, it is as far as possible mutually relevant between each sensor unit of reduction integrated sensor
Disturb, the present invention proposes the new technical scheme on integrated sensor encapsulation.
The invention provides a kind of encapsulating structure of integrated sensor, including：First substrate；It is arranged on the first substrate
On multiple sensors, each sensor includes MEMS sensor chip and electrically connected with the MEMS sensor chip
Asic chip；And at least one the first encapsulation cavity surrounded by the first shell and the first substrate, first envelope
Dress inside cavity is provided with least one the second encapsulation cavity surrounded by second housing and the first substrate；Wherein, each
At least one sensor is provided with the second package cavity body.
Preferably, at least one sensor is arranged at the inside of the first encapsulation cavity while positioned at described second
Encapsulate the outside of cavity.
Preferably, multiple sensors include sensitive sensor and non-sensitive sensor, each sensitive sensor
Isolate with other sensors.
Preferably, multiple sensors include pressure sensor, microphone and humidity sensor, the microphone
It is sensitive sensor with the humidity sensor, the pressure sensor is non-sensitive sensor.
Preferably, the microphone is separately set in the second encapsulation inside cavity, the humidity sensor list
Solely it is arranged at another the second encapsulation inside cavity.
Preferably, the pressure sensor is arranged at the inside of the first encapsulation cavity while positioned at each described second
Encapsulate the outside of cavity.
Preferably, first shell is substrate package or metal shell, the second housing be substrate package or
Metal shell.
Preferably, the sensor is directly arranged on the first substrate or the sensor is set by second substrate
It is placed on the first substrate.
Preferably, the MEMS sensor chip of at least one sensor and asic chip integrate.
Preferably, the asic chip of non-interfering sensor integrates or MEMS sensor integrated chip is one
Rise.
The present invention is discrete by cavity, and each sensor unit of integrated sensor is carried out into insulation package, or will
The sensitive sensor unit that is easily interfered carries out insulation package, with mask each sensor unit of integrated sensor it
Between it is interfering with each other, effectively improve the properties of product of integrated sensor.
Brief description of the drawings
The accompanying drawing of a part for constitution instruction describes embodiments of the invention, and is used to solve together with the description
Release the principle of the present invention.
Fig. 1,2 be existing integrated sensor encapsulating structure structural representation.
Fig. 3,4 be integrated sensor encapsulating structure first embodiment of the present invention structural representation.
Fig. 5 is the structural representation of integrated sensor encapsulating structure second embodiment of the present invention.
Fig. 6 is the structural representation of integrated sensor encapsulating structure 3rd embodiment of the present invention.
Fig. 7 is the structural representation of integrated sensor encapsulating structure fourth embodiment of the present invention.
Fig. 8 is the structural representation of the embodiment of integrated sensor encapsulating structure the 5th of the present invention.
Fig. 9 is the structural representation of integrated sensor encapsulating structure sixth embodiment of the present invention.
Figure 10 is the structural representation of the embodiment of integrated sensor encapsulating structure the 7th of the present invention.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that：Unless have in addition
Body illustrates that the unlimited system of part and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative to be never used as to the present invention below
And its application or any restrictions that use.
It may be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in appropriate situation
Under, the technology and equipment should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The first embodiment of integrated sensor encapsulating structure is shown with reference to figure 3 and Fig. 4, integrated sensor includes altogether two
Individual sensor unit, one of sensor unit include MEMS sensor chip 3 and asic chip 5, pass through one between the two
Lead 4 is electrically connected, and asic chip 5 is electrically connected by a lead with first substrate 1.Another sensor unit senses including MEMS
Device chip 8 and asic chip 7, are electrically connected again by a lead between the two, and asic chip 7 passes through a lead and first substrate
1 electrical connection.Two sensor units are mounted on first substrate 1, pass through the pad 9 and external circuit at the back side of first substrate 1
Electrical connection.
As can be seen that first embodiment is to surround the first encapsulation cavity by shell 2-1 and first substrate 1, in the first envelope
Dress inside cavity is provided with a second encapsulation cavity surrounded by shell 2-2 and first substrate 1.One sensor unit is set
In in the second package cavity body, the opening 6-2 needed for sensor unit sensing is offered at the top of the second encapsulation cavity.It is another
Individual sensor unit is arranged in the space between the first encapsulation cavity and the second encapsulation cavity, at the top of the first encapsulation cavity
Offer the opening 6-1 needed for sensor unit sensing.
It show the second embodiment of integrated sensor encapsulating structure with reference to figure 5, and the first embodiment shown in Fig. 3 is not
It is with part, second embodiment includes three sensor units, and the first package cavity is surrounded by shell 2-1 and first substrate 1
Body, the first encapsulation inside cavity is provided with two second encapsulation cavitys.Shell 2-2 and first substrate 1 surround second envelope
It behave affectedly body, is internally provided with first sensor unit, first sensor unit includes MEMS sensor chip 8 and ASIC
Chip 7, opening 6-2 is offered at the top of the second encapsulation cavity.Shell 2-3 and first substrate 1 surround another the second envelope
It behave affectedly body, is internally provided with second sensor unit, second sensor unit includes the He of MEMS sensor chip 11
Asic chip 10, opening 6-3 is offered at the top of the second encapsulation cavity.3rd sensor unit is arranged at the first encapsulation
In space between cavity and the second encapsulation cavity, first sensor unit includes MEMS sensor chip 3 and ASIC cores
Piece 5, opening 6-1 is offered at the top of the first encapsulation cavity.
Integrated sensor includes multiple sensor units, and some of which sensor unit is relatively more sensitive, i.e., more holds
The interference for the other sensor units being vulnerable in integrated sensor, easily it will be passed here by other sensor unit interference
Sensor cell is referred to as " sensitive sensor ", and the sensor unit outside sensitive sensor is referred to as " non-sensitive sensor ".Ginseng
The 3rd embodiment that Fig. 6 show integrated sensor encapsulating structure, including three sensor units are examined, including a sensitivity
Sensor and two non-sensitive sensors, sensitive sensor unit include MEMS sensor chip 3 and asic chip 5, and one non-
Sensitive sensor unit includes MEMS sensor chip 8 and asic chip 7, and another non-sensitive sensor unit passes including MEMS
Sensor chip 11 and asic chip 10.Two non-sensitive sensors are arranged in the second package cavity body jointly, by sensitive sensor
Device is arranged in the space between the first encapsulation cavity and the second encapsulation cavity, is so achieved that sensitive sensor and other biographies
The isolation of sensor.Sensitive sensor can certainly be individually arranged in the second package cavity body, also can as Fig. 5
Realization is isolated with other sensors.
The present invention makes each sensitive sensor isolate with other sensors, such as includes pressure sensor, wheat at one
In the integrated sensor of gram wind and humidity sensor, pressure sensor, which can discharge electromagnetic signal and heat energy, turns into interference source, wheat
The electromagnetic signal that gram wind is easy to be discharged by pressure sensor is disturbed, and humidity sensor is easy to be discharged by pressure sensor
The heat energy gone out is disturbed, so pressure sensor is non-sensitive sensor, microphone and humidity sensor are sensitive sensor, institute
Microphone is provided separately within by one second encapsulation inside cavity with the present invention, by humidity sensor be provided separately within another the
Two encapsulation inside cavities, pressure sensor is arranged at the inside of the first encapsulation cavity while positioned at each second encapsulation cavity
Outside, can thus avoid microphone and humidity sensor is under pressure the interference of sensor.On basis disclosed by the invention
On, those skilled in the art can determine sensitive sensor and non-sensitive sensor according to practical application product and environment, these
It should also be as belonging in protection scope of the present invention.
It show the fourth embodiment of integrated sensor encapsulating structure with reference to figure 7, and the first embodiment shown in Fig. 3 is not
It is with part, the sensor unit on the right is not to be directly arranged on first substrate 1 but set indirectly by second substrate 15
It is placed on first substrate 1, the sensor unit is mounted on second substrate 15, passes through pad 9 and the outside at the back side of first substrate 1
Circuit electrically connects.In assembling, the course of work in the sensor unit, external stress is transferred to first substrate 1 and then by second
The buffering of substrate 15 is laid down, and is protected the sensor unit, is made the sensor unit performance more stable.Especially for pressure sensor
Unit, structure design of the second substrate 15 as buffer part, avoids external stress and pressure sensor is had an impact and caused
Pressure sensor data error, improve the sensitivity of pressure sensor unit.
In above-described embodiment, each chip needs individually attachment and electrical connection, and the more efficiency of process are low, and bad hidden danger increases severely,
And need to reserve assembling safe space between each chip, waste product overall space.In order to preferably realize cavity
It is discrete, sensor unit can also be carried out Integrated design by the present invention, to reduce space waste, excellent province's manufacturing procedure, lifting
Packaging efficiency and product yield.The invention provides following three kinds of integration modes：
The 5th embodiment of integrated sensor encapsulating structure is shown with reference to figure 8, as the second embodiment shown in Fig. 5
Including three sensor units, difference is, positioned at the MEMS sensor chip and ASIC of the sensor unit 21 of centre
Integrated chip is together.
It show the sixth embodiment of integrated sensor encapsulating structure with reference to figure 9, and the 3rd embodiment shown in Fig. 6 is not
It is with part, two non-interfering sensor units share an asic chip, specifically the He of MEMS sensor chip 8
MEMS sensor chip 11 shares an asic chip 10.
It show the 7th embodiment of integrated sensor encapsulating structure with reference to figure 10, and the 3rd embodiment shown in Fig. 6
Difference is that two non-interfering sensor units share a MEMS sensor chip, specifically asic chip 7
A MEMS sensor chip 8 is shared with asic chip 10.
In above-described embodiment, shell uses metal shell, naturally it is also possible to the substrate package being made up of substrate is used, these
It should all belong in protection scope of the present invention.
The packaged type of a large cavity is shared relative to existing integrated sensor, the present invention is discrete by cavity, will
Each sensor unit of integrated sensor carries out insulation package, or the sensitive sensor unit being easily interfered is entered
Row insulation package, it is interfering with each other between each sensor unit of integrated sensor to mask, effectively improve integrated biography
The properties of product of sensor.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel it should be understood that above example merely to illustrating, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (6)
- A kind of 1. encapsulating structure of integrated sensor, it is characterised in that including：First substrate；The multiple sensors being arranged on the first substrate, each sensor include MEMS sensor chip and with institute State the asic chip of MEMS sensor chip electrical connection；AndAt least one the first encapsulation cavity surrounded by the first shell and the first substrate, the first encapsulation inside cavity are set It is equipped with least one the second encapsulation cavity surrounded by second housing and the first substrate；Wherein, each second encapsulation At least one sensor is provided with cavity；At least one sensor is arranged at the inside of the first encapsulation cavity while positioned at the described second encapsulation cavity It is outside；Multiple sensors include sensitive sensor and non-sensitive sensor, each sensitive sensor with other sensings Device is isolated.
- 2. structure according to claim 1, it is characterised in that multiple sensors include pressure sensor, microphone, And humidity sensor, the microphone and the humidity sensor are sensitive sensor, and the pressure sensor is non-sensitive Sensor.
- 3. structure according to claim 2, it is characterised in that the microphone is separately set in second encapsulation Inside cavity, the humidity sensor are separately set in another the second encapsulation inside cavity.
- 4. structure according to claim 3, it is characterised in that the pressure sensor is arranged at the first encapsulation cavity Inside simultaneously positioned at it is each it is described second encapsulation cavity outside.
- 5. according to the structure described in claim any one of 1-3, it is characterised in that the sensor is directly arranged at described first On substrate or the sensor is arranged on the first substrate by second substrate.
- 6. according to the structure described in claim any one of 1-3, it is characterised in that the MEMS sensings of at least one sensor Device chip and asic chip integrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510181957.5A CN104766831B (en) | 2015-04-16 | 2015-04-16 | A kind of encapsulating structure of integrated sensor |
| PCT/CN2015/096910 WO2016165360A1 (en) | 2015-04-16 | 2015-12-10 | Encapsulation structure for integrated sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510181957.5A CN104766831B (en) | 2015-04-16 | 2015-04-16 | A kind of encapsulating structure of integrated sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104766831A CN104766831A (en) | 2015-07-08 |
| CN104766831B true CN104766831B (en) | 2018-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510181957.5A Active CN104766831B (en) | 2015-04-16 | 2015-04-16 | A kind of encapsulating structure of integrated sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104766831B (en) |
| WO (1) | WO2016165360A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766831B (en) * | 2015-04-16 | 2018-03-23 | 歌尔股份有限公司 | A kind of encapsulating structure of integrated sensor |
| CN105652654A (en) * | 2016-03-26 | 2016-06-08 | 林捷达 | Smart watch with magnetic field intensity detection function |
| CN105676621A (en) * | 2016-03-26 | 2016-06-15 | 林捷达 | Intelligent watch with illumination detection |
| CN105629713A (en) * | 2016-03-26 | 2016-06-01 | 林捷达 | Smart watch with humidity detection function |
| WO2017205533A1 (en) * | 2016-05-26 | 2017-11-30 | Knowles Electronics, Llc | Microphone device with integrated pressure sensor |
| CN108726469A (en) * | 2018-08-17 | 2018-11-02 | 宁波琻捷电子科技有限公司 | Sensor-packaging structure and method |
| CN112701211B (en) * | 2020-12-29 | 2023-04-28 | 上海烨映微电子科技股份有限公司 | Infrared thermopile packaging structure and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016165360A1 (en) | 2016-10-20 |
| CN104766831A (en) | 2015-07-08 |
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