CN112701211B - Infrared thermopile packaging structure and method - Google Patents
Infrared thermopile packaging structure and method Download PDFInfo
- Publication number
- CN112701211B CN112701211B CN202011588262.6A CN202011588262A CN112701211B CN 112701211 B CN112701211 B CN 112701211B CN 202011588262 A CN202011588262 A CN 202011588262A CN 112701211 B CN112701211 B CN 112701211B
- Authority
- CN
- China
- Prior art keywords
- thermopile
- electromagnetic wave
- cover plate
- reference unit
- sensing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention provides an infrared thermopile packaging structure and a method, wherein the packaging structure comprises the following components: a tube seat; the thermopile reference unit and the thermopile sensing unit are arranged on the tube seat; and the cover plate is connected with and covers the thermopile reference unit to shield electromagnetic wave signals. According to the invention, the cover plate with the electromagnetic wave signal shielding function is arranged on the thermopile reference unit, so that the interference of external electromagnetic wave signals on the thermopile reference unit is eliminated, and the temperature detection precision is improved. In addition, the cover plate is directly connected with and covers the thermopile reference unit through the packaging technology, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an infrared thermopile packaging structure and method.
Background
With the increasing application of isothermal measurement in body temperature detection, temperature detection devices such as frontal thermometer, ear thermometer, fire alarm, heat flow detector, motion sensor, robot sensor and low resolution thermal imager have become the focus of research and development in the industry. In the above-mentioned devices, thermopiles are an indispensable core element for converting the temperature difference existing between the cold and hot ends of a semiconductor or metal material into an electrical signal based on the seebeck effect, thereby precisely measuring the temperature difference change of the environment.
At present, in a common temperature detection device, a thermopile sensing unit for detecting a temperature difference change receives electromagnetic wave signals such as infrared rays of a detection object from an opening position of a packaging structure, and converts a temperature difference formed by the received signals into an electric signal. In addition, a thermopile reference unit is provided in the package structure in addition to the thermopile-sensitive unit. This is because the thermopile is in an environment with a temperature, and its fluctuation will interfere with the output signal, affecting the measurement accuracy. Therefore, the above-described interference can be eliminated by additionally providing the thermopile reference unit which does not receive the detection object electromagnetic wave signal.
However, the existing thermopile packaging structure is difficult to completely shield the influence of external electromagnetic wave signals on the thermopile reference unit, which causes that the thermopile reference unit is also interfered by the electromagnetic wave signals of the detection object, and the influence of the environmental temperature of the thermopile cannot be accurately eliminated, so that the accuracy of the temperature detection result is reduced. In addition, a case structure such as a cap for shielding electromagnetic wave signals is also difficult to integrate with wafer level packaging, resulting in difficulty in improving packaging efficiency.
Therefore, it is necessary to provide a new infrared thermopile packaging structure and method, which solve the above-mentioned problems.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide an infrared thermopile packaging structure and method for solving the problem that the packaging structure in the prior art is difficult to shield electromagnetic wave signals from influencing a thermopile reference unit.
To achieve the above and other related objects, the present invention provides an infrared thermopile package, comprising:
a tube seat;
the thermopile reference unit and the thermopile sensing unit are arranged on the tube seat;
and the cover plate is connected with and covers the thermopile reference unit to shield electromagnetic wave signals.
As an alternative of the present invention, the infrared thermopile package structure further includes: the pipe cap is arranged on the pipe seat and covers the cover plate, the thermopile reference unit and the thermopile sensing unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives electromagnetic wave signals through the first opening.
As an alternative of the present invention, the infrared thermopile package structure further includes: the optical filter is arranged at the first opening and is used for filtering out part of frequency bands in the electromagnetic wave signals.
As an alternative of the present invention, the cover plate includes a top plate and a side wall supporting the top plate, and the top plate and the side wall form a first cavity above the thermopile reference unit.
As an alternative of the present invention, an electromagnetic wave blocking layer is provided on the top plate.
As an alternative of the present invention, the cover plate is formed of at least one of a silicon material, a glass material, or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
As an alternative of the present invention, the thermopile reference unit and the thermopile sensing unit are integrated on the same substrate.
As an alternative of the present invention, the cover plate further covers the thermopile sensing unit, and the top plate and the side wall further form a second cavity above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensing unit receives electromagnetic wave signals through the second opening.
As an alternative of the present invention, the cover plate is made of an electromagnetic wave shielding material.
The invention also provides an infrared thermopile packaging method, which is characterized by comprising the following steps of:
providing a tube seat;
a thermopile reference unit and a thermopile sensing unit are arranged on the tube seat;
and a cover plate is connected to the thermopile reference unit, and covers the thermopile reference unit to shield electromagnetic wave signals.
As an alternative of the present invention, the method of connecting the cover plate and the thermopile reference unit includes a chip mounting process, a metal sealing process, or a wafer level bonding process.
As an alternative of the present invention, after the cover plate is connected to the thermopile reference unit, a step of providing a cap on the stem is further included; the pipe cap covers the cover plate, the thermopile reference unit and the thermopile sensing unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives electromagnetic wave signals through the first opening.
As an alternative of the present invention, an optical filter is further disposed at the first opening of the cap, and is configured to filter a part of the frequency band in the electromagnetic wave signal.
As an alternative of the present invention, the cover plate includes a top plate and a side wall supporting the top plate, and the top plate and the side wall form a first cavity above the thermopile reference unit.
As an alternative of the present invention, an electromagnetic wave blocking layer is provided on the top plate.
As an alternative of the present invention, the cover plate is formed of at least one of a silicon material, a glass material, or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
As an alternative of the present invention, the thermopile reference unit and the thermopile sensing unit are integrated on the same substrate.
As an alternative of the present invention, the cover plate further covers the thermopile sensing unit, and the top plate and the side wall further form a second cavity above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensing unit receives electromagnetic wave signals through the second opening.
As an alternative of the present invention, the cover plate is composed of an electromagnetic wave blocking material.
As described above, the invention provides an infrared thermopile packaging structure and method, which eliminates the interference of external electromagnetic wave signals on a thermopile reference unit and improves the temperature detection precision by arranging the cover plate with the function of shielding the electromagnetic wave signals on the thermopile reference unit. In addition, the cover plate is directly connected with and covers the thermopile reference unit through the packaging technology, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
Drawings
FIG. 1 is a schematic cross-sectional view of an infrared thermopile package of the prior art.
Fig. 2 is a schematic cross-sectional view of an infrared thermopile package according to a first embodiment of the present invention.
Fig. 3 is a flowchart of an infrared thermopile packaging method according to a first embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of an infrared thermopile package according to a second embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of an infrared thermopile package according to a third embodiment of the present invention.
Description of element reference numerals
101. Tube seat
102. Thermopile reference unit
102a first thermopile
102b first substrate
103. Thermopile sensing unit
103a second thermopile
103b second substrate
104. Pipe cap
104a opening
105. Filter plate
201. Tube seat
202. Thermopile reference unit
202a first thermopile
202b first substrate
203. Thermopile sensing unit
203a second thermopile
203b second substrate
204. Pipe cap
204a first opening
205. Filter plate
206. Cover plate
206a first cavity
207. Electromagnetic wave blocking layer
301. Tube seat
302. Thermopile reference unit
302a first thermopile
302b first substrate
303. Thermopile sensing unit
303a second thermopile
303b second substrate
304. Pipe cap
304a first opening
305. Filter plate
306. Cover plate
306a first cavity
307. Electromagnetic wave blocking layer
401. Tube seat
402. Thermopile reference unit
402a first thermopile
402b first substrate
403. Thermopile sensing unit
403a second thermopile
403b second substrate
404. Pipe cap
404a first opening
405. Filter plate
406. Cover plate
406a first cavity
406b second cavity
406c second opening
407. Electromagnetic wave blocking layer
S1-S3 Steps 1) -3)
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 1 to 5. It should be noted that, the illustrations provided in the present embodiment are merely schematic illustrations of the basic concepts of the present invention, and only the components related to the present invention are shown in the illustrations, rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1, a schematic diagram of a conventional infrared thermopile package structure is shown.
A thermopile reference unit 102 and a thermopile sensing unit 103 are provided on the stem 101. The thermopile reference unit 102 comprises a first thermopile 102a and a first substrate 102b carrying the first thermopile 102 a; the thermopile-sensitive unit 103 comprises a second thermopile 103a and a second substrate 103b carrying the second thermopile 103 a.
The pipe seat 101 is further provided with a pipe cap 104, and the pipe cap 104 covers the thermopile reference unit 102 and the thermopile sensing unit 103 below, and the constituent materials of the pipe cap 104 may be electromagnetic wave shielding materials such as metal or resin containing conductive particles so as to shield electromagnetic wave signals such as external infrared rays. The cap 104 also serves to protect other underlying packaging structures. An opening 104a is provided in the pipe cap 104 above the thermopile sensor unit 103, and electromagnetic wave signals such as infrared rays incident from the outside can be received by the thermopile sensor unit 103 through the opening 104 a. A filter 105 is further disposed at the opening 104a, and is used for filtering out unwanted wave bands in the electromagnetic wave signals, so as to ensure that the thermopile sensing unit 103 only receives electromagnetic wave signals in specific wave bands, and improve detection accuracy.
The arrows in fig. 1 illustrate the propagation of electromagnetic wave signals outside of the cap 104 in the vertical direction. In the above-described package structure design, the opening 104a is disposed above the thermopile-sensing unit 103 so as to allow only the thermopile-sensing unit 103 to receive electromagnetic wave signals vertically incident thereto, while the thermopile reference unit 102 having a certain distance therefrom is designed to not receive electromagnetic wave signals. However, due to the influence of the fluctuation of the incident angle of the electromagnetic wave, or the effects of reflection, diffraction, etc., as shown in fig. 1, the electromagnetic wave signal still having a part of deviation from the set incident route on the left side will be received by the thermopile reference unit 102, which will seriously interfere with the normal functioning of the thermopile reference unit 102, making it impossible to accurately eliminate the influence of the thermopile ambient temperature, thereby causing the accuracy of the temperature detection result to be lowered.
Example 1
Referring to fig. 2, the present embodiment provides an infrared thermopile package structure, which is characterized by comprising:
a stem 201;
a thermopile reference unit 202 and a thermopile sensing unit 203 provided on the stem 201;
a cover plate 206 connected to and covering the thermopile reference unit 202 to shield electromagnetic wave signals.
As shown in fig. 2, a thermopile reference unit 202 and a thermopile sensing unit 203 are provided on a stem 201. The thermopile reference unit 202 comprises a first thermopile 202a and a first substrate 202b carrying the first thermopile 202 a; the thermopile-sensitive unit 203 comprises a second thermopile 203a and a second substrate 203b carrying the second thermopile 203 a. The cover plate 206 is connected to and covers the thermopile reference unit 202 to shield electromagnetic wave signals.
The cover plate 206 is connected to the first substrate 202b, and isolates and shields the first thermopile 202a from external electromagnetic wave signals. Optionally, the cover 206 is connected to the first substrate 202b by a packaging process such as a bonding process, a metal sealing process, or a wafer level bonding process. The first cavity 206a below the cover plate 206 can be completely isolated and sealed from the outside through the packaging process, which can perform better electromagnetic wave signal shielding effect.
As an example, as shown in fig. 2, the infrared thermopile package structure further includes: a cap 204 provided on the stem 201 and covering the cover plate 206, the thermopile reference unit 202, and the thermopile sensing unit 203. The cap 204 is provided with a first opening 204a, and the thermopile-sensitive unit 203 receives an electromagnetic wave signal through the first opening 204 a. In fig. 2, arrows represent the propagation directions of the external electromagnetic wave signals. Due to the shielding protection of the cover plate 206, even if a part of electromagnetic wave signals irradiates the position of the thermopile reference unit 202 from the first opening 204a, the thermopile reference unit 202 is not affected by the electromagnetic wave signals, so that the reference function can be normally exerted, and the detection accuracy of the thermopile sensing unit 203 is improved.
Optionally, a filter 205 is further disposed at the first opening 204a, and is configured to filter a part of the frequency band of the electromagnetic wave signal. It should be noted that, in other embodiments of the present invention, if the protection effect of the cap 204 on the package structure is not considered, the cap 204 may not be formed, and the cover 206 may only play a role of shielding electromagnetic wave signals.
As an example, as shown in fig. 2, the cover plate 206 includes a top plate and a side wall supporting the top plate, the top plate and the side wall constituting a first cavity 206a located above the thermopile reference unit. Optionally, the first cavity 206a may house the first thermopile 202a and shield the first thermopile 202a from external electromagnetic wave signals. In fig. 2, the top plate, i.e., the portion of the top of the cover plate 206 extending in the horizontal direction, and the side walls are portions extending in the vertical direction, supporting the top plate, and connecting the stem 201 below. Optionally, an electromagnetic wave blocking layer 207 is also provided on the top plate. The electromagnetic wave blocking layer 207 may be formed of an electromagnetic wave shielding material such as metal or resin containing conductive particles to enhance the ability of the cover plate 206 to shield electromagnetic waves.
As an example, as shown in fig. 2, the cover plate 206 is formed of at least one of a silicon material, a glass material, or a ceramic material, and the first cavity 206a is formed by dry etching or wet etching the cover plate 206. Specifically, the processing of the cover plate 206 may be completed by a MEMS process, which is well-developed for processing the cavity structure on the silicon wafer substrate, and the processed wafer including the cavity structure also has the potential of wafer-level bonding with the thermopile, which greatly improves the packaging efficiency. Alternatively, when the cover plate 206 is formed of a silicon material, the dry etching includes a DRIE deep silicon etching process commonly used in MEMS processes, which has the process capability of anisotropically etching a bulk silicon material, and also facilitates formation of a structural feature having a high aspect ratio.
As an example, as shown in fig. 2, the cover plate 206 is made of an electromagnetic wave shielding material. Alternatively, the electromagnetic wave shielding material includes a metal or a resin containing conductive particles, or the like. The cover plate 206 is directly formed of an electromagnetic wave shielding material, and the cover plate 206 itself is sufficient to achieve the effect of shielding electromagnetic wave signals even if the electromagnetic wave blocking layer 207 is not formed thereon. In other embodiments of the present invention, the electromagnetic wave blocking layer 207 may not be formed when the cover plate 206 is made of an electromagnetic wave shielding material. The electromagnetic wave blocking layer 207 may be formed before etching the first cavity 206a, or may be formed after etching the first cavity 206a.
As can be seen from fig. 2, electromagnetic wave signals such as infrared rays incident from the first opening 204a pass through the optical filter 205 and are received by the thermopile-sensing unit 203, while the thermopile reference unit 202 is shielded from electromagnetic waves by the cover 206, and does not interfere with the first thermopile 202 a. The thermopile reference unit 202 will serve as a reference comparison signal, making the thermopile sensing unit 203 more accurate for temperature measurement of the received electromagnetic wave signal.
Referring to fig. 2 and 3, the present embodiment further provides an infrared thermopile packaging method, which is characterized by comprising the following steps:
1) Providing a tube seat 201;
2) A thermopile reference unit 202 and a thermopile sensing unit 203 are provided on the stem 201;
3) A cover plate 206 is connected to the thermopile reference unit 202, and the cover plate 206 covers the thermopile reference unit 202 to shield electromagnetic wave signals.
In step 1), referring to step S1 of fig. 3 and fig. 2, a stem 201 is provided.
In step 2), referring to step S2 of fig. 3 and fig. 2, a thermopile reference unit 202 and a thermopile sensing unit 203 are disposed on the stem 201. Optionally, the thermopile reference unit 202 comprises a first thermopile 202a and a first substrate 202b carrying the first thermopile 202 a; the thermopile-sensitive unit 203 comprises a second thermopile 203a and a second substrate 203b carrying the second thermopile 203 a.
In step 3), referring to step S3 of fig. 3 and fig. 2, a cover plate 206 is connected to the thermopile reference unit 202, and the cover plate 206 covers the thermopile reference unit 202 to shield electromagnetic wave signals. Optionally, the method of connecting the cover plate 206 and the thermopile reference unit 202 includes a chip packaging process, a metal seal soldering process, or a wafer level bonding process. The first cavity 206a below the cover plate 206 may be completely closed by the above-mentioned encapsulation process, which may perform a better electromagnetic wave signal shielding function. The method for packaging the infrared thermopile provided by the embodiment can be used for preparing the infrared thermopile packaging structure shown in fig. 2 of the embodiment.
As an example, as shown in fig. 2, after the cover plate 206 is connected to the thermopile reference unit 202, a step of disposing a cap 204 on the stem 201 is further included. The cap 204 covers the cover plate 206, the thermopile reference unit 202 and the thermopile sensing unit 203; the cap 204 is provided with a first opening 204a, and the thermopile-sensitive unit 203 receives an electromagnetic wave signal through the first opening 204 a. Optionally, an optical filter 205 is further disposed at the first opening 204a of the cap 204, for filtering out a part of the frequency band of the electromagnetic wave signal.
As an example, as shown in fig. 2, the cover plate 206 includes a top plate and a side wall supporting the top plate, the top plate and the side wall constituting a first cavity 206a located above the thermopile reference unit 202. An electromagnetic wave blocking layer 207 is also provided on the top plate. The cover plate 206 may be formed of a silicon material, and the first cavity 206a is formed by dry etching or wet etching the silicon material.
Example two
Referring to fig. 4, the present embodiment provides an infrared thermopile package structure and method, which are different from the first embodiment in that: the thermopile reference unit 302 and the thermopile sensing unit 303 are integrated on the same substrate.
As shown in fig. 4, a thermopile reference unit 302 and a thermopile sensing unit 303 are provided on a stem 301. The thermopile reference unit 302 comprises a first thermopile 302a and a first substrate 302b carrying the first thermopile 302 a; the thermopile-sensitive unit 303 comprises a second thermopile 303a and a second substrate 303b carrying the second thermopile 303 a. The cover 306 is connected to and covers the thermopile reference unit 302 to shield electromagnetic wave signals.
It should be noted that in the present embodiment, the first substrate 302b and the second substrate 303b are integrated, and there is only a conceptual boundary line indicated by a dotted line in fig. 4 between them, that is, the thermopile reference unit 302 and the thermopile sensing unit 303 are integrated on the same substrate. Alternatively, the thermopile reference unit 302 and the thermopile sensing unit 303 may be fabricated in a wafer level packaging process, and the first thermopile 302a and the second thermopile 303a are packaged on the same wafer substrate and integrated on the same substrate after dicing.
The other structures of the infrared thermopile package structure provided in this embodiment are the same as those of the first embodiment. Specifically, the infrared thermopile packaging structure further comprises: a cap 304 provided on the stem 301; a filter 305 is further disposed at the first opening 304 a; the cover plate 306 includes a top plate and a side wall supporting the top plate, the top plate and the side wall form a first cavity 306a located above the thermopile reference unit, and an electromagnetic wave blocking layer 307 is further disposed on the top plate.
The packaging method for forming the above-mentioned packaging structure may be referred to as implementing the above-mentioned method, and only the difference is that the same substrate is disposed on the stem 301 when the thermopile reference unit 302 and the thermopile sensor unit 303 are disposed.
The infrared thermopile packaging structure provided in this embodiment integrates the thermopile reference unit 302 and the thermopile sensing unit 303 on the same substrate. This helps to improve the packaging efficiency of the package structure by advanced packaging processes such as wafer level packaging. Also, since the cover 306 is introduced, the electromagnetic wave shielding capability is enhanced, and the thermopile reference unit 302 and the thermopile sensing unit 303 can be integrated on the same substrate under adjacent layout conditions. This is not possible in the prior art by electromagnetic wave shielding through the cap alone. In particular, in fig. 1, the thermopile reference unit 102 and the thermopile-sensitive unit 103 must be spaced apart by a sufficient distance to ensure that electromagnetic wave signals incident at the opening 104a do not interfere with the thermopile reference unit 102.
Example III
Referring to fig. 5, the present embodiment provides an infrared thermopile package structure and method, which are different from the first embodiment in that: the thermopile reference unit 402 and the thermopile sensing unit 403 are integrated on the same substrate, and the cover 406 also covers the thermopile sensing unit 403. The top plate and the side wall also form a second cavity 406b positioned above the thermopile sensing unit, and the second cavity 406b and the first cavity 406a are isolated from each other by the side wall. A second opening 406c is provided in the top plate above the second cavity 406b, and the thermopile-sensing unit receives electromagnetic wave signals through the second opening 406 c.
As shown in fig. 5, a thermopile reference unit 402 and a thermopile sensing unit 403 are provided on the stem 401. The thermopile reference unit 402 comprises a first thermopile 402a and a first substrate 402b carrying the first thermopile 402 a; the thermopile-sensitive unit 403 comprises a second thermopile 403a and a second substrate 403b carrying the second thermopile 403 a. The cover 406 is connected to and covers the thermopile reference unit 402 to shield electromagnetic wave signals. The cover plate 406 extends further above the thermopile sensing unit 403.
It should be noted that in the present embodiment, the first substrate 402b and the second substrate 403b are integrated, and there is only a conceptual boundary line indicated by a dotted line in fig. 5 between each other, that is, the thermopile reference unit 402 and the thermopile sensing unit 403 are integrated on the same substrate. Alternatively, the cover 406, the thermopile reference unit 402 and the thermopile sensing unit 403 may be fabricated by a wafer level packaging process, where the first thermopile 402a and the second thermopile 403a are packaged on the same wafer substrate and bonded to another wafer substrate forming the cover 406, and formed into an integrated integral structure after dicing, and integrally placed on the stem 401 during a subsequent packaging process.
The other structures of the infrared thermopile package structure provided in this embodiment are the same as those of the first embodiment. Specifically, the infrared thermopile packaging structure further comprises: a cap 404 provided on the stem 401; a filter 405 is further disposed at the first opening 404 a; the cover plate 406 includes a top plate and a side wall supporting the top plate, the top plate and the side wall form a first cavity 406a located above the thermopile reference unit, and an electromagnetic wave blocking layer 407 is further disposed on the top plate.
The packaging method for forming the above-mentioned packaging structure can be referred to the implementation, which is different in that the same substrate is disposed on the stem 401 when the thermopile reference unit 402 and the thermopile sensing unit 403 are disposed; and when the cover 406 is provided, the cover 406 also covers the thermopile sensing unit 403.
The infrared thermopile packaging structure provided in this embodiment integrates the thermopile reference unit 402 and the thermopile sensing unit 403 on the same substrate, and the cover plate 406 covers not only the thermopile reference unit 402 but also the thermopile sensing unit 403, so that the thermopile sensing unit 403 can receive electromagnetic wave signals through the second opening 406 c. The connection between the cover 406 and the lower integrated substrate may be achieved by a wafer level packaging process, and after dicing, the wafer may be a monolithic structure that may be directly disposed on the header 401. This helps to improve the packaging efficiency of the package structure by advanced packaging processes such as wafer level packaging.
In summary, the present invention provides an infrared thermopile packaging structure and method, the packaging structure includes: a tube seat; the thermopile reference unit and the thermopile sensing unit are arranged on the tube seat; and the cover plate is connected with and covers the thermopile reference unit to shield electromagnetic wave signals. According to the invention, the cover plate with the electromagnetic wave signal shielding function is arranged on the thermopile reference unit, so that the interference of external electromagnetic wave signals on the thermopile reference unit is eliminated, and the temperature detection precision is improved. In addition, the cover plate is directly connected with and covers the thermopile reference unit through the packaging technology, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (15)
1. An infrared thermopile package, comprising:
a tube seat;
the thermopile reference unit and the thermopile sensing unit are arranged on the tube seat;
the cover plate is connected with and covers the thermopile reference unit to shield electromagnetic wave signals, and comprises a top plate positioned above the thermopile reference unit and a side wall for supporting the top plate, wherein the top plate and the side wall form a first cavity positioned above the thermopile reference unit;
the pipe cap is arranged on the pipe seat and covers the cover plate, the thermopile reference unit and the thermopile sensing unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives electromagnetic wave signals through the first opening.
2. The infrared thermopile packaging structure of claim 1, wherein: further comprises:
the optical filter is arranged at the first opening and is used for filtering out part of frequency bands in the electromagnetic wave signals.
3. The infrared thermopile packaging structure of claim 1, wherein: an electromagnetic wave blocking layer is arranged on the top plate.
4. The infrared thermopile packaging structure of claim 1, wherein: the cover plate is made of at least one of a silicon material, a glass material or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
5. The infrared thermopile packaging structure of claim 1, wherein: the thermopile reference unit and the thermopile sensing unit are integrated on the same substrate.
6. The infrared thermopile packaging structure of claim 5, wherein: the cover plate also covers the thermopile sensing unit, and the top plate and the side wall also form a second cavity positioned above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensing unit receives electromagnetic wave signals through the second opening.
7. The infrared thermopile packaging structure of claim 1, wherein: the cover plate is made of an electromagnetic wave shielding material.
8. An infrared thermopile packaging method is characterized by comprising the following steps:
providing a tube seat;
a thermopile reference unit and a thermopile sensing unit are arranged on the tube seat;
connecting a cover plate on the thermopile reference unit, wherein the cover plate covers the thermopile reference unit so as to shield electromagnetic wave signals, the cover plate comprises a top plate positioned above the thermopile reference unit and a side wall for supporting the top plate, and the top plate and the side wall form a first cavity positioned above the thermopile reference unit;
the pipe seat is provided with a pipe cap, the pipe cap covers the cover plate, the thermopile reference unit and the thermopile sensing unit, the pipe cap is provided with a first opening, and the thermopile sensing unit receives electromagnetic wave signals through the first opening.
9. The method of infrared thermopile packaging of claim 8, wherein: the method for connecting the cover plate and the thermopile reference unit comprises a surface mounting packaging process, a metal seal welding process or a wafer level bonding process.
10. The method of infrared thermopile packaging of claim 8, wherein: and an optical filter is further arranged at the first opening of the pipe cap and is used for filtering out part of frequency bands in the electromagnetic wave signals.
11. The method of infrared thermopile packaging of claim 8, wherein: an electromagnetic wave blocking layer is arranged on the top plate.
12. The method of infrared thermopile packaging of claim 8, wherein: the cover plate is made of at least one of a silicon material, a glass material or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
13. The method of infrared thermopile packaging of claim 8, wherein: the thermopile reference unit and the thermopile sensing unit are integrated on the same substrate.
14. The method of infrared thermopile packaging of claim 13, wherein: the cover plate also covers the thermopile sensing unit, and the top plate and the side wall also form a second cavity positioned above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensing unit receives electromagnetic wave signals through the second opening.
15. The method of infrared thermopile packaging of claim 8, wherein: the cover plate is made of an electromagnetic wave blocking material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011588262.6A CN112701211B (en) | 2020-12-29 | 2020-12-29 | Infrared thermopile packaging structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011588262.6A CN112701211B (en) | 2020-12-29 | 2020-12-29 | Infrared thermopile packaging structure and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112701211A CN112701211A (en) | 2021-04-23 |
| CN112701211B true CN112701211B (en) | 2023-04-28 |
Family
ID=75511422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011588262.6A Active CN112701211B (en) | 2020-12-29 | 2020-12-29 | Infrared thermopile packaging structure and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112701211B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2312646A1 (en) * | 2000-06-28 | 2001-12-28 | Institut National D'optique | Hybrid micropackaging of microdevices |
| US8354747B1 (en) * | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3743394B2 (en) * | 2002-05-31 | 2006-02-08 | 株式会社村田製作所 | Infrared sensor and electronic device using the same |
| JP4042707B2 (en) * | 2004-02-13 | 2008-02-06 | 株式会社デンソー | Infrared detector |
| US7432586B2 (en) * | 2004-06-21 | 2008-10-07 | Broadcom Corporation | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
| WO2006122529A2 (en) * | 2005-05-17 | 2006-11-23 | Heimann Sensor Gmbh | Thermopile infrared sensor array |
| DE102005053765B4 (en) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS package and method of manufacture |
| CN101488059B (en) * | 2008-01-18 | 2010-09-29 | 世纪民生科技股份有限公司 | Optical navigation sensor and optical navigation apparatus |
| US20100207257A1 (en) * | 2009-02-17 | 2010-08-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and manufacturing method thereof |
| FR2966596B1 (en) * | 2010-10-26 | 2012-12-07 | Commissariat Energie Atomique | DEVICE FOR DETECTING ELECTROMAGNETIC RADIATION. |
| JP5678727B2 (en) * | 2011-03-03 | 2015-03-04 | セイコーエプソン株式会社 | Vibration device, method for manufacturing vibration device, electronic apparatus |
| US9472536B2 (en) * | 2011-10-11 | 2016-10-18 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
| US9851258B2 (en) * | 2014-11-04 | 2017-12-26 | Maxim Integrated Products, Inc. | Thermopile temperature sensor with a reference sensor therein |
| US10626012B2 (en) * | 2015-04-13 | 2020-04-21 | Infineon Technologies Ag | Semiconductor device including a cavity lid |
| CN104779214A (en) * | 2015-04-16 | 2015-07-15 | 歌尔声学股份有限公司 | Packaging structure for integrated sensor |
| CN104766831B (en) * | 2015-04-16 | 2018-03-23 | 歌尔股份有限公司 | A kind of encapsulating structure of integrated sensor |
| CN111504476A (en) * | 2019-01-31 | 2020-08-07 | 众智光电科技股份有限公司 | Infrared temperature sensor |
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
-
2020
- 2020-12-29 CN CN202011588262.6A patent/CN112701211B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2312646A1 (en) * | 2000-06-28 | 2001-12-28 | Institut National D'optique | Hybrid micropackaging of microdevices |
| US8354747B1 (en) * | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112701211A (en) | 2021-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2912426B1 (en) | Combined pressure and humidity sensor | |
| US20150253194A1 (en) | Infrared sensor module | |
| KR101263096B1 (en) | infrared sensor and infrared sensor module | |
| CN103988062B (en) | Infrared sensor | |
| KR101491889B1 (en) | Spectroscope | |
| US6828560B2 (en) | Integrated light concentrator | |
| EP2802009B1 (en) | Integrated imaging device for infrared radiation and method of production | |
| US9227839B2 (en) | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | |
| JP2006194791A (en) | Infrared sensor device | |
| EP2051294A2 (en) | Hypersensitive sensor comprising SOI flip-chip | |
| KR101415559B1 (en) | Non-contact infrared temperature sensor module | |
| US20080128620A1 (en) | Method of making a thermopile detector and package | |
| CN108885137A (en) | A kind of IR detector array equipment | |
| JP2006317232A (en) | Infrared sensor | |
| CN112701211B (en) | Infrared thermopile packaging structure and method | |
| CN110088037B (en) | Semiconductor device and method for forming semiconductor device | |
| US9612159B2 (en) | Infrared sensor and infrared sensor array | |
| KR102070665B1 (en) | Package structure and packaging method | |
| CN112635505A (en) | Packaging structure and packaging method | |
| JP5706217B2 (en) | Infrared sensor | |
| CN108352389B (en) | Solid-state imaging device and solid-state imaging apparatus | |
| JP2013137259A (en) | Infrared detector | |
| JP4042707B2 (en) | Infrared detector | |
| WO2023071984A1 (en) | Integrated mems thermopile infrared detector chip and manufacturing method for chip | |
| CN219416452U (en) | Uncooled infrared focal plane detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |