CN112701211A - Infrared thermopile packaging structure and method - Google Patents
Infrared thermopile packaging structure and method Download PDFInfo
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- CN112701211A CN112701211A CN202011588262.6A CN202011588262A CN112701211A CN 112701211 A CN112701211 A CN 112701211A CN 202011588262 A CN202011588262 A CN 202011588262A CN 112701211 A CN112701211 A CN 112701211A
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Abstract
The invention provides an infrared thermopile packaging structure and method, wherein the packaging structure comprises: a tube holder; the thermopile reference unit and the thermopile sensitive unit are arranged on the tube seat; and the cover plate is connected with and covers the thermopile reference unit so as to shield electromagnetic wave signals. According to the invention, the cover plate with the function of shielding the electromagnetic wave signals is arranged on the thermopile reference unit, so that the interference of external electromagnetic wave signals on the thermopile reference unit is eliminated, and the temperature detection precision is improved. In addition, the cover plate is directly connected with and covers the thermopile reference unit through a packaging process, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an infrared thermopile packaging structure and method.
Background
With the increasing application of temperature measurement such as body temperature detection, temperature detection devices such as forehead temperature guns, ear temperature guns, fire alarms, heat flow detectors, motion sensors, robot sensors, and low-resolution thermal imagers have become the key points of research and development in the industry. In the above-described apparatus, the thermopile is an indispensable core element that converts a temperature difference existing between a cold end and a hot end of a semiconductor or a metal material into an electric signal based on the seebeck effect, thereby accurately measuring a temperature difference change of an environment.
At present, in a common temperature detection device, a thermopile sensing unit for detecting a temperature difference change receives an electromagnetic wave signal such as an infrared ray of a detection object from an opening of a package structure, and converts a temperature difference formed by the received signal into an electrical signal. In addition, in addition to the thermopile sensing unit, a thermopile reference unit may be provided in the package structure. This is because the environment of the thermopile has a certain temperature, and the fluctuation thereof will interfere with the output signal, affecting the measurement accuracy. Therefore, the above-described interference can be eliminated by additionally providing the thermopile reference unit that does not receive the electromagnetic wave signal of the detection object.
However, the conventional thermopile package structure is difficult to completely shield the influence of external electromagnetic wave signals on the thermopile reference unit, which may cause the thermopile reference unit to be interfered by electromagnetic wave signals of a detection object, and the influence of the thermopile environment temperature cannot be accurately eliminated, thereby causing the accuracy of the temperature detection result to be reduced. In addition, the housing structure such as the cap for shielding electromagnetic wave signals is also difficult to integrate with the wafer level package, resulting in difficulty in improving the packaging efficiency.
Therefore, there is a need for a new infrared thermopile package structure and method to solve the above-mentioned problems.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an infrared thermopile package structure and method for solving the problem in the prior art that the package structure is difficult to shield the influence of electromagnetic wave signals on the thermopile reference unit.
To achieve the above and other related objects, the present invention provides an infrared thermopile package structure, comprising:
a tube holder;
the thermopile reference unit and the thermopile sensitive unit are arranged on the tube seat;
and the cover plate is connected with and covers the thermopile reference unit so as to shield electromagnetic wave signals.
As an alternative of the present invention, the infrared thermopile packaging structure further includes: the tube cap is arranged on the tube seat and covers the cover plate, the thermopile reference unit and the thermopile sensitive unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives an electromagnetic wave signal through the first opening.
As an alternative of the present invention, the infrared thermopile packaging structure further includes: and the optical filter is arranged at the first opening and used for filtering part of frequency bands in the electromagnetic wave signals.
As an alternative of the present invention, the cover plate includes a top plate and side walls supporting the top plate, the top plate and the side walls forming a first cavity above the thermopile reference unit.
As an alternative of the present invention, an electromagnetic wave blocking layer is provided on the top plate.
As an alternative of the present invention, the cover plate is made of at least one of a silicon material, a glass material or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
As an alternative of the invention, the thermopile reference unit and the thermopile sensitive unit are integrated on the same substrate.
As an alternative of the present invention, the cover plate further covers the thermopile sensing unit, and the top plate and the side walls further form a second cavity located above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensitive unit receives electromagnetic wave signals through the second opening.
As an alternative of the present invention, the cover plate is made of an electromagnetic wave shielding material.
The invention also provides an infrared thermopile packaging method, which is characterized by comprising the following steps of:
providing a tube seat;
arranging a thermopile reference unit and a thermopile sensitive unit on the tube seat;
and a cover plate is connected to the thermopile reference unit and covers the thermopile reference unit to shield electromagnetic wave signals.
As an alternative of the invention, the method for connecting the cover plate and the thermopile reference unit comprises a chip packaging process, a metal sealing and welding process or a wafer-level bonding process.
As an alternative of the invention, after the cover plate is connected to the thermopile reference unit, the method further comprises the step of arranging a pipe cap on the pipe seat; the pipe cap covers the cover plate, the thermopile reference unit and the thermopile sensitive unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives an electromagnetic wave signal through the first opening.
As an alternative of the present invention, an optical filter is further disposed at the first opening of the cap, and is used for filtering a part of the frequency band in the electromagnetic wave signal.
As an alternative of the present invention, the cover plate includes a top plate and side walls supporting the top plate, the top plate and the side walls forming a first cavity above the thermopile reference unit.
As an alternative of the present invention, an electromagnetic wave blocking layer is provided on the top plate.
As an alternative of the present invention, the cover plate is made of at least one of a silicon material, a glass material or a ceramic material, and the first cavity is formed by dry etching or wet etching the cover plate.
As an alternative of the invention, the thermopile reference unit and the thermopile sensitive unit are integrated on the same substrate.
As an alternative of the present invention, the cover plate further covers the thermopile sensing unit, and the top plate and the side walls further form a second cavity located above the thermopile sensing unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensitive unit receives electromagnetic wave signals through the second opening.
As an alternative of the present invention, the cover plate is composed of an electromagnetic wave blocking material.
As described above, the present invention provides an infrared thermopile packaging structure and method, in which a cover plate having an electromagnetic wave signal shielding function is disposed on a thermopile reference unit, so that interference of an external electromagnetic wave signal on the thermopile reference unit is eliminated, and temperature detection accuracy is improved. In addition, the cover plate is directly connected with and covers the thermopile reference unit through a packaging process, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a prior art infrared thermopile package structure.
Fig. 2 is a schematic cross-sectional view of an infrared thermopile package structure according to a first embodiment of the present invention.
Fig. 3 is a flowchart of an infrared thermopile packaging method according to a first embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of an infrared thermopile package structure according to a second embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of an infrared thermopile package structure according to a third embodiment of the present invention.
Description of the element reference numerals
101 tube seat
102 thermopile reference unit
102a first thermopile
102b first substrate
103 thermopile sensing unit
103a second thermopile
103b second substrate
104 pipe cap
104a opening
105 filter segment
201 tube seat
202 thermopile reference cell
202a first thermopile
202b first substrate
203 thermopile sensitive unit
203a second thermopile
203b second substrate
204 pipe cap
204a first opening
205 filter segment
206 cover plate
206a first cavity
207 electromagnetic wave barrier layer
301 tube base
302 thermopile reference cell
302a first thermopile
302b first substrate
303 thermopile sensitive unit
303a second thermopile
303b second substrate
304 pipe cap
304a first opening
305 filter segment
306 cover plate
306a first cavity
307 electromagnetic wave blocking layer
401 socket
402 thermopile reference cell
402a first thermopile
402b first substrate
403 thermopile sensitive unit
403a second thermopile
403b second substrate
404 pipe cap
404a first opening
405 filter segment
406 cover plate
406a first cavity
406b second cavity
406c second opening
407 electromagnetic wave blocking layer
S1-S3 Steps 1) -3)
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 5. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Fig. 1 is a schematic diagram of a conventional infrared thermopile package structure.
On the stem 101 there is a thermopile reference unit 102 and a thermopile sensitive unit 103. The thermopile reference unit 102 includes a first thermopile 102a and a first substrate 102b carrying the first thermopile 102 a; the thermopile sensing unit 103 includes a second thermopile 103a and a second substrate 103b carrying the second thermopile 103 a.
The tube seat 101 is further provided with a tube cap 104, the tube cap 104 covers the thermopile reference unit 102 and the thermopile sensing unit 103 below, and the forming material of the tube cap 104 may be metal or electromagnetic wave shielding material such as resin containing conductive particles, so as to shield external electromagnetic wave signals such as infrared rays. The cap 104 also serves to protect other packaging structures below. An opening 104a is provided at a position of the cap 104 above the thermopile sensing unit 103, and electromagnetic wave signals such as infrared rays incident from the outside can be received by the thermopile sensing unit 103 through the opening 104 a. The opening 104a is further provided with a filter 105, which is used for filtering out unwanted wave bands in the electromagnetic wave signals, so that the thermopile sensing unit 103 is ensured to receive only electromagnetic wave signals of specific wave bands, and the detection precision is improved.
The arrows in fig. 1 show the propagation of electromagnetic wave signals outside the pipe cap 104 in the vertical direction. In the above-mentioned design of the package structure, the opening 104a is disposed above the thermopile sensing unit 103 in order to allow only the thermopile sensing unit 103 to receive the vertically incident electromagnetic wave signal, and the thermopile reference unit 102 having a certain distance from the thermopile sensing unit is designed not to receive the electromagnetic wave signal. However, due to the influence of the fluctuation of the incident angle of the electromagnetic wave, or the effects of reflection, diffraction, etc., as shown in fig. 1, the electromagnetic wave signal still partially deviating from the set incident path on the left side will be received by the thermopile reference unit 102, which will seriously interfere with the thermopile reference unit 102 from performing its normal function, so that it cannot accurately eliminate the influence of the thermopile ambient temperature, thereby resulting in the accuracy of the temperature detection result being reduced.
Example one
Referring to fig. 2, the present embodiment provides an infrared thermopile package structure, which includes:
a stem 201;
a thermopile reference unit 202 and a thermopile sensing unit 203, which are arranged on the stem 201;
a cover plate 206 that connects to and covers the thermopile reference unit 202 to shield electromagnetic wave signals.
As shown in fig. 2, a thermopile reference unit 202 and a thermopile sensing unit 203 are provided on a stem 201. The thermopile reference unit 202 includes a first thermopile 202a and a first substrate 202b carrying the first thermopile 202 a; the thermopile sensing unit 203 includes a second thermopile 203a and a second substrate 203b carrying the second thermopile 203 a. The cover plate 206 is coupled to and covers the thermopile reference unit 202 to shield electromagnetic wave signals.
The cover plate 206 is connected to the first substrate 202b and shields the first thermopile 202a from external electromagnetic wave signals. Optionally, the cover plate 206 is connected to the first substrate 202b by a packaging process such as a die bonding, metal sealing, or wafer bonding. The first cavity 206a under the cover plate 206 can be completely isolated and sealed from the outside by the above-mentioned packaging process, which can exert better electromagnetic wave signal shielding effect.
As an example, as shown in fig. 2, the infrared thermopile packaging structure further includes: a cap 204 disposed on the stem 201 and covering the cover plate 206, the thermopile reference unit 202, and the thermopile sensing unit 203. The cap 204 is provided with a first opening 204a, and the thermopile sensing unit 203 receives an electromagnetic wave signal through the first opening 204 a. In fig. 2, the arrows represent the propagation direction of the external electromagnetic wave signal. Due to the shielding protection of the cover plate 206, even if a part of the electromagnetic wave signals are irradiated from the first opening 204a to the position of the thermopile reference unit 202, the thermopile reference unit 202 is not affected by the electromagnetic wave signals, so that the reference function can be normally performed, and the detection accuracy of the thermopile sensing unit 203 is improved.
Optionally, an optical filter 205 is further disposed at the first opening 204a, and is used for filtering a partial frequency band in the electromagnetic wave signal. It should be noted that in other embodiments of the present invention, if the protection of the package structure by the cap 204 is not considered, the cap 204 may not be formed, and the cover 206 can only independently exert its effect of shielding electromagnetic wave signals.
As an example, as shown in fig. 2, the cover plate 206 includes a top plate and side walls supporting the top plate, and the top plate and the side walls form a first cavity 206a located above the thermopile reference unit. Optionally, the first cavity 206a may accommodate the first thermopile 202a and shield the first thermopile 202a from external electromagnetic wave signals. In fig. 2, the top plate is a portion extending in the horizontal direction at the top of the cover plate 206, and the side walls are portions extending in the vertical direction, supporting the top plate, and connecting the socket 201 therebelow. Optionally, an electromagnetic wave blocking layer 207 is further disposed on the top plate. The electromagnetic wave blocking layer 207 may be made of an electromagnetic wave shielding material such as metal or resin containing conductive particles to enhance the ability of the cover plate 206 to shield electromagnetic waves.
As an example, as shown in fig. 2, the cover plate 206 is made of at least one of a silicon material, a glass material, or a ceramic material, and the first cavity 206a is formed by performing dry etching or wet etching on the cover plate 206. Specifically, the cover plate 206 can be processed by an MEMS process, the MEMS process is mature and complete for processing the cavity structure on the silicon wafer substrate, and the processed wafer including the cavity structure also has the potential of wafer-level bonding with the thermopile, which greatly improves the packaging efficiency. Optionally, when the cover plate 206 is made of a silicon material, the dry etching includes a DRIE deep silicon etching process commonly used in the MEMS process, which has a process capability of anisotropically etching a large volume of silicon material and is also easy to form a structural feature with a high aspect ratio.
As an example, as shown in fig. 2, the cover plate 206 is made of an electromagnetic wave shielding material. Alternatively, the electromagnetic wave shielding material includes a metal or a resin containing conductive particles, or the like. The cover plate 206 is directly formed of an electromagnetic wave shielding material, and the cover plate 206 itself is sufficient to achieve an effect of shielding an electromagnetic wave signal even though the electromagnetic wave blocking layer 207 is not formed thereon. In other embodiments of the present invention, when the cover plate 206 is made of an electromagnetic wave shielding material, the electromagnetic wave blocking layer 207 may not be formed. The electromagnetic wave blocking layer 207 may be formed before the etching of the first cavity 206a, or may be formed after the etching of the first cavity 206 a.
As can be seen from fig. 2, electromagnetic wave signals such as infrared rays incident from the first opening 204a pass through the optical filter 205 and are received by the thermopile sensing unit 203, while the thermopile reference unit 202 is electromagnetically shielded by the cover plate 206 without interfering with the first thermopile 202 a. The thermopile reference unit 202 will serve as a reference comparison signal, making the thermopile sensing unit 203 more accurate for temperature measurement of received electromagnetic wave signals.
Referring to fig. 2 and fig. 3, the present embodiment further provides an infrared thermopile packaging method, which includes the following steps:
1) providing a socket 201;
2) arranging a thermopile reference unit 202 and a thermopile sensitive unit 203 on the stem 201;
3) a cover plate 206 is attached to the thermopile reference unit 202, and the cover plate 206 covers the thermopile reference unit 202 to shield electromagnetic wave signals.
In step 1), referring to step S1 of fig. 3 and fig. 2, the socket 201 is provided.
In step 2), referring to step S2 of fig. 3 and fig. 2, a thermopile reference unit 202 and a thermopile sensing unit 203 are disposed on the stem 201. Optionally, the thermopile reference unit 202 includes a first thermopile 202a and a first substrate 202b carrying the first thermopile 202 a; the thermopile sensing unit 203 includes a second thermopile 203a and a second substrate 203b carrying the second thermopile 203 a.
In step 3), please refer to step S3 of fig. 3 and fig. 2, a cover plate 206 is connected to the thermopile reference unit 202, and the cover plate 206 covers the thermopile reference unit 202 to shield the electromagnetic wave signal. Optionally, the method of connecting the cover plate 206 and the thermopile reference unit 202 includes a chip-on-chip process, a metal sealing process, or a wafer-level bonding process. The first cavity 206a under the cover 206 can be completely sealed by the above-mentioned packaging process, which can perform better electromagnetic wave signal shielding function. The infrared thermopile packaging method provided by this embodiment may be used for preparing the infrared thermopile packaging structure shown in fig. 2 of this embodiment.
As an example, as shown in fig. 2, after the cover plate 206 is connected to the thermopile reference unit 202, a step of disposing a cap 204 on the stem 201 is further included. The cap 204 covers the cover plate 206, the thermopile reference unit 202 and the thermopile sensitive unit 203; the cap 204 is provided with a first opening 204a, and the thermopile sensing unit 203 receives an electromagnetic wave signal through the first opening 204 a. Optionally, an optical filter 205 is further disposed at the first opening 204a of the cap 204, and is used for filtering a part of the frequency band in the electromagnetic wave signal.
As an example, as shown in fig. 2, the cover plate 206 includes a top plate and side walls supporting the top plate, which form a first cavity 206a above the thermopile reference unit 202. An electromagnetic wave blocking layer 207 is also provided on the top plate. The cover plate 206 may be made of a silicon material, and the first cavity 206a is formed by performing dry etching or wet etching on the silicon material.
Example two
Referring to fig. 4, the present embodiment provides an infrared thermopile package structure and method, which is different from the first embodiment in that: the thermopile reference unit 302 and the thermopile sensitive unit 303 are integrated on the same substrate.
As shown in fig. 4, a thermopile reference unit 302 and a thermopile sensing unit 303 are provided on a stem 301. The thermopile reference unit 302 includes a first thermopile 302a and a first substrate 302b carrying the first thermopile 302 a; the thermopile sensing unit 303 includes a second thermopile 303a and a second substrate 303b carrying the second thermopile 303 a. The cover plate 306 is coupled to and covers the thermopile reference unit 302 to shield electromagnetic wave signals.
It should be noted that in this embodiment, the first substrate 302b and the second substrate 303b are integrated, and there is only a conceptual boundary line marked by a dotted line in fig. 4 between them, that is, the thermopile reference unit 302 and the thermopile sensing unit 303 are integrated on the same substrate. Alternatively, the thermopile reference unit 302 and the thermopile sensing unit 303 may be prepared in a wafer level packaging process, and the first thermopile 302a and the second thermopile 303a are packaged on the same wafer substrate and integrated on the same substrate after being diced.
The other structures of the infrared thermopile package structure provided in this embodiment are the same as those of the first embodiment. Specifically, the infrared thermopile package structure further includes: a cap 304 provided on the stem 301; a filter 305 is further disposed at the first opening 304 a; the cover plate 306 comprises a top plate and a side wall for supporting the top plate, the top plate and the side wall form a first cavity 306a located above the thermopile reference unit, and an electromagnetic wave blocking layer 307 is further arranged on the top plate.
The packaging method for forming the above-mentioned packaging structure can refer to the implementation, and only differs from the implementation in that when the thermopile reference unit 302 and the thermopile sensing unit 303 are arranged, the same substrate is arranged on the stem 301.
The infrared thermopile package structure provided in this embodiment integrates the thermopile reference unit 302 and the thermopile sensing unit 303 on the same substrate. This is helpful to improve the packaging efficiency of the packaging structure by advanced packaging processes such as wafer level packaging. And because the structure of the cover plate 306 is introduced in the invention, the electromagnetic wave shielding capability is enhanced, and the thermopile reference unit 302 and the thermopile sensitive unit 303 can be integrated on the same substrate under the adjacent layout condition. This is not possible in the prior art by merely shielding electromagnetic waves through the cap. Specifically, in fig. 1, the thermopile reference unit 102 and the thermopile sensing unit 103 must be spaced apart enough to ensure that electromagnetic wave signals incident at the opening 104a do not interfere with the thermopile reference unit 102.
EXAMPLE III
Referring to fig. 5, the present embodiment provides an infrared thermopile package structure and method, which is different from the first embodiment in that: the thermopile reference unit 402 and the thermopile sensitive unit 403 are integrated on the same substrate, and the cover plate 406 also covers the thermopile sensitive unit 403. The top plate and the side walls further form a second cavity 406b located above the thermopile sensing unit, and the second cavity 406b and the first cavity 406a are isolated from each other by the side walls. A second opening 406c is disposed on the top plate above the second cavity 406b, and the thermopile sensing unit receives an electromagnetic wave signal through the second opening 406 c.
As shown in fig. 5, a thermopile reference unit 402 and a thermopile sensing unit 403 are provided on a stem 401. The thermopile reference unit 402 includes a first thermopile 402a and a first substrate 402b carrying the first thermopile 402 a; the thermopile sensitive unit 403 includes a second thermopile 403a and a second substrate 403b carrying the second thermopile 403 a. The cover plate 406 is coupled to and covers the thermopile reference unit 402 to shield electromagnetic wave signals. The cover plate 406 also extends further above the thermopile sensing unit 403.
It should be noted that in the present embodiment, the first substrate 402b and the second substrate 403b are integrated, and there is only a conceptual boundary line marked by a dotted line in fig. 5 between them, i.e. the thermopile reference unit 402 and the thermopile sensing unit 403 are integrated on the same substrate. Alternatively, the cover plate 406, the thermopile reference unit 402, and the thermopile sensing unit 403 may all be prepared by a wafer-level packaging process, and the first thermopile 402a and the second thermopile 403a are packaged on the same wafer substrate and bonded with another wafer substrate forming the cover plate 406, and after being diced, they are integrated into an integrated structure and integrally placed on the stem 401 in a subsequent packaging process.
The other structures of the infrared thermopile package structure provided in this embodiment are the same as those of the first embodiment. Specifically, the infrared thermopile package structure further includes: a cap 404 provided on the stem 401; an optical filter 405 is further disposed at the first opening 404 a; the cover plate 406 includes a top plate and a side wall supporting the top plate, the top plate and the side wall form a first cavity 406a above the thermopile reference unit, and an electromagnetic wave blocking layer 407 is further disposed on the top plate.
The packaging method for forming the above packaging structure can refer to the implementation of the first embodiment, and is different in that when the thermopile reference unit 402 and the thermopile sensitive unit 403 are arranged, the same substrate is arranged on the stem 401; and when the cover plate 406 is disposed, the cover plate 406 also covers the thermopile sensing unit 403.
In the infrared thermopile package structure provided in this embodiment, the thermopile reference unit 402 and the thermopile sensing unit 403 are integrated on the same substrate, and the cover plate 406 also covers the thermopile reference unit 402 and the thermopile sensing unit 403, so that the thermopile sensing unit 403 can receive an electromagnetic wave signal through the second opening 406 c. The connection of the cover plate 406 to the integrated substrate below may be achieved by a wafer level packaging process, and after wafer dicing, an integrated structure may be obtained that can be directly disposed on the socket 401. This is helpful to improve the packaging efficiency of the packaging structure by advanced packaging processes such as wafer level packaging.
In summary, the present invention provides an infrared thermopile package structure and method, where the package structure includes: a tube holder; the thermopile reference unit and the thermopile sensitive unit are arranged on the tube seat; and the cover plate is connected with and covers the thermopile reference unit so as to shield electromagnetic wave signals. According to the invention, the cover plate with the function of shielding the electromagnetic wave signals is arranged on the thermopile reference unit, so that the interference of external electromagnetic wave signals on the thermopile reference unit is eliminated, and the temperature detection precision is improved. In addition, the cover plate is directly connected with and covers the thermopile reference unit through a packaging process, so that the electromagnetic wave shielding performance is better, and the packaging efficiency can be effectively improved.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (19)
1. An infrared thermopile package structure, comprising:
a tube holder;
the thermopile reference unit and the thermopile sensitive unit are arranged on the tube seat;
and the cover plate is connected with and covers the thermopile reference unit so as to shield electromagnetic wave signals.
2. The infrared thermopile package structure of claim 1, wherein: further comprising:
the tube cap is arranged on the tube seat and covers the cover plate, the thermopile reference unit and the thermopile sensitive unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives an electromagnetic wave signal through the first opening.
3. The infrared thermopile package structure of claim 2, wherein: further comprising:
and the optical filter is arranged at the first opening and used for filtering part of frequency bands in the electromagnetic wave signals.
4. The infrared thermopile package structure of claim 1, wherein: the cover plate comprises a top plate and a side wall, the top plate is located above the thermopile reference unit, the side wall supports the top plate, and the top plate and the side wall form a first cavity located above the thermopile reference unit.
5. The infrared thermopile package structure of claim 4, wherein: and an electromagnetic wave barrier layer is arranged on the top plate.
6. The infrared thermopile package structure of claim 4, wherein: the cover plate is made of at least one of silicon materials, glass materials or ceramic materials, and the first cavity is formed by performing dry etching or wet etching on the cover plate.
7. The infrared thermopile package structure of claim 4, wherein: the thermopile reference unit and the thermopile sensitive unit are integrated on the same substrate.
8. The infrared thermopile package structure of claim 7, wherein: the cover plate also covers the thermopile sensitive unit, and the top plate and the side wall also form a second cavity positioned above the thermopile sensitive unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensitive unit receives electromagnetic wave signals through the second opening.
9. The infrared thermopile package structure of claim 4, wherein: the cover plate is made of an electromagnetic wave shielding material.
10. An infrared thermopile packaging method is characterized by comprising the following steps:
providing a tube seat;
arranging a thermopile reference unit and a thermopile sensitive unit on the tube seat;
and a cover plate is connected to the thermopile reference unit and covers the thermopile reference unit to shield electromagnetic wave signals.
11. The infrared thermopile packaging method of claim 10, wherein: the method for connecting the cover plate and the thermopile reference unit comprises a chip-on-chip packaging process, a metal sealing and welding process or a wafer-level bonding process.
12. The infrared thermopile packaging method of claim 10, wherein: after the cover plate is connected to the thermopile reference unit, a step of arranging a pipe cap on the pipe seat is also included; the pipe cap covers the cover plate, the thermopile reference unit and the thermopile sensitive unit; the pipe cap is provided with a first opening, and the thermopile sensing unit receives an electromagnetic wave signal through the first opening.
13. The infrared thermopile packaging method of claim 12, wherein: and the first opening of the pipe cap is also provided with an optical filter which is used for filtering part of frequency bands in the electromagnetic wave signals.
14. The infrared thermopile packaging method of claim 10, wherein: the cover plate comprises a top plate and a side wall, the top plate is located above the thermopile reference unit, the side wall supports the top plate, and the top plate and the side wall form a first cavity located above the thermopile reference unit.
15. The infrared thermopile packaging method of claim 14, wherein: and an electromagnetic wave barrier layer is arranged on the top plate.
16. The infrared thermopile packaging method of claim 14, wherein: the cover plate is made of at least one of silicon materials, glass materials or ceramic materials, and the first cavity is formed by performing dry etching or wet etching on the cover plate.
17. The infrared thermopile packaging method of claim 14, wherein: the thermopile reference unit and the thermopile sensitive unit are integrated on the same substrate.
18. The infrared thermopile packaging method of claim 17, wherein: the cover plate also covers the thermopile sensitive unit, and the top plate and the side wall also form a second cavity positioned above the thermopile sensitive unit; the second cavity and the first cavity are mutually isolated through the side wall, a second opening is formed in the top plate above the second cavity, and the thermopile sensitive unit receives electromagnetic wave signals through the second opening.
19. The infrared thermopile packaging method of claim 14, wherein: the cover plate is made of an electromagnetic wave blocking material.
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| CN202011588262.6A CN112701211B (en) | 2020-12-29 | 2020-12-29 | Infrared thermopile packaging structure and method |
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| CN202011588262.6A CN112701211B (en) | 2020-12-29 | 2020-12-29 | Infrared thermopile packaging structure and method |
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Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2312646A1 (en) * | 2000-06-28 | 2001-12-28 | Institut National D'optique | Hybrid micropackaging of microdevices |
| US20030222218A1 (en) * | 2002-05-31 | 2003-12-04 | Murata Manufacturing Co., Ltd. | Infrared sensor and electronic device using the same |
| JP2005227180A (en) * | 2004-02-13 | 2005-08-25 | Denso Corp | Infrared detector |
| US20050280127A1 (en) * | 2004-06-21 | 2005-12-22 | Broadcom Corporation | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
| US20080216883A1 (en) * | 2005-05-17 | 2008-09-11 | Heimann Sensor Gmbh | Thermopile Infrared Sensor Array |
| US20090001553A1 (en) * | 2005-11-10 | 2009-01-01 | Epcos Ag | Mems Package and Method for the Production Thereof |
| CN101488059A (en) * | 2008-01-18 | 2009-07-22 | 世纪民生科技股份有限公司 | Optical navigation sensor and optical navigation apparatus |
| US20100207257A1 (en) * | 2009-02-17 | 2010-08-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and manufacturing method thereof |
| US20120097853A1 (en) * | 2010-10-26 | 2012-04-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for detecting electromagnetic radiation |
| US20120223622A1 (en) * | 2011-03-03 | 2012-09-06 | Seiko Epson Corporation | Vibrating device, method for manufacturing vibrating device, and electronic apparatus |
| US8354747B1 (en) * | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
| CN104766831A (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | Packaging structure of integrated sensors |
| CN104779214A (en) * | 2015-04-16 | 2015-07-15 | 歌尔声学股份有限公司 | Packaging structure for integrated sensor |
| US20160005724A1 (en) * | 2011-10-11 | 2016-01-07 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
| CN105806492A (en) * | 2014-11-04 | 2016-07-27 | 马克西姆综合产品公司 | Thermopile temperature sensor with a reference sensor therein |
| US20160297672A1 (en) * | 2015-04-13 | 2016-10-13 | Infineon Technologies Ag | Semiconductor device including a cavity lid |
| CN111504476A (en) * | 2019-01-31 | 2020-08-07 | 众智光电科技股份有限公司 | Infrared temperature sensor |
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
-
2020
- 2020-12-29 CN CN202011588262.6A patent/CN112701211B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2312646A1 (en) * | 2000-06-28 | 2001-12-28 | Institut National D'optique | Hybrid micropackaging of microdevices |
| US20030111441A1 (en) * | 2000-06-28 | 2003-06-19 | Institut National D'optique | Miniature microdevice package and process for making thereof |
| US20030222218A1 (en) * | 2002-05-31 | 2003-12-04 | Murata Manufacturing Co., Ltd. | Infrared sensor and electronic device using the same |
| JP2005227180A (en) * | 2004-02-13 | 2005-08-25 | Denso Corp | Infrared detector |
| US20050280127A1 (en) * | 2004-06-21 | 2005-12-22 | Broadcom Corporation | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
| US20080216883A1 (en) * | 2005-05-17 | 2008-09-11 | Heimann Sensor Gmbh | Thermopile Infrared Sensor Array |
| US20090001553A1 (en) * | 2005-11-10 | 2009-01-01 | Epcos Ag | Mems Package and Method for the Production Thereof |
| CN101488059A (en) * | 2008-01-18 | 2009-07-22 | 世纪民生科技股份有限公司 | Optical navigation sensor and optical navigation apparatus |
| US20100207257A1 (en) * | 2009-02-17 | 2010-08-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and manufacturing method thereof |
| US8354747B1 (en) * | 2010-06-01 | 2013-01-15 | Amkor Technology, Inc | Conductive polymer lid for a sensor package and method therefor |
| US20120097853A1 (en) * | 2010-10-26 | 2012-04-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Device for detecting electromagnetic radiation |
| US20120223622A1 (en) * | 2011-03-03 | 2012-09-06 | Seiko Epson Corporation | Vibrating device, method for manufacturing vibrating device, and electronic apparatus |
| US20160005724A1 (en) * | 2011-10-11 | 2016-01-07 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
| CN105806492A (en) * | 2014-11-04 | 2016-07-27 | 马克西姆综合产品公司 | Thermopile temperature sensor with a reference sensor therein |
| US20160297672A1 (en) * | 2015-04-13 | 2016-10-13 | Infineon Technologies Ag | Semiconductor device including a cavity lid |
| CN104766831A (en) * | 2015-04-16 | 2015-07-08 | 歌尔声学股份有限公司 | Packaging structure of integrated sensors |
| CN104779214A (en) * | 2015-04-16 | 2015-07-15 | 歌尔声学股份有限公司 | Packaging structure for integrated sensor |
| CN111504476A (en) * | 2019-01-31 | 2020-08-07 | 众智光电科技股份有限公司 | Infrared temperature sensor |
| CN111900244A (en) * | 2020-07-01 | 2020-11-06 | 上海烨映电子技术有限公司 | Insulating plate heat-carrying electric pile sensor component and manufacturing method thereof |
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