WO2016165360A1

WO2016165360A1 - Encapsulation structure for integrated sensor

Info

Publication number: WO2016165360A1
Application number: PCT/CN2015/096910
Authority: WO
Inventors: 端木鲁玉; 张俊德; 宋青林
Original assignee: 歌尔声学股份有限公司
Priority date: 2015-04-16
Filing date: 2015-12-10
Publication date: 2016-10-20
Also published as: CN104766831B; CN104766831A

Abstract

Provided is an encapsulation structure for an integrated sensor, comprising: a first substrate (1); a plurality of sensors arranged on the first substrate (1), each of the sensors comprising a MEMS sensor chip (8) and an ASIC chip (7) electrically connected to the MEMS sensor chip (8); and at least one first encapsulation cavity enclosed by a first outer housing (2-1) and the first substrate (1), the first encapsulation cavity being internally provided with at least one second encapsulation cavity enclosed by a second outer housing (2-2) and the first substrate (1); each of the second encapsulation cavities is internally provided with at least one sensor. The cavities are separate and each of the sensor units of the integrated sensor is encapsulated in isolation, or sensitive sensor units more likely to be subjected to interference are encapsulated in isolation, so that interference between the sensor units of the integrated sensor is shielded, effectively improving the product performance of the integrated sensor.

Description

Integrated sensor package structure

Technical field

The invention relates to a package structure of an integrated sensor.

Background technique

The integrated sensor is a sensor chip that integrates multiple sensor units (such as an integrated sensor integrated by a pressure sensor unit and a temperature sensor unit) and is used as a stand-alone chip capable of simultaneously implementing multiple sensing functions. At present, the package of the integrated sensor is generally mounted on the substrate with the MEMS sensor chip and the ASIC chip of each sensor unit, and finally packaged in a cavity for integration, for example, as shown in FIG. 1 and FIG. 2: the outer cover 2 covers the first substrate 1 is surrounded by a large cavity, and two sensor units mounted on the first substrate 1 are disposed in the cavity. One of the sensor units includes a MEMS sensor chip 3 and an ASIC chip 5, which are electrically connected by a lead 4, and the AISC chip 5 is connected to the first substrate 1 by wires. The other sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, which are also electrically connected by wires, and the AISC chip 7 is connected to the first substrate 1 by wires. The outer casing 2 is provided with an opening 6 required for sensor unit sensing, and the back surface of the first substrate 1 is provided with a pad 9, and the sensor unit is electrically connected to an external circuit through the pad 9.

The existing integrated sensor is packaged in a cavity in which all sensor units of the integrated sensor are packaged. In this case, electrical, magnetic, thermal, and optical interferences between the different sensor units are easily caused, which seriously affects the integrated sensor. Overall performance.

Summary of the invention

In order to solve the above technical problem, the mutual interference between the individual sensor units of the integrated sensor is minimized, and the present invention proposes a new technical solution for the integrated sensor package.

The present invention provides a package structure of an integrated sensor, comprising: a first substrate; a plurality of sensors disposed on the first substrate, each of the sensors including a MEMS sensor chip And an ASIC chip electrically connected to the MEMS sensor chip; and at least one first package cavity surrounded by the first housing and the first substrate, the first package cavity being internally provided with at least one And a second encapsulation cavity surrounded by the first substrate; wherein each of the second package cavities is provided with at least one of the sensors.

Preferably, at least one of the sensors is disposed inside the first package cavity while being external to the second package cavity.

Preferably, the plurality of sensors comprise sensitive sensors and non-sensitive sensors, each of which is isolated from other sensors.

Preferably, the plurality of sensors comprise a pressure sensor, a microphone, and a humidity sensor, the microphone and the humidity sensor being sensitive sensors, the pressure sensor being a non-sensitive sensor.

Preferably, the microphone is separately disposed inside one of the second package cavities, and the humidity sensor is separately disposed inside the other of the second package cavities.

Preferably, the pressure sensor is disposed inside the first package cavity while being located outside each of the second package cavities.

Preferably, the first outer casing is a substrate outer casing or a metal outer casing, and the second outer casing is a substrate outer casing or a metal outer casing.

Preferably, the sensor is directly disposed on the first substrate or the sensor is disposed on the first substrate through a second substrate.

Preferably, at least one of the sensor's MEMS sensor chip and ASIC chip are integrated.

Preferably, the ASIC chips of the mutually non-interfering sensors are integrated or the MEMS sensor chips are integrated.

The invention separates and encapsulates each sensor unit of the integrated sensor through the cavity separation, or isolates the sensitive sensor unit which is susceptible to interference, so as to shield the mutual interference between the various sensor units of the integrated sensor and effectively improve Product performance with integrated sensors.

DRAWINGS

The accompanying drawings, which are incorporated in FIG.

1 and 2 are schematic structural views of a conventional integrated sensor package structure.

3 and 4 are schematic views showing the structure of the first embodiment of the integrated sensor package structure of the present invention.

FIG. 5 is a schematic structural view of a second embodiment of the integrated sensor package structure of the present invention.

6 is a schematic structural view of a third embodiment of the integrated sensor package structure of the present invention.

7 is a schematic structural view of a fourth embodiment of the integrated sensor package structure of the present invention.

FIG. 8 is a schematic structural view of a fifth embodiment of the integrated sensor package structure of the present invention.

9 is a schematic structural view of a sixth embodiment of an integrated sensor package structure of the present invention.

FIG. 10 is a schematic structural view of a seventh embodiment of the integrated sensor package structure of the present invention.

detailed description

Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in the embodiments are not intended to limit the scope of the invention unless otherwise specified.

The following description of the at least one exemplary embodiment is merely illustrative and is in no way

Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques and devices should be considered as part of the specification.

In all of the examples shown and discussed herein, any specific values are to be construed as illustrative only and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following figures, and therefore, once an item is defined in one figure, it is not required to be further discussed in the subsequent figures.

Referring to FIG. 3 and FIG. 4, a first embodiment of an integrated sensor package structure includes two sensor units, one of which includes a MEMS sensor chip 3 and an ASIC chip 5, and a lead 4 is passed between the two. Electrical connection, ASIC chip 5 through a lead The wire is electrically connected to the first substrate 1. The other sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, which are also electrically connected by a lead, and the ASIC chip 7 is electrically connected to the first substrate 1 through a lead. Both sensor units are mounted on the first substrate 1, and are electrically connected to an external circuit through the pads 9 on the back surface of the first substrate 1.

It can be seen that the first embodiment encloses a first package cavity through the outer casing 2-1 and the first substrate 1, and a first envelope body 2-2 and a first substrate 1 are disposed inside the first package cavity. a second package cavity. A sensor unit is disposed in the second package cavity, and an opening 6-2 required for sensor unit sensing is disposed at a top of the second package cavity. Another sensor unit is disposed in a space between the first package cavity and the second package cavity, and an opening 6-1 required for sensor unit sensing is disposed at a top of the first package cavity.

Referring to FIG. 5, a second embodiment of the integrated sensor package structure is different from the first embodiment shown in FIG. 3 in that the second embodiment includes three sensor units, through the housing 2-1 and the first The substrate 1 encloses a first package cavity, and two second package cavities are disposed inside the first package cavity. The outer casing 2-2 and the first substrate 1 enclose a second package cavity, and a first sensor unit is disposed therein. The first sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7 in the second package cavity. The top of the opening is provided with an opening 6-2. The outer casing 2-3 and the first substrate 1 enclose another second package cavity, and a second sensor unit is disposed therein, and the second sensor unit includes a MEMS sensor chip 11 and an ASIC chip 10, and the second package cavity The top of the body is provided with an opening 6-3. The third sensor unit is disposed in a space between the first package cavity and the second package cavity, the first sensor unit includes a MEMS sensor chip 3 and an ASIC chip 5, and is disposed at a top of the first package cavity Opening 6-1.

The integrated sensor includes a plurality of sensor units, some of which are relatively more sensitive, ie, more susceptible to interference from other sensor units in the integrated sensor, where the sensor unit that is susceptible to interference from other sensor units is referred to as a "sensitive sensor. Sensor units outside the sensitive sensor are called "non-sensitive sensors." Referring to FIG. 6, a third embodiment of an integrated sensor package structure includes three sensor units including one sensitive sensor and two non-sensitive sensors. The sensitive sensor unit includes a MEMS sensor chip 3 and an ASIC chip 5, one non-sensitive The sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, and the other non-sensitive sensor unit includes a MEMS sensor chip 11 and an ASIC chip 10. Will The two non-sensitive sensors are disposed together in the second package cavity, and the sensitive sensor is disposed in the space between the first package cavity and the second package cavity, thereby achieving isolation of the sensitive sensor and other sensors. Of course, as shown in FIG. 5, the sensitive sensor can be separately disposed in the second package cavity, and isolation from other sensors can also be realized.

The invention separates each sensitive sensor from other sensors. For example, in an integrated sensor including a pressure sensor, a microphone, and a humidity sensor, the pressure sensor releases electromagnetic signals and heat energy as a source of interference, and the microphone is easily released by the pressure sensor. The electromagnetic signal is disturbed, the humidity sensor is easily interfered by the thermal energy released by the pressure sensor, so the pressure sensor is a non-sensitive sensor, the microphone and the humidity sensor are sensitive sensors, so the present invention separately sets the microphone in a second package cavity Internally, the humidity sensor is separately disposed inside the other second package cavity, and the pressure sensor is disposed inside the first package cavity while being located outside the second package cavity, thereby preventing the microphone and the humidity sensor from being stressed. Sensor interference. Based on the disclosure of the present invention, those skilled in the art can determine sensitive sensors and non-sensitive sensors according to actual application products and environments, and these should also fall within the protection scope of the present invention.

Referring to FIG. 7, a fourth embodiment of the integrated sensor package structure is different from the first embodiment shown in FIG. 3 in that the sensor unit on the right side is not directly disposed on the first substrate 1 but through the second The substrate 15 is indirectly disposed on the first substrate 1. The sensor unit is mounted on the second substrate 15 and electrically connected to the external circuit through the pads 9 on the back surface of the first substrate 1. During the assembly and operation of the sensor unit, external stress is transmitted to the first substrate 1 and then buffered by the second substrate 15, which protects the sensor unit and makes the sensor unit more stable. Especially for the pressure sensor unit, the second substrate 15 is designed as a buffer portion, which avoids the influence of external stress on the pressure sensor and causes pressure sensor data error, thereby improving the sensitivity of the pressure sensor unit.

In the above embodiments, each chip needs to be separately mounted and electrically connected, the process is low in efficiency, the hidden dangers are sharply increased, and the assembled safety space needs to be left between the chips, thereby wasting the overall space of the product. In order to better realize the separation of the cavity, the invention can also integrate the sensor unit to reduce space waste, optimize the processing procedure, and improve the packaging efficiency and product yield. The present invention provides the following three integration methods:

Referring to FIG. 8, a fifth embodiment of the integrated sensor package structure includes three sensor units as in the second embodiment shown in FIG. 5, except that the MEMS sensor chip and ASIC of the sensor unit 21 located in the middle are provided. The chips are integrated.

Referring to FIG. 9, a sixth embodiment of the integrated sensor package structure is different from the third embodiment shown in FIG. 6 in that two sensor units that do not interfere with each other share an ASIC chip, specifically a MEMS sensor. The chip 8 and the MEMS sensor chip 11 share one ASIC chip 10.

Referring to FIG. 10, a seventh embodiment of the integrated sensor package structure is different from the third embodiment shown in FIG. 6 in that two mutually non-interfering sensor units share one MEMS sensor chip, specifically an ASIC. The chip 7 and the ASIC chip 10 share a MEMS sensor chip 8.

In the above embodiment, the outer casing is made of a metal casing, and of course, a substrate casing composed of a substrate may be used, which is all within the scope of the present invention.

Compared with the existing integrated sensor sharing a large cavity packaging method, the present invention separates each sensor unit of the integrated sensor by cavity separation, or isolates the sensitive sensor unit that is susceptible to interference, The mutual interference between the various sensor units of the integrated sensor is shielded, which effectively improves the product performance of the integrated sensor.

While the invention has been described in detail with reference to the specific embodiments of the present invention, it should be understood that It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

A package structure of an integrated sensor, comprising:

First substrate;

a plurality of sensors disposed on the first substrate, each of the sensors including a MEMS sensor chip and an ASIC chip electrically connected to the MEMS sensor chip;

At least one first package cavity surrounded by the first outer casing and the first substrate, the first package cavity being internally provided with at least one second package cavity surrounded by the second outer casing and the first substrate a body; wherein each of the second package cavities is provided with at least one of the sensors.
The structure of claim 1 wherein at least one of said sensors is disposed inside said first package cavity while external to said second package cavity.
The structure of claim 1 wherein a plurality of said sensors comprise sensitive sensors and non-sensitive sensors, each of said sensitive sensors being isolated from other sensors.
The structure of claim 3 wherein the plurality of sensors comprise a pressure sensor, a microphone, and a humidity sensor, the microphone and the humidity sensor being sensitive sensors, the pressure sensor being a non-sensitive sensor.
The structure according to claim 4, wherein the microphone is separately disposed inside one of the second package cavities, and the humidity sensor is separately disposed inside the other of the second package cavities.
The structure according to claim 5, wherein the pressure sensor is disposed inside the first package cavity while being located outside each of the second package cavities.
The structure according to any one of claims 1 to 6, wherein the first outer casing is a substrate outer casing or a metal outer casing, and the second outer casing is a substrate outer casing or a metal outer casing.
The structure according to any one of claims 1 to 6, wherein the sensor is directly disposed on the first substrate or the sensor is disposed on the first substrate through a second substrate.
A structure according to any of claims 1-6, characterized in that the MEMS sensor chip and the ASIC chip of at least one of said sensors are integrated.
A structure according to any one of claims 1 to 6, wherein the mutual interference is not transmitted The ASICs of the sensors are integrated or the MEMS sensor chips are integrated.