WO2021082270A1 - Sensor encapsulation structure and electronic apparatus - Google Patents

Sensor encapsulation structure and electronic apparatus Download PDF

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Publication number
WO2021082270A1
WO2021082270A1 PCT/CN2019/130228 CN2019130228W WO2021082270A1 WO 2021082270 A1 WO2021082270 A1 WO 2021082270A1 CN 2019130228 W CN2019130228 W CN 2019130228W WO 2021082270 A1 WO2021082270 A1 WO 2021082270A1
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substrate
conductive layer
electrical connection
connection portion
hole
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PCT/CN2019/130228
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French (fr)
Chinese (zh)
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庞胜利
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歌尔微电子有限公司
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Publication of WO2021082270A1 publication Critical patent/WO2021082270A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to the field of electroacoustic technology, and more specifically, the present invention relates to a sensor packaging structure and electronic equipment.
  • Micro-Electro-Mechanical System is a kind of miniaturized mechanical and electronic mechanical components made by micro-manufacturing technology. In use, it is usually packaged in a sensor device such as a microphone with an integrated circuit (Application Specific Integrated Circuit, ASIC) chip using corresponding technology to form a sensor packaging structure.
  • sensor packaging structures with built-in MEMS chips can be assembled into different types of electronic devices such as mobile phones, tablet computers, notebook computers, VR devices, and smart wearable devices, and their applications are very wide.
  • a chip assembly composed of a MEMS chip and an ASIC chip is installed in a package structure enclosed by a substrate and a housing, and the package structure is also provided with a device for external sound to enter.
  • the sound hole (of course, the sound hole can be designed on the substrate or the housing as required).
  • its shell is usually a single-layer structure, and its ability to resist radio frequency interference (ie, anti-electromagnetic wave interference) is relatively weak, which cannot meet the special design requirements of some electronic products.
  • An object of the present invention is to provide a sensor packaging structure and a new technical solution for electronic equipment.
  • a sensor packaging structure including a substrate and a packaging shell provided on the substrate, the substrate and the packaging shell enclosing a cavity;
  • It also includes a MEMS chip mounted on the substrate, and the MEMS chip is located in the cavity;
  • the packaging shell includes a first conductive layer and a second conductive layer, and the surface of the substrate connected to the packaging shell includes a first electrical connection portion and a second electrical connection portion; the lower end of the first conductive layer passes through a first The electrical connection portion is electrically connected to the substrate, and the lower end of the second conductive layer is electrically connected to the substrate through a second electrical connection portion; An insulating portion, the first electrical connection portion and the second electrical connection portion are respectively grounded.
  • the packaging shell further includes a core layer; the first conductive layer is combined with the inner surface of the core layer, and the second conductive layer is combined with the outer surface of the core layer; the material of the core layer is Insulation Materials.
  • the thickness dimension of the core layer is ⁇ 1 mm.
  • At least one of the first conductive layer and the second conductive layer is formed on the core layer by electroplating; or,
  • At least one of the first conductive layer and the second conductive layer and the core layer are bonded together by bonding.
  • a first metalized through hole and a second metalized through hole are provided on the substrate, the first metalized through hole is connected to the first electrical connection portion, and the second metalized through hole Connected with the second electrical connection part;
  • a grounding shielding layer is provided on the bottom of the substrate, and the grounding shielding layer is respectively connected to the first metalized through hole and the second metalized through hole.
  • a solder resist material is provided between the first electrical connection portion and the second electrical connection portion.
  • the first electrical connection part has a closed ring structure
  • the second electrical connection part has a closed ring structure.
  • a sound hole is provided on the substrate at a position corresponding to the MEMS chip.
  • the MEMS chip includes a substrate with a back cavity, and a diaphragm and a back plate supported on the substrate, the diaphragm and the back plate are spaced apart; the sound hole and The back cavity is in communication.
  • the sensor packaging structure further includes an ASIC chip
  • the ASIC chip is mounted on the substrate; or,
  • the ASIC chip is embedded in the substrate.
  • the sensor packaging structure further includes a filter component
  • the filter element is mounted on the substrate; or,
  • the filter element is buried inside the substrate.
  • an electronic device including the sensor packaging structure as described above.
  • the sensor packaging structure provided by the embodiment of the present invention improves the structure of the packaging shell.
  • the packaging shell is designed as a two-layer electromagnetic shielding structure, and a core layer is arranged between the two electromagnetic shielding structures.
  • This design can be obvious Improve the ability of the sensor package structure to resist radio frequency interference and avoid electromagnetic waves from affecting it.
  • the double-layer shielding structure is electrically connected together, so that the entire sensor package structure can be easily assembled into the electronic device without the need for additional pads, and the assembly complexity will not increase.
  • the technical task to be achieved or the technical problem to be solved by the present invention is never thought of or unexpected by those skilled in the art, so the present invention is a new technical solution.
  • FIG. 1 is a schematic structural diagram of a sensor packaging structure provided by an embodiment of the present invention.
  • the embodiment of the present invention provides a sensor packaging structure.
  • the sensor packaging structure may be, for example, a MEMS microphone device, etc., which is not limited.
  • the sensor packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, tablet computers, VR devices, and smart wearable devices, and has a wide range of applications.
  • the sensor packaging structure provided by the present invention has good anti-radio frequency interference ability, can effectively shield the influence of electromagnetic waves on its performance, and overcomes the disadvantages of the existing sensor packaging structure.
  • the embodiment of the present invention provides a sensor packaging structure.
  • the structure is as follows: a substrate 1 and a packaging housing 2 provided on the substrate 1, and the substrate 1 and the packaging housing 2 are enclosed together. Synthetic cavity.
  • the sensor package structure provided by the present invention further includes a MEMS chip 3 fixedly arranged on the substrate 1, and the MEMS chip 3 is located inside the cavity, that is, the MEMS chip 3 can be effectively protected by the cavity.
  • the packaging shell 2 is a multi-layer composite structure, which includes a core layer 202, a first conductive layer 201 bonded to the inner surface of the core layer 202, and a second conductive layer bonded to the outer surface of the core layer 202. ⁇ 203.
  • the lower end of the first conductive layer 201 is connected to the substrate 1 through the first electrical connection portion 6.
  • the lower end of the second conductive layer 203 is connected to the substrate 1 through a second electrical connection portion 7.
  • the first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1 and grounded. At this time, a complete two-layer electromagnetic shielding structure can be formed.
  • the sensor packaging structure provided by the embodiment of the present invention improves the structure of the packaging shell 2 thereof.
  • the package housing 2 is designed as a two-layer electromagnetic shielding structure, and a core layer 202 is arranged between the two electromagnetic shielding structures.
  • This design can significantly improve the ability of the sensor package structure to resist radio frequency interference and avoid electromagnetic waves. Make an impact.
  • the packaging shell 2 can also be designed as an electromagnetic shielding structure with more layers.
  • the core layer 202 can be provided between two adjacent electromagnetic shielding structures, and those skilled in the art can flexibly adjust according to actual needs.
  • This design in the present invention can improve the anti-radio frequency interference ability of the sensor package structure to a large extent, and prevent it from being interfered by electromagnetic waves.
  • the double-layer electromagnetic shielding structure that is, the first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1.
  • the substrate 1 of the present invention can be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited in the present invention.
  • the substrate 1 adopts a circuit board to realize the circuit design of the sensor packaging structure.
  • the packaging shell 2 of the present invention includes a core layer 202, a first conductive layer 201 and a second conductive layer 203.
  • the core layer 202 is located in the middle, the first conductive layer 201 is attached to the inner surface of the core layer 202, and the second conductive layer 203 is attached to the outer surface of the core layer 202.
  • At least one of the first conductive layer 201 and the second conductive layer 203 is formed on the core layer 202 by electroplating.
  • At least one of the first conductive layer 201 and the second conductive layer 203 and the core layer 202 are bonded together by bonding.
  • the core layer 202, the first conductive layer 201, and the second conductive layer 203 can be manufactured separately, and then the first conductive layer 201 can be bonded to the core layer 202.
  • the second conductive layer 203 is bonded to the outer surface of the core layer, so that the core layer 202, the first conductive layer 201, and the second conductive layer 203 are The way of bonding is combined together.
  • the package casing 2 of the present invention has a structure as shown in FIG. 1, including a top opposite to the substrate 1 and a side wall extending from the peripheral edge of the top to the direction of the substrate 1.
  • the side wall and the top half surround it. structure.
  • the substrate 1 is fixedly arranged at the position of the opening end of the packaging shell 2 to jointly form a packaging structure with a closed space.
  • the MEMS chip 3 is packaged in the enclosed space.
  • the first conductive layer 201 and the second conductive layer 203 of the package housing 2 can be made of metal materials, for example, to ensure that the formed package structure has a good electromagnetic shielding effect and can protect the MEMS inside. The working performance of the chip 3 will not be affected by the outside, thereby ensuring that the entire sensor packaging structure can work normally.
  • the packaging shell 2 can also be made of other materials well-known in the art, and those skilled in the art can make adjustments as needed, and the present invention does not limit this.
  • the core layer 202 constituting the encapsulation shell 2 can be made of an insulating material, for example, a resin material or the like can be used.
  • a core layer 202 is provided between the first conductive layer 201 and the second conductive layer 203. That is, the first conductive layer 201 and the second conductive layer 203 are not directly attached together, but separated by the core layer 202.
  • the thickness of the core layer 202 is designed to be ⁇ 1 mm.
  • the size of the sensor package structure of the present invention is relatively small. If the thickness of the core layer 202 is designed to be too large, the size of the package shell 2 will be too large, which is not conducive to the assembly of the sensor package structure; The size of the first conductive layer 201 of the inner layer is too small, which results in the size of the cavity enclosed by the package housing 2 and the substrate 1 is too small.
  • a first metalized through hole 101 and a second metalized through hole 102 are respectively provided on the substrate 1.
  • the first metallization via 101 is connected to the first conductive layer 201
  • the second metallization via 102 is connected to the second conductive layer 203.
  • a shielding layer is provided at the bottom of the substrate 1, and the shielding layer is connected to the first metalized through hole 101 and the second metalized through hole 102 respectively. It should be noted that at this time, the shielding layer provided at the bottom of the substrate 1 is connected to the external grounding pad, and grounding is performed through it.
  • a solder resist material 5 is provided between the first electrical connection portion 6 and the second electrical connection portion 7. That is, the first electrical connection portion 6 and the second electrical connection portion 7 are separated by the solder resist material 5 to avoid direct contact between the two.
  • a solder resist material 5 is provided between the first electrical connection portion 6 and the second electrical connection portion 7, which can prevent the first conductive layer 201 and the second conductive layer 203 from being exposed to the solder resist material. 5 corresponds to this position to conduct each other.
  • the solder resist material 5 can be, for example, an insulating resin material or the like. Of course, the solder resist material 5 can also use other insulating materials well known to those skilled in the art, which is not limited in the present invention.
  • the first electrical connection part 6 of the present invention may be a closed ring structure, for example.
  • the lower end of the first conductive layer 201 is fixedly connected to the substrate 1 through the first electrical connection portion 6.
  • the shape of the first electrical connection portion 6 should be adapted to the cross-sectional shape of the first conductive layer 201.
  • the cross-sectional shape of the first conductive layer 201 is circular, and at this time, the shape of the first electrical connection portion 6 is a closed circular ring structure.
  • the cross-sectional shape of the first conductive layer 201 is rectangular, and at this time, the shape of the first electrical connection portion 6 is a closed rectangular ring structure.
  • the second electrical connection portion 7 of the present invention can be the same as the above-mentioned first electrical connection portion 6 in a closed ring structure viewed from the outside, and the lower end of the second conductive layer 203 is fixedly connected to the substrate 1 through the second electrical connection portion 7 .
  • an acoustic hole 103 is provided on the substrate 1 at a position corresponding to the MEMS chip 3.
  • the sound hole 103 can allow external sound and air flow to enter the inside of the sensor packaging structure.
  • those skilled in the art can flexibly adjust the number of sound holes 103 as required.
  • the number of sound holes 103 can be set to one, of course, the number of sound holes 103 can also be set to multiple, which is not limited in the present invention.
  • the sound hole 103 may be, for example, a round hole, a square hole, a rectangular hole, an oval hole, a triangle hole, a rhombus hole, or a parallelogram hole.
  • Various forms of sound holes 103 can achieve the technical effects of the present invention, which are more conducive to processing and manufacturing, and have higher practicability and reliability.
  • the MEMS chip 3 can be mounted on the substrate 1.
  • a special adhesive is used to bond the MEMS chip 3 to the substrate 1.
  • the MEMS chip 3 can also be turned on through the circuit layout in the substrate 1 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.
  • the MEMS chip 3 of the present invention is structured as follows: as shown in FIG. 1, it includes a substrate with a back cavity 301, and a diaphragm 302 and a back plate 303 supported on the substrate. The diaphragm 302 and The back plates 303 are spaced apart. The sound hole 103 is in communication with the back cavity 301, and external sound can directly enter the back cavity 301 of the MEMS chip 3.
  • the sensor package structure of the present invention also includes an ASIC chip 4.
  • the ASIC chip 4 and the MEMS chip 3 are connected together, so that the electrical signal output by the MEMS chip 3 can be transmitted to the ASIC chip 4 and processed and output by the ASIC chip 4.
  • the MEMS chip 3 and the ASIC chip 4 can be electrically connected through metal wires (bonding wires) to realize the conduction between the two.
  • the ASIC chip 4 can be mounted on the substrate 1.
  • a special adhesive is used to bond the ASIC chip 4 to the substrate 1.
  • the ASIC chip 4 can also be embedded in the substrate 1. It should be noted that when the ASIC chip 4 is buried in the substrate 1, at least one metal layer needs to be provided above and below the ASIC chip 4 directly. Wherein, the metal layer may be a copper layer, for example. The metal layer is grounded as a shield. A plurality of metallized vias are arranged in the surrounding area of the ASIC chip 4, which together with the above-mentioned metal layer constitute a shielding structure.
  • the design of embedding the ASIC chip 4 in the substrate 1 eliminates the need to cover the surface of the ASIC chip 4 with protective glue, which simplifies the process and improves the product’s resistance to light noise.
  • embedding the ASIC chip 4 inside the substrate 1 also reduces the volume of the cavity enclosed by the substrate 1 and the package casing 2.
  • the sensor packaging structure of the present invention may also include filter components (not shown in FIG. 1).
  • the filter component can be mounted on the substrate 1.
  • the filter device may also be buried inside the substrate 1.
  • the present invention can further improve the anti-radio frequency interference capability of the entire sensor packaging structure by providing filter components.
  • the present invention also provides an electronic device.
  • the electronic device includes the sensor packaging structure as described above.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
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Abstract

Disclosed in the present invention are a sensor encapsulation structure and an electronic apparatus. The sensor encapsulation structure comprises a substrate and a encapsulation shell arranged on the substrate, with a cavity being enclosed by the substrate and the encapsulation shell; the sensor encapsulation structure further comprises an MEMS chip mounted on the substrate, and the MEMS chip is positioned in the cavity; the encapsulation shell comprises a core layer, a first conductive layer combined on an inner surface of the core layer, and a second conductive layer combined on an outer surface of the core layer; a lower end of the first conductive layer is connected to the substrate by means of a first electric connection portion, and a lower end of the second conductive layer is connected to the substrate by means of a second electric connection portion; and the first conductive layer and the second conductive layer are electrically connected together on the substrate and are grounded. One technical effect of the present invention is that the radio frequency interference resistance of a product can be effectively improved.

Description

一种传感器封装结构以及电子设备Sensor packaging structure and electronic equipment 技术领域Technical field
本发明涉及电声技术领域，更具体地，本发明涉及一种传感器封装结构以及电子设备。The present invention relates to the field of electroacoustic technology, and more specifically, the present invention relates to a sensor packaging structure and electronic equipment.
背景技术Background technique
微机电系统(Micro-Electro-Mechanical System，MEMS)是一种利用微制造工艺制成的小型化机械和电子机械元件。在使用中通常将其与集成电路(Application Specific Integrated Circuit，ASIC)芯片采用相应的技术封装于麦克风等传感器装置中，形成一种传感器封装结构。现如今，内置MEMS芯片的传感器封装结构已经能被装配到诸如手机、平板电脑、笔记本电脑、VR设备以及智能穿戴设备等不同类型的电子设备中，其应用非常广泛。Micro-Electro-Mechanical System (MEMS) is a kind of miniaturized mechanical and electronic mechanical components made by micro-manufacturing technology. In use, it is usually packaged in a sensor device such as a microphone with an integrated circuit (Application Specific Integrated Circuit, ASIC) chip using corresponding technology to form a sensor packaging structure. Nowadays, sensor packaging structures with built-in MEMS chips can be assembled into different types of electronic devices such as mobile phones, tablet computers, notebook computers, VR devices, and smart wearable devices, and their applications are very wide.
从现有技术来看，由MEMS芯片和ASIC芯片组成的芯片组件被安装在由基板和外壳围合而成的一个封装结构的内部，并且在该封装结构上还设置有可供外部声音进入的声孔(当然，声孔可以根据需要设计在基板或外壳上)。然而，现有的这种传感器封装结构，它的外壳通常为单层结构，其抗射频干扰(即抗电磁波干扰)的能力比较弱，这就无法满足一些电子产品的特殊设计要求。Judging from the prior art, a chip assembly composed of a MEMS chip and an ASIC chip is installed in a package structure enclosed by a substrate and a housing, and the package structure is also provided with a device for external sound to enter. The sound hole (of course, the sound hole can be designed on the substrate or the housing as required). However, in the existing sensor packaging structure, its shell is usually a single-layer structure, and its ability to resist radio frequency interference (ie, anti-electromagnetic wave interference) is relatively weak, which cannot meet the special design requirements of some electronic products.
基于此，需要提供一种抗射频干扰能力良好的传感器封装结构，以解决现有技术中存在的问题。Based on this, it is necessary to provide a sensor packaging structure with good anti-radio frequency interference ability to solve the problems existing in the prior art.
发明内容Summary of the invention
本发明的一个目的是提供一种传感器封装结构以及电子设备的新技术方案。An object of the present invention is to provide a sensor packaging structure and a new technical solution for electronic equipment.
根据本发明的第一方面，提供了一种传感器封装结构，包括基板和设置在所述基板上的封装外壳，所述基板与所述封装外壳围成腔体；According to a first aspect of the present invention, there is provided a sensor packaging structure, including a substrate and a packaging shell provided on the substrate, the substrate and the packaging shell enclosing a cavity;
还包括贴装在所述基板上的MEMS芯片，所述MEMS芯片位于所述腔体 内；It also includes a MEMS chip mounted on the substrate, and the MEMS chip is located in the cavity;
所述封装外壳包括第一导电层及第二导电层，所述基板与所述封装外壳连接的表面包括第一电连接部及第二电连接部；所述第一导电层的下端通过第一电连接部与所述基板电连接，所述第二导电层的下端通过第二电连接部与所述基板电连接；所述第一电连接部与所述第二电连接部之间设置有绝缘部，所述第一电连接部与所述第二电连接部分别接地设置。The packaging shell includes a first conductive layer and a second conductive layer, and the surface of the substrate connected to the packaging shell includes a first electrical connection portion and a second electrical connection portion; the lower end of the first conductive layer passes through a first The electrical connection portion is electrically connected to the substrate, and the lower end of the second conductive layer is electrically connected to the substrate through a second electrical connection portion; An insulating portion, the first electrical connection portion and the second electrical connection portion are respectively grounded.
可选地，所述封装外壳还包括芯层；所述第一导电层与所述芯层内表面结合，所述第二导电层与所述芯层外表面结合；所述芯层的材质为绝缘材料。Optionally, the packaging shell further includes a core layer; the first conductive layer is combined with the inner surface of the core layer, and the second conductive layer is combined with the outer surface of the core layer; the material of the core layer is Insulation Materials.
可选地，所述芯层的厚度尺寸为≤1mm。Optionally, the thickness dimension of the core layer is ≤ 1 mm.
可选地，所述第一导电层、所述第二导电层中的至少一个采用电镀的方式形成在所述芯层上；或者是，Optionally, at least one of the first conductive layer and the second conductive layer is formed on the core layer by electroplating; or,
所述第一导电层和所述第二导电层中的至少一个与所述芯层之间采用粘接的方式结合在一起。At least one of the first conductive layer and the second conductive layer and the core layer are bonded together by bonding.
可选地，所述基板上设置有第一金属化通孔和第二金属化通孔，所述第一金属化通孔与所述第一电连接部连接，所述第二金属化通孔与所述第二电连接部连接；Optionally, a first metalized through hole and a second metalized through hole are provided on the substrate, the first metalized through hole is connected to the first electrical connection portion, and the second metalized through hole Connected with the second electrical connection part;
在所述基板的底部设置有接地屏蔽层，所述接地屏蔽层分别与所述第一金属化通孔、所述第二金属化通孔连接。A grounding shielding layer is provided on the bottom of the substrate, and the grounding shielding layer is respectively connected to the first metalized through hole and the second metalized through hole.
可选地，所述第一电连接部与所述第二电连接部之间设置有阻焊材料。Optionally, a solder resist material is provided between the first electrical connection portion and the second electrical connection portion.
可选地，所述第一电连接部呈封闭的环形结构；Optionally, the first electrical connection part has a closed ring structure;
所述第二电连接部呈封闭的环形结构。The second electrical connection part has a closed ring structure.
可选地，所述基板上对应于所述MEMS芯片的位置设置有声孔。Optionally, a sound hole is provided on the substrate at a position corresponding to the MEMS chip.
可选地，所述MEMS芯片包括具有背腔的衬底，以及支撑在所述衬底上的振膜和背极板，所述振膜与所述背极板间隔开；所述声孔与所述背腔连通。Optionally, the MEMS chip includes a substrate with a back cavity, and a diaphragm and a back plate supported on the substrate, the diaphragm and the back plate are spaced apart; the sound hole and The back cavity is in communication.
可选地，所述的传感器封装结构，还包括ASIC芯片；Optionally, the sensor packaging structure further includes an ASIC chip;
所述ASIC芯片贴装在所述基板上；或者是，The ASIC chip is mounted on the substrate; or,
所述ASIC芯片埋设在所述基板内部。The ASIC chip is embedded in the substrate.
可选地，所述的传感器封装结构，还包括滤波器件；Optionally, the sensor packaging structure further includes a filter component;
所述滤波器件贴装在所述基板上；或者是，The filter element is mounted on the substrate; or,
所述滤波器件埋设在所述基板内部。The filter element is buried inside the substrate.
根据本发明的第二方面，提供了一种电子设备，包括如上所述的传感器封装结构。According to a second aspect of the present invention, there is provided an electronic device including the sensor packaging structure as described above.
本发明实施例提供的传感器封装结构，对其封装外壳的结构进行了改进，将封装外壳设计为两层电磁屏蔽结构，并在这两层电磁屏蔽结构之间设置了芯层，该设计能够明显提升传感器封装结构的抗射频干扰的能力，避免电磁波对其产生影响。而且，其中的双层屏蔽结构是电连接在一起，这样可以方便地将整个传感器封装结构装配到电子设备中，无需额外设置过多的焊盘，不会增加装配的复杂度。本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。The sensor packaging structure provided by the embodiment of the present invention improves the structure of the packaging shell. The packaging shell is designed as a two-layer electromagnetic shielding structure, and a core layer is arranged between the two electromagnetic shielding structures. This design can be obvious Improve the ability of the sensor package structure to resist radio frequency interference and avoid electromagnetic waves from affecting it. Moreover, the double-layer shielding structure is electrically connected together, so that the entire sensor package structure can be easily assembled into the electronic device without the need for additional pads, and the assembly complexity will not increase. The technical task to be achieved or the technical problem to be solved by the present invention is never thought of or unexpected by those skilled in the art, so the present invention is a new technical solution.
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.
附图说明Description of the drawings
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.
图1是本发明实施例提供的传感器封装结构的结构示意图。FIG. 1 is a schematic structural diagram of a sensor packaging structure provided by an embodiment of the present invention.
附图标记说明：Description of reference signs:
1-基板，101-第一金属化通孔，102-第二金属化通孔，103-声孔，2-封装外壳，201-第一导电层，202-芯层，203-第二导电层，3-MEMS芯片，301-背腔，302-振膜，303-背极板，4-ASIC芯片，5-阻焊材料，6-第一电连接部，7-第二电连接部。1- substrate, 101- first metalized through hole, 102- second metalized through hole, 103- sound hole, 2- package shell, 201- first conductive layer, 202- core layer, 203- second conductive layer , 3-MEMS chip, 301-back cavity, 302-diaphragm, 303-back plate, 4-ASIC chip, 5-soldering resist material, 6-first electrical connection, 7-second electrical connection.
具体实施方式Detailed ways
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、 数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
本发明实施例提供了一种传感器封装结构。该传感器封装结构例如可以是MEMS麦克风装置等，对此不作限制。该传感器封装结构可应用于手机、笔记本电脑、平板电脑、VR设备以及智能穿戴设备等多种类型的电子产品中，应用较为广泛。本发明提供的传感器封装结构具有良好的抗射频干扰能力，能够有效屏蔽电磁波对其性能的影响，克服了现有传感器封装结构的弊端。The embodiment of the present invention provides a sensor packaging structure. The sensor packaging structure may be, for example, a MEMS microphone device, etc., which is not limited. The sensor packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, tablet computers, VR devices, and smart wearable devices, and has a wide range of applications. The sensor packaging structure provided by the present invention has good anti-radio frequency interference ability, can effectively shield the influence of electromagnetic waves on its performance, and overcomes the disadvantages of the existing sensor packaging structure.
以下就本发明实施例提供的传感器封装结构的具体结构进行进一步地说明。The specific structure of the sensor package structure provided by the embodiment of the present invention will be further described below.
本发明实施例提供了一种传感器封装结构，如图1所示，其结构为：包括基板1以及设置在所述基板1上的封装外壳2，所述基板1与所述封装外壳2一起围合成腔体。本发明提供的传感器封装结构还包括固定设置在所述基板1上的MEMS芯片3，且所述MEMS芯片3位于所述腔体的内部，即可以由腔体对MEMS芯片3进行有效的保护。其中，所述封装外壳2为多层复合结构，其包括有芯层202，以及结合在所述芯层202内表面的第一导电层201和结合在所述芯层202外表面的第二导电层203。所述第一导电层201的下端通过第一电连接部6与所述基板1连接。所述第二导电层203的下端通过第二电连接部7与所述基板1连接。所述第一导电层201与所述第二导电层203在所述基板1上电连接在一起并接地，此时，可以 形成完整的两层电磁屏蔽结构。The embodiment of the present invention provides a sensor packaging structure. As shown in FIG. 1, the structure is as follows: a substrate 1 and a packaging housing 2 provided on the substrate 1, and the substrate 1 and the packaging housing 2 are enclosed together. Synthetic cavity. The sensor package structure provided by the present invention further includes a MEMS chip 3 fixedly arranged on the substrate 1, and the MEMS chip 3 is located inside the cavity, that is, the MEMS chip 3 can be effectively protected by the cavity. Wherein, the packaging shell 2 is a multi-layer composite structure, which includes a core layer 202, a first conductive layer 201 bonded to the inner surface of the core layer 202, and a second conductive layer bonded to the outer surface of the core layer 202.层203. The lower end of the first conductive layer 201 is connected to the substrate 1 through the first electrical connection portion 6. The lower end of the second conductive layer 203 is connected to the substrate 1 through a second electrical connection portion 7. The first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1 and grounded. At this time, a complete two-layer electromagnetic shielding structure can be formed.
本发明实施例提供的传感器封装结构，对其封装外壳2的结构进行了改进。具体地，将封装外壳2设计为两层电磁屏蔽结构，并在这两层电磁屏蔽结构之间设置了芯层202，该设计能够明显提升传感器封装结构的抗射频干扰的能力，避免电磁波对其产生影响。当然，也可以将封装外壳2设计为更多层的电磁屏蔽结构，此时在相邻的两层电磁屏蔽结构之间设置芯层202即可，本领域技术人员可以根据实际需要灵活调整。本发明中的这一设计可以在很大程度上提升传感器封装结构的抗射频干扰的能力，避免其受电磁波的干扰。而且，其中的双层电磁屏蔽结构，即第一导电层201和第二导电层203在基板1上是电连接在一起的，当将整个传感器封装结构装配到电子设备中的时候，无需额外设置过多的焊盘，装配方式简单，不会增加装配的复杂度。The sensor packaging structure provided by the embodiment of the present invention improves the structure of the packaging shell 2 thereof. Specifically, the package housing 2 is designed as a two-layer electromagnetic shielding structure, and a core layer 202 is arranged between the two electromagnetic shielding structures. This design can significantly improve the ability of the sensor package structure to resist radio frequency interference and avoid electromagnetic waves. Make an impact. Of course, the packaging shell 2 can also be designed as an electromagnetic shielding structure with more layers. In this case, the core layer 202 can be provided between two adjacent electromagnetic shielding structures, and those skilled in the art can flexibly adjust according to actual needs. This design in the present invention can improve the anti-radio frequency interference ability of the sensor package structure to a large extent, and prevent it from being interfered by electromagnetic waves. Moreover, the double-layer electromagnetic shielding structure, that is, the first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1. When the entire sensor packaging structure is assembled into an electronic device, no additional configuration is required. Too many pads, simple assembly method, will not increase the complexity of assembly.
本发明的基板1可以采用本领域熟知的电路板，例如可以采用PCB板等，本发明对此不作限制。基板1采用电路板可以实现传感器封装结构的电路设计。The substrate 1 of the present invention can be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited in the present invention. The substrate 1 adopts a circuit board to realize the circuit design of the sensor packaging structure.
本发明的封装外壳2，如图1所示，其包括芯层202、第一导电层201和第二导电层203。其中，所述芯层202位于中部，所述第一导电层201附着在所述芯层202的内表面上，所述第二导电层203附着在所述芯层202的外表面上。The packaging shell 2 of the present invention, as shown in FIG. 1, includes a core layer 202, a first conductive layer 201 and a second conductive layer 203. The core layer 202 is located in the middle, the first conductive layer 201 is attached to the inner surface of the core layer 202, and the second conductive layer 203 is attached to the outer surface of the core layer 202.
在本发明一个可选的例子中，所述第一导电层201、所述第二导电层203中的至少一个采用电镀的方式形成在所述芯层202上。In an optional example of the present invention, at least one of the first conductive layer 201 and the second conductive layer 203 is formed on the core layer 202 by electroplating.
在本发明另一个可选的例子中，所述第一导电层201和所述第二导电层203中的至少一个与所述芯层202之间采用粘接的方式结合在一起。具体来说，可以先将所述芯层202、所述第一导电层201以及所述第二导电层203分别制作出，然后将所述第一导电层201粘接在所述芯层202的内表面上，将所述第二导电层203粘接在所述芯层的外表面上，以使所述芯层202、所述第一导电层201和所述第二导电层203之间采用粘接的方式结合在一起。In another optional example of the present invention, at least one of the first conductive layer 201 and the second conductive layer 203 and the core layer 202 are bonded together by bonding. Specifically, the core layer 202, the first conductive layer 201, and the second conductive layer 203 can be manufactured separately, and then the first conductive layer 201 can be bonded to the core layer 202. On the inner surface, the second conductive layer 203 is bonded to the outer surface of the core layer, so that the core layer 202, the first conductive layer 201, and the second conductive layer 203 are The way of bonding is combined together.
本发明的封装外壳2，其结构为：如图1所示，包括与基板1相对的 顶部以及从顶部四周边缘朝向基板1方向延伸的侧壁部，由侧壁部与顶部围成了半包围结构。基板1被固定设置在封装外壳2的开口端位置，共同形成了具有封闭空间的封装结构。所述MEMS芯片3被封装在该封闭空间内部。The package casing 2 of the present invention has a structure as shown in FIG. 1, including a top opposite to the substrate 1 and a side wall extending from the peripheral edge of the top to the direction of the substrate 1. The side wall and the top half surround it. structure. The substrate 1 is fixedly arranged at the position of the opening end of the packaging shell 2 to jointly form a packaging structure with a closed space. The MEMS chip 3 is packaged in the enclosed space.
本发明中，构成所述封装外壳2的第一导电层201和第二导电层203例如可以选用金属材料制作而成，以保证形成的封装结构具有良好的电磁屏蔽效果，能保障其内部的MEMS芯片3的工作性能不会受到外界影响，从而确保整个传感器封装结构能够正常的工作。当然，封装外壳2也可以采用本领域熟知的其他材料制作，本领域技术人员可以根据需要进行调整，本发明对此不作限制。构成所述封装外壳2的芯层202可以选用绝缘材料制作而成，例如可以采用树脂材料等。In the present invention, the first conductive layer 201 and the second conductive layer 203 of the package housing 2 can be made of metal materials, for example, to ensure that the formed package structure has a good electromagnetic shielding effect and can protect the MEMS inside. The working performance of the chip 3 will not be affected by the outside, thereby ensuring that the entire sensor packaging structure can work normally. Of course, the packaging shell 2 can also be made of other materials well-known in the art, and those skilled in the art can make adjustments as needed, and the present invention does not limit this. The core layer 202 constituting the encapsulation shell 2 can be made of an insulating material, for example, a resin material or the like can be used.
本发明的封装外壳2，其中的第一导电层201与第二导电层203之间设置有芯层202。即，第一导电层201与第二导电层203并非是直接贴合在一起的，而是通过芯层202隔开的。在本发明的一个可选的例子中，将所述芯层202的厚度设计为≤1mm。本发明的传感器封装结构本身的尺寸比较小，若将芯层202的厚度设计的过大，就会造成封装外壳2的尺寸过大，这样不利于传感器封装结构装配；又或者是，会造成位于内层的第一导电层201的尺寸过小，导致封装外壳2与基板1围成的腔体尺寸过小。In the packaging shell 2 of the present invention, a core layer 202 is provided between the first conductive layer 201 and the second conductive layer 203. That is, the first conductive layer 201 and the second conductive layer 203 are not directly attached together, but separated by the core layer 202. In an optional example of the present invention, the thickness of the core layer 202 is designed to be ≤1 mm. The size of the sensor package structure of the present invention is relatively small. If the thickness of the core layer 202 is designed to be too large, the size of the package shell 2 will be too large, which is not conducive to the assembly of the sensor package structure; The size of the first conductive layer 201 of the inner layer is too small, which results in the size of the cavity enclosed by the package housing 2 and the substrate 1 is too small.
本发明的传感器封装结构，如图1所示，在所述基板1上分别设置有第一金属化通孔101和第二金属化通孔102。所述第一金属化通孔101与所述第一导电层201连接，所述第二金属化通孔102与所述第二导电层203连接。并且，在所述基板1的底部设置有屏蔽层，所述屏蔽层分别与所述第一金属化通孔101、所述第二金属化通孔102连接。需要说明的是，此时在所述基板1底部设置的屏蔽层是与外部接地焊盘连接的，通过其进行接地。In the sensor package structure of the present invention, as shown in FIG. 1, a first metalized through hole 101 and a second metalized through hole 102 are respectively provided on the substrate 1. The first metallization via 101 is connected to the first conductive layer 201, and the second metallization via 102 is connected to the second conductive layer 203. In addition, a shielding layer is provided at the bottom of the substrate 1, and the shielding layer is connected to the first metalized through hole 101 and the second metalized through hole 102 respectively. It should be noted that at this time, the shielding layer provided at the bottom of the substrate 1 is connected to the external grounding pad, and grounding is performed through it.
如图1所示，在本发明的基板1上，所述第一电连接部6与所述第二电连接部7之间设置有阻焊材料5。即，由阻焊材料5将第一电连接部6和第二电连接部7隔离开来，避免二者直接接触。本发明中在所述第一电连接部6和所述第二电连接部7之间设置阻焊材料5，可以防止所述第一 导电层201和所述第二导电层203在阻焊材料5对应的这一位置相互导通。所述阻焊材料5例如可以采用绝缘的树脂材料等。当然，所述阻焊材料5也可以采用本领域技术人员熟知的其它绝缘材料，本发明对此不作限制。As shown in FIG. 1, on the substrate 1 of the present invention, a solder resist material 5 is provided between the first electrical connection portion 6 and the second electrical connection portion 7. That is, the first electrical connection portion 6 and the second electrical connection portion 7 are separated by the solder resist material 5 to avoid direct contact between the two. In the present invention, a solder resist material 5 is provided between the first electrical connection portion 6 and the second electrical connection portion 7, which can prevent the first conductive layer 201 and the second conductive layer 203 from being exposed to the solder resist material. 5 corresponds to this position to conduct each other. The solder resist material 5 can be, for example, an insulating resin material or the like. Of course, the solder resist material 5 can also use other insulating materials well known to those skilled in the art, which is not limited in the present invention.
本发明的第一电连接部6例如可以呈封闭的环形结构。第一导电层201的下端通过第一电连接部6固定连接在基板1上。其中，第一电连接部6的形状应当与第一导电层201的横截面形状相适配。例如，第一导电层201的横截面形状呈圆形，此时第一电连接部6的形状则为封闭的圆环形结构。又例如，第一导电层201的横截面形状呈矩形，此时第一电连接部6的形状则为封闭的矩形环结构。The first electrical connection part 6 of the present invention may be a closed ring structure, for example. The lower end of the first conductive layer 201 is fixedly connected to the substrate 1 through the first electrical connection portion 6. Among them, the shape of the first electrical connection portion 6 should be adapted to the cross-sectional shape of the first conductive layer 201. For example, the cross-sectional shape of the first conductive layer 201 is circular, and at this time, the shape of the first electrical connection portion 6 is a closed circular ring structure. For another example, the cross-sectional shape of the first conductive layer 201 is rectangular, and at this time, the shape of the first electrical connection portion 6 is a closed rectangular ring structure.
本发明的第二电连接部7可以如上述的第一电连接部6一样，从外形看呈封闭的环形结构，第二导电层203的下端通过第二电连接部7固定连接在基板1上。The second electrical connection portion 7 of the present invention can be the same as the above-mentioned first electrical connection portion 6 in a closed ring structure viewed from the outside, and the lower end of the second conductive layer 203 is fixedly connected to the substrate 1 through the second electrical connection portion 7 .
本发明的传感器封装结构，如图1所示，在所述基板1上对应于所述MEMS芯片3的位置设置有声孔103。所述声孔103可以供外部的声音、气流进入到传感器封装结构的内部。其中，本领域技术人员可以根据需要灵活调整声孔103的设置数量。例如，所述声孔103可以设置为一个，当然，声孔103也可以设置为多个，本发明对此不作限制。此外，所述声孔103例如可以为圆形孔，正方形孔、长方形孔、椭圆形孔、三角形孔、菱形孔或平行四边形孔等。多种形式的声孔103均可实现本发明的技术效果，更加有利于加工制造，实用性、可靠性更高。In the sensor package structure of the present invention, as shown in FIG. 1, an acoustic hole 103 is provided on the substrate 1 at a position corresponding to the MEMS chip 3. The sound hole 103 can allow external sound and air flow to enter the inside of the sensor packaging structure. Among them, those skilled in the art can flexibly adjust the number of sound holes 103 as required. For example, the number of sound holes 103 can be set to one, of course, the number of sound holes 103 can also be set to multiple, which is not limited in the present invention. In addition, the sound hole 103 may be, for example, a round hole, a square hole, a rectangular hole, an oval hole, a triangle hole, a rhombus hole, or a parallelogram hole. Various forms of sound holes 103 can achieve the technical effects of the present invention, which are more conducive to processing and manufacturing, and have higher practicability and reliability.
如图1所示，所述MEMS芯片3可以被贴装在基板1上。例如，采用专门的胶黏剂将MEMS芯片3粘接在基板1上。当然，MEMS芯片3也可以采用倒装的方式通过基板1中的电路布图导通，这属于本领域技术人员的公知常识，本发明在此不再具体说明。As shown in FIG. 1, the MEMS chip 3 can be mounted on the substrate 1. For example, a special adhesive is used to bond the MEMS chip 3 to the substrate 1. Of course, the MEMS chip 3 can also be turned on through the circuit layout in the substrate 1 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.
本发明的MEMS芯片3，其结构为：如图1所示，包括具有背腔301的衬底，以及支撑在所述衬底上的振膜302和背极板303，所述振膜302与所述背极板303间隔开来。所述声孔103与所述背腔301连通，外部的声音可以直接进入到MEMS芯片3的背腔301内。The MEMS chip 3 of the present invention is structured as follows: as shown in FIG. 1, it includes a substrate with a back cavity 301, and a diaphragm 302 and a back plate 303 supported on the substrate. The diaphragm 302 and The back plates 303 are spaced apart. The sound hole 103 is in communication with the back cavity 301, and external sound can directly enter the back cavity 301 of the MEMS chip 3.
除了上述的MEMS芯片3之外，本发明的传感器封装结构还包括有ASIC 芯片4。通常，ASIC芯片4与MEMS芯片3连接在一起，使得MEMS芯片3输出的电信号可以传输到ASIC芯片4中，并被ASIC芯片4处理、输出。其中，MEMS芯片3与ASIC芯片4之间可以通过金属导线(焊线)进行电性连接，以实现二者的导通。In addition to the aforementioned MEMS chip 3, the sensor package structure of the present invention also includes an ASIC chip 4. Generally, the ASIC chip 4 and the MEMS chip 3 are connected together, so that the electrical signal output by the MEMS chip 3 can be transmitted to the ASIC chip 4 and processed and output by the ASIC chip 4. Among them, the MEMS chip 3 and the ASIC chip 4 can be electrically connected through metal wires (bonding wires) to realize the conduction between the two.
在本发明中，ASIC芯片4可以贴装在基板1上。例如，采用专门的胶黏剂将ASIC芯片4粘接在基板1上。In the present invention, the ASIC chip 4 can be mounted on the substrate 1. For example, a special adhesive is used to bond the ASIC chip 4 to the substrate 1.
此外，本发明中还可以将ASIC芯片4埋设在基板1的内部。需要说明的是，当将ASIC芯片4埋入基板1内的时候，需要在ASIC芯片4正对的上方和下方至少各设置一层金属层。其中，所述金属层例如可以为铜层。金属层接地作为屏蔽。ASIC芯片4周围区域布置有多个金属化过孔，与上述金属层一起构成屏蔽结构。将ASIC芯片4埋入基板1内的设计，使得不必在ASIC芯片4表面包覆保护胶，这样简化了工艺，同时提升了产品的光噪声抵抗能力。并且，将ASIC芯片4埋入基板1内部，还减少了占用基板1和封装外壳2围成的腔体体积。In addition, in the present invention, the ASIC chip 4 can also be embedded in the substrate 1. It should be noted that when the ASIC chip 4 is buried in the substrate 1, at least one metal layer needs to be provided above and below the ASIC chip 4 directly. Wherein, the metal layer may be a copper layer, for example. The metal layer is grounded as a shield. A plurality of metallized vias are arranged in the surrounding area of the ASIC chip 4, which together with the above-mentioned metal layer constitute a shielding structure. The design of embedding the ASIC chip 4 in the substrate 1 eliminates the need to cover the surface of the ASIC chip 4 with protective glue, which simplifies the process and improves the product’s resistance to light noise. In addition, embedding the ASIC chip 4 inside the substrate 1 also reduces the volume of the cavity enclosed by the substrate 1 and the package casing 2.
本发明的传感器封装结构，还可以包括滤波器件(图1中未示出)。例如，滤波器件可以贴装在基板1上。又例如，滤波器件也可以埋设在基板1内部。本发明通过设置滤波器件，能够进一步提升整个传感器封装结构的抗射频干扰能力。The sensor packaging structure of the present invention may also include filter components (not shown in FIG. 1). For example, the filter component can be mounted on the substrate 1. For another example, the filter device may also be buried inside the substrate 1. The present invention can further improve the anti-radio frequency interference capability of the entire sensor packaging structure by providing filter components.
另一方面，本发明还提供了一种电子设备。该电子设备包括如前所述的传感器封装结构。On the other hand, the present invention also provides an electronic device. The electronic device includes the sensor packaging structure as described above.
其中，所述电子设备可以是手机、笔记本电脑、平板电脑、VR设备、智能穿戴设备等，本发明对此不作限制。Wherein, the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (12)

  1. 一种传感器封装结构，其特征在于：包括基板和设置在所述基板上的封装外壳，所述基板与所述封装外壳围成腔体；A sensor packaging structure, characterized in that it comprises a substrate and an encapsulation shell arranged on the substrate, and the substrate and the encapsulation shell enclose a cavity;
    还包括贴装在所述基板上的MEMS芯片，所述MEMS芯片位于所述腔体内；It also includes a MEMS chip mounted on the substrate, and the MEMS chip is located in the cavity;
    所述封装外壳包括第一导电层及第二导电层，所述基板与所述封装外壳连接的表面包括第一电连接部及第二电连接部；所述第一导电层的下端通过第一电连接部与所述基板电连接，所述第二导电层的下端通过第二电连接部与所述基板电连接；所述第一电连接部与所述第二电连接部之间设置有绝缘部，所述第一电连接部与所述第二电连接部分别接地设置。The packaging shell includes a first conductive layer and a second conductive layer, and the surface of the substrate connected to the packaging shell includes a first electrical connection portion and a second electrical connection portion; the lower end of the first conductive layer passes through a first The electrical connection portion is electrically connected to the substrate, and the lower end of the second conductive layer is electrically connected to the substrate through a second electrical connection portion; An insulating portion, the first electrical connection portion and the second electrical connection portion are respectively grounded.
  2. 根据权利要求1所述的传感器封装结构，其特征在于：所述封装外壳还包括芯层；所述第一导电层与所述芯层内表面结合，所述第二导电层与所述芯层外表面结合；所述芯层的材质为绝缘材料。The sensor packaging structure of claim 1, wherein the packaging shell further comprises a core layer; the first conductive layer is combined with the inner surface of the core layer, and the second conductive layer is connected to the core layer. The outer surface is combined; the material of the core layer is an insulating material.
  3. 根据权利要求2所述的传感器封装结构，其特征在于：所述芯层的厚度尺寸为≤1mm。The sensor packaging structure according to claim 2, wherein the thickness of the core layer is ≤ 1 mm.
  4. 根据权利要求2所述的传感器封装结构，其特征在于：所述第一导电层、所述第二导电层中的至少一个采用电镀的方式形成在所述芯层上；或者是，The sensor package structure according to claim 2, wherein at least one of the first conductive layer and the second conductive layer is formed on the core layer by electroplating; or,
    所述第一导电层和所述第二导电层中的至少一个与所述芯层之间采用粘接的方式结合在一起。At least one of the first conductive layer and the second conductive layer and the core layer are bonded together by bonding.
  5. 根据权利要求1所述的传感器封装结构，其特征在于：所述基板上设置有第一金属化通孔和第二金属化通孔，所述第一金属化通孔与所述第一电连接部连接，所述第二金属化通孔与所述第二电连接部连接；The sensor package structure according to claim 1, wherein a first metalized through hole and a second metalized through hole are provided on the substrate, and the first metalized through hole is electrically connected to the first through hole. Part connection, the second metallized through hole is connected to the second electrical connection part;
    在所述基板的底部设置有接地屏蔽层，所述接地屏蔽层分别与所述第 一金属化通孔、所述第二金属化通孔连接。A grounding shielding layer is provided on the bottom of the substrate, and the grounding shielding layer is respectively connected to the first metalized through hole and the second metalized through hole.
  6. 根据权利要求1所述的传感器封装结构，其特征在于：所述第一电连接部与所述第二电连接部之间设置有阻焊材料。The sensor package structure of claim 1, wherein a solder resist material is provided between the first electrical connection portion and the second electrical connection portion.
  7. 根据权利要求1所述的传感器封装结构，其特征在于：所述第一电连接部呈封闭的环形结构；The sensor packaging structure according to claim 1, wherein the first electrical connection portion has a closed ring structure;
    所述第二电连接部呈封闭的环形结构。The second electrical connection part has a closed ring structure.
  8. 根据权利要求1所述的传感器封装结构，其特征在于：所述基板上对应于所述MEMS芯片的位置设置有声孔。The sensor package structure according to claim 1, wherein a sound hole is provided on the substrate at a position corresponding to the MEMS chip.
  9. 根据权利要求8所述的传感器封装结构，其特征在于：所述MEMS芯片包括具有背腔的衬底，以及支撑在所述衬底上的振膜和背极板，所述振膜与所述背极板间隔开；所述声孔与所述背腔连通。The sensor package structure according to claim 8, wherein the MEMS chip comprises a substrate with a back cavity, and a diaphragm and a back plate supported on the substrate, the diaphragm and the The back plates are spaced apart; the sound hole communicates with the back cavity.
  10. 根据权利要求1所述的传感器封装结构，其特征在于：还包括ASIC芯片；The sensor package structure according to claim 1, characterized in that it further comprises an ASIC chip;
    所述ASIC芯片贴装在所述基板上；或者是，The ASIC chip is mounted on the substrate; or,
    所述ASIC芯片埋设在所述基板内部。The ASIC chip is embedded in the substrate.
  11. 根据权利要求1所述的传感器封装结构，其特征在于：还包括滤波器件；The sensor packaging structure according to claim 1, characterized in that it further comprises a filter element;
    所述滤波器件贴装在所述基板上；或者是，The filter component is mounted on the substrate; or,
    所述滤波器件埋设在所述基板内部。The filter element is embedded in the substrate.
  12. 一种电子设备，其特征在于：包括如权利要求1-11任意一项所述的传感器封装结构。An electronic device, characterized by comprising the sensor packaging structure according to any one of claims 1-11.
PCT/CN2019/130228 2019-10-28 2019-12-31 Sensor encapsulation structure and electronic apparatus WO2021082270A1 (en)

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