CN207269267U - A kind of noise control silicon microphone - Google Patents
A kind of noise control silicon microphone Download PDFInfo
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- CN207269267U CN207269267U CN201721132816.5U CN201721132816U CN207269267U CN 207269267 U CN207269267 U CN 207269267U CN 201721132816 U CN201721132816 U CN 201721132816U CN 207269267 U CN207269267 U CN 207269267U
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- silicon microphone
- acoustic aperture
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Abstract
The utility model discloses a kind of noise control silicon microphone, including:PCB and the first shell, first shell are installed on the PCB and form accommodating chamber, and the MEMS chip and IC chip of attachment on the pcb are equipped with the accommodating chamber;The second housing more than first shell is also equipped with the PCB, the second housing is by first casing cover together in interior, first shell is equipped with the first acoustic aperture, the second housing is equipped with the second acoustic aperture, and the dust-proof sound passing membrane of light blocking for sealing first acoustic aperture and second acoustic aperture is equipped between first shell and the second housing.The utility model embodiment has the following advantages:Prevent ambient from entering inside silicon microphone, optical noise can be avoided the formation of;In addition, double casing plays the role of electromagnetic shielding, it is not easy to receives the electromagnetic interference of the signals such as extraneous radio frequency, improves the call tone quality of silicon microphone.
Description
Technical field
It the utility model is related to silicon microphone technical field, and in particular to a kind of noise control silicon microphone.
Background technology
Conventional silicon microphone product includes the encapsulating structure that PCB and metal shell are formed, and use is provided with metal shell
In being provided with MEMS (Micro-Electro- in the acoustic aperture for receiving external sound signal, the PCB inside encapsulating structure
Mechanical Systems, MEMS)Chip and IC(Integrated Circuit, integrated circuit)Chip, MEMS
The voice signal being passed to out of acoustic aperture can be transformed into electric signal by chip, and MEMS chip is electrically connected with the IC chip on wiring board
Connect, the voice signal of MEMS chip transformation is further handled through IC chip, and external circuit is connected to by PCB.
Due to being provided with the acoustic aperture connected with exterior space on silicon microphone, this has resulted in extraneous light easily from acoustic aperture
Irradiate into inside silicon microphone, once light is irradiated to MEMS chip and IC chip, optical noise will be formed, to silicon microphone
Electrical property has an impact, and causes distortion or failure that sound passes to.
Utility model content
The utility model embodiment provides a kind of noise control silicon microphone, for the influence of optical noise to be reduced or avoided.
Used technical solution is as follows:
A kind of noise control silicon microphone, including:PCB(10)With the first shell(11), first shell(11)It is installed on institute
State PCB(10)Go up and form accommodating chamber(13), the accommodating chamber(13)Interior be equipped with is mounted on the PCB(10)On MEMS chip
(14)And IC chip(15);
The PCB(10)On be also equipped with being more than first shell(11)Second housing(12), the second housing
(12)By first shell(11)In being covered on, first shell(11)It is equipped with the first acoustic aperture(21), outside described second
Shell(12)It is equipped with the second acoustic aperture(22), first shell(11)With the second housing(12)Between be equipped with and seal described the
One acoustic aperture(21)With second acoustic aperture(22)The dust-proof sound passing membrane of light blocking(30).
Optionally, first acoustic aperture(21)With second acoustic aperture(22)Position mutually stagger.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages:
By setting double casing, acoustic aperture is set respectively on double casing, and sets light blocking dust-proof between double casing
Sound passing membrane, then, external sound can not influence pickup from smoothly entering inside silicon microphone;Meanwhile ambient is prevented by light blocking
Dirt sound passing membrane blocks, it is impossible into inside silicon microphone, will not be irradiated in MEMS chip and IC chip, would not form light and make an uproar
Sound.
In addition, the first and second double casings can play the role of electromagnetic shielding so that the noise control silicon microphone is not allowed
Easily by the electromagnetic interference of the signals such as extraneous radio frequency, the call tone quality of silicon microphone is improved.
Brief description of the drawings
, below will be to embodiment and description of the prior art in order to illustrate more clearly of the utility model embodiment technical solution
Needed in attached drawing be briefly described, it should be apparent that, drawings in the following description are only the utility model
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is a kind of structure diagram for noise control silicon microphone that the utility model embodiment one provides;
Fig. 2 is a kind of structure diagram for noise control silicon microphone that the utility model embodiment two provides.
Embodiment
It is real below in conjunction with the utility model in order to make those skilled in the art more fully understand the utility model
The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only the embodiment of the utility model part, instead of all the embodiments.Based on the reality in the utility model
Apply example, those of ordinary skill in the art's all other embodiments obtained without making creative work, all should
When the scope for belonging to the utility model protection.
Term " first " in the specification and claims of the utility model and above-mentioned attached drawing, " second ", " the 3rd "
Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they
Any deformation, it is intended that cover non-exclusive include.Such as contain the process of series of steps or unit, method, system,
The step of product or equipment are not limited to list or unit, but the step of not listing or unit are alternatively further included,
Or alternatively further include for the intrinsic other steps of these processes, method, product or equipment or unit.
Below by specific embodiment, it is described in detail respectively.
Please refer to Fig.1, the embodiment one of the use of the new type, there is provided a kind of noise control silicon microphone, it may include:
PCB10 and the first shell 11, first shell 11 is installed on the PCB10 and forms accommodating chamber 13, described
The MEMS chip 14 and IC chip 15 being mounted on the PCB10 are equipped with accommodating chamber 13;MEMS chip(DIE)It is silicon substrate core
Piece, is used for realization acoustic-electric conversion;IC chip is specially ASIC(Application Specific Integrated Circuit,
Application-specific integrated circuit), the electric signal for being changed to MEMS DIE, which is done, the processing such as amplifies, and then exports to PCB.PCB is equipped with
The input/output structures such as pad.
It is particular in that:It is also equipped with the second housing 12 more than first shell 11 on the PCB10, described the
In first shell 11 is covered on by two shells 12, first shell 11 is equipped with the first acoustic aperture 21, the second housing
12 are equipped with the second acoustic aperture 22, are equipped between first shell 11 and the second housing 12 and seal 21 He of the first acoustic aperture
The dust-proof sound passing membrane 30 of light blocking of second acoustic aperture 22.
Optionally, the dust-proof sound passing membrane 30 of the light blocking can use Air Filter.
Optionally, the position of first acoustic aperture 21 and second acoustic aperture 22 is mutually staggered.
By setting double casing and two layers of acoustic aperture, and the dust-proof sound passing membrane of light blocking, then, extraneous sound are set between double casing
Sound can smoothly enter inside silicon microphone, not influence pickup;Meanwhile ambient is blocked by the dust-proof sound passing membrane of light blocking, it is impossible to
It into inside silicon microphone, will not be irradiated in MEMS chip and IC chip, optical noise would not be formed, will not be to silicon microphone
Electrical property have an impact, it is ensured that pickup quality.
Please refer to Fig.2, the embodiment two of the use of the new type, the noise control silicon microphone provided above-described embodiment one carries out
Some are improved, and improvements may include:The 3rd acoustic aperture 23 covered by the MEMS chip 14, institute are additionally provided with the PCB10
State the inner cavity 16 that the 3rd acoustic aperture 23 connects the MEMS chip 14.Other structures then remain unchanged.
In this way, improved silicon microphone just has two into sound passage, one of them is made of the 3rd acoustic aperture 23, another
It is a to be made of the first acoustic aperture 21 and the second acoustic aperture 22, so that, by embodiment one all referring to silicon microphone, it transform double direction silicon as
Microphone.
Please continue to refer to Fig. 2, the embodiment three of the use of the new type, to the noise control silicon microphone that above-described embodiment two provides into
Some improvement are gone, improvements may include:The dust-proof sound passing membrane 30 of the light blocking is used as using damping, that is to say, that first
What 21 and second acoustic aperture 22 of acoustic aperture was formed damps into setting in sound passage.
In this way, improved silicon microphone just has two into sound passage, one of them is made of the 3rd acoustic aperture 23, another
It is a be made of the first acoustic aperture 21 and the second acoustic aperture 22 and should into being equipped with damping in sound passage to control the volume of entrance so that, will
Double direction silicon microphones of embodiment two, transform single direction silicon microphone as.
What deserves to be explained is in above-described embodiment one, two and three, following improvement can also be included:
The material of first shell 11 and the second housing 12 is the material with electro-magnetic screen function so that should
Noise control silicon microphone is not susceptible to the electromagnetic interference of the signals such as extraneous radio frequency, can improve the call tone quality of silicon microphone.
Optionally, first shell 11 and the second housing 12 are metal shell, such as aluminum alloy casing.
Optionally, the second housing 12 can pass through the line-to-ground on the PCB10.It is thus possible to avoid silicon Mike
The electric field of wind influences external circuits.
Optionally, the spacing of first shell 11 and the second housing 12 is between 1mm to 5mm.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages:
By setting double casing, acoustic aperture is set respectively on double casing, and sets light blocking dust-proof between double casing
Sound passing membrane, then, external sound can smoothly enter inside silicon microphone, not influence pickup;Meanwhile the acoustic aperture on double casing is wrong
Open, in this way, ambient is blocked by the dust-proof sound passing membrane of light blocking, it is impossible into inside silicon microphone, MEMS chip will not be irradiated to
In IC chip, optical noise would not be formed.
In addition, the first and second double casings can play the role of electromagnetic shielding so that the noise control silicon microphone is not allowed
Easily by the electromagnetic interference of the signals such as extraneous radio frequency, the call tone quality of silicon microphone is improved., can be with by the way that double casing is grounded
Make silicon microphone not only from the influence of external electromagnetic signal, but also do not influence external electrical field, it is ensured that the reliability of silicon microphone, and can
Realize the flexible topology of silicon microphone.
In addition, by setting double casing, the ability of silicon microphone tolerance Reflow Soldering can be strengthened, enhance silicon microphone
Reliability.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations;The common skill of this area
Art personnel should be understood:It can still modify the technical solution described in the various embodiments described above, or to its middle part
Technical characteristic is divided to carry out equivalent substitution;And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality
The spirit and scope of new each embodiment technical solution.
Claims (8)
- A kind of 1. noise control silicon microphone, it is characterised in that including:PCB(10)With the first shell(11), first shell(11)It is installed on the PCB(10)Go up and form accommodating chamber (13), the accommodating chamber(13)Interior be equipped with is mounted on the PCB(10)On MEMS chip(14)And IC chip(15);The PCB(10)On be also equipped with being more than first shell(11)Second housing(12), the second housing(12) By first shell(11)In being covered on, first shell(11)It is equipped with the first acoustic aperture(21), the second housing (12)It is equipped with the second acoustic aperture(22), first shell(11)With the second housing(12)Between be equipped with sealing described first Acoustic aperture(21)With second acoustic aperture(22)The dust-proof sound passing membrane of light blocking(30).
- 2. noise control silicon microphone according to claim 1, it is characterised in thatFirst acoustic aperture(21)With second acoustic aperture(22)Position mutually stagger.
- 3. noise control silicon microphone according to claim 1, it is characterised in thatThe PCB(10)It is equipped with by the MEMS chip(14)3rd acoustic aperture of covering(23), the 3rd acoustic aperture(23)Even Lead to the MEMS chip(14)Inner cavity(16).
- 4. noise control silicon microphone according to claim 2, it is characterised in thatThe dust-proof sound passing membrane of light blocking(30)Specially damp.
- 5. noise control silicon microphone according to claim 1, it is characterised in thatFirst shell(11)With the second housing(12)Material be the material with electro-magnetic screen function.
- 6. noise control silicon microphone according to claim 5, it is characterised in thatFirst shell(11)With the second housing(12)It is metal shell.
- 7. noise control silicon microphone according to claim 6, it is characterised in thatThe second housing(12)Pass through the PCB(10)On line-to-ground.
- 8. noise control silicon microphone according to claim 1, it is characterised in thatFirst shell(11)With the second housing(12)Spacing between 1mm to 5mm.
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CN201721132816.5U CN207269267U (en) | 2017-09-05 | 2017-09-05 | A kind of noise control silicon microphone |
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CN201721132816.5U CN207269267U (en) | 2017-09-05 | 2017-09-05 | A kind of noise control silicon microphone |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110482478A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
CN110526199A (en) * | 2019-09-10 | 2019-12-03 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
WO2021082270A1 (en) * | 2019-10-28 | 2021-05-06 | 歌尔微电子有限公司 | Sensor encapsulation structure and electronic apparatus |
-
2017
- 2017-09-05 CN CN201721132816.5U patent/CN207269267U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110482478A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
CN110526199A (en) * | 2019-09-10 | 2019-12-03 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
WO2021082270A1 (en) * | 2019-10-28 | 2021-05-06 | 歌尔微电子有限公司 | Sensor encapsulation structure and electronic apparatus |
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