CN203461813U

CN203461813U - MEMS packaging structure

Info

Publication number: CN203461813U
Application number: CN201320428871.4U
Authority: CN
Inventors: 张睿; 吴志江; 孟珍奎
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2013-07-18
Filing date: 2013-07-18
Publication date: 2014-03-05
Anticipated expiration: 2023-07-18

Abstract

The utility model provides an MEMS packaging structure. The MEMS packaging structure includes a substrate, an ASIC chip arranged on the substrate and connected with the substrate electrically and at least two MEMS sensors arranged on the substrate and having different functions. The MEMS sensors are both connected with the ASIC chip electrically. By packaging the at least two MEMS sensors having different functions and the ASIC chip on the substrate, a compact structure is realized and complete functions can be realized in a condition that the packaging size is reduced. At the same time, the ASIC chip collects and processes signals of different chips and performs superposition of output signals of the chips of the same kinds, so that natural elimination of random errors and noise in the output signals can be realized and precision of output signals of a product is improved. Also, intensity of integral input signals of the ASIC chip can be enhanced and product performance is improved.

Description

MEMS encapsulation

[technical field]

The utility model relates to a kind of MEMS(Micro of utilization Electro Mechanical System) sensor (MEMS sensor) that technology is manufactured, relate in particular to a kind of MEMS encapsulation.

[background technology]

MEMS (Micro Electro Mechanical Systems) refers to the Micro Electro Mechanical System that integrates microsensor, actuator, signal processor, control circuit, interface circuit, communication and power supply.It relates to multiple subject and the technology such as electronics, machinery, material, physics, chemistry, biology, medical science, has broad application prospects.MEMS sensor is to adopt microelectronics and the produced novel sensor of micromachining technology.Compare with traditional sensor, it has, and volume is little, lightweight, cost is low, low in energy consumption, reliability is high, be suitable for mass production, be easy to integrated and realize intelligentized feature.Meanwhile, the characteristic size in micron dimension makes it can complete the irrealizable function of some traditional mechanical pick-up device.

MEMS encapsulation of the prior art, conventionally single MEMS pressure sensor and single MEMS microphone are encapsulated to realize corresponding function with single asic chip based on pcb board respectively, under this structure, if realize several functions, need to adopt different encapsulation to realize, be unfavorable for cost savings.Secondly, often there is random error and noise in the output signal of single package, and these random errors and noise can not be subdued voluntarily, is therefore also unfavorable for the raising of product output signal precision.

Therefore, be necessary to provide a kind of novel MEMS encapsulation.

[utility model content]

The purpose of this utility model is to provide a kind of structure more compact and can under less package dimension, realize the MEMS encapsulation of more perfect function.

The technical solution of the utility model is as follows: a kind of MEMS encapsulation, it comprises substrate, is located on described substrate and the asic chip being electrically connected to described substrate and at least two kinds of MEMS sensors of being located on described substrate and having difference in functionality, and described MEMS sensor is all electrically connected to described asic chip.

Preferably, described MEMES sensor comprises at least one MEMS pressure sensor and at least one MEMS microphone.

Preferably, this MEMS encapsulation also comprises binding gold thread, and described MEMS sensor is electrically connected to described asic chip by described binding gold thread.

Preferably, described substrate is pcb board.

Preferably, described pcb board is provided with wire, and described MEMS sensor is electrically connected to described asic chip by the wire on described pcb board.

The beneficial effects of the utility model are: at least two kinds of MEMS sensor and asic chips with difference in functionality are encapsulated based on substrate, realized more compact structure, can under less package dimension, realize more perfect function, situation about encapsulating respectively with respect to the MEMS sensor of difference in functionality, is further reduced production cost thereby can reduce encapsulating material;

Asic chip carries out respectively acquisition and processing to the signal of each chip simultaneously, and the output signal of similar chip is carried out to overlap-add procedure, not only can realize the natural attenuation to the random error in output signal and noise, effectively improved the precision of product output signal, can also increase the intensity of the whole input signal of asic chip, improve the performance of product.

[accompanying drawing explanation]

Fig. 1 is the structural representation of a kind of MEMS encapsulation of the utility model preferred embodiment.

[specific embodiment]

Below in conjunction with drawings and embodiments, the utility model is described in further detail.

As shown in Figure 1, in the first embodiment of the present utility model, this MEMS encapsulation 100 comprises substrate 101, be located on substrate 100 and the asic chip 102 being electrically connected to substrate 101, at least one is located on substrate 101 and the MEMS pressure sensor 103 being electrically connected to asic chip 102 and at least one are located on substrate 101 and the MEMS microphone 104 being electrically connected to asic chip 102.Asic chip 102 can carry out acquisition process to the signal of

MEMS pressure sensor

102 and 104 outputs of MEMS microphone respectively, with this, realizes different functions.

Preferably, this MEMS encapsulation 100 also comprises binding gold thread 105, and MEMS pressure sensor 103 and MEMS microphone 104 are all electrically connected to asic chip 102 by described binding gold thread 105.Or when substrate 101 is pcb board, because pcb board is provided with wire, MEMS pressure sensor 103 and MEMS microphone 104 can also be electrically connected to asic chip 102 by the wire on pcb board.

On the basis of above preferred embodiment, asic chip 102 can be electrically connected to substrate 101 by binding gold thread 105, or when substrate 101 is pcb board, by the wire on pcb board, is electrically connected to pcb board.

Understandable, other different types of MEMS sensors such as MEMS temperature sensor, MEMS flow sensor and asic chip can be encapsulated to realize more diversified function based on same substrate, preferred embodiment of the present utility model has not just exemplified one by one yet.

At least two kinds of MEMS chip and asic chips with difference in functionality are encapsulated based on substrate, realized more compact structure, can under less package dimension, realize more perfect function, situation about encapsulating respectively with respect to the MEMS sensor of difference in functionality, is further reduced production cost thereby can reduce encapsulating material; Asic chip carries out respectively acquisition and processing to the signal of each chip simultaneously, and the output signal of similar chip is carried out to overlap-add procedure, not only can realize the natural attenuation to the random error in output signal and noise, effectively improved the precision of product output signal, can also increase the intensity of the whole input signal of asic chip, improve the performance of product.

Above-described is only embodiment of the present utility model; at this, it should be pointed out that for the person of ordinary skill of the art, do not departing under the prerequisite of the utility model creation design; can also make improvement, but these all belong to protection domain of the present utility model.

Claims

1. a MEMS encapsulation, it is characterized in that, it comprises substrate, is located on described substrate and the asic chip being electrically connected to described substrate and at least two kinds of MEMS sensors of being located on described substrate and having difference in functionality, and described MEMS sensor is all electrically connected to described asic chip.

2. MEMS encapsulation according to claim 1, is characterized in that, described MEMES sensor comprises at least one MEMS pressure sensor and at least one MEMS microphone.

3. according to the MEMS encapsulation described in claim 1 or 2 any one, it is characterized in that, this MEMS encapsulation also comprises binding gold thread, and described MEMS sensor is electrically connected to described asic chip by described binding gold thread.

4. according to the MEMS encapsulation described in claim 1 or 2 any one, it is characterized in that, described substrate is pcb board.

5. MEMS encapsulation according to claim 4, is characterized in that, described pcb board is provided with wire, and described MEMS sensor is electrically connected to described asic chip by the wire on described pcb board.