CN203011622U - Inlet manifold pressure sensor - Google Patents
Inlet manifold pressure sensor Download PDFInfo
- Publication number
- CN203011622U CN203011622U CN 201220596902 CN201220596902U CN203011622U CN 203011622 U CN203011622 U CN 203011622U CN 201220596902 CN201220596902 CN 201220596902 CN 201220596902 U CN201220596902 U CN 201220596902U CN 203011622 U CN203011622 U CN 203011622U
- Authority
- CN
- China
- Prior art keywords
- chip
- pressure sensor
- substrate
- intake manifold
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000008859 change Effects 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model relates to an inlet manifold pressure sensor, comprising a housing, a substrate, a pressure sensing chip and a special-purpose integrated circuit chip. The substrate is positioned in the housing; both the pressure sensing chip and the special-purpose integrated circuit chip are positioned on the substrate; and a signal input end of the special-purpose integrated circuit chip is connected with an output end of the pressure sensing chip. According to the utility model, the pressure sensing chip is used to convert pressure change into capacitance change, and the special-purpose integrated circuit chip is used to carry out linearization processing on the capacitance change amount and input processed capacitance change amount into an electric control unit (ECU). Compared with the prior art, the inlet manifold pressure sensor has the advantages including novel structure, simple operation and high control precision.
Description
Technical field
The utility model relates to a kind of sensor, relates in particular to a kind of intake manifold pressure sensor.
Background technology
Intake manifold pressure sensor, it is very important sensor in D type (speed density type) fuel injection system, its effect is the pressure in inlet manifold to be changed convert voltage signal to, and ECU (Electrical Control Unit) control system (ECU) determines to enter air capacity in cylinder according to this signal and engine speed.At present, what use on automobile is all semiconductor piezoresistor type intake manifold pressure sensor basically, and this semiconductor piezoresistor type intake manifold pressure sensor Resistor-Capacitor Unit is many, can produce the error that temperature drift brings in use.On the other hand, adopt variable resistor to regulate its output voltage, control accuracy is not high.
The utility model content
The purpose of this utility model is to provide a kind of intake manifold pressure sensor that adopts capacitance method to control.
For achieving the above object, the utility model provides a kind of intake manifold pressure sensor.This sensor comprises housing, substrate, pressure sensitive chip and dedicated IC chip, and described substrate is positioned in described housing; Described pressure sensitive chip and described dedicated IC chip all are positioned on described substrate, and described pressure sensitive chip is used for converting the pressure variation to capacitance variations; The signal input part of described dedicated IC chip is connected with described pressure sensitive chip output, is used for the capacitance change of gaging pressure induction chip, and measurement result is converted to digital signal output, and the interface with external circuits also is provided simultaneously.
The utility model changes pressure being converted to capacitance variations, and by described dedicated IC chip, the capacitance change that measures is carried out inputting ECU (Electrical Control Unit) (ECU) after linearization process again by adopting the pressure sensitive chip.Compared with prior art, the utlity model has novel structure, simple to operate, control accuracy advantages of higher.
Description of drawings
Fig. 1 is the structural drawing according to the intake manifold pressure sensor of the utility model embodiment.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 1 is the structural drawing according to the intake manifold pressure sensor of the utility model embodiment.
As shown in Figure 1, the intake manifold pressure sensor of this embodiment comprises pressure sensitive chip 1, silicon strain films 2, vacuum cavity 3, dedicated IC chip 4, substrate 5, pad 6, lead-in wire 7, load glue 8, housing 9.Wherein, pressure sensitive chip 1 is fixed on substrate 5 by load glue 8, and substrate 5 is ceramic substrate or printed-wiring board (PWB), is provided with circuit and pad 6 for intraconnection above it.Load glue 8 can adopt any one in epoxy glue, silica gel, silver slurry or brazing metal, and it is used for fixation pressure induction chip 1 and dedicated IC chip 4.Pressure sensitive chip 1 can comprise silicon strain films 2, vacuum cavity 3, by the up and down pressure differential of ambient pressure in described silicon strain films 2 surface formation, makes the two-plate spacing sounding on silicon strain films 2 change, and then converts the pressure variation to capacitance variations.Substrate 5 is provided with dedicated IC chip 4, the signal input part of dedicated IC chip 47 is connected with pressure sensitive chip 1 output terminal by going between, the signal output part of dedicated IC chip 4 connects pad 6 by lead-in wire 7, and pad 6 is provided with the input/output end port that is connected with external circuits.Wherein, lead-in wire 7 can adopt any one in aluminum steel, copper cash or gold thread, and it is used for transmission of electric signals, and electric signal is connected to pad 6 by via 11.
When engine operation, external atmosphere pressure acts on silicon strain films 2 through air intake opening 10, because the one side of silicon strain films 2 is vacuum cavities 3, it is higher that another side imports air-distributor pressure, 2 distortion of silicon strain films are larger, two-plate spacing on its diaphragm is also just larger, and the variation of pressure has at this moment just converted the variation of electric capacity to.Measure the variable quantity of electric capacity and measurement result is converted to digital signal by dedicated IC chip 4 and carry out exporting after linearization process, ECU (Electrical Control Unit) control system (ECU) determines to enter air capacity in cylinder according to this output signal and engine speed.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the above is only embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (6)
1. an intake manifold pressure sensor, comprise housing, substrate, pressure sensitive chip and dedicated IC chip, and described substrate is positioned in described housing; Described pressure sensitive chip and described dedicated IC chip all are positioned on described substrate, and described pressure sensitive chip is used for converting the pressure variation to capacitance variations; The signal input part of described dedicated IC chip is connected with described pressure sensitive chip output, is used for the capacitance change of gaging pressure induction chip, and measurement result is converted to digital signal output, and the interface with external circuits also is provided simultaneously.
2. intake manifold pressure sensor according to claim 1, it is characterized in that, described pressure sensitive chip comprises silicon strain films and vacuum cavity, by the up and down pressure differential of ambient pressure in the surface formation of described silicon strain films, make the two-plate spacing sounding on the silicon strain films change, and then convert the pressure variation to capacitance variations.
3. intake manifold pressure sensor according to claim 1, is characterized in that, described substrate is ceramic substrate or printed-wiring board (PWB), is provided with circuit and pad for intraconnection above described substrate.
4. intake manifold pressure sensor according to claim 3, is characterized in that, described pad is used for providing the input/output end port that is connected with external circuits.
5. intake manifold pressure sensor according to claim 1, is characterized in that, also comprises lead-in wire, is used for transmission of electric signals.
6. intake manifold pressure sensor according to claim 1, is characterized in that, also comprises load glue, is used for fixing described pressure sensitive chip and described dedicated IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220596902 CN203011622U (en) | 2012-11-13 | 2012-11-13 | Inlet manifold pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220596902 CN203011622U (en) | 2012-11-13 | 2012-11-13 | Inlet manifold pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203011622U true CN203011622U (en) | 2013-06-19 |
Family
ID=48603205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220596902 Expired - Lifetime CN203011622U (en) | 2012-11-13 | 2012-11-13 | Inlet manifold pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203011622U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108871655A (en) * | 2018-05-07 | 2018-11-23 | 南京新力感电子科技有限公司 | MEMS pressure sensor and batch calibrator (-ter) unit and calibration process based on mould group |
-
2012
- 2012-11-13 CN CN 201220596902 patent/CN203011622U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108871655A (en) * | 2018-05-07 | 2018-11-23 | 南京新力感电子科技有限公司 | MEMS pressure sensor and batch calibrator (-ter) unit and calibration process based on mould group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130619 |
|
| CX01 | Expiry of patent term |