CN203011622U - Inlet manifold pressure sensor - Google Patents

Inlet manifold pressure sensor Download PDF

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Publication number
CN203011622U
CN203011622U CN 201220596902 CN201220596902U CN203011622U CN 203011622 U CN203011622 U CN 203011622U CN 201220596902 CN201220596902 CN 201220596902 CN 201220596902 U CN201220596902 U CN 201220596902U CN 203011622 U CN203011622 U CN 203011622U
Authority
CN
China
Prior art keywords
chip
pressure sensor
substrate
intake manifold
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220596902
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Chinese (zh)
Inventor
张毅
陈利军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI CONSENSIC ELECTRONICS Ltd
Original Assignee
WUXI CONSENSIC ELECTRONICS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI CONSENSIC ELECTRONICS Ltd filed Critical WUXI CONSENSIC ELECTRONICS Ltd
Priority to CN 201220596902 priority Critical patent/CN203011622U/en
Application granted granted Critical
Publication of CN203011622U publication Critical patent/CN203011622U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to an inlet manifold pressure sensor, comprising a housing, a substrate, a pressure sensing chip and a special-purpose integrated circuit chip. The substrate is positioned in the housing; both the pressure sensing chip and the special-purpose integrated circuit chip are positioned on the substrate; and a signal input end of the special-purpose integrated circuit chip is connected with an output end of the pressure sensing chip. According to the utility model, the pressure sensing chip is used to convert pressure change into capacitance change, and the special-purpose integrated circuit chip is used to carry out linearization processing on the capacitance change amount and input processed capacitance change amount into an electric control unit (ECU). Compared with the prior art, the inlet manifold pressure sensor has the advantages including novel structure, simple operation and high control precision.

Description

A kind of intake manifold pressure sensor
Technical field
The utility model relates to a kind of sensor, relates in particular to a kind of intake manifold pressure sensor.
Background technology
Intake manifold pressure sensor, it is very important sensor in D type (speed density type) fuel injection system, its effect is the pressure in inlet manifold to be changed convert voltage signal to, and ECU (Electrical Control Unit) control system (ECU) determines to enter air capacity in cylinder according to this signal and engine speed.At present, what use on automobile is all semiconductor piezoresistor type intake manifold pressure sensor basically, and this semiconductor piezoresistor type intake manifold pressure sensor Resistor-Capacitor Unit is many, can produce the error that temperature drift brings in use.On the other hand, adopt variable resistor to regulate its output voltage, control accuracy is not high.
The utility model content
The purpose of this utility model is to provide a kind of intake manifold pressure sensor that adopts capacitance method to control.
For achieving the above object, the utility model provides a kind of intake manifold pressure sensor.This sensor comprises housing, substrate, pressure sensitive chip and dedicated IC chip, and described substrate is positioned in described housing; Described pressure sensitive chip and described dedicated IC chip all are positioned on described substrate, and described pressure sensitive chip is used for converting the pressure variation to capacitance variations; The signal input part of described dedicated IC chip is connected with described pressure sensitive chip output, is used for the capacitance change of gaging pressure induction chip, and measurement result is converted to digital signal output, and the interface with external circuits also is provided simultaneously.
The utility model changes pressure being converted to capacitance variations, and by described dedicated IC chip, the capacitance change that measures is carried out inputting ECU (Electrical Control Unit) (ECU) after linearization process again by adopting the pressure sensitive chip.Compared with prior art, the utlity model has novel structure, simple to operate, control accuracy advantages of higher.
Description of drawings
Fig. 1 is the structural drawing according to the intake manifold pressure sensor of the utility model embodiment.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 1 is the structural drawing according to the intake manifold pressure sensor of the utility model embodiment.
As shown in Figure 1, the intake manifold pressure sensor of this embodiment comprises pressure sensitive chip 1, silicon strain films 2, vacuum cavity 3, dedicated IC chip 4, substrate 5, pad 6, lead-in wire 7, load glue 8, housing 9.Wherein, pressure sensitive chip 1 is fixed on substrate 5 by load glue 8, and substrate 5 is ceramic substrate or printed-wiring board (PWB), is provided with circuit and pad 6 for intraconnection above it.Load glue 8 can adopt any one in epoxy glue, silica gel, silver slurry or brazing metal, and it is used for fixation pressure induction chip 1 and dedicated IC chip 4.Pressure sensitive chip 1 can comprise silicon strain films 2, vacuum cavity 3, by the up and down pressure differential of ambient pressure in described silicon strain films 2 surface formation, makes the two-plate spacing sounding on silicon strain films 2 change, and then converts the pressure variation to capacitance variations.Substrate 5 is provided with dedicated IC chip 4, the signal input part of dedicated IC chip 47 is connected with pressure sensitive chip 1 output terminal by going between, the signal output part of dedicated IC chip 4 connects pad 6 by lead-in wire 7, and pad 6 is provided with the input/output end port that is connected with external circuits.Wherein, lead-in wire 7 can adopt any one in aluminum steel, copper cash or gold thread, and it is used for transmission of electric signals, and electric signal is connected to pad 6 by via 11.
When engine operation, external atmosphere pressure acts on silicon strain films 2 through air intake opening 10, because the one side of silicon strain films 2 is vacuum cavities 3, it is higher that another side imports air-distributor pressure, 2 distortion of silicon strain films are larger, two-plate spacing on its diaphragm is also just larger, and the variation of pressure has at this moment just converted the variation of electric capacity to.Measure the variable quantity of electric capacity and measurement result is converted to digital signal by dedicated IC chip 4 and carry out exporting after linearization process, ECU (Electrical Control Unit) control system (ECU) determines to enter air capacity in cylinder according to this output signal and engine speed.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the above is only embodiment of the present utility model; and be not used in and limit protection domain of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.

Claims (6)

1. an intake manifold pressure sensor, comprise housing, substrate, pressure sensitive chip and dedicated IC chip, and described substrate is positioned in described housing; Described pressure sensitive chip and described dedicated IC chip all are positioned on described substrate, and described pressure sensitive chip is used for converting the pressure variation to capacitance variations; The signal input part of described dedicated IC chip is connected with described pressure sensitive chip output, is used for the capacitance change of gaging pressure induction chip, and measurement result is converted to digital signal output, and the interface with external circuits also is provided simultaneously.
2. intake manifold pressure sensor according to claim 1, it is characterized in that, described pressure sensitive chip comprises silicon strain films and vacuum cavity, by the up and down pressure differential of ambient pressure in the surface formation of described silicon strain films, make the two-plate spacing sounding on the silicon strain films change, and then convert the pressure variation to capacitance variations.
3. intake manifold pressure sensor according to claim 1, is characterized in that, described substrate is ceramic substrate or printed-wiring board (PWB), is provided with circuit and pad for intraconnection above described substrate.
4. intake manifold pressure sensor according to claim 3, is characterized in that, described pad is used for providing the input/output end port that is connected with external circuits.
5. intake manifold pressure sensor according to claim 1, is characterized in that, also comprises lead-in wire, is used for transmission of electric signals.
6. intake manifold pressure sensor according to claim 1, is characterized in that, also comprises load glue, is used for fixing described pressure sensitive chip and described dedicated IC chip.
CN 201220596902 2012-11-13 2012-11-13 Inlet manifold pressure sensor Expired - Lifetime CN203011622U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220596902 CN203011622U (en) 2012-11-13 2012-11-13 Inlet manifold pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220596902 CN203011622U (en) 2012-11-13 2012-11-13 Inlet manifold pressure sensor

Publications (1)

Publication Number Publication Date
CN203011622U true CN203011622U (en) 2013-06-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220596902 Expired - Lifetime CN203011622U (en) 2012-11-13 2012-11-13 Inlet manifold pressure sensor

Country Status (1)

Country Link
CN (1) CN203011622U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108871655A (en) * 2018-05-07 2018-11-23 南京新力感电子科技有限公司 MEMS pressure sensor and batch calibrator (-ter) unit and calibration process based on mould group

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108871655A (en) * 2018-05-07 2018-11-23 南京新力感电子科技有限公司 MEMS pressure sensor and batch calibrator (-ter) unit and calibration process based on mould group

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CX01 Expiry of patent term

Granted publication date: 20130619

CX01 Expiry of patent term