CN203503702U - 无引线封装发光二极管 - Google Patents

无引线封装发光二极管 Download PDF

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Publication number
CN203503702U
CN203503702U CN201320638873.6U CN201320638873U CN203503702U CN 203503702 U CN203503702 U CN 203503702U CN 201320638873 U CN201320638873 U CN 201320638873U CN 203503702 U CN203503702 U CN 203503702U
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emitting diode
support
light emitting
silica gel
blue light
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Expired - Fee Related
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CN201320638873.6U
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English (en)
Inventor
蒋国忠
熊新华
刘芳娇
马丽华
杨文�
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Jiangxi Lianchuang Optoelectronic Technology Co Ltd
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Jiangxi Lianchuang Optoelectronic Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

一种无引线封装发光二极管，包括支架、硅胶、支架正极、支架负极、蓝色发光二极管芯片，蓝色发光二极管芯片倒装在支架上，蓝色发光二极管芯片电极通过金锡焊料焊接在支架上，并分别与支架正极、支架负极相连，倒装的蓝色发光二极管芯片用硅胶包封。本实用新型的无引线封装发光二极管，采用蓝宝石衬底倒装蓝色发光二极管芯片，使得芯片PN结发出的光线经由蓝宝石衬底通过硅胶出射，既无“金线”和焊点对出射光线产生遮挡，又增大了光线出射的全反射角，大大提升了发光二极管的发光效率。同时，因金锡焊点的热传导率远远大于现有技术粘结胶的热传导率，散热性能大大提高，极大地提升了可靠性。

Description

无引线封装发光二极管
技术领域
本实用新型涉及一种无引线封装发光二极管。
背景技术
发光二极管具有发光效率高、节能、环保、寿命长等特点，被称为 “绿色照明光源”。近年来，随着芯片技术的发展和发光二极管封装技术的提高，发光二极管的发光效率和可靠性等各项技术性能指标也得到了很大的提升，除了在仪器仪表指示、景观照明、室内外装饰照明、交通信号灯、室内外显示屏等领域使用，还逐步拓展到了液晶显示器、液晶电视及移动装置显示器所需的背光源及室内外通用照明、车用照明等领域，因此对发光二极管的发光效率、可靠性提出了更高的要求。
目前照明和背光用发光二极管普遍采用粘结胶将正面生长电极的蓝光LED芯片装配在PPA、PCT（高温特种工程塑料）支架或EMC(热固型塑料)支架上，然后采用超声球焊工艺利用金线将芯片电极和支架电极进行连接，再选用硅胶对芯片进行包封，从而制备成发光二极管，此种方法制备的发光二极管为有引线封装发光二极管。有引线封装发光二极管采用“金线”进行芯片和支架的电路连接，焊点和“金线”降低了发光二极管的发光效率及可靠性。
发明内容
本实用新型的目的就是提供一种发光效率高、散热性能好、可靠性强的无引线封装发光二极管。
本实用新型的无引线封装发光二极管，包括支架、硅胶、支架正极、支架负极、蓝色发光二极管芯片，其特点是，蓝色发光二极管芯片倒装在支架上，蓝色发光二极管芯片电极通过金锡焊料焊接在支架上，并分别与支架正极、支架负极相连，倒装的蓝色发光二极管芯片用硅胶包封。
本实用新型的无引线封装发光二极管，采用蓝宝石衬底倒装蓝色发光二极管芯片，通过金锡焊料结合高温共晶技术将芯片电极和支架电极进行焊接，使得芯片PN结发出的光线经由蓝宝石衬底通过硅胶出射，既无“金线”和焊点对出射光线产生遮挡，又增大了光线出射的全反射角，大大提升了发光二极管的发光效率。同时，封装发光二极管芯片PN结产生的热量通过金锡焊点传递到支架上，因金锡焊点的热传导率远远大于现有技术粘结胶的热传导率，散热性能大大提高，极大地提升了可靠性。
附图说明
图1为本实用新型的结构示意图。
具体实施方式
一种无引线封装发光二极管，包括支架6、硅胶1、支架正极4、支架负极7、蓝色发光二极管芯片2，其特点是，蓝色发光二极管芯片2倒装在支架6上，蓝色发光二极管芯片电极3通过金锡焊料5焊接在支架6上，并分别与支架正极4、支架负极7相连，倒装的蓝色发光二极管芯片2用硅胶1包封。

Claims (1)

1.一种无引线封装发光二极管，包括支架（6）、硅胶（1）、支架正极（4）、支架负极（7）、蓝色发光二极管芯片（2），其特征在于：蓝色发光二极管芯片（2）倒装在支架（6）上，蓝色发光二极管芯片电极（3）通过金锡焊料（5）焊接在支架（6）上，并分别与支架正极（4）、支架负极（7）相连，倒装的蓝色发光二极管芯片（2）用硅胶（1）包封。
CN201320638873.6U 2013-10-17 2013-10-17 无引线封装发光二极管 Expired - Fee Related CN203503702U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104654222A (zh) * 2015-01-30 2015-05-27 安徽绿龙光电科技有限公司 一种具有防水防尘功能的led灯板
CN105387360A (zh) * 2015-12-23 2016-03-09 江苏鸿佳电子科技有限公司 一种五面发光无封装led
CN110416382A (zh) * 2015-07-21 2019-11-05 福建天电光电有限公司 Led光源的封装方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104654222A (zh) * 2015-01-30 2015-05-27 安徽绿龙光电科技有限公司 一种具有防水防尘功能的led灯板
CN110416382A (zh) * 2015-07-21 2019-11-05 福建天电光电有限公司 Led光源的封装方法
CN110416382B (zh) * 2015-07-21 2023-03-31 福建天电光电有限公司 Led光源的封装方法
CN105387360A (zh) * 2015-12-23 2016-03-09 江苏鸿佳电子科技有限公司 一种五面发光无封装led

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