CN203707179U - 液晶显示屏幕背光板封装模组 - Google Patents
液晶显示屏幕背光板封装模组 Download PDFInfo
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- CN203707179U CN203707179U CN201420067487.0U CN201420067487U CN203707179U CN 203707179 U CN203707179 U CN 203707179U CN 201420067487 U CN201420067487 U CN 201420067487U CN 203707179 U CN203707179 U CN 203707179U
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- negative electrode
- circuit board
- emitting diode
- light
- liquid crystal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
本实用新型公开了一种液晶显示屏幕背光板封装模组，包括发光二极管，在发光二极管上方覆盖有光散射板和液晶面板，下方为电路板，电路板下方为石墨散热片。本实用新型的封装模组散热效率高，并且导电、导热分离。
Description
技术领域
本实用新型涉及一种发光器件，尤其涉及液晶显示屏幕的背光板封装模组，属于显示装置领域。
背景技术
LED具有工作寿命长，省电节能，工作电压低等特点，但是LED单位亮度较低，难于适应大功率应用场合。大功率LED器件需要解决散热问题，否则会降低产品的使用寿命及发光量。
发明内容
针对现有技术的缺陷，本实用新型公开了一种液晶显示屏幕背光板封装模组，有效改善了其散热和导热能力。
为实现上述目的，本实用新型是通过下述技术方案实现的：
液晶显示屏幕背光板封装模组，包括多个发光二极管，其上覆盖有光散射板及液晶面板；发光二极管的下面为电路板，电路板的下面设有石墨散热片。
进一步的，为了进一步改善散热能力，石墨散热片还连接外置金属散热片。
具体的，在上述结构中电路的电连接关系为电路板两端分别设有阳极外电路接点和阴极外电路接点，二者分别连接阳极引脚、阴极引脚，阳极引脚连接阳极引线，阴极引脚连接阴极，阴极连接发光二极管，发光二极管连接阳极引线；阴极下方与电路板连接处由石墨散热片封装。
进一步的，阴极、发光二极管、阳极引线外罩有环氧树脂光学透镜。
通过上述结构，本实用新型的封装模组具有高度集成化的架构，散热性能高，并使LED寿命延长及提升发光效率。
附图说明
图1为本实用新型封装模组的电路结构示意图；
图2为本实用新型封装模组的封装结构示意图。
具体实施方式
参考附图1所示，本实用新型的液晶显示屏幕背光板封装模组在电路板18的两边分别设有阳极外电路接点151和阴极外电路接141；阳极外电路接点151连接阳极引脚15，阴极外电路接点141连接阴极引脚14，阳极引脚15连接阳极引线19，阴极引脚14连接阴极17，阴极17上设有发光二极管13，发光二极管13连接阳极引线19；阴极17的下方与电路板18连接处由石墨散热片11封装。
进一步的，石墨散热片11下面连接外部金属散热片16。
其中，石墨散热片11、阴极17、发光二极管13、阳极引线19外罩有环氧树脂光学透镜12。
如图2所示，显示了产品的完整封装结构，发光二极管10，其上覆盖有液晶面板8，液晶面板上面为光散射板9；发光二极管10的下面为电路板18，电路板18的下面设有金属散热片16。
Claims (4)
1.液晶显示屏幕背光板封装模组，其特征在于包括多个发光二极管，在发光二极管上方覆盖有光散射板和液晶面板，下方为电路板，电路板下方为石墨散热片。
2.根据权利要求1所述的液晶显示屏幕背光板封装模组，其特征在于石墨散热片还连接外置金属散热片。
3.根据权利要求1所述的液晶显示屏幕背光板封装模组，其特征在于电路板两端分别设有阳极外电路接点和阴极外电路接点，二者分别连接阳极引脚、阴极引脚，阳极引脚连接阳极引线，阴极引脚连接阴极，阴极连接发光二极管，发光二极管连接阳极引线；阴极下方与电路板连接处由石墨散热片封装。
4.根据权利要求3所述的液晶显示屏幕背光板封装模组，其特征在于阴极、发光二极管、阳极引线外罩有环氧树脂光学透镜。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420067487.0U CN203707179U (zh) | 2014-02-17 | 2014-02-17 | 液晶显示屏幕背光板封装模组 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420067487.0U CN203707179U (zh) | 2014-02-17 | 2014-02-17 | 液晶显示屏幕背光板封装模组 |
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| CN203707179U true CN203707179U (zh) | 2014-07-09 |
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| CN201420067487.0U Expired - Fee Related CN203707179U (zh) | 2014-02-17 | 2014-02-17 | 液晶显示屏幕背光板封装模组 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104763909A (zh) * | 2015-04-24 | 2015-07-08 | 东莞市闻誉实业有限公司 | Led灯 |
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2014
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104763909A (zh) * | 2015-04-24 | 2015-07-08 | 东莞市闻誉实业有限公司 | Led灯 |
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Assignee: Shenzhen DiJing Industry Co., Ltd. Assignor: SHENZHEN WEIZHAN PHOTOELECTRIC CO., LTD. Contract record no.: 2014440020449 Denomination of utility model: Liquid crystal display screen backlight plate packaging module Granted publication date: 20140709 License type: Exclusive License Record date: 20141224 |
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Granted publication date: 20140709 Termination date: 20170217 |