CN203406330U - Packaging rack set applied to light emitting diodes - Google Patents
Packaging rack set applied to light emitting diodes Download PDFInfo
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- CN203406330U CN203406330U CN201320357658.9U CN201320357658U CN203406330U CN 203406330 U CN203406330 U CN 203406330U CN 201320357658 U CN201320357658 U CN 201320357658U CN 203406330 U CN203406330 U CN 203406330U
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- package shelf
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Abstract
The utility model relates to the field of semiconductor luminescence technology, and in particular to a packaging rack set applied to light emitting diodes. The packaging rack set includes at least one set of packaging rack, each set of the packaging rack includes a first support, a second support and a cavity; the second support is adjacent to the first support, a gap is arrange between the second support and the first support, and the cavity is opened in the top of the second support; and the lower end of the first support is provided with an extending first pin, the lower end of the second support is provided with an extending second pin, and the distance between the first pin and the second pin is 5.80 to 5.90 mm. According to the packaging rack set applied to light emitting diodes, the distance between the first pin and the second pin is 5.80 to 5.90 mm, on the premise that bonding of scolding tin can be ensured to be prevented during the first pin and the second pin are welded by a welding machine, more sets of packaging racks can be arranged on a single packaging rack set by adopting the comparative small distance, and batch packaging and processing of light emitting diodes are convenient, so as to raise production efficiency.
Description
Technical field
The utility model relates to semiconductor light emitting technical field, relates in particular to a kind of package shelf group that is applied to light-emitting diode.
Background technology
Along with energy crisis highlights day by day, energy shortage problem restricts economic fast development.China, as populous nation, certainly will be power consumption rich and influential family, therefore, wants to alleviate national shortage of electric power and reduces energy consumption, will promote the use of green light source.At present, light-emitting diode is as a kind of new light sources of environmental protection, have energy-conservation, environmental protection, long service life, the light source of the feature such as volume is little, embodies the environmental protection concept of our novel society.
Light emitting semiconductor device is to utilize under electric field action, the Sony ericsson mobile comm ab that PN junction is luminous.Light-emitting diode is by MOCVD (Metal-organic Chemical Vapor Deposition as the use representative of light emitting semiconductor device, metallo-organic compound chemical gaseous phase deposition) in Sapphire Substrate or silicon carbide substrates, grow p type layer, n type layer and the p-n photosphere of binding up one's hair, then by lighting, cutting, granule proliferation, the techniques such as graduation are made the chip of different size, current encapsulation process of light-emitting diode is that these chips are fixed on a package support, again by organic resin encapsulant by package support with chip bag is attached forms in the inner hemispheric optically focused package blocks.
At present, along with people are to the improving constantly of the matching requirements of light-emitting diode, manufacturer requires to produce package support group, makes light-emitting diode chip for backlight unit can carry out batch and encapsulates, and to enhance productivity, and then reduces production costs.Existing package support group is that the iron plate by 0.5mm thickness is stamped to form, package support group comprises several package supports, it can form single package support through cutting, single package support comprises the pin of two supports and two support lower ends, because the spacing between two pins is larger, the negligible amounts of the package support therefore comprising in package support group, is unfavorable for realizing the encapsulation in enormous quantities of light-emitting diode chip for backlight unit, is difficult to enhance productivity.
Utility model content
The purpose of this utility model is for the deficiencies in the prior art, and provides a kind of being beneficial to realize the encapsulation in enormous quantities of light-emitting diode chip for backlight unit, the structure improved package shelf group that can enhance productivity.
The utility model is achieved through the following technical solutions.
A kind of package shelf group that is applied to light-emitting diode, include the package shelf of at least one group, every group of package shelf includes the first support, the second support and cavity, described the second support adjacent to described the first support and and described the first support between be provided with gap, described cavity is opened in the top of described the first support, the lower end extension of described the first support is provided with the first pin, the lower end extension of described the second support is provided with the second pin, and the spacing of described the first pin and described the second pin is 5.80 ~ 5.90mm.
Wherein, the spacing of described the first pin and described the second pin is 5.84mm.
Wherein, the top of the top of described the first support and described the first pin, described the second support and described the second pin is the sealing portion of described package shelf, and described sealing portion is provided with anti-slip veins.
Wherein, described package shelf also comprises entablature and sill, described entablature is arranged at the below of described sealing portion, described sill is arranged at the below of described entablature and is positioned at the bottom of described package shelf, the entablature of two adjacent package shelf interconnects, and the sill of two adjacent package shelf interconnects.
Wherein, between every two adjacent package shelf, be provided with two stuck points, described stuck point is all arranged at described entablature.
Wherein, described package shelf group also comprises retaining structure, described retaining structure comprises the first retaining structure and the second retaining structure, described the first retaining structure consists of an end of described entablature the first convex body forming that stretches out, described the second retaining structure consists of an end of described sill the second convex body forming that stretches out, and described the first retaining structure and described the second retaining structure are arranged at respectively the both sides of described package shelf group.
Wherein, described sill is provided with location hole.
Wherein, the cross section ovalize of described cavity.
The beneficial effects of the utility model are: the spacing of the first pin of the present utility model and the second pin is set to 5.80 ~ 5.90mm, this spacing is less, can be when guaranteeing that bonding machine welds the first pin and the second pin do not produce under the prerequisite of scolding tin bonding, make to comprise in single package frame group the package shelf of more groups of numbers, be convenient to light-emitting diode and carry out batch encapsulation, processing, to enhance productivity.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Reference numeral comprises:
1-package shelf, the 11-the first support, the 12-the second support, 13-cavity, the 14-the first pin, the 15-the second pin, 2-entablature, 3-sill, 31-location hole, 4-stuck point, the 51-the first retaining structure, the 52-the first retaining structure, 6-anti-slip veins.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1, a kind of package shelf group that is applied to light-emitting diode of the present embodiment, include the package shelf 1 of at least one group, every group of package shelf 1 includes the first support 11, the second support 12 and cavity 13, described the second support 12 adjacent to described the first support 11 and and described the first support 11 between be provided with gap, described cavity 13 is opened in the top of described the first support 11, the lower end extension of described the first support 11 is provided with the first pin 14, the lower end extension of described the second support 12 is provided with the second pin 15, the spacing of described the first pin 14 and described the second pin 15 is 5.80 ~ 5.90mm.The spacing of the first pin 14 of the present utility model and the second pin 15 is set to 5.80 ~ 5.90mm, this spacing is less, can be when guaranteeing that bonding machine welds the first pin 14 and the second pin 15 do not produce under the prerequisite of scolding tin bonding, make to comprise in single package frame group the package shelf 1 of more groups of numbers, be convenient to light-emitting diode and carry out batch encapsulation, processing, to enhance productivity.
In the present embodiment, the spacing of described the first pin 14 and described the second pin 15 is 5.84mm.As preferably, the spacing of 5.84mm is when guaranteeing that bonding machine welds, not produce the optimal distance between the first pin 14 and the second pin 15 under the prerequisite of scolding tin bonding.
In the present embodiment, described package shelf 1 also comprises entablature 2 and sill 3, described entablature 2 is arranged at the below of described sealing portion, described sill 3 is arranged at the below of described entablature 2 and is positioned at the bottom of described package shelf 1, the entablature 2 of two adjacent package shelf 1 interconnects, and the sill 3 of two adjacent package shelf 1 interconnects.Entablature 2 and sill 3 are set, each can be organized to package shelf 1 and link together, while facilitating producer to make light-emitting diode, use.
In the present embodiment, between every two adjacent package shelf 1, be provided with two stuck points 4, stuck point 4 is all arranged at described entablature 2.The utility model need position by module when encapsulating, two stuck points 4 are connected in the spacing card on module, as cross spacing structure, can avoid sealing portion to move left and right in the glue-filling slot of module, avoid any side of package support to touch the sidewall of glue-filling slot, guarantee that package support and chip can be wrapped completely attached, packaging effect is good.
In the present embodiment, described package shelf group also comprises retaining structure, described retaining structure comprises the first retaining structure 51 and the second retaining structure 52, described the first retaining structure 51 consists of an end of described entablature 2 the first convex body forming that stretches out, described the second retaining structure 52 consists of an end of described sill 3 the second convex body forming that stretches out, and described the first retaining structure 51 and described the second retaining structure 52 are arranged at respectively the both sides of described package shelf group.Module two ends for the utility model location are provided with draw-in groove, retaining structure can with draw-in groove clamping, be convenient to the location of package shelf group; And the first retaining structure 51 and the second retaining structure 52 are stretched out and formed by an end of entablature 2, sill 3 respectively, processing is simple, and materials are saved, and lays respectively at the both sides of package shelf group, is beneficial to and realizes strong fix.
In the present embodiment, the top of the top of described the first support 11 and described the first pin 14, described the second support 12 and described the second pin 15 is the sealing portion of described package shelf 1, and described sealing portion is provided with anti-slip veins 6.Sealing of the present utility model portion is owing to being provided with anti-slip veins 6, and anti-slip veins 6 can increase the roughness on sealing portion surface, and while making to encapsulate, the laminating degree of organic resin and sealing portion is better, and it is high that organic resin adheres to compactness, has strengthened the stability of organic resin encapsulating structure.
In the present embodiment, described sill 3 is provided with location hole 31.Package shelf group during for the manufacture of light-emitting diode, is placed it in LED package machine conventionally, by the detent mechanism arranging in location hole 31 and LED package machine, coordinate, realize the location of package shelf group.
In the present embodiment, the cross section ovalize of described cavity 13.Cavity 13 is for carrying light-emitting diode crystal chip, and oval-shaped cavity 13 is more conducive to the utilization in space, and its intensity in encapsulation is also more stable.
The above execution mode, it is better embodiment of the present utility model, be not to limit the utility model practical range, the equivalence of doing according to structure, feature and principle described in the utility model claim therefore all changes or modifies, and all should comprise in the utility model patent claim.
Claims (8)
1. a package shelf group that is applied to light-emitting diode, include the package shelf of at least one group, every group of package shelf includes the first support, the second support and cavity, described the second support adjacent to described the first support and and described the first support between be provided with gap, described cavity is opened in the top of described the first support, the lower end extension of described the first support is provided with the first pin, the lower end extension of described the second support is provided with the second pin, it is characterized in that: the spacing of described the first pin and described the second pin is 5.80 ~ 5.90mm.
2. a kind of package shelf group that is applied to light-emitting diode according to claim 1, is characterized in that: the spacing of described the first pin and described the second pin is 5.84mm.
3. a kind of package shelf group that is applied to light-emitting diode according to claim 1, it is characterized in that: the top of the top of described the first support and described the first pin, described the second support and described the second pin is the sealing portion of described package shelf, described sealing portion is provided with anti-slip veins.
4. a kind of package shelf group that is applied to light-emitting diode according to claim 3, it is characterized in that: described package shelf also comprises entablature and sill, described entablature is arranged at the below of described sealing portion, described sill is arranged at the below of described entablature and is positioned at the bottom of described package shelf, the entablature of two adjacent package shelf interconnects, and the sill of two adjacent package shelf interconnects.
5. a kind of package shelf group that is applied to light-emitting diode according to claim 4, is characterized in that: between every two adjacent package shelf, be provided with two stuck points of space, described stuck point is all arranged at described entablature.
6. a kind of package shelf group that is applied to light-emitting diode according to claim 4, it is characterized in that: described package shelf group also comprises retaining structure, described retaining structure comprises the first retaining structure and the second retaining structure, described the first retaining structure consists of an end of described entablature the first convex body forming that stretches out, described the second retaining structure consists of an end of described sill the second convex body forming that stretches out, and described the first retaining structure and described the second retaining structure are arranged at respectively the both sides of described package shelf group.
7. a kind of package shelf group that is applied to light-emitting diode according to claim 4, is characterized in that: described sill is provided with location hole.
8. a kind of package shelf group that is applied to light-emitting diode according to claim 1, is characterized in that: the cross section ovalize of described cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320357658.9U CN203406330U (en) | 2013-06-21 | 2013-06-21 | Packaging rack set applied to light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320357658.9U CN203406330U (en) | 2013-06-21 | 2013-06-21 | Packaging rack set applied to light emitting diodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203406330U true CN203406330U (en) | 2014-01-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320357658.9U Expired - Fee Related CN203406330U (en) | 2013-06-21 | 2013-06-21 | Packaging rack set applied to light emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203406330U (en) |
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2013
- 2013-06-21 CN CN201320357658.9U patent/CN203406330U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20170621 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |