CN201868424U - Light-emitting diode (LED) module - Google Patents
Light-emitting diode (LED) module Download PDFInfo
- Publication number
- CN201868424U CN201868424U CN2010205455212U CN201020545521U CN201868424U CN 201868424 U CN201868424 U CN 201868424U CN 2010205455212 U CN2010205455212 U CN 2010205455212U CN 201020545521 U CN201020545521 U CN 201020545521U CN 201868424 U CN201868424 U CN 201868424U
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- China
- Prior art keywords
- led
- soft board
- illuminating module
- led chips
- led illuminating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a light-emitting diode (LED) module which comprises a strip-shaped soft board, a plurality of LED chips that are directly connected in series and arranged in the soft board, and a plurality of encapsulation bodies used for correspondingly encapsulating the LED chips. Through the way, the plurality of LED chips are directly arranged on the soft board, so as to enable the radiating effect of the LED module to be better, save cost and simplify process.
Description
[technical field]
The utility model relates to a kind of illuminating module, particularly a kind of LED illuminating module.
[background technology]
Led chip is because little, the brightness advantages of higher of volume, is widely used in various fields in society now.In existing LED illuminating module, generally led chip is installed on the support, then support is fixed on the carrier such as soft board, so radiating effect is not very desirable, and cost is higher, technology is complicated.
[summary of the invention]
The technical problem that the utility model solves provides and a kind of a plurality of led chips directly is installed on LED illuminating module on the soft board, to improve the radiating effect of LED illuminating module.
The utility model provides a kind of LED illuminating module, comprising: the soft board of bar shaped; A plurality of led chips in soft board directly are installed in series; And a plurality of packaging bodies that are used for corresponding packaging LED chips.
According to the utility model one preferred embodiment, soft board is provided with the conductive pattern that is used to a plurality of led chip power supplies.
According to the utility model one preferred embodiment, a plurality of led chips connect conductive pattern by lead.
According to the utility model one preferred embodiment, interconnect between the conductive pattern, make that series connection is provided with and arrangement in alignment between a plurality of led chips.
According to the utility model one preferred embodiment, the upper surface of soft board is provided with insulating barrier at the correspondence position of led chip.
According to the utility model one preferred embodiment, between a plurality of led chips resistance is set, resistance is connected with a plurality of led chips.
By the way, a plurality of led chips directly are installed on the soft board, make the radiating effect of LED illuminating module better, and save cost, simplify technology.
[description of drawings]
Fig. 1 is the schematic diagram of LED illuminating module one embodiment of the present utility model.
[embodiment]
Below in conjunction with drawings and Examples the utility model is elaborated.
As shown in Figure 1, Fig. 1 is the schematic diagram of LED illuminating module one embodiment of the present utility model.LED illuminating module 1 comprises soft board 10, a plurality of led chip 20 and a plurality of packaging body 30.In the present embodiment, soft board 10 is a strip, and a plurality of led chips 20 directly disperse to be installed in the soft board 10.Soft version 10 is preferably and meets the ROHS authentication, and corrosion-resistant.
In order to prevent led chip 20 electric leakages, the correspondence position that led chip generally can be installed in soft board 10 is provided with insulating barrier (not shown).Packaging body 30 is packaged in led chip on the soft board 10, and packaging body 30 is preferably the silica gel packaging body.
As shown in Figure 1, be provided with conductive pattern 11 in position in the soft board 10 near led chip 20.Led chip 20 connects conductive patterns 11 by lead 21, and being powered by 11 pairs of a plurality of led chips 20 of conductive pattern, and then driving LED chip 20 carries out work.In a preferred embodiment, conductive pattern 11 is connected in a predefined manner, realize series connection setting and arrangement in alignment between a plurality of led chips 20 with this in soft board 10 inside or lower surface.In the present embodiment, 20 of a plurality of led chips a resistance 40 is set, resistance 40 is connected with led chip 20.
By the way, a plurality of led chips directly are installed on make the radiating effect of LED illuminating module better on the soft board, and save cost, simplify technology.
In the above-described embodiments, only the utility model has been carried out exemplary description, but those skilled in the art can carry out various modifications to the utility model after reading present patent application under the situation that does not break away from spirit and scope of the present utility model.
Claims (6)
1. a LED illuminating module is characterized in that, described LED illuminating module comprises:
Soft board, described soft board are bar shaped;
A plurality of led chips directly are installed in series in described soft board; And
A plurality of packaging bodies are used for the described led chip of corresponding encapsulation.
2. LED illuminating module according to claim 1 is characterized in that, described soft board is provided with the conductive pattern that is used to described a plurality of led chip power supplies.
3. LED illuminating module according to claim 2 is characterized in that, described a plurality of led chips connect described conductive pattern by lead.
4. LED illuminating module according to claim 2 is characterized in that, interconnects between the described conductive pattern, makes that series connection is provided with and arrangement in alignment between described a plurality of led chip.
5. LED illuminating module according to claim 1 is characterized in that the upper surface of described soft board is provided with insulating barrier at the correspondence position of described led chip.
6. LED illuminating module according to claim 1 is characterized in that, between described a plurality of led chips resistance is set, and described resistance is connected with described a plurality of led chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205455212U CN201868424U (en) | 2010-09-28 | 2010-09-28 | Light-emitting diode (LED) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205455212U CN201868424U (en) | 2010-09-28 | 2010-09-28 | Light-emitting diode (LED) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201868424U true CN201868424U (en) | 2011-06-15 |
Family
ID=44139571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205455212U Expired - Fee Related CN201868424U (en) | 2010-09-28 | 2010-09-28 | Light-emitting diode (LED) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201868424U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231988A (en) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | Ultrathin display board technique and ultrathin display board |
-
2010
- 2010-09-28 CN CN2010205455212U patent/CN201868424U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231988A (en) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | Ultrathin display board technique and ultrathin display board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20110928 |