CN203324438U - Aging test batten for OLED packaging motherboard - Google Patents
Aging test batten for OLED packaging motherboard Download PDFInfo
- Publication number
- CN203324438U CN203324438U CN2013202849521U CN201320284952U CN203324438U CN 203324438 U CN203324438 U CN 203324438U CN 2013202849521 U CN2013202849521 U CN 2013202849521U CN 201320284952 U CN201320284952 U CN 201320284952U CN 203324438 U CN203324438 U CN 203324438U
- Authority
- CN
- China
- Prior art keywords
- motherboard
- organic light
- cover plate
- common electrodes
- oled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The utility model discloses an aging test batten for an OLED packaging motherboard, comprising a set of organic light-emitting diodes, a set of common electrodes in connection with anodes and cathodes of the organic light-emitting diodes, a substrate and a cover plate; the organic light-emitting diodes, the common electrodes, the substrate and the cover plate are in a packaging state, wherein the cover plate of the batten located on the upper part of the common electrodes is cut to expose the common electrodes to the outside. According to the utility model, an OLED packaging motherboard to be tested is cut into a plurality of battens along the rim of one sides of the organic light-emitting diodes not communicating with the common electrodes, and the cover plate of the battens located on the upper part of the common electrodes is cut to expose the common electrodes, thereby providing convenience for contact with a probe of an aged test tool, avoiding complex processes of preparing pre-openings, reducing product processing cost and raising test efficiency.
Description
Technical field
The utility model belongs to the display device technical field, is specifically related to a kind of OLED encapsulation motherboard burn-in test batten.
Background technology
When OLED encapsulation motherboard carries out burn-in test in process of production, the probe of test fixture needs to contact with common electrode, therefore must carry out pre-drilled cavity on the encapsulation cover plate of OLED, has improved the purchase cost of encapsulation cover plate.
The utility model content
The purpose of this utility model is to overcome the problems referred to above that prior art exists, and provides a kind of without on the OLED encapsulation cover plate, pre-drilled cavity being set, the OLED encapsulation motherboard burn-in test batten that reduces the production cost and can increase work efficiency.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of OLED encapsulation motherboard burn-in test batten, comprise one group of Organic Light Emitting Diode, one group of common electrode, substrate and cover plate that is connected with OLED anode and negative electrode, Organic Light Emitting Diode and common electrode are fixed on substrate, described substrate and cover plate bond and form encapsulating structure by binding material, wherein, the cover plate that is positioned at common electrode top on batten is cut, outside common electrode is exposed to.
Further, the length that OLED encapsulation motherboard burn-in test is OLED encapsulation motherboard to be measured by the length of batten, width be the Organic Light Emitting Diode while to adjacent that the interior Organic Light Emitting Diode of OLED encapsulation motherboard to be measured does not connect common electrode do not connect common electrode distance.
Compared with prior art, the beneficial effects of the utility model are:
OLED encapsulation motherboard burn-in test batten described in the utility model, become some row battens by the edge cuts that OLED encapsulation motherboard to be measured is not connected to common electrode one side along Organic Light Emitting Diode, and on the excision batten common electrode top cover plate so that common electrode come out, be convenient to contact with the probe of burn-in test frock, avoid preparing the complicated technology of pre-drilled cavity, improved detection efficiency.
OLED described in the utility model encapsulation motherboard burn-in test batten, simple in structure, to make simple and easyly, the detection of being convenient to is in process of production applied.
The accompanying drawing explanation
Fig. 1 is the vertical view that the OLED encapsulation motherboard burn-in test in the utility model embodiment is used batten;
Fig. 2 is the cut-open view along A-A line in Fig. 1;
Fig. 3 is the cut-open view along B-B line in Fig. 1.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As described in Fig. 1,2,3, OLED encapsulation motherboard burn-in test batten in the present embodiment, comprise one group of Organic Light Emitting Diode 1, one group of common electrode 2, substrate 3 and cover plate 4 that is connected with OLED 1 anode and negative electrode, Organic Light Emitting Diode 1 and common electrode 2 are fixed on substrate 3, described substrate 3 and cover plate 4 bond and form encapsulating structure by binding material, wherein, the cover plate that is positioned at common electrode 2 tops is cut, outside common electrode 2 is exposed to.
This batten is that one side cutting by OLED encapsulation motherboard to be measured is not connected to common electrode 2 along Organic Light Emitting Diode 1 forms, therefore, the length that the length of batten is OLED to be measured encapsulation motherboard, width be the Organic Light Emitting Diode while to adjacent that in OLED encapsulation motherboard to be measured, Organic Light Emitting Diode 1 does not connect common electrode 2 do not connect common electrode distance.
Although with reference to best interpretations embodiment of the present utility model, the utility model is described here, but, should be appreciated that, those skilled in the art can design a lot of other modification and embodiments, and these are revised and within embodiment will drop on the disclosed principle scope and spirit of the application.More particularly, in the scope of, accompanying drawing open in the application and claim, can carry out multiple modification and improvement to building block and/or the layout of subject combination layout.Except modification that building block and/or layout are carried out with improving, to those skilled in the art, other purposes will be also obvious.
Claims (2)
1. an OLED encapsulates motherboard burn-in test batten, comprise one group of Organic Light Emitting Diode, one group of common electrode, substrate and cover plate that is connected with OLED anode and negative electrode, Organic Light Emitting Diode and common electrode are fixed on substrate, described substrate and cover plate bond and form encapsulating structure by binding material, it is characterized in that: the cover plate that is positioned at common electrode top on batten is cut, outside common electrode is exposed to.
2. OLED according to claim 1 encapsulates motherboard burn-in test batten, it is characterized in that: the length that the length of this batten is OLED to be measured encapsulation motherboard, width be the Organic Light Emitting Diode while to adjacent that in OLED encapsulation motherboard to be measured, Organic Light Emitting Diode does not connect common electrode do not connect common electrode distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202849521U CN203324438U (en) | 2013-05-22 | 2013-05-22 | Aging test batten for OLED packaging motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202849521U CN203324438U (en) | 2013-05-22 | 2013-05-22 | Aging test batten for OLED packaging motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203324438U true CN203324438U (en) | 2013-12-04 |
Family
ID=49663775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202849521U Expired - Fee Related CN203324438U (en) | 2013-05-22 | 2013-05-22 | Aging test batten for OLED packaging motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203324438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107315139A (en) * | 2017-05-24 | 2017-11-03 | 东莞市艾百人工智能科技有限公司 | A kind of OLED display device failure detection detection system and its detection method |
-
2013
- 2013-05-22 CN CN2013202849521U patent/CN203324438U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107315139A (en) * | 2017-05-24 | 2017-11-03 | 东莞市艾百人工智能科技有限公司 | A kind of OLED display device failure detection detection system and its detection method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2014060355A3 (en) | Method for producing a multiplicity of optoelectronic semiconductor components | |
| CN203324438U (en) | Aging test batten for OLED packaging motherboard | |
| CN105355752B (en) | A kind of LED chip construction, encapsulating structure and preparation method thereof | |
| CN205539412U (en) | A testing arrangement for LED lamp pearl | |
| TW200802946A (en) | Base structure for ultra-thin light-emitting diode and manufacturing method thereof | |
| CN202656595U (en) | Non-contact intelligent card silk screen printing working table with positioning device | |
| CN203134800U (en) | Step type light emitting diode raising high-voltage LED process yield | |
| CN206176061U (en) | No base plate equipment LED lamp pole | |
| CN203085645U (en) | Die bonder fixture | |
| CN207325380U (en) | A kind of point measurement machine structure of LED light splitting machines | |
| CN202549840U (en) | Multi-wafer integration type white-light light emitting diode (LED) packaging structure | |
| CN206278466U (en) | A kind of electronic component back-sticked type tape package structure | |
| CN202986314U (en) | Conducting film screen printing clamp convenient for turning around | |
| CN208241967U (en) | A kind of substrate | |
| CN202102068U (en) | Batch detecting device for SMD LEDs | |
| CN205082063U (en) | Circuit board | |
| CN202797068U (en) | Patched type laser packaging structure | |
| CN203702785U (en) | Calculator foot pad pasting machine | |
| CN202893964U (en) | Plunger chip for punching | |
| CN105322069A (en) | LED lamp filament support material plate | |
| CN202178254U (en) | Vertical heap-type light emitting diode structure | |
| CN203631492U (en) | Axial diode SKY and GPP product rotating plate tooling | |
| CN203549330U (en) | LED (light emitting diode) display screen printing fixed support | |
| CN203707166U (en) | All-metal integrated LED lamp bead packaging structure | |
| CN203406320U (en) | Packaging rack set applied to light emitting diodes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20210522 |