CN202285233U - 半导体装置 - Google Patents

半导体装置 Download PDF

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CN202285233U
CN202285233U CN2009901006313U CN200990100631U CN202285233U CN 202285233 U CN202285233 U CN 202285233U CN 2009901006313 U CN2009901006313 U CN 2009901006313U CN 200990100631 U CN200990100631 U CN 200990100631U CN 202285233 U CN202285233 U CN 202285233U
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pin
encapsulated
resin
recess
island portion
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古贺明宏
西冈太郎
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Rohm Co Ltd
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Abstract

本实用新型提供一种半导体装置，包括：半导体芯片、在上表面接合有所述半导体芯片的岛部、配置在所述岛部的周围的引脚、架设在所述半导体芯片的表面和所述引脚的上表面之间的焊线、将所述半导体芯片、所述岛部、所述引脚及所述焊线进行整体密封的树脂封装，所述岛部的下表面及所述引脚的下表面在所述树脂封装的背面露出，在所述引脚上形成有从下表面侧凹陷，且在其侧面被打开的凹部。

Description

半导体装置
技术领域
本发明涉及表面安装型的半导体装置。
背景技术
作为表面安装型封装，公知的是去掉来自树脂封装的引脚的延伸，而使引脚(outer lead：外引脚)在树脂封装的下表面露出的所谓无引脚封装(Non-Lead Package)。
采用了无引脚封装的半导体装置具有将半导体芯片与引脚框一起用树脂封装进行密封的结构。引脚框通过对金属薄板进行冲切而形成，并具备岛部(island)和配置在该岛部的周围的多个引脚。半导体芯片被管芯焊接在岛部的上表面，利用架设于其表面和各引脚的上表面之间的焊线(bonding wire)，与各引脚进行电连接。而且，岛部及各引脚的下表面在树脂封装的背面露出。
现有技术文献
专利文献
专利文献1：(日本)特开2007-95788号公报
发明内容
本发明要解决的课题
在这种结构中，各引脚只通过其上表面及侧面和树脂封装的接合力保持于树脂封装。因此，引脚可能会从树脂封装脱落。
因此，本发明的目的在于，提供一种能够实现引脚与树脂封装的接合强度的提高的表面安装型的半导体装置。
解决课题的手段
用于达成所述的目的的本发明的半导体装置，含有：半导体芯片、上表面接合有所述半导体芯片的岛部、配置在所述岛部的周围的引脚、架设在所述半导体芯片的表面与所述引脚的上表面之间的焊线、和将所述半导体芯片、所述岛部、所述引脚及所述焊线进行整体密封的树脂封装，所述岛部的下表面及所述引脚的下表面在所述树脂封装的背面露出，在所述引脚形成有从下表面侧凹陷，且在其侧面被打开的凹部。
在该半导体装置中，通过接合(管芯焊接)有半导体芯片的岛部及半导体芯片和焊线而电连接的引脚的各下表面，在将这些进行整体密封的树脂封装的背面露出。因此，所述半导体装置能够进行对配线基板的表面安装。
而且，在引脚形成有从其下表面侧凹陷，且在侧面被打开的凹部。由于树脂封装的材料进入该凹部，引脚的周缘部的一部分被树脂封装从其上下两侧夹持。由此，能够实现引脚和树脂封装的接合强度的提高。其结果是，能够防止引脚从树脂封装脱落。
优选所述凹部具有从底面看呈圆弧状的部分。在该构成中，能够增强该圆弧状的全部半径方向的引脚和树脂封装的接合强度。
例如，在引脚的侧面在树脂封装的侧面露出的构成的情况下，当凹部按照在其露出的侧面被打开的方式形成时，由于凹部被用于树脂封装的形成的成型模具闭塞，树脂封装的材料可能不能进入凹部。
因此，优选所述凹部在与引脚的岛部对置的侧面被打开。由此，由于凹部不会被成型模具闭塞，能够使树脂封装的材料确实地进入凹部，因此，能够确实地提高引脚与树脂封装的接合强度。
另外，所述岛部从底面看呈方形状，引脚从底面看，配置在分别与岛部的四边对置的部分，也可以形成为具有与该对置的边平行的边的形状。在该情况下，优选凹部在具有与各引脚的岛部的各边对置的边的侧面被打开。由此，由于能够使树脂封装的材料确实地进入各引脚的凹部，因此，能够确实地提高各引脚和树脂封装的接合强度。
另外，优选所述凹部从底面看的面积为引脚的下表面的总面积的1/2以下。只要为这种凹部的尺寸，就能够实现引脚和树脂封装的接合强度的提高，同时，能够使焊线接合到引脚的相对较厚的部分。而且，能够充分地确保引脚相对于配线基板的接触面积。
另外，优选所述引脚具有在树脂封装的侧面露出的侧面，在沿引脚的其露出的侧面的部分，遍及沿该侧面的方向的整个宽度，形成有从所述引脚的下表面侧凹陷的凹槽。由于树脂封装的材料也进入该凹槽中，所以能够进一步提高引脚和树脂封装的接合强度。
附图说明
图1是本发明的第一实施方式的半导体装置的底面图；
图2是将图1所示的半导体装置用切断线II-II切断时的剖面示意图；
图3是本发明的第二实施方式的半导体装置的底面图；
图4是本发明的第三实施方式的半导体装置的底面图；
图5是本发明的第四实施方式的半导体装置的底面图；
图6是本发明的第五实施方式的半导体装置的底面图；
图7是本发明的第六实施方式的半导体装置的底面图。
符号说明
1…半导体装置
2…半导体芯片
4…树脂封装
5…岛部
6…引脚
12…凹部
13…焊线
31…半导体装置
32…凹部
41…半导体装置
42…凹槽
51…半导体装置
52…凹部
53…凹部
61…半导体装置
62…凹部
具体实施方式
下面，参照附图对本发明的实施方式详细地进行说明。
图1是本发明的第一实施方式的半导体装置的底面图。图2是将图1所示的半导体装置用切断线II-II切断时的剖面示意图。
半导体装置1具有将半导体芯片2与引脚框3一起用树脂封装4进行密封的结构。半导体装置1的外形呈扁平的立方体形状(在该实施方式中为俯看呈正方形状的六面体)。
引脚框3通过对金属薄板(例如，铜薄板)进行冲切而形成，具备岛部5、和配置于岛部5的周围的4个引脚6。
岛部5从平面看呈方形状(在该实施方式中俯看为正方形状)。岛部5的下表面在树脂封装4的背面露出。
引脚6从底面看，配置于分别与岛部5的四边对置的部分。各引脚6从底面看形成为梯形状。更具体地说，各引脚6在平面看，形成为具有：与岛部5的对置的边平行的边7、在树脂封装4的侧面上延伸的边8、与边8正交并与树脂封装4的侧面平行地延伸的边9、分别与边7和边8，9连接的边10，11的形状。
在各引脚6形成有从引脚6的下表面(露出面)侧凹陷，且在与岛部5对置的侧面即具有边7的侧面被打开的、底面看呈半圆形状的凹部12。树脂封装4的材料进入凹部12内。凹部12能够通过例如，化学蚀刻或粉碎加工形成。
而且，各引脚6的下表面除凹部12外，在树脂封装4的背面露出，作为用于与配线基板(未图示)连接的外部端子发挥功能。另外，各引脚6的具有边8的侧面在树脂封装4的侧面露出。
半导体芯片2在使形成有功能元件的一侧的表面(器件形成面)朝向上方的状态下，其背面经由导电性接合剂接合(die bonding：管芯焊接)于岛部5。在半导体芯片2的表面，与各引脚6对应，通过使配线层的一部分从表面保护膜露出而形成有焊盘(未图示)。在各焊盘接合有焊线(bonding wire)13的一端。焊线13的另一端接合在各引脚6的相对较厚的部分(没有形成凹部12的部分)的上表面。由此，半导体芯片2经由焊线13与引脚6电连接。
如上所述，岛部5及引脚6的各下表面在树脂封装4的背面露出。因此，半导体装置1可以进行对配线基板的表面安装。
而且，在各引脚6形成有从其下表面侧凹陷，且在具有边7的侧面被打开的凹部12。由于树脂封装4的材料进入该凹部12，形成有各引脚6的凹部12的部分树脂封装4从其上下两侧夹持。由此，能够实现各引脚6和树脂封装4的接合强度的提高。其结果，能够防止引脚6从树脂封装4脱落。
另外，由于凹部12在具有边7的侧面打开，所以能够使树脂封装4的材料确实地进入凹部12。
另外，由于凹部12从底面看形成为半圆形状，所以能够增强该圆弧的所有半径方向的引脚6与树脂封装4的接合强度。
图3是本发明的第二实施方式的半导体装置的底面图。在图3中，对相当于图1所示的各部的部分，附加与这些各部所附加的参照符号相同的参照符号。而且，下面，对于图3所示的构成，只对与图1所示的构成的不同点进行说明，省略附加了相同参照符号的各部的说明。
在图3所示的半导体装置31中，在各引脚6上形成有从其下表面侧凹陷，且在具有边7的侧面被打开的、从底面看为直角三角形状的凹部32。树脂封装4的材料进入凹部32。凹部32能够通过例如化学蚀刻或粉碎加工而形成。
在该构成中，能够实现各引脚6和树脂封装4的接合强度的提高。其结果，能够防止引脚6从树脂封装4脱落。
图4是本发明的第三实施方式的半导体装置的底面图。在图4中，对相当于图1所示的各部的部分，附加与这些各部所附加的参照符号相同的参照符号。而且，下面，对于图4所示的构成，只对与图1所示的构成的不同点进行说明，省略附加了相同的参照符号的各部的说明。
在图4所示的半导体装置41中，在各引脚6的具有边8的部分，遍及沿该边8的方向的整个宽度，形成有从各引脚6的下表面侧凹陷的凹槽42。
根据该构成，由于树脂封装4的材料进入凹部12及凹槽42，因此，能够进一步提高各引脚6和树脂封装4的接合强度。
图5是本发明的第四实施方式的半导体装置的底面图。在图5中，对相当于图1所示的各部的部分，附加与这些各部所附加的参照符号相同的参照符号。而且，下面，对于图5所示的构成，只对与图1所示的构成的不同点进行说明，省略附加了相同的参照符号的各部的说明。
在图5所示的半导体装置51中，在各引脚6上形成有从其下表面侧凹陷，且在具有各边7，8，9的侧面被开放的、从底面看呈半圆形状的凹部12，52，53。
根据该构成，由于树脂封装4的材料进入凹部12，52，53，因此，能够进一步提高各引脚6和树脂封装4的接合强度。
图6是本发明的第五实施方式的半导体装置的底面图。在图6中，对相当于图1所示的各部的部分，附加与这些各部所附加的参照符号相同的参照符号。而且，下面，对图6所示的构成，只对与图1所示的构成的不同点进行说明，省略附加了相同的参照符号的各部的说明。
在图6所示的半导体装置61中，在各引脚6上形成有比图1所示的凹部12尺寸大的、从底面看呈半圆形状的凹部62。凹部62从其下表面侧凹陷，在具有边7的侧面被打开。而且，凹部62的从底面看的面积是引脚6的下表面的总面积的约1/2。
如果凹部62的从底面看的面积为引脚6的下表面的总面积的1/2以下，则可以实现引脚6和树脂封装4的接合强度的提高，同时，能够使焊线13与引脚6的相对较厚的部分接合。而且，能够充分确保引脚6相对于配线基板的接触面积。
图7是本发明的第六实施方式的半导体装置的底面图。在图7中，对相当于图1所示的各部的部分，附加与这些各部所附加的参照符号相同的参照符号。而且，下面，对图7所示的构成，只对与图1所示的构成的不同点进行说明，省略附加了相同的参照符号的各部的说明。
在图7所示的半导体装置71中，在岛部5形成有从其下表面侧凹陷，从底面看，沿岛部5的两根对角线延伸的槽状的凹部72。树脂封装4的材料进入凹部72。凹部72可以通过例如化学蚀刻或粉碎加工而形成。
通过树脂封装4的材料进入凹部72，岛部5的形成有凹部72的部分被树脂封装4从其上下两侧夹持。由此，能够实现岛部5和树脂封装4的接合强度的提高。其结果是，能够防止岛部5从树脂封装4脱落。
以上，对本发明的第一～第六实施方式进行了说明，但第一～第六实施方式也可以适当组合进行实施。例如，也可以通过组合第一实施方式和第四实施方式，图5所示的三个凹部12，52，53中的一个或两个从底面看形成为半圆形状，其余从底面看形成为直角三角形状。另外，也可以通过组合第二实施方式和第三实施方式，在各引脚6上形成图3所示的从底面看呈直角三角形状的凹部32和图4所示的凹槽42。
虽然对本发明的实施方式详细地进行了说明，但这些只不过是为了说明本发明的技术内容而使用的具体例，本发明不应限定于这些具体例来进行解释，本发明的精神及范围只通过添付的权利要求进行限定。
本申请与2008年12月22日在日本国特许厅提出的特愿2008-326113号相对应，该申请的全部公开在此通过引用被编入。

Claims (17)

1.一种半导体装置，其特征在于，包括：
半导体芯片；
在上表面接合有所述半导体芯片的岛部；
配置在所述岛部的周围的引脚；
架设在所述半导体芯片的表面与所述引脚的上表面之间的焊线；和
将所述半导体芯片、所述岛部、所述引脚及所述焊线进行整体密封的树脂封装，其中，
所述岛部的下表面及所述引脚的下表面在所述树脂封装的背面露出，
在所述引脚形成有从下表面侧凹陷，且在其侧面被打开的凹部。
2.如权利要求1所述的半导体装置，其特征在于：
所述凹部具有在底面看呈圆弧状的部分。
3.如权利要求1或2所述的半导体装置，其特征在于：
所述凹部在所述引脚的与所述岛部对置的侧面被打开。
4.如权利要求1或2所述的半导体装置，其特征在于：
所述岛部从底面看呈方形，
所述引脚从底面看配置在分别与所述岛部的四边对置的部分，形成为具有与该对置的边平行的边的形状。
5.如权利要求1或2所述的半导体装置，其特征在于：
所述凹部的在底面看的面积为所述引脚的下表面的总面积的1/2以下。
6.如权利要求1或2所述的半导体装置，其特征在于：
所述引脚具有在所述树脂封装的侧面露出的侧面，
在所述引脚的沿所述露出的侧面的部分，遍及沿该侧面的方向的整个宽度，形成有从所述引脚的下表面侧凹陷的凹槽。 
7.如权利要求4所述的半导体装置，其特征在于：
所述引脚还具有与所述树脂封装的边平行的边。
8.一种半导体装置，其特征在于，包括：
半导体芯片；
在上表面接合有所述半导体芯片的岛部；
配置在所述岛部的周围的引脚；
架设在所述半导体芯片的表面和所述引脚的上表面之间的焊线；和
将所述半导体芯片、所述岛部、所述引脚及所述焊线进行整体密封的树脂封装，其中，
所述引脚配置在所述树脂封装的角部附近，
所述岛部按照所述半导体芯片的角部与所述树脂封装的各边的大致中央部对置的方式，相对于所述树脂封装的所述各边倾斜配置，
所述岛部的下表面及所述引脚的下表面在所述树脂封装的背面露出，
在所述引脚形成有从下表面侧凹陷，且在其侧面被打开的凹部。
9.如权利要求8所述的半导体装置，其特征在于：
所述凹部具有在底面看呈圆弧状的部分。
10.如权利要求8或9所述的半导体装置，其特征在于：
所述凹部在与所述引脚的所述岛部对置的侧面被打开。
11.如权利要求8或9所述的半导体装置，其特征在于：
所述岛部从底面看呈方形，
所述引脚从底面看配置在分别与所述岛部的四边对置的部分，形成为具有与该对置的边平行的边的形状。
12.如权利要求8或9所述的半导体装置，其特征在于：
所述凹部的在底面看的面积为所述引脚的下表面的总面积的1/2以下。 
13.如权利要求8或9所述的半导体装置，其特征在于：
所述引脚具有在所述树脂封装的侧面露出的侧面，
在所述引脚的沿所述露出的侧面的部分，遍及沿该侧面的方向的整个宽度，形成有从所述引脚的下表面侧凹陷的凹槽。
14.如权利要求8所述的半导体装置，其特征在于：
所述岛部的所述下表面的一边比所述树脂封装的一边的一半还短。
15.如权利要求8所述的半导体装置，其特征在于：
所述凹部包括在形成所述引脚的多个边上形成的多个凹部。
16.如权利要求8所述的半导体装置，其特征在于：
所述岛部具有与所述引脚的所述凹部不同的形状的凹部。
17.如权利要求8所述的半导体装置，其特征在于：
所述岛部具有沿其对角线延伸的槽状的凹部。 
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CN104701286A (zh) * 2013-12-06 2015-06-10 恩智浦有限公司 具有内部多边形焊盘的封装半导体器件
CN104701286B (zh) * 2013-12-06 2018-05-01 安世有限公司 具有内部多边形焊盘的封装半导体器件
US10056343B2 (en) 2013-12-06 2018-08-21 Nexperia B.V. Packaged semiconductor device with interior polygonal pads
CN109427960A (zh) * 2017-09-04 2019-03-05 罗姆股份有限公司 半导体器件

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US20150179554A1 (en) 2015-06-25
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US9035436B2 (en) 2015-05-19
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KR20110102917A (ko) 2011-09-19
US8742552B2 (en) 2014-06-03
US9607932B2 (en) 2017-03-28
US20160225700A1 (en) 2016-08-04
US8502359B2 (en) 2013-08-06
US9887150B2 (en) 2018-02-06
US20170179006A1 (en) 2017-06-22
US10014241B2 (en) 2018-07-03
US20170287817A1 (en) 2017-10-05
US20120018896A1 (en) 2012-01-26
US20140225243A1 (en) 2014-08-14
US20130285250A1 (en) 2013-10-31
US20180122726A1 (en) 2018-05-03

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