CN202282349U - 贴片式led支架 - Google Patents

贴片式led支架 Download PDF

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Publication number
CN202282349U
CN202282349U CN2011202712943U CN201120271294U CN202282349U CN 202282349 U CN202282349 U CN 202282349U CN 2011202712943 U CN2011202712943 U CN 2011202712943U CN 201120271294 U CN201120271294 U CN 201120271294U CN 202282349 U CN202282349 U CN 202282349U
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王璇
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HUIZHOU HAOEN PRECISION INJECTION MOLDING CO Ltd
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HUIZHOU HAOEN PRECISION INJECTION MOLDING CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H01L2224/48097—Kinked the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

本实用新型公开了一种贴片式LED支架，它包括塑胶底座、复数个导电引脚、反光杯及晶片，所述导电引脚一端穿过塑胶底座且显露于塑胶底座的封装腔内；另一端靠近塑胶底座位置折弯形成电极支脚而隐藏于塑胶底座底部，反光杯及晶片设置于塑胶底座的封装腔内，所述晶片与导电引脚之间通过金线连接，其改进在于：所述塑胶底座封装腔内设置有一金属片，金属片呈凹槽状结构，凹槽槽底显露于塑胶底座底面，凹槽内连接有一铜柱，晶片安装于铜柱上；本实用新型的有益效果在于本实用新型结构中的晶片放置面与金线焊接面不在同一平面，从而使晶片放置区域与金线焊接区域不产生相互影响，而且金属片可直接将晶片发光所产生的热量导出到外界，具有更好的散热效果。

Description

贴片式LED支架
【技术领域】
本实用新型涉及LED产品，尤其是一种贴片式LED支架。
【背景技术】
随着半导体技术的迅猛发展和应用技术的日益成熟，LED作为一种新型的节能环保光源，在照明方面的应用，深受人们的密切关注，同时人们对LED的使用要求也越来越高，大功率，高出光率，高显色性己是做为照明市场的要求，很多国家和企业投入大量的人力和财力进行研发生产，如图1至图2所示，目前，现有技术中的LED支架包括塑胶底座1、复数个导电引脚2、反光杯3及晶片4，导电引脚2一端穿过塑胶底座1且显露于塑胶底座1的封装腔内；另一端靠近塑胶底座1位置折弯形成电极支脚21而隐藏于塑胶底座1底部，反光杯3及晶片4设置于塑胶底座1的封装腔内，晶片4与导电引脚2之间通过金线连接；该结构存在以下缺陷：1)、晶片的放置空间受限，产品的功率只能做到中功率，因晶片放置与金线连接位置都在同一平面，同时晶片在固定时所使用的胶水会有扩散现象，如增大晶片放置区域，相应金线连接的区域就会减少，这样会影响产品生产制程。2)、散热性不好，出光效率低，长期使用过程中光衰严重，产品的可靠性差。产品的散热是通过引脚散热，散热路径长，因引脚包在塑胶内，散热效果不好。
【实用新型内容】
本实用新型的目的在于提供一种可有效克服上述不足、散热效果好、可靠性高的贴片式LED支架。
本实用新型的技术方案是这样实现的：它包括塑胶底座、复数个导电引脚、反光杯及晶片，所述导电引脚一端穿过塑胶底座且显露于塑胶底座的封装腔内；另一端靠近塑胶底座位置折弯形成电极支脚而隐藏于塑胶底座底部，反光杯及晶片设置于塑胶底座的封装腔内，所述晶片与导电引脚之间通过金线连接，其改进在于：所述塑胶底座封装腔内设置有一金属片，金属片呈凹槽状结构，凹槽槽底显露于塑胶底座底面，凹槽内连接有一铜柱，晶片安装于铜柱上；
上述结构中，所述塑胶底座的封装腔内的导电引脚部分与凹槽的槽口位于同一平面；
上述结构中，所述塑胶底座的封装腔内的导电引脚部分与金属片之间通过胶体隔开。
相比于现有技术中的LED支架，本实用新型的有益效果在于：本实用新型的贴片式LED支架在塑胶底座封装腔内设置有一金属片，金属片呈凹槽状结构，凹槽槽底显露于塑胶底座底面，金属片凹槽内连接有一铜柱，晶片安装于铜柱上，该结构设计使得晶片放置面与金线焊接面不在同一平面，从而使晶片放置区域与金线焊接区域不产生相互影响，而且金属片可直接将晶片发光所产生的热量导出到外界，具有更好的散热效果；此外，由于导电引脚与金属片槽底不在同一平面内，即导电引脚与晶片放置区域采用分离式结构，使得热路和电路部分相对隔开，可避免因晶片发热过高对电路造成影响，其可靠性更高、功率大。
【附图说明】
图1为现有技术中的LED支架的主视图；
图2为现有技术中的LED支架的结构示意图；
图3为本实用新型的单个贴片式LED支架的主视图；
图4为本实用新型的贴片式LED支架的结构示意图；
图5为本实用新型多个贴片式LED支架组成的整体结构示意图；
【具体实施方式】
下面结合附图和实施例对本实用新型作进一步的描述。
如图3至图4所示，本实用新型揭示的贴片式LED支架，它包括塑胶底座1、复数个导电引脚2、反光杯3及晶片4，导电引脚2一端穿过塑胶底座1且显露于塑胶底座1的封装腔内，另一端靠近塑胶底座1位置折弯形成电极支脚21而隐藏于塑胶底座1底部，反光杯3及晶片4设置于塑胶底座1的封装腔内，晶片4与导电引脚2之间通过金线7连接；塑胶底座1封装腔内设置有一金属片5，金属片5呈凹槽状结构，凹槽槽底显露于塑胶底座1底面，凹槽内焊接有一铜柱6，晶片4安装于铜柱6上。如图5所示，将成型的多个贴片式LED支架100固定于固定架200上，形成LED产品。
优选地，塑胶底座1的封装腔内的导电引脚部分与金属片5的凹槽的槽口位于同一平面，且塑胶底座1的封装腔内的导电引脚部分与金属片5之间通过胶体8隔开。
由于本实用新型的贴片式LED支架在塑胶底座1封装腔内设置有一金属片5，金属片5呈凹槽状结构，凹槽槽底显露于塑胶底座1底面，金属片5的凹槽内连接有一铜柱6，晶片4安装于铜柱6上，所以使得晶片4放置面与金线7焊接面不在同一平面，从而使晶片4放置区域与金线7焊接区域不产生相互影响，而且金属片5可直接将晶片4发光所产生的热量导出到外界，具有更好的散热效果；此外，由于导电引脚2与金属片5槽底不在同一平面内，即导电引脚2与晶片4放置区域采用分离式结构，使得热路和电路部分相对隔开，可避免因晶片4发热过高对电路造成影响，其可靠性更高、功率大。
以上所描述的仅为本实用新型的较佳实施例，上述具体实施例不是对本实用新型的限制。在本实用新型的技术思想范畴内，可以出现各种变形及修改，凡本领域的普通技术人员根据以上描述所做的润饰、修改或等同替换，均属于本实用新型所保护的范围。

Claims (3)

1.一种贴片式LED支架，它包括塑胶底座、复数个导电引脚、反光杯及晶片，所述导电引脚一端穿过塑胶底座且显露于塑胶底座的封装腔内；另一端靠近塑胶底座位置折弯形成电极支脚而隐藏于塑胶底座底部，反光杯及晶片设置于塑胶底座的封装腔内，所述晶片与导电引脚之间通过金线连接，其特征在于：所述塑胶底座封装腔内设置有一金属片，金属片呈凹槽状结构，凹槽槽底显露于塑胶底座底面，凹槽内连接有一铜柱，晶片安装于铜柱上。
2.根据权利要求1所述的贴片式LED支架，其特征在于：所述塑胶底座的封装腔内的导电引脚部分与凹槽的槽口位于同一平面。
3.根据权利要求1所述的贴片式LED支架，其特征在于：所述塑胶底座的封装腔内的导电引脚部分与金属片之间通过胶体隔开。 
CN2011202712943U 2011-07-27 2011-07-27 贴片式led支架 Expired - Fee Related CN202282349U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016078011A1 (zh) * 2014-11-19 2016-05-26 史伯梅 Led支架及led发光单元
CN107946431A (zh) * 2017-11-22 2018-04-20 深圳成光兴光电技术股份有限公司 一种贴片式红外线发射管
CN108963045A (zh) * 2017-05-19 2018-12-07 东莞昶通精密五金有限公司 一种高信赖性的白光led支架
CN109682490A (zh) * 2019-02-19 2019-04-26 兴勤（宜昌）电子有限公司 模组化导热测温传感器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016078011A1 (zh) * 2014-11-19 2016-05-26 史伯梅 Led支架及led发光单元
CN108963045A (zh) * 2017-05-19 2018-12-07 东莞昶通精密五金有限公司 一种高信赖性的白光led支架
CN107946431A (zh) * 2017-11-22 2018-04-20 深圳成光兴光电技术股份有限公司 一种贴片式红外线发射管
CN109682490A (zh) * 2019-02-19 2019-04-26 兴勤（宜昌）电子有限公司 模组化导热测温传感器

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