CN202269093U - 铝基覆铜线路板 - Google Patents

铝基覆铜线路板 Download PDF

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Publication number
CN202269093U
CN202269093U CN2011203589151U CN201120358915U CN202269093U CN 202269093 U CN202269093 U CN 202269093U CN 2011203589151 U CN2011203589151 U CN 2011203589151U CN 201120358915 U CN201120358915 U CN 201120358915U CN 202269093 U CN202269093 U CN 202269093U
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China
Prior art keywords
layer
copper foil
aluminum
routing
circuit board
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Expired - Fee Related
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CN2011203589151U
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English (en)
Inventor
刘伟
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Zhejiang Long-Range Electronic Development Co Ltd
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Zhejiang Long-Range Electronic Development Co Ltd
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Abstract

本实用新型提供了一种高密度走线的铝基覆铜线路板,包括铝板,所述铝板上设有铜箔层,所述铜箔层上依次设有下走线层和上走线层,所述铝板与铜箔层之间、铜箔层与下走线层之间、下走线层与上走线层之间分别设有绝缘层,所述上走线层、下走线层及其铜箔层上方的绝缘层上设有多个贯通孔。本实用新型的铝基覆铜线路板,在铜箔上方设有两层走线层,并设有绝缘层,两层走线层上设有多个贯通孔与铜箔相贯通,实现了高密度走线的需求,并且通过铝板进行散热,导热效果好,线路板的使用寿命长。

Description

铝基覆铜线路板
技术领域
本实用新型涉及一种线路板,尤其是一种铝基覆铜线路板。
背景技术
铝基覆铜线路板目前正广泛用于电源模块、汽车电子及LED照明灯领域,由于其良好的导热性,较高的绝缘水平及较低的制造成本,其应用领域正在逐步扩展。但在模块电源的应用中,随着功率电子技术不断进步,功率密度正逐步提高,对使用的铝基电路板提出了更高密度的要求。而普通铝基板由于只能单面走线已很难满足需求。
实用新型内容
本实用新型提供了一种高密度走线的铝基覆铜线路板。
实现本实用新型目的的铝基覆铜线路板,包括铝板,所述铝板上设有铜箔层,所述铜箔层上依次设有下走线层和上走线层,所述铝板与铜箔层之间、铜箔层与下走线层之间、下走线层与上走线层之间分别设有绝缘层,所述上走线层、下走线层及其铜箔层上方的绝缘层上设有多个贯通孔。
本实用新型的有益效果如下:
本实用新型的铝基覆铜线路板,在铜箔上方设有两层走线层,并设有绝缘层,两层走线层上设有多个贯通孔与铜箔相贯通,实现了高密度走线的需求,并且通过铝板进行散热,导热效果好,线路板的使用寿命长。
附图说明
图1为本实用新型铝基覆铜线路板的结构示意图。
具体实施方式
本实用新型的实施例如下:
如图1所示,本实用新型的铝基覆铜线路板,包括铝板1,所述铝板1上设有铜箔层3,所述铜箔层3上依次设有下走线层4和上走线层5,所述铝板1与铜箔层3之间、铜箔层3与下走线层4之间、下走线层4与上走线层5之间分别设有绝缘层2,所述上走线层5、下走线层4及其铜箔层3上方的绝缘层2上设有多个贯通孔6。
本实用新型的铝基覆铜线路板,在铜箔层3上方设有两层走线层,并设有绝缘层2,两层走线层上设有多个贯通孔6与铜箔层3相贯通,实现了高密度走线的需求,并且通过铝板1进行散热,导热效果好,线路板的使用寿命长。
上面所述的实施例仅仅是对本实用新型的优选实施方式进行描述,并非对本实用新型的范围进行限定,在不脱离本实用新型设计精神前提下,本领域普通工程技术人员对本实用新型技术方案做出的各种变形和改进,均应落入本实用新型的权利要求书确定的保护范围内。

Claims (1)

1.一种铝基覆铜线路板,包括铝板,所述铝板上设有铜箔层,其特征在于:所述铜箔层上依次设有下走线层和上走线层,所述铝板与铜箔层之间、铜箔层与下走线层之间、下走线层与上走线层之间分别设有绝缘层,所述上走线层、下走线层及其铜箔层上方的绝缘层上设有多个贯通孔。
CN2011203589151U 2011-09-02 2011-09-02 铝基覆铜线路板 Expired - Fee Related CN202269093U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203589151U CN202269093U (zh) 2011-09-02 2011-09-02 铝基覆铜线路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203589151U CN202269093U (zh) 2011-09-02 2011-09-02 铝基覆铜线路板

Publications (1)

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CN202269093U true CN202269093U (zh) 2012-06-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793462A (zh) * 2016-12-23 2017-05-31 皆利士多层线路版(中山)有限公司 高导热单面金属基线路板及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793462A (zh) * 2016-12-23 2017-05-31 皆利士多层线路版(中山)有限公司 高导热单面金属基线路板及其制备方法

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Assignee: ZHEJIANG WEIHONG ELECTRONIC MATERIAL DEVELOPMENT CO., LTD.

Assignor: Zhejiang long-range electronic development Co., Ltd

Contract record no.: 2014330000148

Denomination of utility model: Aluminum-based copper-coated circuit board

Granted publication date: 20120606

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Record date: 20140512

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