CN202066613U - Oil-filled temperature pressure combined sensor - Google Patents
Oil-filled temperature pressure combined sensor Download PDFInfo
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- CN202066613U CN202066613U CN2011201779607U CN201120177960U CN202066613U CN 202066613 U CN202066613 U CN 202066613U CN 2011201779607 U CN2011201779607 U CN 2011201779607U CN 201120177960 U CN201120177960 U CN 201120177960U CN 202066613 U CN202066613 U CN 202066613U
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- pressure
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- temperature
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- circular groove
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Abstract
An oil-filled temperature pressure combined sensor belongs to the technical field of a temperature pressure combined sensor, and solves the problem that a temperature pressure combined sensor formed by assembling two sensors cannot carry out measurement to signals in a local area simultaneously. The oil-filled temperature pressure combined sensor comprises a pipe holder, a pressure chip, a temperature chip, a gold wire lead wire, a silver palladium wire, an outer leading out wire bunch, a ceramic ring, a sealing plug, a corrugated diaphragm, and a press ring, wherein the pressure chip and the temperature chip are closely arranged in the pipe holder and welded on the pipe holder via an eutectic welding mode. In using the oil-filled temperature pressure combined sensor, after vacuum oil filling is carried out, the pressure chip and the temperature chip are protected simultaneously, and the corrugated diaphragm is used for sensing pressure. The oil-filled temperature pressure combined sensor is suitable for the simultaneous measurement of the temperature and pressure of the local area.
Description
Technical field
The utility model relates to a kind of filling type temperature and pressure compound sensor, belongs to the temperature and pressure compound sensor technical field.
Background technology
Existing temperature and pressure compound sensor mainly contains two kinds of forms: a kind of is that different temperature sensors and pressure transducer are fitted together, two common apart from each others of sensor that this mode makes up, at least at the cm order of magnitude, can not experience the temperature signal and the pressure signal of little regional area simultaneously, and since temperature sensor and pressure transducer need encapsulate respectively and isolate with measured medium, therefore cause the overall volume of sensor bigger, manufacturing cost is higher; Another kind is that temperature sensor and pressure transducer are produced on the same chip, the realization single-chip is compound, because it is platinum film that the standard of temperature sensor is experienced film, and the sensitive resistance of experiencing pressure is a monocrystalline silicon, therefore the compound mode of this single-chip is compatible relatively poor on manufacture craft, makes the poor-performing of compound sensor.
The utility model content
The utility model is the problem that can not measure the signal of regional area simultaneously for the temperature and pressure compound sensor that solves two kinds of sensors assemblings of employing formation, and a kind of filling type temperature and pressure compound sensor is provided.
Filling type temperature and pressure compound sensor described in the utility model, it by base, pressure chip, chip temperature, spun gold lead-in wire, silver-colored palladium silk, draw wire harness, ceramic ring, shutoff plug, convoluted diaphragm and pressure ring outward and form,
Base is a solid of revolution, and the upper surface center of base has circular groove, and the circular groove bottom has oil hole and outer lead hole, and all near the cell wall place of circular groove, the bottom of oil hole is provided with the shutoff plug for oil hole and outer lead hole,
Pressure chip and chip temperature eutectic are welded in the circular groove of base; The adjacently situated surfaces distance of pressure chip and chip temperature is d; Ceramic ring is fixedly installed in the circular groove; And pressure chip and chip temperature are positioned at ceramic ring; Has uniform gap between the outer wall surface of ceramic ring and the cell wall of circular groove; Be provided with through hole on the ceramic ring sidewall corresponding with oil filler point and outer lead hole; Drawing wire harness outward passes the outer lead hole and extends in the circular groove; Draw outward wire harness outside in the fairlead mode by glass sintering be fixedly connected with base
Each electrode of pressure chip is by the terminal bonding of an intrafascicular lead of spun gold lead-in wire and outer extension line, and each electrode of chip temperature is by the end welding of an intrafascicular lead of silver-colored palladium silk and outer extension line;
The upper surface of base is welded with convoluted diaphragm, and this convoluted diaphragm covers the circular groove top on the base, and making this circular groove is confined space, on the upper surface of convoluted diaphragm pressure ring is set, pressure ring is connected with the upper surface of base by the argon arc welding, and convoluted diaphragm is compressed
Be full of extending oil in the circular groove of base.
The utility model has the advantages that: the utility model is with pressure chip and chip temperature is in-plant is assemblied in the base; mode by the eutectic weldering is welded on it on base; in use; after carrying out vacuum oil filling; pressure chip and chip temperature are protected simultaneously, experience pressure by convoluted diaphragm again.Owing to adopt this mode, pressure chip and chip temperature can realize the mm level apart from the gap, therefore can experience the temperature signal and the pressure signal of little regional area simultaneously, measure accurately, solve the technical barrier of measuring the same area pressure and temperature signal simultaneously, simultaneously pressure sensing temperature compensation has been had good effect.
The volume of the utility model device self is little, and pressure chip and chip temperature are filled oil guard, does not directly contact with measured medium, has advantages of higher stability and reliability; The utility model device is easy to assembling, can produce in batches.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
Embodiment
Embodiment one: present embodiment is described below in conjunction with Fig. 1, the described filling type temperature and pressure compound sensor of present embodiment, it by base 1, pressure chip 2, chip temperature 3, spun gold lead-in wire 4-1, silver-colored palladium silk 4-2, draw wire harness 5, ceramic ring 6, shutoff plug 7, convoluted diaphragm 8 and pressure ring 9 outward and form
Each electrode of pressure chip 2 is by spun gold lead-in wire 4-1 and the terminal bonding of drawing a lead in the wire harness 5 outward, and each electrode of chip temperature 3 is by silver-colored palladium silk 4-2 and the end welding of drawing a lead in the wire harness 5 outward;
The upper surface of base 1 is welded with convoluted diaphragm 8, the circular groove top that this convoluted diaphragm 8 covers on the base 1, and making this circular groove is confined space, pressure ring 9 is set on the upper surface of convoluted diaphragm 8, pressure ring 9 is connected with the upper surface of base 1 by the argon arc welding, and convoluted diaphragm 8 is compressed
Be full of extending oil in the circular groove of base 1.
The described filling type temperature and pressure compound sensor of present embodiment is compared with the complex method that different temperature sensors and pressure transducer are fitted together, and it is little to have a volume, is easy to produce, and can accurately measure the advantage of the temperature and pressure signal of same position; Compare with the single-chip complex method that temperature sensor and pressure transducer are produced on the same chip, because pressure chip 2 and chip temperature 3 are made respectively, in the compatibility issue of having avoided pressure chip 2 and chip temperature 3 different process, can measure the pressure and temperature signal in the little regional area simultaneously.
Silver palladium silk 4-2 and the welding of drawing a lead in the wire harness 5 outward for guaranteeing weld strength, draw silver-colored palladium silk 4-2 outside earlier on the lead in the wire harness 5 and twine two circles, tap into the row welding with argon arc welding then.
The purpose that ceramic ring 6 is set is in order to make extending oil few as far as possible, to use ceramic ring 6 to occupy the wasted space that can't process in the circular groove of base 1.
Extending oil is used for carrying out the pressure transmission, can adopt methyl-silicone oil.Its fill method for processing that methyl-silicone oil is dewatered, outgas after, vacuumize and be filled in the base 1.After finishing, perfusion adopt process for stamping or energy storage welding method to carry out shutoff with shutoff plug 7 in the bottom of oil hole.Shutoff plug 7 can adopt steel ball.
Embodiment two: present embodiment is for to the further specifying of embodiment one, and the scope of described d is 0.5mm-2mm.
Design by rational distance between pressure chip 2 and the chip temperature 3, eutectic is welded in the base 1, utilize the argon arc welding that convoluted diaphragm 8 is welded on base 1 upper surface, adopt the method for vacuum oil in base 1, to inject extending oil, this extending oil can be silicone oil, carry out the oil hole shutoff after oiling is finished, promptly finish the making of filling type temperature and pressure compound sensor.
Embodiment three: present embodiment is for to the further specifying of embodiment one or two, and described pressure chip 2 is by SOI substrate, four monocrystalline silicon presser sensor resistance and SiO
2Layer is formed, and passes through SiO between four monocrystalline silicon presser sensor resistance and the SOI substrate
2Layer is isolated.
Four monocrystalline silicon presser sensor resistance are standard P t1000 resistance, and physical dimension is 2 * 4.
Embodiment four: present embodiment is for to the further specifying of embodiment one to three, and described chip temperature 3 is made up of ceramic substrate, platinum film and surperficial encapsulated layer, ceramic substrate upper surface attaching platinum film, platinum film upper surface wall-attached surface encapsulated layer.
Embodiment five: present embodiment is for to the further specifying of embodiment one to four, and base 1 adopts the argon arc welding with the welding of convoluted diaphragm 8.
Embodiment six: present embodiment is for to the further specifying of embodiment four, and evaporation or sputter have the gold layer on the outside surface of described ceramic substrate.
Embodiment seven: present embodiment is for to the further specifying of embodiment one to six, and the eutectic weld with pressure chip 2 and chip temperature 3 on the described base 1 is coated with the gold layer, and the eutectic solder of employing is the AuSn solder sheet.
Need eutectic weldering place to be coated with gold layer on base 1, the fusing point of AuSn eutectic solder is 280 ℃, about 300 ℃～310 ℃ of brazing temperature, have intensity height, creep resistant, heat conduction and conduct electricity very well, wellability is good, low viscosity and characteristics such as anticorrosive.Need not have the AuSn eutectic reflow soldering of scaling powder under vacuum environment, the vacuum reflow soldering can reduce the voidage of welding greatly, improves welding quality.
Embodiment eight: present embodiment is for to the further specifying of embodiment one to seven, and described spun gold lead-in wire 4-1 adopts the Metal Ball ultrasonic-thermocompression welding with the bonding of drawing a lead in the wire harness 5 outward.
Embodiment nine: present embodiment is for to the further specifying of embodiment one to eight, silver-colored palladium silk 4-2 with draw a lead in the wire harness 5 outward be welded as the argon arc welding.
Embodiment ten: present embodiment is for to the further specifying of embodiment one to nine, described base 1 and draw wire harness 5 employing kovar alloy materials outward and make.
The outside of drawing every lead in the wire harness 5 outward is coated with metallic gold, is connected by glass sintering with base 1.
Claims (9)
1. filling type temperature and pressure compound sensor, it is characterized in that: it by base (1), pressure chip (2), chip temperature (3), spun gold lead-in wire (4-1), silver-colored palladium silk (4-2), draw wire harness (5), ceramic ring (6), shutoff plug (7), convoluted diaphragm (8) and pressure ring (9) outward and form
Base (1) is a solid of revolution, and the upper surface center of base (1) has circular groove, and the circular groove bottom has oil hole and outer lead hole, and all near the cell wall place of circular groove, the bottom of oil hole is provided with shutoff plug (7) for oil hole and outer lead hole,
Pressure chip (2) and chip temperature (3) eutectic are welded in the circular groove of base (1), the adjacently situated surfaces distance of pressure chip (2) and chip temperature (3) is d, ceramic ring (6) is fixedly installed in the circular groove, and pressure chip (2) and chip temperature (3) are positioned at ceramic ring (6), has uniform gap between the outer wall surface of ceramic ring (6) and the cell wall of circular groove, be provided with through hole on ceramic ring (6) and the corresponding sidewall of oil hole and outer lead hole, drawing wire harness (5) outward passes the outer lead hole and extends in the circular groove, drawing wire harness (5) outward fixedlys connected with base (1) by the mode of glass sintering in the fairlead outside
Each electrode of pressure chip (2) is by spun gold lead-in wire (4-1) and the terminal bonding of drawing a lead in the wire harness (5) outward, and each electrode of chip temperature (3) is by silver-colored palladium silk (4-2) and the end welding of drawing a lead in the wire harness (5) outward;
The upper surface of base (1) is welded with convoluted diaphragm (8), this convoluted diaphragm (8) covers the circular groove top on the base (1), making this circular groove is confined space, pressure ring (9) is set on the upper surface of convoluted diaphragm (8), pressure ring (9) is connected with the upper surface of base (1) by the argon arc welding, convoluted diaphragm (8) is compressed
Be full of extending oil in the circular groove of base (1).
2. filling type temperature and pressure compound sensor according to claim 1 is characterized in that: the scope of described d is 0.5mm-2mm.
3. filling type temperature and pressure compound sensor according to claim 1 and 2 is characterized in that: described pressure chip (2) is by SOI substrate, four monocrystalline silicon presser sensor resistance and SiO
2Layer is formed, and passes through SiO between four monocrystalline silicon presser sensor resistance and the SOI substrate
2Layer is isolated.
4. filling type temperature and pressure compound sensor according to claim 1 and 2 is characterized in that: described chip temperature (3) is made up of ceramic substrate, platinum film and surperficial encapsulated layer, and the ceramic substrate upper surface attaches platinum film, platinum film upper surface wall-attached surface encapsulated layer.
5. filling type temperature and pressure compound sensor according to claim 1 and 2 is characterized in that: base (1) adopts the argon arc welding with the welding of convoluted diaphragm (8).
6. filling type temperature and pressure compound sensor according to claim 4 is characterized in that: evaporation or sputter have the gold layer on the outside surface of described ceramic substrate.
7. filling type temperature and pressure compound sensor according to claim 1 is characterized in that: described base (1) is gone up and the eutectic weld of pressure chip (2) and chip temperature (3) is coated with the gold layer.
8. filling type temperature and pressure compound sensor according to claim 1 is characterized in that: described spun gold lead-in wire (4-1) adopts the Metal Ball ultrasonic-thermocompression welding with the bonding of drawing a lead in the wire harness (5) outward.
9. filling type temperature and pressure compound sensor according to claim 1 is characterized in that: silver-colored palladium silk (4-2) welds with the argon arc that is welded as of drawing a lead in the wire harness (5) outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201779607U CN202066613U (en) | 2011-05-30 | 2011-05-30 | Oil-filled temperature pressure combined sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201779607U CN202066613U (en) | 2011-05-30 | 2011-05-30 | Oil-filled temperature pressure combined sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202066613U true CN202066613U (en) | 2011-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201779607U Expired - Lifetime CN202066613U (en) | 2011-05-30 | 2011-05-30 | Oil-filled temperature pressure combined sensor |
Country Status (1)
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| CN (1) | CN202066613U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102322893A (en) * | 2011-05-30 | 2012-01-18 | 中国电子科技集团公司第四十九研究所 | Oil-filled temperature and pressure combined sensor |
| CN102980692A (en) * | 2012-11-19 | 2013-03-20 | 西安微纳传感器研究所有限公司 | High-temperature impact-pressure-resistant sensor and production method thereof |
| CN103196617A (en) * | 2013-03-21 | 2013-07-10 | 西安交通大学 | Cylinder type ultra-high-pressure sensor of side cavity oil charging structure |
| CN104122026A (en) * | 2013-04-25 | 2014-10-29 | 浙江三花股份有限公司 | Pressure transducer and pressure system |
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
| CN106768592A (en) * | 2017-02-24 | 2017-05-31 | 中国电子科技集团公司第三十八研究所 | A kind of pressure transmitter oil filling core body of band signal processing function |
| CN107478362A (en) * | 2017-08-21 | 2017-12-15 | 北京精密机电控制设备研究所 | A kind of side seal formula silicon piezoresistance sensitivity core body |
| CN108151952A (en) * | 2018-01-29 | 2018-06-12 | 北京布莱迪仪器仪表有限公司 | A kind of double diaphragm leakage protection diaphragms |
| CN108375428A (en) * | 2018-01-04 | 2018-08-07 | 南京沃天科技有限公司 | A kind of pressure sensor for fixing absolute pressure chip using no plastic structure |
| CN109540374A (en) * | 2019-01-10 | 2019-03-29 | 中南大学 | Ultrasound sintering packaging system |
-
2011
- 2011-05-30 CN CN2011201779607U patent/CN202066613U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102322893A (en) * | 2011-05-30 | 2012-01-18 | 中国电子科技集团公司第四十九研究所 | Oil-filled temperature and pressure combined sensor |
| CN102980692A (en) * | 2012-11-19 | 2013-03-20 | 西安微纳传感器研究所有限公司 | High-temperature impact-pressure-resistant sensor and production method thereof |
| CN102980692B (en) * | 2012-11-19 | 2015-08-19 | 西安微纳传感器研究所有限公司 | Shock-resistant pressure transducer of a kind of high temperature and preparation method thereof |
| CN103196617A (en) * | 2013-03-21 | 2013-07-10 | 西安交通大学 | Cylinder type ultra-high-pressure sensor of side cavity oil charging structure |
| CN103196617B (en) * | 2013-03-21 | 2014-10-15 | 西安交通大学 | Cylinder type ultra-high-pressure sensor of side cavity oil charging structure |
| CN104122026B (en) * | 2013-04-25 | 2017-11-03 | 浙江三花制冷集团有限公司 | A kind of pressure sensor and pressure system |
| CN104122026A (en) * | 2013-04-25 | 2014-10-29 | 浙江三花股份有限公司 | Pressure transducer and pressure system |
| CN106289634A (en) * | 2016-08-23 | 2017-01-04 | 太仓市威士达电子有限公司 | A kind of metal shell for pressure sensor package combines |
| CN106768592A (en) * | 2017-02-24 | 2017-05-31 | 中国电子科技集团公司第三十八研究所 | A kind of pressure transmitter oil filling core body of band signal processing function |
| CN107478362A (en) * | 2017-08-21 | 2017-12-15 | 北京精密机电控制设备研究所 | A kind of side seal formula silicon piezoresistance sensitivity core body |
| CN108375428A (en) * | 2018-01-04 | 2018-08-07 | 南京沃天科技有限公司 | A kind of pressure sensor for fixing absolute pressure chip using no plastic structure |
| CN108375428B (en) * | 2018-01-04 | 2020-08-28 | 南京沃天科技有限公司 | Pressure sensor adopting adhesive-free structure to fix absolute pressure chip |
| CN108151952A (en) * | 2018-01-29 | 2018-06-12 | 北京布莱迪仪器仪表有限公司 | A kind of double diaphragm leakage protection diaphragms |
| CN109540374A (en) * | 2019-01-10 | 2019-03-29 | 中南大学 | Ultrasound sintering packaging system |
| CN109540374B (en) * | 2019-01-10 | 2024-03-15 | 中南大学 | Ultrasonic sintering packaging device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20111207 Effective date of abandoning: 20130306 |
|
| RGAV | Abandon patent right to avoid regrant |