CN202836865U - Leadless package structure for silicon pressure sensors - Google Patents
Leadless package structure for silicon pressure sensors Download PDFInfo
- Publication number
- CN202836865U CN202836865U CN 201220342862 CN201220342862U CN202836865U CN 202836865 U CN202836865 U CN 202836865U CN 201220342862 CN201220342862 CN 201220342862 CN 201220342862 U CN201220342862 U CN 201220342862U CN 202836865 U CN202836865 U CN 202836865U
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- silicon pressure
- sensitive chip
- pressure sensitive
- pin
- pressure sensor
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Abstract
The utility model discloses a leadless package structure for silicon pressure sensors, comprising a silicon pressure sensitive chip, a pin base and Kovar alloy pins. The silicon pressure sensitive chip is fixed on the bottom surface of the pin base; the Kovar alloy pins pass through the bottom surface of the pin base; glass glaze material is filled inside the bottom surface, where the Kovar alloy pins pass through, of the pin base; and the silicon pressure sensitive chip is connected with the Kovar alloy pins through metal solder. According to the utility model, no lead is used for the transition between the silicon pressure sensitive chip and the Kovar alloy pins on the pin base so that the volume of a sensor can be reduced to the maximum, and the resistance to harsh environments can be improved due to the leadless method.
Description
Technical field
The utility model relates to a kind of pressure transducer, particularly a kind of silicon pressure sensor leadless packaging structure.
Background technology
At present, the packing forms of silicon piezoresistance type presser sensor chip mostly is the oil-filled isolated structure of band lead-in wire, oil-filled isolation is for pressure medium and presser sensor chip are isolated, play the effect of protection presser sensor chip, this oil-filled isolated structure has bulky shortcoming, is not suitable for the low volume applications occasion; Another band pin configuration of silicon piezoresistance type presser sensor chip is non-filling type, and presser sensor chip is fixedly connected with mode with oil-filled isolated, and it is very little that volume can be done, but presser sensor chip exposes, and lead-in wire also exposes, therefore, not corrosion-resistant, poor stability.
Summary of the invention
Technical problem to be solved in the utility model is, and is not enough for prior art, and a kind of silicon pressure sensor leadless packaging structure is provided, and overcomes existing lead type silicon piezoresistance type pressure sensitive chip package structure volume large, the defective that corrosion resistance is poor.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of silicon pressure sensor leadless packaging structure, comprise the Silicon pressure sensitive chip, also comprise base, pin, the Silicon pressure sensitive chip is fixed on the base bottom surface, pin passes the base bottom surface, and the position that the inner pin in base bottom surface passes is filled with the glass glaze, and the Silicon pressure sensitive chip is connected with pin by brazing metal.
Adopt the face-down bonding technology that the Silicon pressure sensitive chip is welded on the base.
Compared with prior art, the beneficial effects of the utility model are: do not adopt the lead-in wire transition between the utility model Silicon pressure sensitive chip and the base pin, can reduce to greatest extent the volume of sensor, improved the ability of adverse environment resistant without the lead-in wire mode, solved traditional leaded oil-filled isolated silicon piezoresistive pressure sensor volume large, the anti-environment capacity of leaded non-oil-filled isolated silicon piezoresistive pressure sensor poor problem.
Description of drawings
Fig. 1 is the utility model one embodiment cut-open view;
Wherein:
1: sizing material; 2: base; 3: the Covar pin; 4: brazing metal; 5: the Silicon pressure sensitive chip; 6: pressure-sensitive face; 7: the glass glaze.
Embodiment
As shown in Figure 1, the utility model one embodiment comprises Silicon pressure sensitive chip, base, four Covar pins, the Silicon pressure sensitive chip is welded on the base by the face-down bonding technology, four Covar pins all pass the base bottom surface, the place that the inner Covar in base bottom surface passes is filled with the glass glaze, and presser sensor chip is connected with the Covar pin by scolding tin.
For vibration resistance and the shock-resistant ability that guarantees described leadless packaging structure, described Silicon pressure sensitive chip need adopt gluing mode to be fixed on the base, gluing and pin welding is carried out simultaneously, and described Silicon pressure sensitive chip needs to be welded on the Covar pin by scolder.
In order to guarantee the pressure cycling life-span of product, described adhesive means finally forms the thickness of sizing material less than 0.2mm.
Silicon pressure sensitive chip sensitive resistance bar is the contact medium not, and sensitive chip is connected without lead-in wire with the Covar pin, this pressure survey that can realize small space and rugged surroundings occasion without lead-in wire silicon pressure sensor encapsulating structure.
The diameter of base is below 6mm, and pressure-sensitive surface contact pressure medium is experienced pressure and changed.
Claims (7)
1. silicon pressure sensor leadless packaging structure, comprise the Silicon pressure sensitive chip, it is characterized in that, also comprise base, pin, the Silicon pressure sensitive chip is fixed on the base bottom surface, pin passes the base bottom surface, and the position that the inner pin in base bottom surface passes is filled with the glass glaze, and the Silicon pressure sensitive chip is connected with pin by brazing metal.
2. silicon pressure sensor leadless packaging structure according to claim 1 is characterized in that, described brazing metal is scolding tin.
3. silicon pressure sensor leadless packaging structure according to claim 1 is characterized in that, described Silicon pressure sensitive chip is welded on the base by the face-down bonding technology.
4. silicon pressure sensor leadless packaging structure according to claim 1 is characterized in that, described pin number is 4～6.
5. silicon pressure sensor leadless packaging structure according to claim 1 is characterized in that, described Silicon pressure sensitive chip is adhesive on the base by sizing material.
6. silicon pressure sensor leadless packaging structure according to claim 5 is characterized in that, described sizing material thickness is less than 0.2mm.
7. according to claim 1 or 4 described silicon pressure sensor leadless packaging structures, it is characterized in that, described pin is the Covar pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342862 CN202836865U (en) | 2012-07-16 | 2012-07-16 | Leadless package structure for silicon pressure sensors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342862 CN202836865U (en) | 2012-07-16 | 2012-07-16 | Leadless package structure for silicon pressure sensors |
Publications (1)
| Publication Number | Publication Date |
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| CN202836865U true CN202836865U (en) | 2013-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220342862 Expired - Lifetime CN202836865U (en) | 2012-07-16 | 2012-07-16 | Leadless package structure for silicon pressure sensors |
Country Status (1)
| Country | Link |
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| CN (1) | CN202836865U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103926029A (en) * | 2014-04-28 | 2014-07-16 | 中国电子科技集团公司第四十九研究所 | Method for air tightness hard packaging of sensitive chip of piezoresistive pressure sensor |
| CN106595947A (en) * | 2015-10-14 | 2017-04-26 | 南京高华科技股份有限公司 | Pressure sensor |
| CN108275648A (en) * | 2017-12-21 | 2018-07-13 | 中航（重庆）微电子有限公司 | A kind of pressure sensor packaging structure based on silicon piezoresistance type |
| CN109534282A (en) * | 2018-10-26 | 2019-03-29 | 江西新力传感科技有限公司 | Production technology based on upside-down mounting welding core media isolation type pressure sensor |
| CN109781334A (en) * | 2019-01-02 | 2019-05-21 | 西安交通大学 | A kind of leadless packaging structure and packaging method of piezoresistive transducer |
| CN109883578A (en) * | 2019-03-29 | 2019-06-14 | 夏罗登工业科技(上海)有限公司 | Pressure sensor |
| CN111141442A (en) * | 2020-01-20 | 2020-05-12 | 南京新力感电子科技有限公司 | Pressure sensor |
| CN113697762A (en) * | 2021-08-25 | 2021-11-26 | 中国电子科技集团公司第四十九研究所 | Differential pressure resonance pressure sensitive chip probe of isolation packaging structure and packaging method |
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
-
2012
- 2012-07-16 CN CN 201220342862 patent/CN202836865U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103926029A (en) * | 2014-04-28 | 2014-07-16 | 中国电子科技集团公司第四十九研究所 | Method for air tightness hard packaging of sensitive chip of piezoresistive pressure sensor |
| CN103926029B (en) * | 2014-04-28 | 2016-03-30 | 中国电子科技集团公司第四十九研究所 | The hard method for packing of piezoresistive pressure sensor sensitive chip impermeability |
| CN106595947A (en) * | 2015-10-14 | 2017-04-26 | 南京高华科技股份有限公司 | Pressure sensor |
| CN108275648A (en) * | 2017-12-21 | 2018-07-13 | 中航（重庆）微电子有限公司 | A kind of pressure sensor packaging structure based on silicon piezoresistance type |
| CN109534282A (en) * | 2018-10-26 | 2019-03-29 | 江西新力传感科技有限公司 | Production technology based on upside-down mounting welding core media isolation type pressure sensor |
| CN109534282B (en) * | 2018-10-26 | 2020-06-16 | 江西新力传感科技有限公司 | Production process of dielectric isolation type pressure sensor based on flip chip |
| CN109781334A (en) * | 2019-01-02 | 2019-05-21 | 西安交通大学 | A kind of leadless packaging structure and packaging method of piezoresistive transducer |
| CN109883578A (en) * | 2019-03-29 | 2019-06-14 | 夏罗登工业科技(上海)有限公司 | Pressure sensor |
| CN111141442A (en) * | 2020-01-20 | 2020-05-12 | 南京新力感电子科技有限公司 | Pressure sensor |
| CN113697762A (en) * | 2021-08-25 | 2021-11-26 | 中国电子科技集团公司第四十九研究所 | Differential pressure resonance pressure sensitive chip probe of isolation packaging structure and packaging method |
| CN113697762B (en) * | 2021-08-25 | 2023-08-11 | 中国电子科技集团公司第四十九研究所 | Differential pressure resonance pressure sensitive chip probe with isolation packaging structure and packaging method |
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |
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| CX01 | Expiry of patent term |